INTEGRATED CIRCUITS DATA SHEET TDA1074A Dual tandem electronic potentiometer circuit Product specification File under Integrated Circuits, IC01 December 1982 Philips Semiconductors Product specification Dual tandem electronic potentiometer circuit TDA1074A GENERAL DESCRIPTION The TDA1074A is a monolithic integrated circuit designed for use as volume and tone control circuit in stereo amplifiers. This dual tandem potentiometer IC consists of two ganged pairs of electronic potentiometers with the eight inputs connected via impedance converters, and the four outputs driving individual operational amplifiers. The setting of each electronic potentiometer pair is controlled by an individual d.c. control voltage. The potentiometers operate by current division between the arms of cross-coupled long-tailed pairs. The current division factor is determined by the level and polarity of the d.c. control voltage with respect to an externally available reference level of half the supply voltage. Since the electronic potentiometers are adjusted by a d.c. control voltage, each pair can be controlled by single linear potentiometers which can be located in any position dictated by the equipment styling. Since the input feedback impedances around the operational amplifier gain blocks are external, the TDA1074A can perform bass/treble and volume/loudness control. It also can be used as a low-level fader to control the sound distribution between the front and rear loudspeakers in car radio installations. Features • High impedance inputs to both ‘ends’ of each electronic potentiometer • Ganged potentiometers track within 0,5 dB • Electronic rejection of supply ripple • Internally generated reference level available externally so that the control voltage can be made to swing positively and negatively around a well-defined 0 V level • The operational amplifiers have push-pull outputs for wide voltage swing and low current consumption • The operational amplifier outputs are current limited to provide output short-circuit protection • Although designed to operate from a 20 V supply (giving a maximum input and output signal level of 6 V), the TDA1074A can work from a supply as low as 7,5 V with reduced input and output signal levels. QUICK REFERENCE DATA Supply voltage (pin 11) VP typ. 20 V Supply current (pin 11) IP typ. 22 mA Input signal voltage (r.m.s. value) Vi(rms) max. 6 V Output signal voltage (r.m.s. value) Vo(rms) max. 6 V Total harmonic distortion THD typ. Output noise voltage (r.m.s. value) Vno(rms) typ. 50 µV Control range ∆α typ. 110 dB Cross-talk attenuation (L/R) αct typ. 80 dB Ripple rejection (100 Hz) α100 typ. 46 dB Tracking of ganged potentiometers ∆Gv typ. 0,5 dB Supply voltage range VP Operating ambient temperature range Tamb PACKAGE OUTLINE 18-lead DIL; plastic (SOT102); SOT102-1; 1996 July 18. December 1982 2 0,05 % 7,5 to 23 V −30 to + 80 °C Philips Semiconductors Product specification Dual tandem electronic potentiometer circuit Fig.1 TDA1074A Block diagram and basic external components; Ic1 (at pin 9) and Ic2 (at pin 10) are control input currents; Vc1 (at pin 9) and Vc2 (at pin 10) are control input voltages with respect to Vref = VP/2 at pin 8; Z1 = Z2 = Z3 = Z4 = 22 kΩ; the input generator resistance RG = 60 Ω; the output load resistance RL = 4,7 kΩ; the coupling capacitors at the inputs and outputs are Ci = 2,2 µF and Co = 10 µF respectively. December 1982 3 Philips Semiconductors Product specification Dual tandem electronic potentiometer circuit TDA1074A RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage (pin 11) VP max. 23 V Control voltages (pins 9 and 10) ±Vc1; ±Vc2 max. 1V Input voltage ranges (with respect to pin 18) at pins 3, 4, 5, 6, 13, 14, 15, 16 0 to VP V Vi max. 800 mW Total power dissipation Ptot Storage temperature range Tstg −55 to + 150 °C Operating ambient temperature range Tamb −30 to + 80 °C THERMAL RESISTANCE From crystal to ambient Rth cr-a = 80 K/W REMARK The difference between the TDA1074 and its successor the TDA1074A is shown in Fig.2 as the different component configuration at pin 8. Fig.2 Component configuration at pin 8 showing the difference between the TDA1074 and the TDA1074A. December 1982 4 Philips Semiconductors Product specification Dual tandem electronic potentiometer circuit TDA1074A APPLICATION INFORMATION Treble and bass control circuit VP = 20 V; Tamb = 25 °C; measured in Fig.3; RG = 60 Ω; RL > 4,7 kΩ; CL < 30 pF; f = 1 kHz; with a linear frequency response (Vc1 = Vc2 = 0 V); unless otherwise specified PARAMETER Supply current (without load) SYMBOL MIN. TYP. MAX. UNIT IP 14 22 30 mA f 10 − 20 000 Hz Gv(1) − 0 − dB ∆Gv(1) − ±1 − dB − 17,5 − dB − 17,5 − dB − 16 − dB − 16 − dB Frequency response (−1 dB) Vc1 = Vc2 = 0 V Voltage gain at linear frequency response (Vc1 = Vc2 = 0 V) Gain variation at f = 1 kHz at maximum bass/treble boost or cut at ±Vc1 = ±Vc2 = 120 mV Bass boost at 40 Hz (ref. 1 kHz) Vc2 = 120 mV Bass cut at 40 Hz (ref. 1 kHz) −Vc2 = 120 mV Treble boost at 16 kHz (ref. 1 kHz) Vc1 = 120 mV Treble cut at 16 kHz (ref. 1 kHz) −Vc1 = 120 mV Total harmonic distortion at Vo(rms) = 300 mV f = 1 kHz (measured selectively) THD − 0,002 − % f = 20 Hz to 20 kHz THD − 0,005 − % f = 1 kHz THD − 0,015 0,1 % f = 20 Hz to 20 kHz THD − 0,05 0,1 % Vi; o(rms) 5,5 6,2 − V B − 40 − kHz at Vo(rms) = 5 V Signal level at THD = 0,7% (input and output) Power bandwidth at reference level Vo(rms) = 5 V (−3 dB); THD = 0,1% December 1982 5 Philips Semiconductors Product specification Dual tandem electronic potentiometer circuit TDA1074A PARAMETER SYMBOL MIN. TYP. MAX. UNIT Output noise voltages signal plus noise (r.m.s. value); Vno(rms) − 75 − µV Vno(m) − 160 230 µV f = 1 kHz αct − 86 − dB f = 20 Hz to 20 kHz αct − 80 − dB −αct − 20 − dB α100 − 46 − dB f = 20 Hz to 20 kHz noise (peak value); weighted to DIN 45 405; CCITT filter Cross-talk attenuation (stereo) Control voltage cross-talk to the outputs at f = 1 kHz; Vc1(rms) = Vc2(rms) = 1 mV Ripple rejection at f = 100 Hz; VP(rms) < 200 mV Note 1. Gv = Vo / Vi. December 1982 6 Philips Semiconductors Product specification Dual tandem electronic potentiometer circuit TDA1074A Fig.3 Application diagram for treble and bass control. December 1982 7 Philips Semiconductors Product specification Dual tandem electronic potentiometer circuit TDA1074A Fig.4 Frequency response curves; voltage gain (treble and bass) as a function of frequency. Fig.5 Control curve; voltage gain (bass) as a function of the control voltage (Vc2); f = 40 Hz. December 1982 Fig.6 8 Control curve; voltage gain (treble) as a function of the control voltage (Vc1); f = 16 kHz. Philips Semiconductors Product specification Dual tandem electronic potentiometer circuit TDA1074A curve no. 1 10 kΩ 2 100 kΩ 3 220 kΩ 4 470 kΩ 5 Fig.7 1 MΩ Voltage gain (Gv = Vo / Vi) control curves as a function of the angle of rotation (α) of a linear potentiometer (R); for curve numbers see table above; f = 40 Hz to 16 kHz. Fig.8 Circuit diagram for measuring curves in Fig.7. December 1982 value of R 9 Philips Semiconductors Product specification Dual tandem electronic potentiometer circuit TDA1074A Fig.9 Output signal level as a function of VP; THD = 0,7%; f = 1 kHz; Vc1 = Vc2 = 0 V. Fig.10 Total harmonic distortion as a function of the output level; VP = 20 V; RL = 4,7 kΩ; Vc1 = Vc2 = 0 V (linear, Gv tot = 1). f = 1 kHz; − − − − f = 20 kHz. December 1982 10 Philips Semiconductors Product specification Dual tandem electronic potentiometer circuit TDA1074A Fig.11 Power bandwidth at THD = 0,1%; reference level is 5 V (r.m.s.). Fig.12 Cross-talk as a function of frequency; linear treble/bass setting (Vc1 = Vc2 = 0 V); Vi = 5 V; RG = 60 Ω; RL = 4,7 kΩ. December 1982 11 Philips Semiconductors Product specification Dual tandem electronic potentiometer circuit TDA1074A Application recommendations 1. If one or more electronic potentiometers in an IC are not used, the following is recommended: a) Unused signal inputs of an electronic potentiometer should be connected to the associated output, e.g. pins 3 and 4 to pin 2. b) Unused control voltage inputs should be connected directly to pin 8 (Vref). 2. Where more than one TDA1074A IC are used in an application, pins 1 can be connected together; however, pins 8 (Vref) may not be connected together directly. 3. Additional circuitry for limiting the frequency response in the ultrasonic range: see Fig.13 4. Alternative circuitry for limiting the gain of the treble control circuit in the ultrasonic range: see Fig.14 (1) f−3 dB = 110 kHz at linear setting. Fig.13 Circuit diagram for frequency response limiting. December 1982 12 Philips Semiconductors Product specification Dual tandem electronic potentiometer circuit TDA1074A For RS1 = RS2 = 3,3 kΩ; f−3 dB ≅ 1 MHz at linear setting. For RS1 = RS2 = 0 Ω; f−3 dB ≅ 100 kHz at linear setting. Fig.14 Circuit diagram for limiting gain of treble control circuit. December 1982 13 Philips Semiconductors Product specification Dual tandem electronic potentiometer circuit TDA1074A PACKAGE OUTLINE DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 1.40 1.14 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 0.85 inches 0.19 0.020 0.15 0.055 0.044 0.021 0.015 0.055 0.044 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.033 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 93-10-14 95-01-23 SOT102-1 December 1982 EUROPEAN PROJECTION 14 Philips Semiconductors Product specification Dual tandem electronic potentiometer circuit TDA1074A The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. December 1982 15