VISHAY TCND3000

TCND3000
Vishay Semiconductors
Reflective Sensor for Touchless Switch
Description
TCND3000 is a reflective optical sensor for applications using the HALIOS® (High Ambient Light Independent Optical System) principle. It consists of an
infrared emitter and a photodetector forming the optical sensing path. According to the HALIOS principle a
second infrared emitter is used for compensation of
disturbing ambient light. Optoelectronic parameters of
the sensor are matched to the corresponding integrated circuit E909.01, manufactured by ELMOS
Semiconductor AG (www.elmos.de).
Features
• Package type: Surface mount
• Detector type: PIN Photodiode
• Dimensions:
e4
L 4.83 mm x W 2.54 mm x H 2.21 mm
• Peak operating distance: 20 mm
• Peak operating range: 10 mm to 20 mm
• Typical output current under test: IC = 5.6 µA
• Lead (Pb)-free soldering released
• Lead (Pb)-free component in accordance to RoHS
2002/95/EC and WEEE 2002/96/EC
• Emitter wavelength 885 nm
• Daylight blocking filter
• Touch distance: 10 mm*)
• Proximity distance: 20 mm*)
• High ambient light suppression for sunlight:
≤ 200 klx
• High ambient light suppression for CIE standard
illuminant A: ≤ 100 klx
• Minimum order quantity 800 pcs, 800 pcs/reel
Applications
• Optical switches for general purpose
*) Using E909.01 interface ASIC and Kodak grey card
with 20 % diffuse reflection
Document Number 84606
Rev. 1.2, 23-Aug-06
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TCND3000
Vishay Semiconductors
Absolute Maximum Ratings
Tamb = 25 °C, unless otherwise specified
Sensor
Parameter
Test condition
Symbol
Value
Unit
PV
180
mW
Storage temperature range
Tstg
- 40 to + 100
°C
Operating temperature range
Tamb
- 40 to + 85
°C
Thermal resistance
junction/ambient
RthJA
450
K/W
Tsd
260
°C
Tamb ≤ 25 °C
Power dissipation
Soldering temperature
acc. figure 7
IR Emitter LEDS (Transmitter)
Symbol
Value
Unit
Reverse voltage
Parameter
Test condition
VRS
5
V
Forward current
IFS
50
mA
IFS
100
mA
Tjs
105
°C
Symbol
Value
Unit
Ts = 8 µs
tps = 4 µs
Peak forward current
Junction temperature
IR Emitter LEDC (Compensation)
Parameter
Test condition
Reverse voltage
VRC
5
V
Forward current
IFC
50
mA
IFC
100
mA
Tjs
105
°C
Unit
Ts = 8 µs
tpc = 4 µs
Peak forward current
Junction temperature
Detector
Symbol
Value
Reverse voltage
Parameter
Test condition
VRD
5
V
Junction temperature
TjD
105
°C
PV - Power Dissipation (mW)
200
150
R thJA
100
50
0
0
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Figure 1. Power Dissipation Limit vs. Ambient Temperature
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Document Number 84606
Rev. 1.2, 23-Aug-06
TCND3000
Vishay Semiconductors
Electrical Characteristics
Tamb = 25 °C, unless otherwise specified
Sensor
Parameter
Test condition
Symbol
Min
Typ.
Max
Unit
Light current
Kodak Grey Card
20 % diffuse reflection
distance: 1 cm
IFS = 10 mA
ICA
1.2
µA
Optical crosstalk sensing path
no reflective medium
IFS = 10 mA
ICA
0.9
µA
Compensation current
IFC = 2 mA
ICR
5
µA
IR Emitter LEDS (Transmitter)
Parameter
Test condition
Symbol
Forward voltage
IFS = 10 mA
tp = 20 ms
VFS
Reverse voltage
IRS = 10 µA
VRS
Min
Typ.
Max
Unit
1.3
V
CjS
50
pF
IFS = 10 mA
tp = 20 ms
Ie
2
IFS = 10 mA
λps
Spectral bandwidth
IFS = 10 mA
Δλs
42
nm
Virtual source diameter
DIN EN ISO 1146/1:2005
Ø
1.4
mm
Junction capacitance
Radiant intensity
ϕS
Angle of half intensity
Peak wavelength
5
875
V
22
mW/sr
± 20
deg
885
nm
IR Emitter LEDC (Compensation)
Parameter
Test condition
Symbol
Forward voltage
IFC = 10 mA
tpC = 20 ms
VFC
Reverse voltage
IRC = 10 µA
VRC
Junction capacitance
Min
Typ.
