AD AD677JNZ

REVISIONS
LTR
DESCRIPTION
A
DATE (YR-MO-DA)
Update boilerplate to reflect current requirements. -rrp
APPROVED
01-11-16
R. MONNIN
REV
SHEET
REV
SHEET
REV STATUS
REV
A
A
A
A
A
A
A
A
A
A
A
OF SHEETS
SHEET
1
2
3
4
5
6
7
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PMIC N/A
PREPARED BY
Dan Wonnell
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
CHECKED BY
Sandra Rooney
APPROVED BY
Michael A. Frye
MICROCIRCUIT, DIGITAL-LINEAR, FAST, SERIAL,
16-BIT, A/D CONVERTER, MULTICHIP SILICON
DRAWING APPROVAL DATE
96-01-16
REVISION LEVEL
A
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1 OF
5962-95592
11
5962-E073-02
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the
Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the
PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
95592
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
01
M
E
X
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
01
Circuit function
AD677
16-bit, 100 kSPS, serial, A/D converter
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Device requirements documentation
M
Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
E
Descriptive designator
CDIP2-T16
Terminals
Package style
16
Dual-in-line
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
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DSCC FORM 2234
APR 97
SIZE
5962-95592
A
REVISION LEVEL
A
SHEET
2
1.3 Absolute maximum ratings. 1/
VCC to VEE ....................................................................................................
VDD to DGND ...............................................................................................
VCC to AGND ...............................................................................................
VEE to AGND ...............................................................................................
AGND to DGND ..........................................................................................
Digital inputs (CAL, SAMPLE, CLK) to DGND ............................................
Analog inputs (VIN, VREF, AGND SENSE) to AGND ....................................
Power dissipation (PD):
VREF = 10 V ..............................................................................................
VREF = 5 V ................................................................................................
Thermal resistance, junction-to-case (θJC) ..................................................
Thermal resistance, junction-to-ambient (θJA) .............................................
Storage temperature range .........................................................................
Lead temperature (soldering, 10 sec) .........................................................
-0.3 V dc to +26.4 V dc
-0.3 V dc to +7 V dc
-0.3 V dc to +18 V dc
-18 V dc to +0.3 V dc
±0.3 V dc
0 V dc to +5.5 V dc
(VCC + 0.3 V) to (VEE – 0.3 V)
630 mW
530 mW
15°C/W
80°C/W
-65°C to +150°C
+300°C
1.4 Recommended operating conditions. 2/
Ambient operating temperature range (TA) .................................................
Positive analog supply voltage (VCC) ...........................................................
Negative analog supply voltage (VEE) .........................................................
Digital supply voltage (VDD) .........................................................................
Analog reference voltage (VREF) ..................................................................
Analog input voltage range (VIN) .................................................................
Analog ground sense voltage ......................................................................
-55°C to +125°C
11.4 V dc to 12.6 V dc
-11.4 V dc to –12.6 V dc
4.5 V dc to 5.5 V dc
5 V dc to 10 V dc
-VREF to VREF
-0.1 V dc to 0.1 V dc
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
1/
2/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
AGND and DGND tied at ADC.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
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DSCC FORM 2234
APR 97
SIZE
5962-95592
A
REVISION LEVEL
A
SHEET
3
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535
and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number H (see MIL-PRF-38535, appendix A).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
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APR 97
SIZE
5962-95592
A
REVISION LEVEL
A
SHEET
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
-55°C ≤ TA ≤ +125°C,
VCC = +12 V, VEE = -12 V,
VDD = +5 V, VREF = 10 V,
VIH = 2.0 V, VIL = 0.8 V
unless otherwise specified
Group A
subgroups
Device
type
Limits
Min
2.0
Unit
Max
Logic input high voltage
VIH
1,2,3
01
Logic input low voltage
VIL
1,2,3
01
Logic input current
ILIN
VIH = 5 V, VIL = 0 V
1,2,3
01
-10
Logic output high voltage
VOH
IOH = 0.5 mA
1,2,3
01
2.4
Logic output low voltage
VOL
IOL = 1.6 mA
1,2,3
01
0.4
V
Power supply current
ICC
VREF = 10 V,
device converting
1,2,3
01
24
mA
IEE
IEE
PD
INL
1,2,3
630
01
all codes
1
all codes 1/
Bipolar zero error
BPZE
code = 32767.5
±1.5
01
code = 0.5
1,2,3
01
1
01
1
16
1
VREF
Signal-to-noise + distortion
S/(N+D)
Total harmonic distortion
±3.0
01
Conversion time
±3.0
01
01
5
fIN = 1 kHz 2/
4,5,6
01
89
THD
fIN = 1 kHz
4,5,6
01
tC
see figure 2
9,11
01
tCLK
see figure 2
9,11
LSB
±4.0
10
10
V
dB
-95
10
CLK period
LSB
±4.0
1,2,3
2/
LSB
±4.0
2,3
Voltage reference input
Bits
±3.0
2,3
code = 65535.5
LSB
±2.0
2,3
AP
mW
530
DNL
Positive full-scale error
V
-20
VREF = 10 V
Differential nonlinearity
AN
µA
5
2,3
Negative full-scale error
+10
20
VREF = 5 V
Integral nonlinearity
V
5
VREF = 5 V,
device converting
IDD
Power dissipation
0.8
-24
IDD
ICC
V
dB
µs
13.3
01
480
10
ns
670
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
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COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
