19-1120; Rev 0; 9/96 ±15kV ESD-Protected, EMC-Compliant, 230kbps, 3-Tx/3-Rx RS-232 IC The MAX1406 is an RS-232 IC designed to meet the stringent electrostatic discharge (ESD) requirements of the European community. All transmitter outputs and receiver inputs are protected to ±15kV using IEC1000-4-2 Air-Gap Discharge, ±8kV using IEC 1000-4-2 Contact Discharge, and ±15kV using the Human Body Model. The MAX1406 has three RS-232 transmitters and three RS-232 receivers, and is optimized for operation in printer, modem, and telecom applications. It is guaranteed to run at data rates up to 230kbps, providing compatibility with popular software for communicating with personal computers. Power-supply current is less than 500µA for IDD and ISS, and less than 1mA for ICC. The MAX1406 is pin and functionally compatible with the industry-standard MC145406, so existing designs can instantly become Electromagnetic Compatibility (EMC) compliant. The MAX1406 is available in DIP and SO packages, and in a tiny SSOP that reduces board space. ________________________Applications Telecommunications ____________________________Features ♦ Enhanced ESD Protection: ±15kV Human Body Model ±8kV IEC1000-4-2, Contact Discharge ±15kV IEC1000-4-2, Air-Gap Discharge ♦ Latchup Free During an ESD Event ♦ 16-Pin SSOP or SO Packages ♦ Guaranteed 230kbps Data Rate ♦ Flow-Through Pinout ♦ Pin Compatible with MC145406 ______________Ordering Information PART TEMP. RANGE PIN-PACKAGE MAX1406CPE 0°C to +70°C 16 Plastic DIP MAX1406CWE MAX1406CAE MAX1406C/D MAX1406EPE MAX1406EWE MAX1406EAE 0°C to +70°C 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C -40°C to +85°C 16 Wide SO 16 SSOP Dice* 16 Plastic DIP 16 Wide SO 16 SSOP Modems *Dice are specified at TA = +25°C, DC parameters only. Printers ________________Functional Diagram Instruments +5V Equipment Meeting IEC1000-4-2 0.1µF __________________Pin Configuration +12V VDD VCC MAX1406 T1IN VDD 1 16 VCC R1IN 2 15 R1OUT 14 T1IN T1OUT 3 R2IN 4 MAX1406 T2OUT 5 13 R2OUT T2IN 11 R3OUT T3OUT 7 10 T3IN 9 VSS 8 GND T1 R1OUT T3 T3OUT R1IN R1 R2OUT R3OUT T1OUT T2OUT T2 T3IN 12 T2IN R3IN 6 -12V 0.1µF 0.1µF TOP VIEW VSS R2 R2IN R3IN R3 GND DIP/SO/SSOP ________________________________________________________________ Maxim Integrated Products 1 For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800 MAX1406 _______________General Description MAX1406 ±15kV ESD-Protected, EMC-Compliant, 230kbps, 3-Tx/3-Rx RS-232 IC ABSOLUTE MAXIMUM RATINGS VCC ...........................................................................-0.3V to +7V VDD .........................................................................-0.3V to +14V VSS..........................................................................+0.3V to -14V Input Voltages TIN .........................................................................-0.3V to +6V RIN ....................................................................................±30V Output Voltages TOUT ..................................................................................±15V ROUT ........................................................-0.3V to (VCC + 0.3V) Short-Circuit Duration TOUT (one at a time)................................................Continuous ROUT (one at a time)................................................Continuous Continuous Power Dissipation (TA = +70°C) DIP (derate 10.53mW/°C above +70°C) .......................842mW Wide SO (derate 20.00mW/°C above +70°C)...................1.6W SSOP (derate 8.00mW/°C above +70°C) .....................640mW Operating Temperature Ranges MAX1406C_E .......................................................0°C to +70°C MAX1406E_E ....................................................