Max
Unit
1.3
V
CjC
50
pF
5
V
Peak wavelength
IFC = 10 mA
λpC
885
nm
Spectral bandwidth
IFC = 10 mA
ΔλC
42
nm
Detector
Parameter
Test condition
Symbol
Forward voltage
IFD = 50 mA
VFD
Breakdown voltage
IRD = 100 µA
E=0
V(BR)
Reverse dark current
VRD = 10 V, E = 0
Min
Typ.
Max
1.0
1.3
5
Unit
V
V
Ir0
1
Ira
5.6
µA
TKIra
0.2
%/K
Angle of half sensitivity
ϕD
± 20
deg
Wavelength of peak sensitivity
λp
910
nm
λ0.5
790...1020
nm
Reverse light current
Ee = 1 mW/cm
λ = 870 nm
VRD = 5 V
Temp. coefficient of Ira
VRD = 5 V
λ = 870 nm
Range of spectral bandwidth
Document Number 84606
Rev. 1.2, 23-Aug-06
2
10
nA
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TCND3000
Vishay Semiconductors
Typical Characteristics
Tamb = 25 °C unless otherwise specified
10°
20°
Ie, rel - Relative Radiant Intensity
30°
40°
1.0
0.9
50°
0.8
60°
70°
0.7
80°
94 8883
0.6
0.4
0.2
0
0.2
0.4
S( )rel - Relative Spectral Responsivity
0°
1.2
1.0
0.8
0.6
0.4
0.2
0.0
600
0.6
700
800
900
1000
1100
λ - Wavelength (nm)
Figure 2. Relative Radiant Intensity vs. Angular Displacement
0°
10°
Figure 4. Relative Spectral Sensitivity vs. Wavelength
20°
3.5
40°
1.0
0.9
50°
0.8
60°
ICA- Photocurrent (µA)
Srel - Relative Intensity
30°
3
2.5
I FS = 10 mA
2
1.5
1
Crosstalk Level
70°
0.7
80°
0.5
0
20181
0.6
0.4
0.2
0
0.2
0.4
0.6
1
10
100
d - Distance (mm)
Figure 3. Relative Radiant Sensitivity vs. Angular Displacement
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Figure 5. Photocurrent vs. Distance
Document Number 84606
Rev. 1.2, 23-Aug-06
TCND3000
Vishay Semiconductors
Application Circuit
Figure 6. Test circuit
Document Number 84606
Rev. 1.2, 23-Aug-06
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TCND3000
Vishay Semiconductors
Dimensions
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Document Number 84606
Rev. 1.2, 23-Aug-06
TCND3000
Vishay Semiconductors
Reflow Solder Profiles
Drypack
Temperature (°C)
Preheat
280
260
240
220
200
180
160
140
120
100
Reflow
260 °C
Devices are packed in moisture barrier bags (MBB) to
prevent products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
Cooling
250 °C
210 °C
Floor Life
145 °C
125 °C
~ 20 s
80
60
40
20
0
~ 30 s
~ 40 s
120 s
0
30
60
90
120
150
180
210
240
270
300
Time (s)
19030
Figure 7. Lead (Pb)-Free (Sn) Reflow Solder Profile
948625
300
max. 240 °C
10s
ca. 230 °C
Temperature (°C)
250
Floor life (time between soldering and removing from
MBB) must not exceed the time indicated in
J-STD-020. TCND3000 is released for: Moisture Sensitivity Level 4, according to JEDEC, J-STD-020.
Floor Life: 72 h
Conditions: Tamb < 30 °C, RH < 60 %
Drying
In case of moisture absorption devices should be
baked before soldering. Conditions see J-STD-020 or
label. Devices taped on reel dry using recommended
conditions 192 h at 40 °C (± 5 °C), RH < 5 % or 96 h
at 65 °C (± 5 °C), RH < 5 %.
200
215 °C
150
max 40s
max. 160 °C
100
90s - 120s
Lead Temperature
50
full line
dotted
2 K/s - 4 K/s
: typical
:process limits
0
0
50
100
150
200
250
Time (s)
Figure 8. Lead Tin (SnPb) Reflow Solder Profile
Document Number 84606
Rev. 1.2, 23-Aug-06
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TCND3000
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as
their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use
of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
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Document Number 84606
Rev. 1.2, 23-Aug-06
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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