IRF ST223C

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DISCRETE POWER DIODES and THYRISTORS
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Bulletin
I25174/A
ST223C..C SERIES
INVERTER GRADE THYRISTORS
Hockey Puk Version
Features
Metal case with ceramic insulator
International standard case TO-200AB (A-PUK)
All diffused design
390A
Center amplifying gate
Guaranteed high dV/dt
Guaranteed high dI/dt
High surge current capability
Low thermal impedance
High speed performance
Typical Applications
Inverters
Choppers
Induction heating
case style TO-200AB (A-PUK)
All types of force-commutated converters
Major Ratings and Characteristics
Parameters
ST223C..C
Units
390
A
55
°C
745
A
25
°C
@ 50Hz
5850
A
@ 60Hz
6130
A
@ 50Hz
171
KA2s
@ 60Hz
156
KA2s
400 to 800
V
10 to 30
µs
- 40 to 125
°C
IT(AV)
@ Ths
IT(RMS)
@ Ths
ITSM
I 2t
V DRM /V RRM
tq range
TJ
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ELECTRICAL SPECIFICATIONS
Voltage Ratings
Voltage
V DRM /V RRM , maximum
VRSM , maximum
I DRM /I RRM max.
Code
repetitive peak voltage
non-repetitive peak voltage
@ TJ = TJ max.
V
V
mA
04
400
500
08
800
900
Type number
ST223C..C
40
Current Carrying Capability
ITM
Frequency
ITM
ITM
180oel
180oel
Units
100µs
50Hz
400Hz
930
910
800
770
1430
1490
1220
1300
5870
3120
5240
2740
1000Hz
780
650
1430
1260
1880
1640
2500Hz
490
400
1070
920
1000
860
Recovery voltage Vr
Voltage before turn-on Vd
50
50
50
50
50
50
Rise of on-state current di/dt
50
50
-
-
-
-
A/µs
Heatsink temperature
40
55
40
55
40
55
°C
Equivalent values for RC circuit
47Ω / 0.22µF
V DRM
V DRM
V DRM
47Ω / 0.22µF
A
V
47Ω / 0.22µF
On-state Conduction
Parameter
I T(AV)
ST223C..C
Max. average on-state current
@ Heatsink temperature
Units Conditions
390 (150)
A
180° conduction, half sine wave
55 (85)
°C
double side (single side) cooled
I T(RMS) Max. RMS on-state current
745
DC @ 25°C heatsink temperature double side cooled
I TSM
Max. peak, one half cycle,
5850
t = 10ms
No voltage
non-repetitive surge current
6130
t = 8.3ms
reapplied
4920
t = 10ms
100% VRRM
5150
t = 8.3ms
reapplied
Sinusoidal half wave,
171
t = 10ms
No voltage
Initial TJ = TJ max
t = 8.3ms
reapplied
t = 10ms
100% VRRM
t = 8.3ms
reapplied
2
I t
2
Maximum I t for fusing
A
156
121
KA2s
110
I 2 √t
Maximum I2√t for fusing
1710
KA2√s
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t = 0.1 to 10ms, no voltage reapplied
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Fig. 3 - Current Ratings Characteristics
Fig. 4 - Current Ratings Characteristics
Fig. 5 - On-state Power Loss Characteristics
Fig. 6 - On-state Power Loss Characteristics
Fig. 7 - Maximum Non-repetitive Surge Current
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Fig. 8 - Maximum Non-repetitive Surge Current
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Fig. 9 - On-state Voltage Drop Characteristics
Fig. 11 - Reverse Recovered Charge Characteristics
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Fig. 10 - Thermal Impedance ZthJ-hs Characteristics
Fig. 12 - Reverse Recovery Current Characteristics
Fig. 13 - Frequency Characteristics
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Fig. 14 - Frequency Characteristics
Fig. 15 - Frequency Characteristics
Fig. 16 - Maximum On-state Energy Power Loss Characteristics
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Fig. 17 - Gate Characteristics
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On-state Conduction
Parameter
V TM
Max. peak on-state voltage
V T(TO)1 Low level value of threshold
voltage
V T(TO)2 High level value of threshold
voltage
rt1
Low level value of forward
slope resistance
rt2
ST223C..C Units
1.58
1.05
ITM= 600A, TJ = TJ max, tp = 10ms sine wave pulse
V
0.88
mΩ
IH
600
IL
Typical latching current
1000
(16.7% x π x IT(AV) < I < π x IT(AV)), TJ = TJ max.
(I > π x IT(AV)), TJ = TJ max.
1.09
High level value of forward
slope resistance
Maximum holding current
Conditions
(16.7% x π x IT(AV) < I < π x IT(AV)), TJ = TJ max.
(I > π x IT(AV)), TJ = TJ max.
