INTERSIL HCA10009

HCA10009
Data Sheet
100MHz, Single and Dual Low Noise,
Precision Operational Amplifier
The HCA10009 is a high performance dielectrically isolated,
op amp, featuring precision DC characteristics while providing
excellent AC characteristics. Designed for audio, video, and
other demanding applications, noise (3.4nV/√Hz at 1kHz),
total harmonic distortion (<0.005%), and DC errors are kept to
a minimum.
The precision performance is shown by low offset voltage
(0.3mV), low bias currents (40nA), low offset currents
(15nA), and high open loop gain (128dB). The combination
of these excellent DC characteristics with the fast settling
time (0.4µs) make the HCA10009 ideally suited for precision
signal conditioning.
The unique design of the HCA10009 gives it outstanding AC
characteristics not normally associated with precision op
amps, high unity gain bandwidth (35MHz) and high slew rate
(25V/µs). Other key specifications include high CMRR (95dB)
and high PSRR (100dB). The combination of these
specifications will allow the HCA10009 to be used in RF signal
conditioning as well as video amplifiers.
Pinout
August 1999
Features
• Gain Bandwidth Product. . . . . . . . . . . . . . . . . . . . 100MHz
• Unity Gain Bandwidth. . . . . . . . . . . . . . . . . . . . . . . 25MHz
• Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25V/µs
• Low Offset Voltage . . . . . . . . . . . . . . . . . . . . . . . . . 0.3mV
• High Open Loop Gain. . . . . . . . . . . . . . . . . . . . . . . 128dB
• Channel Separation at 10kHz . . . . . . . . . . . . . . . . 110dB
• Low Noise Voltage at 1kHz. . . . . . . . . . . . . . . . 3.4nV/√Hz
• High Output Current . . . . . . . . . . . . . . . . . . . . . . . . . 56mA
• Low Supply Current per Amplifier. . . . . . . . . . . . . . . . 8mA
Applications
• Precision Test Systems
• Active Filtering
• Small Signal Video
• Accurate Signal Processing
• RF Signal Conditioning
PART NUMBER
(BRAND)
HCA10009
-IN
V-
TEMP.
RANGE (oC)
0 to 75
PACKAGE
8 Ld SOIC
PKG.
NO.
M8.15
8 +BAL
2
+IN 3
4771
Ordering Information
HCA10009
(SOIC)
TOP VIEW
-BAL 1
File Number
7 V+
+
4
6 OUT
5 NC
4-1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999
HCA10009
Absolute Maximum Ratings
Thermal Information
Supply Voltage Between V+ and V- Terminals. . . . . . . . . . . . . . 35V
Differential Input Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . 5V
Output Current Short Circuit Duration . . . . . . . . . . . . . . . . Indefinite
Thermal Resistance (Typical, Note 2)
θJA (oC/W)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
157
Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HCA10009 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 75oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Input is protected by back-to-back zener diodes. See applications section.
2. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
VSUPPLY = ±15V, Unless Otherwise Specified
HCA10009
TEMP. (oC)
MIN
TYP
MAX
UNITS
25
-
0.30
0.75
mV
Full
-
0.35
1.5
mV
Average Offset Voltage Drift
Full
-
0.5
-
µV/oC
Input Bias Current
25
-
40
100
nA
Full
-
70
200
nA
25
-
15
100
nA
Full
-
30
150
nA
25
-
400
750
µV
Full
-
-
1500
µV
Common Mode Range
25
±12
-
-
V
Differential Input Resistance
25
-
70
-
kΩ
PARAMETER
TEST CONDITIONS
INPUT CHARACTERISTICS
Input Offset Voltage
Input Offset Current
Input Offset Voltage Match
Input Noise Voltage
f = 0.1Hz to 10Hz
25
-
0.25
-
µVP-P
Input Noise Voltage
f = 10Hz
25
-
6.2
10
nV/√Hz
Density (Notes 3, 12)
f = 100Hz
25
-
3.6
6
nV/√Hz
f = 1000Hz
25
-
3.4
4.0
nV/√Hz
Input Noise Current
f = 10Hz
25
-
4.7
8.0
pA/√Hz
Density (Notes 3, 12)
f = 100Hz
25
-
1.8
2.8
pA/√Hz
f = 1000Hz
25
-
0.97
1.8
pA/√Hz
Note 4
25
-
<0.005
-
%
Note 5
25
106