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A
REVISION LEVEL
A
SHEET
5
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Conditions
-55°C ≤ TA ≤ +125°C,
VCC = +12 V, VEE = -12 V,
VDD = +5 V, VREF = 10 V,
VIH = 2.0 V, VIL = 0.8 V
unless otherwise specified
Group A
subgroups
Device
type
Limits
Min
Unit
Max
85532
Calibration time
tCT
see figure 2
9,10,11
01
Sampling time
(included in tC)
CAL to BUSY delay
tS
see figure 2
9,10,11
01
tCALB
see figure 2
9,10,11
01
Last CLK to SAMPLE delay
tLCS
see figure 2
9,10,11
01
SAMPLE to BUSY delay
tSB
see figure 2
9,10,11
01
CLK high
tCH
see figure 2
9,10,11
01
50
ns
CLK low
tCL
see figure 2
9,10,11
01
50
ns
tFCD
see figure 2
9,10,11
01
50
ns
SCLK low
tSCL
see figure 2
9,10,11
01
35
ns
CLK to BUSY delay
tCB
see figure 2
9,10,11
01
CLK to SDATA valid
tCD
see figure 2
9,10,11
01
CLK to SCLK high
tCSH
see figure 2
9,10,11
SDATA to SCLK high
tDSH
see figure 2
Sample low
tSL
CAL HIGH
tCALH
1
ST
CLK delay
tCLK
µs
2
50
ns
µs
2.1
75
ns
350
ns
50
200
ns
01
75
350
ns
9,10,11
01
35
ns
see figure 2
9,10,11
01
100
ns
see figure 2
9,10,11
01
50
ns
1/ Minimum resolution for which “no missing codes” is guaranteed.
2/ VIN = 0.05 dB, fIN = 1 kHz, all measurements referred to a 0 dB (20 Vp-p) input signal. The full Nyquist bandwidth is used for
all values.
STANDARD
MICROCIRCUIT DRAWING
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APR 97
SIZE
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A
REVISION LEVEL
A
SHEET
6
Device type
Case outline
Terminal number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
01
E
Terminal symbol
SAMPLE
CLK
SDATA
DGND
VCC
NC
NC
AGND
AGND SENSE
VIN
VREF
VEE
VDD
SCLK
BUSY
CAL
NOTE: NC = No connect
FIGURE 1. Terminal connections.
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REVISION LEVEL
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Note: Shaded portions of input signals are optional. For best performance, it is recommended that these signals be held low
except when explicitly shown high.
FIGURE 2. Timing waveforms.
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4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be
in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1015.
(2) TA = +125°C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table II herein.
4.2.2 Additional criteria for device classes Q and V.
a.
The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1015 of MIL-STD-883.
b.
Interim and final electrical test parameters shall be as specified in table II herein.
c.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for
groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a.
Tests shall be as specified in table II herein.
b.
Subgroups 7 and 8 in table I, method 5005 of MIL-STD-883 shall be omitted.
STANDARD
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REVISION LEVEL
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SHEET
9
TABLE II. Electrical test requirements.
Test requirements
Interim electrical
parameters (see 4.2)
Final electrical
parameters (see 4.2)
Group A test
requirements (see 4.4)
Group C end-point electrical
parameters (see 4.4)
Group D end-point electrical
parameters (see 4.4)
Group E end-point electrical
parameters (see 4.4)
Subgroups
(in accordance with
MIL-STD-883,
method 5005, table I)
Device
class M
1
Subgroups
(in accordance with
MIL-PRF-38535, table III)
Device
class Q
1
Device
class V
1
1,2,3,4,5,6, 1/
9,10,11
1,2,3,4,5,6,
9,10,11
1
1,2,3,4,5,6, 1/
9,10,11
1,2,3,4,5,6,
9,10,11
1
1
1
1,2,3,4,5, 1/
6,9,10,11
1,2,3,4,5,6,
9,10,11
1,2,3,4,5,6,
9,10,11
1,4,9
1
1
1,4,9
1/ PDA applies to subgroup 1.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a.
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method
1005 of MIL-STD-883.
b.
TA = +125°C, minimum.
c.
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of
MIL-STD-883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness
assured (see 3.5 herein).
a.
End-point electrical parameters shall be as specified in table II herein.
b.
For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All
device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at
TA = +25°C ±5°C, after exposure, to the subgroups specified in table II herein.
c.
When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied.
STANDARD
MICROCIRCUIT DRAWING
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DSCC FORM 2234
APR 97
SIZE
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A
REVISION LEVEL
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SHEET
10
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device
classes Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system
application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users
and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering
microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone
(614) 692-0547.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.
The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to
this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DSCC-VA.
STANDARD
MICROCIRCUIT DRAWING
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COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
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REVISION LEVEL
A
SHEET
11
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 01-11-16
Approved sources of supply for SMD 5962-95592 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535.
Standard
microcircuit drawing
PIN 1/
5962-9559201MEA
Vendor
CAGE
number
24355
Vendor
similar
PIN 2/
AD677TD/883B
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
Vendor CAGE
number
Vendor name
and address
24355
Analog Devices
RT 1 Industrial Park
PO Box 9106
Norwood, MA 02062
Point of contact: 804 Woburn Street
Wilmington, MA 01887-3462
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.