0.82
mA
T J = 25°C, I T > 30A
T J = 25°C, V A= 12V, Ra = 6Ω, I G= 1A
Switching
Parameter
di/dt
Max. non-repetitive rate of rise
of turned-on current
td
tq
Typical delay time
Max. turn-off time
ST223C..C Units
1000
A/µs
0.78
Min
10
Max
30
µs
Conditions
TJ = TJ max, VDRM = rated VDRM
ITM = 2 x di/dt
TJ= 25°C, VDM = rated VDRM, ITM = 50A DC, tp= 1µs
Resistive load, Gate pulse: 10V, 5Ω source
TJ = TJ max, ITM = 300A, commutating di/dt = 20A/µs
VR = 50V, tp = 500µs, dv/dt: see table in device code
Blocking
Parameter
ST223C..C Units
dv/dt
Maximum critical rate of rise of
off-state voltage
500
V/µs
IRRM
IDRM
Max. peak reverse and off-state
leakage current
40
mA
Conditions
TJ = TJ max. linear to 80% VDRM, higher value
available on request
TJ = TJ max, rated V DRM/V RRM applied
Triggering
Parameter
PGM
Maximum peak gate power
ST223C..C Units
60
PG(AV) Maximum average gate power
10
IGM
Max. peak positive gate current
10
+VGM
Maximum peak positive
gate voltage
20
-VGM
Maximum peak negative
gate voltage
IGT
Max. DC gate current required
to trigger
VGT
Max. DC gate voltage required
to trigger
Conditions
W
TJ = TJ max, f = 50Hz, d% = 50
A
TJ = TJ max, tp ≤ 5ms
V
TJ = TJ max, tp ≤ 5ms
5
200
mA
TJ = 25°C, VA = 12V, Ra = 6Ω
3
V
IGD
Max. DC gate current not to trigger
20
mA
VGD
Max. DC gate voltage not to trigger
0.25
V
TJ = TJ max, rated VDRM applied
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Thermal and Mechanical Specification
Parameter
ST223C..C
TJ
Max. operating temperature range
-40 to 125
Tstg
Max. storage temperature range
-40 to 150
RthJ-hs Max. thermal resistance,
DC operation single side cooled
K/W
0.08
RthC-hs Max. thermal resistance,
wt
°C
0.17
junction to heatsink
F
Units Conditions
0.033
0.017
Mounting force, ± 10%
5900
N
(600)
(Kg)
50
g
Case style
DC operation single side cooled
K/W
case to heatsink
Approximate weight
DC operation double side cooled
DC operation double side cooled
TO - 200AB (A-PUK)
See Outline Table
∆RthJ-hs Conduction
(The following table shows the increment of thermal resistence RthJ-hs when devices operate at different conduction angles than DC)
Conduction angle
Sinusoidal conduction Rectangular conduction
Single Side Double Side
Units
Conditions
K/W
TJ = TJ max.
Single Side Double Side
180°
0.015
0.017
0.011
0.011
120°
0.019
0.019
0.019
0.019
90°
0.024
0.024
0.026
0.026
60°
0.035
0.035
0.036
0.037
30°
0.060
0.060
0.060
0.061
Ordering Information Table
Device Code
ST
22
3
C
08
C
H
K
1
1
2
3
4
5
6
7
8
9
10
1 - Thyristor
2 - Essential part number
3 - 3 = Fast turn off
4 - C = Ceramic Puk
5 - Voltage code: Code x 100 = VRRM (See Voltage Rating Table)
6 - C = Puk Case TO-200AB (A-PUK)
7 - Reapplied dv/dt code (for tq test condition)
dv/dt - tq combinations available
dv/dt (V/µs)
20
50
100
200
400
10
12
15
18
20
25
30
CN
CM
CL
CP
CK
---
DN
DM
DL
DP
DK
---
EN
EM
EL
EP
EK
---
FN *
FM
FL *
FP
FK
---
--HL
HP
HK
HJ
HH
8 - tq code
9 - 0 = Eyelet term. (Gate and Aux. Cathode Unsoldered Leads)
1 = Fast-on term. (Gate and Aux. Cathode Unsoldered Leads)
2 = Eyelet term. (Gate and Aux. Cathode Soldered Leads)
3 = Fast-on term. (Gate and Aux. Cathode Soldered Leads)
10 - Critical dv/dt:
tq (µs)
*Standard part number.
All other types available only on request.
None = 500V/µsec (Standard value)
L
= 1000V/µsec (Special selection)
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Outline Table
ANODE TO GATE
CREEPAGE DISTANCE: 7.62 (0.30) MIN.
STRIKE DISTANCE: 7.12 (0.28) MIN.
19 (0.75)
0.3 (0.01) MIN.
DIA. MAX.
13.7 / 14.4
(0.54 / 0.57)
0.3 (0.01) MIN.
19 (0.75)
GATE TERM. FOR
1.47 (0.06) DIA.
PIN RECEPTACLE
DIA. MAX.
38 (1.50) DIA MAX.
Case Style TO-200AB (A-PUK)
All dimensions in millimeters (inches)
2 HOLES 3.56 (0.14) x
1.83 (0.07) MIN. DEEP
6.5 (0.26)
4.75 (0.19)
25°± 5°
42 (1.65) MAX.
28 (1.10)
Fig. 1 - Current Ratings Characteristics
Fig. 2 - Current Ratings Characteristics
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