128
-
dB
Full
100
120
-
dB
THD+N
TRANSFER CHARACTERISTICS
Large Signal Voltage Gain
CMRR
VCM = ±10V
Full
86
95
-
dB
Unity Gain Bandwidth
-3dB
25
-
35
-
MHz
Gain Bandwidth Product
1kHz to 400kHz
25
-
100
-
MHz
Full
1
-
-
V/V
Minimum Stable Gain
4-2
HCA10009
Electrical Specifications
VSUPPLY = ±15V, Unless Otherwise Specified (Continued)
HCA10009
TEMP. (oC)
MIN
TYP
MAX
UNITS
RL = 333Ω
Full
±10
-
-
V
RL = 1kΩ
25
±12
±12.5
-
V
RL = 1kΩ
Full
±11.5
±12.1
-
V
VOUT = ±10V
Full
±30
±56
-
mA
25
-
10
-
Ω
Note 6
25
239
398
-
kHz
Slew Rate
Notes 7, 11
Full
15
25
-
V/µs
Rise Time
Notes 8, 11
Full
-
13
20
ns
Overshoot
Notes 8, 11
Full
-
28
50
%
Settling Time (Note 9)
0.1%
25
-
0.4
-
µs
0.01%
25
-
1.5
-
µs
VS = ±10V to ±20V
Full
86
100
-
dB
Full
-
8
11
mA/Op Amp
PARAMETER
TEST CONDITIONS
OUTPUT CHARACTERISTICS
Output Voltage Swing
Output Current
Output Resistance
Full Power Bandwidth
TRANSIENT RESPONSE (Note 10)
POWER SUPPLY
PSRR
Supply Current
NOTES:
3. Refer to typical performance curve in data sheet.
4. AVCL = 10, fO = 1kHz, VO = 5VRMS, RL = 600Ω, 10Hz to 100kHz, Minimum resolution of test equipment is 0.005%.
5. VOUT = 0 to ±10V, RL = 1kΩ, CL = 50pF.
Slew Rate
6. Full Power Bandwidth is calculated by: FPBW = ---------------------------, V PEAK = 10V .
2πV PEAK
7. VOUT = ±2.5V, RL = 1kΩ, CL = 50pF.
8. VOUT = ±100mV, RL = 1kΩ, CL = 50pF.
9. Settling time is specified for a 10V step and AV = -1.
10. See Test Circuits.
11. Guaranteed by characterization.
4-3
HCA10009
Test Circuits and Waveforms
VIN
+
VOUT
-
1kΩ
50pF
FIGURE 1. TRANSIENT RESPONSE TEST CIRCUIT
100mV
2.5V
VIN
0V
0V
-100mV
-2.5V
2.5V
100mV
VOUT
0V
0V
-100mV
-2.5V
VOUT = 2.5V
Vertical Scale = 2V/Div.,
Horizontal Scale = 200ns/Div.
VOUT = ±100mV
Vertical Scale = 100mV/Div.,
Horizontal Scale = 200ns/Div.
FIGURE 2. LARGE SIGNAL RESPONSE
FIGURE 3. SMALL SIGNAL RESPONSE
VSETTLE
5K
5K
2K
2K
VIN
+
VOUT
NOTES:
12. AV = -1.
13. Feedback and summing resistors must be matched (0.1%).
14. HP5082-2810 clipping diodes recommended.
15. Tektronix P6201 FET probe used at settling point.
FIGURE 4. SETTLING TIME TEST CIRCUIT
4-4
HCA10009
Application Information
Operation at Various Supply Voltages
Saturation Recovery
The HCA10009 operates over a wide range of supply
voltages with little variation in performance. The supplies
may be varied from ±5V to ±15V. See Typical Performance
Curves for variations in supply current, slew rate and output
voltage swing.
When an op amp is over driven, output devices can saturate
and sometimes take a long time to recover. By clamping the
input, output saturation can be avoided. If output saturation
can not be avoided, the maximum recovery time when
overdriven into the positive rail is 10.6µs. When driven into
the negative rail the maximum recovery time is 3.8µs.
Offset Adjustment
The following diagram shows the offset voltage adjustment
configuration for the HCA10009. By moving the
potentiometer wiper towards pin 8 (+BAL), the op amps
output voltage will increase; towards pin 1 (-BAL) decreases
the output voltage. A 20kΩ trim pot will allow an offset
voltage adjustment of about 10mV.
Input Protection
The HCA10009 has built in back-to-back protection diodes
which limit the maximum allowable differential input voltage
to approximately 5V. If the HCA10009 will be used in circuits
where the maximum differential voltage may be exceeded,
then current limiting resistors must be used. The input
current should be limited to a maximum of 10mA.
RLIMIT
2
+15V
∆VIN
7
RP
1
8
2
6
PC Board Layout Guidelines
+
4
-15V
Capacitive Loading Considerations
When driving capacitive loads >80pF, a small resistor, 50Ω
to 100Ω, should be connected in series with the output and
inside the feedback loop.
