IRF IRG4PSC71KD

PD - 91684A
PRELIMINARY
IRG4PSC71KD
Short Circuit Rated
UltraFast IGBT
INSULATED GATE BIPOLAR TRANSISTOR WITH
ULTRAFAST SOFT RECOVERY DIODE
C
Features
• Hole-less clip/pressure mount package compatible
with TO-247 and TO-264, with reinforced pins
• High abort circuit rating IGBTs, optimized for
motorcontrol
• Minimum switching losses combined with low
conduction losses
• Tightest parameter distribution
• IGBT co-packaged with ultrafast soft recovery
antiparallel diode
• Creepage distance increased to 5.35mm
VCES = 600V
VCE(on) typ. = 1.83V
G
@VGE = 15V, IC = 60A
E
n-ch an nel
Benefits
• Highest current rating copack IGBT
• Maximum power density, twice the power
handling of the TO-247, less space than TO-264
• HEXFREDTM diode optimized for operation with
IGBT, to minimize EMI, noise and switching losses
SUPER - 247
Absolute Maximum Ratings
Parameter
VCES
IC @ TC = 25°C
IC @ TC = 100°C
ICM
ILM
IF @ TC = 100°C
IFM
tsc
VGE
PD @ TC = 25°C
PD @ TC = 100°C
TJ
TSTG
Collector-to-Emitter Voltage
Continuous Collector Current
Continuous Collector Current
Pulsed Collector Current 
Clamped Inductive Load Current ‚
Diode Continuous Forward Current
Diode Maximum Forward Current
Short Circuit Withstand Time
Gate-to-Emitter Voltage
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 sec.
Max.
Units
600
85 …
60
200
200
50
200
10
± 20
350
140
-55 to +150
V
A
µs
V
W
°C
300 (0.063 in. (1.6mm) from case)
Thermal Resistance\ Mechanical
Parameter
RθJC
RθJC
RθCS
RθJA
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Junction-to-Case - IGBT
Junction-to-Case - Diode
Case-to-Sink, flat, greased surface
Junction-to-Ambient, typical socket mount
Recommended Clip Force
Weight
Min.
Typ.
Max.
–––
–––
–––
–––
20.0(2.0)
–––
–––
–––
0.24
–––
–––
6 (0.21)
0.36
0.69
–––
38
–––
–––
Units
°C/W
N (kgf)
g (oz)
1
5/11/99
IRG4PSC71KD
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
V(BR)CES
∆V(BR)CES/∆TJ
VCE(on)
VGE(th)
∆VGE(th)/∆TJ
gfe
ICES
VFM
IGES
Parameter
Min. Typ. Max. Units
Collector-to-Emitter Breakdown Voltageƒ 600 —
—
V
Temperature Coeff. of Breakdown Voltage —
0.5
— V/°C
Collector-to-Emitter Saturation Voltage
— 1.83 2.3
— 2.20 —
V
— 1.81 —
Gate Threshold Voltage
3.0
—
6.0
Temperature Coeff. of Threshold Voltage
— -8.0 — mV/°C
Forward Transconductance „
31
46
—
S
Zero Gate Voltage Collector Current
—
—
500
µA
—
—
13
mA
Diode Forward Voltage Drop
—
1.4 1.7
V
—
1.3
—
Gate-to-Emitter Leakage Current
—
— ±100 nA
Conditions
VGE = 0V, IC = 250µA
VGE = 0V, IC = 10mA
IC = 60A
VGE = 15V
See Fig. 2, 5
IC = 100A
IC = 60A, TJ = 150°C
VCE = VGE, IC = 250µA
VCE = VGE, IC = 1.5mA
VCE = 50V, IC = 60A
VGE = 0V, VCE = 600V
VGE = 0V, VCE = 600V, TJ = 150°C
IC = 60A
See Fig. 13
IC = 60A, TJ = 150°C
VGE = ±20V
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Qg
Qge
Qgc
td(on)
tr
td(off)
tf
Eon
Eoff
Ets
tsc
Parameter
Total Gate Charge (turn-on)
Gate - Emitter Charge (turn-on)
Gate - Collector Charge (turn-on)
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Short Circuit Withstand Time
td(on)
tr
td(off)
tf
Ets
LE
Cies
Coes
Cres
trr
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Switching Loss
Internal Emitter Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Diode Reverse Recovery Time
Irr
Diode Peak Reverse Recovery Current
Qrr
Diode Reverse Recovery Charge
di(rec)M /dt
Diode Peak Rate of Fall of Recovery
During tb
2
Min.
