FAIRCHILD 74ABT240CMSA

Revised November 1999
74ABT240
Octal Buffer/Line Driver with 3-STATE Outputs
General Description
Features
The ABT240 is an inverting octal buffer and line driver
designed to be employed as a memory address driver,
clock driver and bus oriented transmitter or receiver which
provides improved PC board density.
■ Output sink capability of 64 mA, source capability of
32 mA
■ Guaranteed latchup protection
■ High impedance glitch free bus loading during entire
power up and power down cycle
■ Nondestructive hot insertion capability
Ordering Code:
Order Number
74ABT240CSC
74ABT240CSJ
Package Number
M20B
M20D
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide Body
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74ABT240CMSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
74ABT240CMTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Connection Diagram
Pin Descriptions
Pin Names
Description
OE1, OE2
3-STATE Output
Enable Inputs
I0–I7
Inputs
O0–O7
Outputs
Truth Tables
Inputs
OE1
In
Outputs
(Pins 12, 14, 16, 18)
L
L
L
H
L
H
X
Z
Inputs
H
Outputs
(Pins 3, 5, 7, 9)
OE2
In
L
L
L
H
L
H
X
Z
H
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
© 1999 Fairchild Semiconductor Corporation
DS011664
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74ABT240 Octal Buffer/Line Driver with 3-STATE Outputs
March 1994
74ABT240
Absolute Maximum Ratings(Note 1)
Storage Temperature
−65°C to +150°C
Junction Temperature under Bias
−55°C to +150°C
Recommended Operating
Conditions
−40°C to +85°C
Free Air Ambient Temperature
VCC Pin Potential to Ground Pin
−0.5V to +7.0V
Supply Voltage
Input Voltage (Note 2)
−0.5V to +7.0V
Minimum Input Edge Rate (∆V/∆t)
Input Current (Note 2)
−30 mA to +5.0 mA
Voltage Applied to Any Output
+4.5V to +5.5V
Data Input
50 mV/ns
Enable Input
20 mV/ns
in the Disabled or
Power-Off State
−0.5V to 5.5V
in the HIGH State
−0.5V to VCC
Current Applied to Output
in LOW State (Max)
twice the rated IOL (mA)
DC Latchup Source Current
(Across Comm Operating Range)
−150 mA
Over Voltage Latchup (I/O)
Note 1: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired. Functional operation
under these conditions is not implied.
10V
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
Symbol
Parameter
Min
Typ
Max
2.0
Units
VCC
V
Conditions
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
0.8
V
VCD
Input Clamp Diode Voltage
−1.2
V
Min
VOH
Output HIGH Voltage
2.5
V
Min
IOH = −3 mA
2.0
V
Min
IOH = −32 mA
V
Min
VOL
Output LOW Voltage
0.55
IIH
Input HIGH Current
1
IBVI
Input HIGH Current Breakdown Test
7
IIL
Input LOW Current
−1
1
−1
VID
Input Leakage Test
4.75
IOZH
Output Leakage Current
IOZL
Output Leakage Current
IOS
Output Short-Circuit Current
ICEX
Recognized HIGH Signal
Recognized LOW Signal
µA
Max
µA
Max
µA
Max
V
0.0
IIN = −18 mA
IOL = 64 mA
VIN = 2.7V (Note 3)
VIN = VCC
VIN = 7.0V
VIN = 0.5V (Note 3)
VIN = 0.0V
IID = 1.9 µA
All Other Pins Grounded
10
µA
0 − 5.5V VOUT = 2.7V; OEn = 2.0V
0 − 5.5V VOUT = 0.5V; OEn = 2.0V
−10
µA
−275
mA
Max
VOUT = 0.0V
Output HIGH Leakage Current
50
µA
Max
VOUT = VCC
IZZ
Bus Drainage Test
100
µA
0.0
VOUT = 5.5V; All Others GND
ICCH
Power Supply Current
50
µA
Max
All Outputs HIGH
ICCL
Power Supply Current
30
mA
Max
All Outputs LOW
ICCZ
Power Supply Current
50
µA
Max
−100
OEn = VCC;
All Others at VCC or Ground
ICCT
Additional ICC/Input
Outputs Enabled
1.5
mA
VI = VCC − 2.1V
Outputs 3-STATE
1.5
mA
Enable Input VI = VCC − 2.1V
Outputs 3-STATE
50
µA
Max
Data Input VI = VCC − 2.1V
All Others at VCC or Ground
ICCD
Dynamic ICC
No Load
mA/
(Note 3)
0.1
MHz
Outputs Open
Max
OEn = GND, (Note 4)
One Bit Toggling, 50% Duty Cycle
Note 3: Guaranteed, but not tested.
Note 4: For 8 bits toggling, ICCD < 0.8 mA/MHz.
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Symbol
Parameter
Min
TA = +25°C
TA = −55°C to +125°C
TA = −40°C to +85°C
VCC = +5V
VCC = 4.5V–5.5V
VCC = 4.5V–5.5V
CL = 50 pF
CL = 50 pF
Typ
CL = 50 pF
Max
Min
Max
Min
Max
tPLH
Propagation Delay
1.0
4.8
0.8
5.5
1.0
4.8
tPHL
Data to Outputs
1.6
4.8
1.0
5.5
1.6
4.8
tPZH
Output Enable
1.1
6.2
0.8
7.5
1.1
6.2
tPZL
Time
1.1
6.2
0.8
7.7
1.1
6.2
tPHZ
Output Disable
1.8
6.4
1.0
7.5
1.8
6.4
tPLZ
Time
1.6
5.8
1.0
7.2
1.6
5.8
Units
ns
ns
ns
Capacitance
Symbol
Parameter
Typ
Units
Conditions
TA = 25°C
CIN
Input Capacitance
5.0
pF
VCC = 0V
COUT (Note 5)
Output Capacitance
9.0
pF
VCC = 5.0V
Note 5: COUT is measured at frequency f = 1 MHz, per MIL-STD-883, Method 3012.
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74ABT240
AC Electrical Characteristics
74ABT240
AC Loading
*Includes jig and probe capacitance
Standard AC Test Load
Test Input Signal Levels
Amplitude
Rep. Rate
tW
tr
tf
3.0V
1 MHz
500 ns
2.5 ns
2.5 ns
Test Input Signal Requirements
AC Waveforms
Propagation Delay,
Pulse Width Waveforms
Propagation Delay Waveforms for
Inverting and Non-Inverting Functions
3-STATE Output HIGH
and LOW Enable and Disable Times
Setup Time, Hold Time
and Recovery Time Waveforms
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74ABT240
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide Body
Package Number M20B
5
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74ABT240
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
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74ABT240
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
Package Number MSA20
7
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74ABT240 Octal Buffer/Line Driver with 3-STATE Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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