Typical Performance Curves
When designing with the HCA10009, good high frequency
(RF) techniques should be used when building a PC board.
Use of ground plane is recommended. Power supply
decoupling is very important. A 0.01µF to 0.1µF high quality
ceramic capacitor at each power supply pin with a 2.2µF to
10µF tantalum close by will provide excellent decoupling.
Chip capacitors produce the best results due to ease of
placement next to the op amp and basically no lead
inductance. If leaded capacitors are used, the leads should
be kept as short as possible to minimize lead inductance.
VS = ±15V, TA = 25oC
12
RL = 1K, CL = 50pF
9
AV = +1, RL = 1K, CL = 50pF
GAIN
60
40
20
180
0
135
PHASE
90
45
0
1K
10K
100K
1M
10M
PHASE MARGIN (DEGREES)
GAIN (dB)
100
100M
FREQUENCY (Hz)
FIGURE 5. OPEN LOOP GAIN AND PHASE vs FREQUENCY
4-5
GAIN (dB)
120
80
VOUT
+
3
6
3
GAIN
0
-3
-6
180
PHASE
135
90
45
10K
100K
1M
10M
0
100M
FREQUENCY (Hz)
FIGURE 6. CLOSED LOOP GAIN vs FREQUENCY
PHASE MARGIN (DEGREES)
3
6
RLIMIT
HCA10009
AV = -1, RL = 1K, CL = 50pF
6
3
GAIN
0
180
PHASE
135
90
45
0
10K
10M
1M
60
40
20
AV = -1000
RL = 1K, CL = 50pF
AV = -100
AV = -10
0
AV = -10
AV = -100
135
90
AV = -1000
45
0
10K
100M
100K
1M
10M
100M
FREQUENCY (Hz)
FIGURE 7. CLOSED LOOP GAIN vs FREQUENCY
FIGURE 8. VARIOUS CLOSED LOOP GAINS vs FREQUENCY
AV = +1, RL = 1K
AV = +1, RL = 1K
100
80
80
PSRR (dB)
100
60
40
20
0
-PSRR
60
40
20
+PSRR
0
10K
100K
1M
10M
100M
10K
100K
1M
10M
100M
FREQUENCY (Hz)
FREQUENCY (Hz)
FIGURE 9. CMRR vs FREQUENCY
FIGURE 10. PSRR vs FREQUENCY
20
300
RL = 1K
18
250
16
OFFSET VOLTAGE (µV)
OPEN LOOP GAIN (V/µV)
180
FREQUENCY (Hz)
120
CMRR (dB)
100K
80
PHASE MARGIN (DEGREES)
9
CLOSED LOOP GAIN (dB)
VS = ±15V, TA = 25oC (Continued)
PHASE MARGIN (DEGREES)
GAIN (dB)
Typical Performance Curves
14
12
10
8
6
4
200
150
100
50
0
-50
2
0
-60
-40
-20
0
20
40
60
80
100
TEMPERATURE (oC)
FIGURE 11. OPEN LOOP GAIN vs TEMPERATURE
4-6
120
-100
-60
-40
-20
0
20
40
60
80
100
TEMPERATURE (oC)
FIGURE 12. OFFSET VOLTAGE vs TEMPERATURE
(4 REPRESENTATIVE UNITS)
120
HCA10009
Typical Performance Curves
VS = ±15V, TA = 25oC (Continued)
14
RL = 600Ω
PEAK OUTPUT VOLTAGE (V)
13.5
BIAS CURRENT (nA)
160
140
120
100
80
60
40
20
13
12.5
12
11.5
11
10.5
0
-20
-40
-60
10
-40
-20
0
20
40
60
80
100
-60
120
-40
-20
0
TEMPERATURE (oC)
20
40
60
80
100
120
TEMPERATURE (oC)
FIGURE 13. BIAS CURRENT vs TEMPERATURE
(4 REPRESENTATIVE UNITS)
FIGURE 14. OUTPUT VOLTAGE SWING vs TEMPERATURE
70
AV = +1, RL = 1K, CL = 50pF
1.05
OFFSET VOLTAGE CHANGE (µV)
SLEW RATE (NORMALIZED TO 1 AT 25oC)
1.1
1
0.95
0.9
0.85
0.8
-60
-40
-20
0
20
40
60
80
100
60
50
40
30
20
10
0
120
0
1
TEMPERATURE (oC)
2
3
4
5
TIME AFTER POWER UP (MINUTES)
FIGURE 15. SLEW RATE vs TEMPERATURE
FIGURE 16. OFFSET VOLTAGE WARM-UP DRIFT
AV = +1, RL = 2K, CL = 50pF
34
32
+SLEW RATE
30
8.25
SLEW RATE (V/µs)
SUPPLY CURRENT PER AMPLIFIER (mA)