—
—
—
—
—
—
—
—
—
—
10
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ. Max. Units
Conditions
340 510
IC = 60A
44
66
nC
VCC = 400V
See Fig.8
160 240
VGE = 15V
82
—
107
—
TJ = 25°C
ns
282 423
IC = 60A, VCC = 480V
97 146
VGE = 15V, RG = 5.0Ω
3.95 —
Energy losses include "tail"
2.33 —
mJ and diode reverse recovery
6.28 7.7
See Fig. 9,10,18
—
—
µs
VCC = 360V, TJ = 125°C
VGE = 15V, RG = 5.0Ω , VCPK < 500V
87
—
TJ = 150°C,
See Fig. 11,18
104
—
IC = 60A, VCC = 480V
ns
374
—
VGE = 15V, RG = 5.0Ω
143
—
Energy losses include "tail"
8.5
—
mJ and diode reverse recovery
13
—
nH
Measured 5mm from package
6900 —
VGE = 0V
730
—
pF
VCC = 30V
See Fig. 7
190
—
ƒ = 1.0MHz
82 120
ns
TJ = 25°C See Fig.
140 210
TJ = 125°C
14
IF = 60A
8.2
12
A
TJ = 25°C See Fig.
13
20
TJ = 125°C
15
VR = 200V
364 546
nC
TJ = 25°C See Fig.
1084 1625
TJ = 125°C
16
di/dt = 200A/µs
328
—
A/µs TJ = 25°C See Fig.
266
—
TJ = 125°C
17
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IRG4PSC71KD
60
LOAD CURRENT (A)
F o r b o th :
D u ty c y c le : 5 0 %
TJ = 1 2 5 ° C
T sink = 9 0 ° C
G a te d riv e a s s p e c ifie d
45
P o w e r D is s ip a tio n = 58 W
S q u a re w a v e :
6 0% of rate d
volta ge
30
I
15
Id e a l d io d e s
0
0.1
1
10
100
f, Frequency (KHz)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = IRMS of fundamental)
Ic , Collector-to-Emitter Current (A)
100
I C , Collector-to-Emitter Current (A)
1000
1000
100
TJ = 1 5 0 °C
10
TJ = 2 5 °C
VG E = 15 V
2 0µ s P U L SE W ID TH A
1
0
1
2
3
VC E , C olle ctor-to-Em itter Vo ltag e (V)
Fig. 2 - Typical Output Characteristics
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4
TJ = 150 °C
10
TJ = 25 °C
V CC = 50V
5µs PULSE WIDTH
1
5
6
7
8
9
10
11
VGE , Gate-to-Emitter Voltage (V)
Fig. 3 - Typical Transfer Characteristics
3
IRG4PSC71KD
100
3.0
VCE , Collector-to-Emitter Voltage(V)
Maximum DC Collector Current (A)
LIM ITED BY PA C KA G E
80
60
40
20
V G E = 15 V
A
0
25
50
75
100
125
I C = 120 A
2.0
I C = 60 A
I C = 30 A
1.0
-60 -40 -20
150
0
20
40
60
80 100 120 140 160
TJ , Junction Temperature ( ° C)
TC , C ase Tem p era ture (°C )
Fig. 4 - Maximum Collector Current vs. Case
Temperature
VGE = 15V
80 us PULSE WIDTH
Fig. 5 - Typical Collector-to-Emitter Voltage
vs. Junction Temperature
Thermal Response (ZthJC)
1
D = 0 .50
0.1
0 .20
PDM
0 .1 0
0.05
0.0 2
0.01
t
1
t2
SIN G L E PU L SE
(T HE R M A L R ES PO N SE )
Notes:
1. Duty factor D = t
1 / t2
2. Peak TJ = PDM x Z thJC + TC
0.01
0.0001
0.001
0.01
0.1
1
10
A
100
t 1 , R e ctang ular Pulse D uratio n (sec)
Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
4
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IRG4PSC71KD
10000
VGE , Gate-to-Emitter Voltage (V)
8000
C, Capacitance (pF)
20
VGE = 0V,
f = 1MHz
Cies = Cge + Cgc , Cce SHORTED
Cres = Cgc
Coes = Cce + Cgc
C ies
6000
4000
2000
Coes
VCC = 400V
I C = 60A
16
12
8
4
C res
0
1
10
0
100
0
VCE , Collector-to-Emitter Voltage (V)
Fig. 7 - Typical Capacitance vs.
Collector-to-Emitter Voltage
Total Switching Losses (mJ)
Total Switching Losses (mJ)
V CC = 480V
V GE = 15V
TJ = 25 ° C
I C = 60A
12.0
10.0
8.0
6.0
0
10
20
30
40
RG , Gate Resistance ( Ω )
Fig. 9 - Typical Switching Losses vs. Gate
Resistance
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(Ω)
200
300
400
Fig. 8 - Typical Gate Charge vs.
Gate-to-Emitter Voltage
100
14.0
100
QG , Total Gate Charge (nC)
50
RG = 5.0 Ω
VGE = 15V
VCC = 480V
IC = 120 A
10
IC = 60 A
IC = 30 A
1
-60 -40 -20
0
20
40
60
80 100 120 140 160
TJ , Junction Temperature ( ° C )
Fig. 10 - Typical Switching Losses vs.
