FEATURES FUNCTIONAL BLOCK DIAGRAM Tiny, 3.35 mm × 2.5 mm × 0.98 mm surface-mount package Noninverted signal output Omnidirectional response High SNR of 65 dBA Sensitivity of −38 dBV Sensitivity tolerance of ±2 dB Extended frequency response from 60 Hz to 20 kHz Enhanced radio frequency (RF) performance Acoustic overload point of 124 dB SPL Low current consumption of 180 µA Single-ended analog output High PSR of −78 dBV Compatible with Sn/Pb and Pb-free solder processes RoHS/WEEE compliant OUTPUT AMPLIFIER ADMP510 OUTPUT POWER VDD GND 11532-001 Data Sheet RF Hardened, Ultralow Noise Microphone with Bottom Port and Analog Output ADMP510 Figure 1. APPLICATIONS 11532-002 Smartphones and feature phones Tablet computers Teleconferencing systems Digital still and video cameras Bluetooth headsets Notebook PCs Security and surveillance Figure 2. Isometric Views of the Microphone Package GENERAL DESCRIPTION The ADMP5101 is an RF hardened, analog output, bottom-ported, omnidirectional MEMS microphone with high performance, ultralow noise, and low power. The ADMP510 consists of a MEMS microphone element, an impedance converter, and an output amplifier. The ADMP510 sensitivity specification makes it an excellent choice for both near-field and far-field applications. The ADMP510 is pin compatible with the ADMP504 microphone. 1 The ADMP510 has a very high signal-to-noise ratio (SNR) and extended wideband frequency response, resulting in natural sound with high intelligibility. Low current consumption enables long battery life for portable applications. The ADMP510 is available in an ultraminiature 3.35 mm × 2.5 mm × 0.98 mm surface-mount package. It is reflow solder compatible with no sensitivity degradation. Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897. Other patents are pending. Rev. 0 Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2013 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com ADMP510 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Applications Information .................................................................7 Applications ....................................................................................... 1 Interfacing with Analog Devices Codecs ...................................7 Functional Block Diagram .............................................................. 1 Supporting Documents ................................................................7 General Description ......................................................................... 1 PCB Design and Land Pattern Layout ............................................8 Revision History ............................................................................... 2 Handling Instructions .......................................................................9 Specifications..................................................................................... 3 Pick-and-Place Equipment ..........................................................9 Absolute Maximum Ratings ............................................................ 4 Reflow Solder .................................................................................9 ESD Caution .................................................................................. 4 Board Wash ....................................................................................9 Soldering Profile ........................................................................... 4 Outline Dimensions ....................................................................... 10 Pin Configuration and Function Descriptions ............................. 5 Ordering Guide .......................................................................... 10 Typical Performance Characteristics ............................................. 