36
8.5
8
28
26
24
-SLEW RATE
22
20
18
16
7.75
14
12
7.5
10
5
7
9
11
13
15
17
SUPPLY VOLTAGE (±V)
FIGURE 17. SUPPLY CURRENT vs SUPPLY VOLTAGE
4-7
5
7
9
11
13
15
SUPPLY VOLTAGE (±V)
FIGURE 18. SLEW RATE vs SUPPLY VOLTAGE
17
HCA10009
Typical Performance Curves
VS = ±15V, TA = 25oC (Continued)
15
10
5
16
24
14
21
12
18
10
15
8
12
6
9
VOLTAGE NOISE
2
CURRENT NOISE 3
0
1K
10K
0
0
5
7
9
11
13
SUPPLY VOLTAGE (±V)
15
1
17
10
OFFSET CURRENT (nA)
FIGURE 20. NOISE CHARACTERISTICS
CMRR AND PSRR (dB)
-40
-20
0
20
40
60
80
100
120
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
-60
+PSRR
-PSRR
CMRR
-40
-20
TEMPERATURE (oC)
45
60
80
100
120
130
80
BANDWIDTH
30
60
25
40
20
20
15
0
100
1000
LOAD CAPACITANCE (pF)
FIGURE 23. BANDWIDTH AND PHASE MARGIN vs LOAD
CAPACITANCE
OUTPUT CURRENT (mA)
35
PHASE MARGIN (DEGREE)
BANDWIDTH (MHz)
100
4-8
40
AV = +1, RL = 1K
40
10
20
FIGURE 22. CMRR AND PSRR vs TEMPERATURE
120
1
0
TEMPERATURE (oC)
FIGURE 21. OFFSET CURRENT vs TEMPERATURE
(4 REPRESENTATIVE UNITS)
PHASE MARGIN
100
FREQUENCY (Hz)
FIGURE 19. OUTPUT VOLTAGE SWING vs SUPPLY VOLTAGE
100
90
80
70
60
50
40
30
20
10
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-60
6
4
CURRENT NOISE (pA/√Hz)
RL = 600Ω
VOLTAGE NOISE (nV/√Hz)
PEAK OUTPUT VOLTAGE SWING (V)
20
110
90
70
50
0
1
2
3
4
TIME AFTER SHORT CIRCUIT (MINUTES)
FIGURE 24. SHORT CIRCUIT OUTPUT CURRENT vs TIME
5
HCA10009
Typical Performance Curves
VS = ±15V, TA = 25oC (Continued)
Vertical Scale = 1mV/Div.; Horizontal Scale = 1s/Div.
AV = +25,000; EN = 0.168µVP-P RTI
Vertical Scale = 10mV/Div.; Horizontal Scale = 1s/Div.
AV = +25,000; EN = 1.5µVP-P RTI
FIGURE 25. 0.1Hz TO 10Hz NOISE
18
18
AV = +1, RL = 1K, CL = 15pF, THD ≤ 0.01%
PEAK OUTPUT VOLTAGE (V)
VS = ±18
14
12
VS = ±15
10
8
6
VS = ±10
4
2
VS = ±5
0
10K
AV = +1, THD ≤ 0.01%, f = 1kHz
16
14
VS = ±18
VS = ±15
12
10
VS = ±10
8
6
4
VS = ±5
2
100K
1M
0
10
10M
100
FIGURE 27. OUTPUT VOLTAGE SWING vs FREQUENCY
10K
FIGURE 28. OUTPUT VOLTAGE SWING vs LOAD RESISTANCE
10
9.5
9
8.5
8
7.5
7
6.5
6
-60
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (oC)
FIGURE 29. SUPPLY CURRENT/AMPLIFIER vs TEMPERATURE
4-9
1K
LOAD RESISTANCE (Ω)
FREQUENCY (Hz)
SUPPLY CURRENT PER AMPLIFIER (mA)
PEAK OUTPUT VOLTAGE (V)
16
FIGURE 26. 0.1Hz TO 1MHz
HCA10009
Small Outline Plastic Packages (SOIC)
M8.15 (JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
N
INDEX
AREA
H
0.25(0.010) M
B M
E
INCHES
-B-
1
2
SYMBOL
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
e
α
A1
B
0.25(0.010) M
C
C A M
B S
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
MAX
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
e
0.10(0.004)
MILLIMETERS
MIN
H
0.050 BSC
1.27 BSC
-
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
8o
0o
N
α
8
0o
8
7
8o
Rev. 0 12/93
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
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