Junction Temperature
5
IRG4PSC71KD
RG
TJ
VCC
20
VGE
1000
= 5.0 Ω
= 150 °C
= 480V
= 15V
I C, Collector Current (A)
Total Switching Losses (mJ)
24
16
12
8
VGE = 20V
T J = 125 oC
100
4
SAFE OPERATING AREA
10
0
30
60
90
1
120
10
100
1000
VCE , Collector-to-Emitter Voltage (V)
I C , Collector Current (A)
Fig. 11 - Typical Switching Losses vs.
Collector-to-Emitter Current
Fig. 12 - Turn-Off SOA
Instantaneous forward current - IF (A)
1000
100
10
T J = 1 5 0 °C
T J = 1 2 5 °C
TJ =
2 5 °C
1
0.4
0.8
1.2
1.6
2.0
2.4
F o rw a rd V o lta g e D ro p - V F M (V )
Fig. 13 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current
6
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IRG4PSC71KD
100
200
VR = 2 0 0 V
T J = 1 2 5 °C
T J = 2 5 °C
VR = 2 0 0 V
T J = 1 2 5 °C
T J = 2 5 °C
160
Irr- ( A)
trr- (nC)
120
10
I F = 30 A
I F = 6 0A
I F = 1 20 A
80
40
I F = 30A
I F = 6 0A
I F = 1 20A
0
100
d i f /d t - (A /µ s)
1
100
1000
1000
d i f /d t - (A /µ s )
Fig. 15 - Typical Recovery Current vs. dif/dt
Fig. 14 - Typical Reverse Recovery vs. dif/dt
10000
4000
VR = 2 0 0 V
T J = 1 2 5 °C
T J = 2 5 °C
VR = 2 0 0 V
T J = 1 2 5 °C
T J = 2 5 °C
di (rec) M/dt- (A /µs)
Qrr- (nC)
3000
I F = 3 0A
I F = 60A
I F = 120 A
2000
I F = 120 A
1000
I F = 60A
I F = 30A
1000
0
100
d i f /dt - (A /µ s)
1000
Fig. 16 - Typical Stored Charge vs. dif/dt
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100
100
1000
d i f /d t - (A /µ s)
Fig. 17 - Typical di(rec)M/dt vs. dif/dt
7
IRG4PSC71KD
90% Vge
Same ty pe
device as
D .U.T.
+Vge
V ce
430µF
80%
of Vce
D .U .T.
Ic
9 0 % Ic
10% Vce
Ic
5 % Ic
td (o ff)
tf
E o ff =
Fig. 18a - Test Circuit for Measurement of
ILM, Eon, Eoff(diode), trr, Qrr, Irr, td(on), tr, td(off), tf
t1
∫
t1 + 5 µ S
V c e icIcd tdt
Vce
t1
t2
Fig. 18b - Test Waveforms for Circuit of Fig. 18a, Defining
Eoff, td(off), tf
G A T E V O L T A G E D .U .T .
1 0 % +V g
trr
Q rr =
Ic
∫
trr
id
t
Ic ddt
tx
+Vg
tx
10% Vcc
1 0 % Irr
V cc
D UT VO LTAG E
AN D CU RRE NT
Vce
V pk
Irr
Vcc
1 0 % Ic
Ip k
9 0 % Ic
Ic
D IO D E R E C O V E R Y
W A V E FO R M S
tr
td (o n )
5% Vce
t1
∫
t2
ce ieIcd t dt
E on = V
Vce
t1
t2
E re c =
D IO D E R E V E R S E
REC OVERY ENER GY
t3
Fig. 18c - Test Waveforms for Circuit of Fig. 18a,
Defining Eon, td(on), tr
8
∫
t4
VVd
d idIc
d t dt
t3
t4
Fig. 18d - Test Waveforms for Circuit of Fig. 18a,
Defining Erec, trr, Qrr, Irr
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IRG4PSC71KD
V g G A T E S IG N A L
D E V IC E U N D E R T E S T
C U R R E N T D .U .T .
V O L T A G E IN D .U .T .
C U R R E N T IN D 1
t0
t1
t2
Figure 18e. Macro Waveforms for Figure 18a's Test Circuit
D.U.T.
L
1000V
Vc*
RL=
480V
4 X IC @25°C
0 - 480V
50V
6000µ F
100 V
Figure 19. Clamped Inductive Load Test Circuit
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Figure 20. Pulsed Collector Current
Test Circuit
9
IRG4PSC71KD
Notes:
Repetitive rating: VGE=20V; pulse width limited by maximum junction
temperature (figure 20)
‚VCC=80%(VCES), VGE=20V, L=10µH, RG= 5.0Ω (figure 19)
ƒPulse width ≤ 80µs; duty factor ≤ 0.1%
„Pulse width 5.0µs, single shot
…Current limited by the package, (Die current = 100A)
Case Outline and Dimensions — Super-247
Dimensions are shown in millimeters
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331
IR GREAT BRITAIN: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020
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IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan Tel: 886-2-2377-9936
http://www.irf.com/
Data and specifications subject to change without notice.
5/99
10
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