6 REVISION HISTORY 7/13—Revision 0: Initial Version Rev. 0 | Page 2 of 12 Data Sheet ADMP510 SPECIFICATIONS TA = 25°C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not guaranteed. Table 1. Parameter PERFORMANCE Directionality Output Polarity Sensitivity Signal-to-Noise Ratio Equivalent Input Noise Dynamic Range Symbol SNR EIN Frequency Response 1 Total Harmonic Distortion Power Supply Rejection THD PSR Power Supply Rejection Ratio PSRR Acoustic Overload Point POWER SUPPLY Supply Voltage Supply Current OUTPUT CHARACTERISTICS Output Impedance Output DC Offset Maximum Output Voltage Noise Floor 1 VDD IS Test Conditions/Comments 1 kHz, 94 dB sound pressure level (SPL) 20 Hz to 20 kHz, A-weighted 20 Hz to 20 kHz, A-weighted Derived from EIN and maximum acoustic input Low frequency −3 dB point High frequency −3 dB point 105 dB SPL 217 Hz, 100 mV p-p square wave superimposed on VDD = 1.8 V (A-weighted) 1 kHz, 100 mV p-p sine wave superimposed on VDD = 1.8 V 10% THD Min −40 Typ Omni Noninverted −38 −36 65 29 91 60 >20 0.2 −78 Hz kHz % dBV 124 dB SPL 180 210 124 dB SPL input 20 Hz to 20 kHz, A-weighted, rms 350 0.7 0.398 −103 Rev. 0 | Page 3 of 12 dBV dBA dBA SPL dB dB 1.5 See Figure 5 and Figure 6. 1 Unit −55 VDD = 1.8 V VDD = 3.3 V ZOUT Max 3.63 220 250 V µA µA Ω V V rms dBV ADMP510 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Supply Voltage Sound Pressure Level (SPL) Mechanical Shock Vibration Temperature Range Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rating −0.3 V to +3.63 V 160 dB 10,000 g Per MIL-STD-883 Method 2007, Test Condition B −40°C to +85°C ESD CAUTION SOLDERING PROFILE CRITICAL ZONE TL TO TP tP TP TL tL TSMAX TSMIN tS RAMP-DOWN PREHEAT 11532-003 TEMPERATURE RAMP-UP t25°C TO PEAK TIME Figure 3. Recommended Soldering Profile Limits Table 3. Recommended Soldering Profile Limits Profile Feature Average Ramp Rate (TL to TP) Preheat Minimum Temperature (TSMIN) Maximum Temperature (TSMAX) Time, TSMIN to TSMAX (tS) Ramp-Up Rate (TSMAX to TL) Time Maintained Above Liquidous (tL) Liquidous Temperature (TL) Peak Temperature (TP) Time Within 5°C of Actual Peak Temperature (tP) Ramp-Down Rate Time 25°C (t25°C) to Peak Temperature Sn63/Pb37 1.25°C/sec maximum Pb-Free 1.25°C/sec maximum 100°C 150°C 60 sec to 75 sec 1.25°C/sec 45 sec to 75 sec 183°C 215°C +3°C/−3°C 20 sec to 30 sec 3°C/sec maximum 5 minutes maximum 150°C 200°C 60 sec to 75 sec 1.25°C/sec ~50 sec 217°C 260°C +0°C/−5°C 20 sec to 30 sec 3°C/sec maximum 5 minutes maximum Rev. 0 | Page 4 of 12 Data Sheet ADMP510 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS ADMP510 2 OUTPUT 1 VDD TOP VIEW (TERMINAL SIDE DOWN) Not to Scale Figure 4. Pin Configuration Table 4. Pin Function Descriptions Pin No. 1 2 3 Mnemonic VDD OUTPUT GND Description Power Supply Analog Output Signal Ground Rev. 0 | Page 5 of 12 11532-004 GND 3 ADMP510 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 20 10 10 THD + N (%) NORMALIZED AMPLITUDE (dB) 15 5 0 1 –5 100 1k 0.1 90 11532-005 –15 10 10k FREQUENCY (Hz) 100 110 120 130 INPUT (dB SPL) Figure 5. Frequency Response Mask 11532-008 –10 Figure 8. THD + N vs. Input SPL 15 0 OUTPUT AMPLITUDE (dBV) NORMALIZED AMPLITUDE (dB) –5 10 5 0 –5 –10 –15 –20 –25 –30 –35 –40 –10 –50 11532-007 1k 100 10k FREQUENCY (Hz) 90 100 110 120 130 INPUT AMPLITUDE (dB SPL) Figure 6. Typical Frequency Response (Measured) 140 11532-009 –45 –15 10 Figure 9. Linearity 1.4 –50 –51 1.2 –52 1.0 OUTPUT (V) –54 –55 –56 –57 0.8 0.6 0.4 –58 –60 100 1k 10k FREQUENCY (Hz) 0 0 0.5 1.0 TIME (ms) Figure 7. Typical Power Supply Rejection Ratio vs. Frequency Figure 10. Clipping Characteristics Rev. 0 | Page 6 of 12 11532-010 120dB SPL 124dB SPL 128dB SPL 132dB SPL 0.2 –59 11532-006 PSRR (dB) –53 Data Sheet ADMP510 APPLICATIONS INFORMATION INTERFACING WITH ANALOG DEVICES CODECS SUPPORTING DOCUMENTS The output of the ADMP510 can be connected to a dedicated codec microphone input (see Figure 11) or to a high input impedance gain stage (see Figure 12). A 0.1 µF ceramic capacitor placed close to the ADMP510 supply pin is used for testing and is recommended to adequately decouple the microphone from noise on the power supply. A dc blocking capacitor is required at the output of the microphone. This capacitor creates a highpass filter with a corner