PRELIMINARY FMA411 LOW-NOISE X-BAND MMIC • PERFORMANCE ♦ 8.5 – 14.0 GHz Operating Bandwidth ♦ 2.6 dB Noise Figure ♦ 18 dB Small-Signal Gain ♦ 17.5 dm Output Power ♦ +6V Single Bias Supply ♦ Adjustable Operating Current ♦ DC De-coupled Input and Output Ports • DESCRIPTION AND APPLICATIONS The FMA411 is a 2-stage, reactively matched pHEMT low-noise MMIC amplifier designed for use over the 8.5 to 14.0 GHz bandwidth. The amplifier requires a single +6V supply and one off-chip component for supply de-coupling; the supply voltage can be varied from +3V to +6V if needed. Both the input and output ports are DC de-coupled. Grounding of the amplifier is provided by plated thru-vias to the bottom of the die, no additional ground is required. Operating current can be adjusted using the Source resistor ladders located along the bottom edge, by bonding a particular pad to ground, in order to optimize noise or power performance. Typical applications include low-noise front end amplifiers, and general gain block utilizations in Xband. The amplifier is unconditionally stable over all load states (-45 to +85°C), and conditionally stable if the input port is open-circuited. • ELECTRICAL SPECIFICATIONS AT 22°C Parameter Symbol Test Conditions Min Operating Frequency Bandwidth BW Small Signal Gain S21 VDD = +6 V IDD ≈ 60% IDSS 16.5 Saturated Drain Current IDSS VDD = +3V Typ Max Units 14 GHz 18 21 dB 210 230 270 mA 125 8.5 (see Note) Operating Current IDQ VDD = +6V 140 165 mA Small Signal Gain Flatness ∆S21 VDD = +6 V IDD ≈ 60% IDSS ± 0.8 ± 1.2 dB Noise Figure NF VDD = +6 V IDD ≈ 60% IDSS 2.6 3.5 dB 3 -Order Intermodulation Distortion IMD VDD = +6 V IDD ≈ 60% IDSS rd POUT = +6 dBm SCL • 16 -46 dBc 17.5 dBm Power at 1dB Compression P1dB VDD = +6 V IDD ≈ 60% IDSS Input Return Loss S11 VDD = +6 V IDD ≈ 60% IDSS -10 -6 dB Output Return Loss S22 VDD = +6 V IDD ≈ 60% IDSS -16 -10 dB Reverse Isolation S12 VDD = +6 V IDD ≈ 60% IDSS -40 -35 dB NOTE: Continuous operation at IDSS is not recommended Phone: +1 408 850-5790 Fax: +1 408 850-5766 www.filcs.com Revised: 7/19/04 Email: [email protected] PRELIMINARY FMA411 LOW-NOISE X-BAND MMIC ABSOLUTE MAXIMUM RATINGS1 Parameter Symbol Test Conditions Supply Voltage VDD Supply Current Max Units For any operating current 8 V IDD For VDD < 7V 75% IDSS mA RF Input Power PIN For standard bias conditions 0 dBm Storage Temperature TSTG Non-Operating Storage 150 ºC Total Power Dissipation PTOT See De-Rating Note below 980 mW Comp. Under any bias conditions 5 dB Gain Compression 2 Simultaneous Combination of Limits TAmbient = 22°C unless otherwise noted 1 Min -40 2 or more Max. Limits 80 % Users should avoid exceeding 80% of 2 or more Limits simultaneously 2 Notes: • Operating conditions that exceed the Absolute Maximum Ratings will result in permanent damage to the device. • Total Power Dissipation defined as: PTOT ≡ (PDC + PIN) – POUT, where: PDC: DC Bias Power PIN: RF Input Power POUT: RF Output Power • Total Power Dissipation to be de-rated as follows above 22°C: PTOT= 0.6 - (0.004W/°C) x TCARRIER where TCARRIER = carrier or heatsink temperature above 22°C (coefficient of de-rating formula is the Thermal Conductivity) Example: For a 55°C carrier temperature: PTOT = 0.6 - (0.004 x (55 – 22)) = 0.47W • For optimum heatsinking eutectic die attach is recommended; conductive epoxy die attach is acceptable with some degradation in thermal de-rating performance (PTOT = 550mW) • Note on Thermal Resistivity: The nominal value of 250°C/W is stated for the input stage, which will reach temperature limits before the output stage. The aggregate MMIC thermal resistivity is approximately 175°C/W. • HANDLING PRECAUTIONS To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A per ESD-STM5.1-1998, Human Body Model. Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. Phone: +1 408 850-5790 Fax: +1 408 850-5766 www.filcs.com Revised: 7/19/04 Email: [email protected] PRELIMINARY • FMA411 LOW-NOISE X-BAND MMIC MECHANICAL OUTLINE: Notes: 1) All units are in microns, unless otherwise specified. 2) All bond pads are 100x100 µm2 3) Bias pad (VDD) size is 100x100 µm2 Phone: +1 408 850-5790 Fax: +1 408 850-5766 www.filcs.com Revised: 7/19/04 Email: [email protected]