frequency at For additional information, see the following documents. fC = 1/(2π × C × R) Evaluation Board User Guide UG-325, Analog Output MEMS Microphone Flex Evaluation Board Circuit Note CN-0207, High Performance Analog MEMS Microphone’s Simple Interface to SigmaDSP Audio Codec Application Notes where R is the input impedance of the codec. AN-1003, Recommendations for Mounting and Connecting the Analog Devices, Inc., Bottom-Ported MEMS Microphones A minimum value of 2.2 μF is recommended in Figure 11 because the input impedance of the ADAU1761/ADAU1361 can be as low as 2 kΩ at its highest PGA gain setting, which results in a high-pass filter corner frequency at about 37 Hz. AN-1068, Reflow Soldering of the MEMS Microphone AN-1112, Microphone Specifications Explained AN-1124, Recommendations for Sealing Analog Devices, Inc., Bottom-Port MEMS Microphones from Dust and Liquid Ingress MICBIAS AN-1140, Microphone Array Beamforming 0.1µF VDD 2.2µF MINIMUM AN-1165, Op Amps for MEMS Microphone Preamp Circuits AN-1181, Using a MEMS Microphone in a 2-Wire Microphone Circuit LINN OUTPUT LINP GND CM 11532-011 ADMP510 ADAU1761 OR ADAU1361 Figure 11. ADMP510 Connected to the ADAU1761 or ADAU1361 Codec Figure 12 shows the ADMP510 connected to an ADA4075-2 op amp configured as a noninverting preamplifier. GAIN = (R1 + R2)/R1 R2 R1 VREF 0.1µF VDD ADMP510 ADA4075-2 1µF MINIMUM VOUT 10kΩ VREF 11532-012 OUTPUT GND Figure 12. ADMP510 Connected to the ADA4075-2 Op Amp Rev. 0 | Page 7 of 12 ADMP510 Data Sheet PCB DESIGN AND LAND PATTERN LAYOUT The diameter of the sound hole in the PCB should be larger than the diameter of the sound port of the microphone. A minimum diameter of 0.5 mm is recommended. Lay out the PCB land pattern for the ADMP510 at a 1:1 ratio to the solder pads on the microphone package (see Figure 13). Take care to avoid applying solder paste to the sound hole in the PCB. Figure 14 shows a suggested solder paste stencil pattern layout. 1.52 0.68 1.22 0.61 Ø1.55 1.90 Ø0.95 11532-013 0.61 0.90 Figure 13. Suggested PCB Land Pattern Layout 0.8 × 0.6 1.55/1.05 DIA. 0.225 CUT WIDTH (2×) 2× 0.2 × 45° TYP 1.52mm Figure 14. Suggested Solder Paste Stencil Pattern Layout Rev. 0 | Page 8 of 12 11532-014 1.22 Data Sheet ADMP510 HANDLING INSTRUCTIONS PICK-AND-PLACE EQUIPMENT REFLOW SOLDER The MEMS microphone can be handled using standard pickand-place and chip shooting equipment. Take care to avoid damage to the MEMS microphone structure as follows: For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 3 and Table 3. • • • Use a standard pickup tool to handle the microphone. Because the microphone hole is located on the bottom surface of the package (see Figure 2), the pickup tool can make contact with any part of the top lid surface. Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. Do not use excessive force to place the microphone on the PCB. BOARD WASH When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or ultrasonic cleaning. Rev. 0 | Page 9 of 12 ADMP510 Data Sheet OUTLINE DIMENSIONS 3.425 3.350 3.275 1.52 BSC 0.75 REF 3.06 REF REFERENCE CORNER 1.08 1.07 REF 0.30 BSC 0.25 NOM DIA. 0.20 MIN THRU HOLE 0.90 × 0.68 (PINS 1, 3) 1.55 DIA. 2 2.575 2.500 2.425 2.21 REF (SOUND PORT) 0.95 DIA. 0.54 REF 3 1.22 BSC 1.25 1 TOP VIEW PIN 1 BOTTOM VIEW 01-29-2013-A 1.08 0.98 0.88 0.64 REF 0.20 TYP × 45° SIDE VIEW Figure 15. 3-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] 3.35 mm × 2.5 mm Body (CE-3-5) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADMP510ACEZ-RL ADMP510ACEZ-RL7 EVAL-ADMP510Z-FLEX 1 2 Temperature Range −40°C to +85°C −40°C to +85°C Package Description 3-Terminal LGA_CAV, 13” Tape and Reel 3-Terminal LGA_CAV, 7” Tape and Reel Flexible Evaluation Board Z = RoHS Compliant Part. This package option is halide free. Rev. 0 | Page 10 of 12 Package Option 2 CE-3-5 CE-3-5 Ordering Quantity 10,000 1,000 Data Sheet ADMP510 NOTES Rev. 0 | Page 11 of 12 ADMP510 Data Sheet NOTES ©2013 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D11532-0-7/13(0) Rev. 0 | Page 12 of 12