-40°C to +85°C Storage Temperature Range ............................-65°C to +160°C Lead Temperature (soldering, 10sec) ............................+300°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VCC = +4.5V to +5.5V, VDD = +10.8V to +13.2V, VSS = -10.8V to -13.2V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC CHARACTERISTICS VCC Operating Voltage Range 4.5 VDD 10.8 13.2 VSS -13.2 -10.8 ICC Supply Current 5.5 IDD No load ISS 230 1000 185 500 185 500 V µA LOGIC Input Logic Threshold Low VILT T_IN Input Logic Threshold High VIHT T_IN 0.01 VOLR R_OUT; ISINK = 3.2mA Output Voltage High VOHR R_OUT; ISOURCE = 1mA V 1 V µA 0.4 V 2.0 Input Leakage Current Output Voltage Low 0.8 VCC - 0.6 V TRANSMITTER OUTPUTS Output Voltage Swing Transmitter Output Resistance VDD = 7.0V, VSS = -7.0V, RL = 3kΩ ±5.0 VDD = 12V, VSS = -12V, RL = 3kΩ ±9.5 VCC = VDD = VSS = 0V, VT_OUT = ±2V 300 RS-232 Output Short-Circuit Current V Ω ±35 ±60 mA +25 V RECEIVER INPUTS Receiver Input Voltage Operating Range -25 RS-232 Input Threshold Low 0.75 V RS-232 Input Threshold High RS-232 Input Hysteresis 2 2.4 0.65 _______________________________________________________________________________________ V V ±15kV ESD-Protected, EMC-Compliant, 230kbps, 3-Tx/3-Rx RS-232 IC (VCC = +4.5V to +5.5V, VDD = +10.8V to +13.2V, VSS = -10.8V to -13.2V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 3 5 7 kΩ RECEIVER INPUTS (continued) RS-232 Input Resistance Receiver Output Short-Circuit Current ±10 mA ESD CHARACTERISTICS Human Body Model ESD Protection ±15 IEC1000-4-2 (Contact Discharge) ±8 IEC1000-4-2 (Air-Gap Discharge) ±15 kV TIMING CHARACTERISTICS (TA = +25°C, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS Transmitter Output Propagation Delay, Low to High tPLHT VDD = 12V, VSS = -12V, RL = 3kΩ, CL = 1000pF 4 µs Transmitter Output Propagation Delay, High to Low tPLHT VDD = 12V, VSS = -12V RL = 3kΩ, CL = 1000pF 4 µs Transmitter Propagation Delay Skew, |tPLHT - tPHLT| tSKT VDD = 12V, VSS = -12V RL = 3kΩ, CL = 1000pF 0.4 µs SR VDD = 12V, VSS = -12V, RL = 3kΩ to 7kΩ, measured from +3V to -3V or -3V to +3V Transition Output Slew Rate MIN TYP MAX CL = 150pF to 2500pF 4 12 30 CL = 50pF to 1000pF 8 12 30 UNITS V/µs Receiver Output Propagation Delay, Low to High tPLHR VCC = 5V, CL = 50pF 4.0 µs Receiver Output Propagation Delay, High to Low tPHLR VCC = 5V, CL = 50pF 4.0 µs Receiver Propagation Delay Skew, |tPLHR - tPHLR| tSKR VCC = 5V, CL = 50pF 0.4 µs DR VCC = 5V, VDD = 12V, VSS = -12V, RL = 3kΩ to 7kΩ Guaranteed Data Rate CL = 150pF to 2500pF 120 kbps CL = 50pF to 1000pF 230 _______________________________________________________________________________________ 3 MAX1406 ELECTRICAL CHARACTERISTICS (continued) __________________________________________Typical Operating Characteristics (VCC = +5.0V, VDD = +12.0V, VSS = -12.0V, TA = +25°C, unless otherwise noted.) ICC 0 1 TRANSMITTER AT DATA RATE 2 TRANMITTERS AT DATA RATE/16 3kΩ + 2500pF LOAD ISS, 20kbps -5 ISS, 120kbps -10 10 IDD, 20kbps 0 3kΩ + CL ICC 1 TRANSMITTER AT DATA RATE 2 TRANMITTERS AT DATA RATE/16 -5 -10 ISS, 20kbps -15 ISS, 120kbps -20 -20 10.8 11.4 12.0 12.6 2000 3000 4000 SLEW RATE vs. LOAD CAPACITANCE TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE MAX1406 TOC-4 FALL RISE 8 1 TRANSMITTER AT DATA RATE 2 TRANMITTERS AT DATA RATE/16 3kΩ + CL LOAD 4 1000 LOAD CAPACITANCE (pF) 12 6 0 13.2 SUPPLY VOLTAGE (V) 14 10 ISS, 240kbps -25 16 2 12.5 5000 120kbps 10.0 7.5 240kbps 5.0 2.5 1 TRANSMITTER AT DATA RATE 2 TRANMITTERS AT DATA RATE/16 3kΩ + CL LOAD 0 -2.5 240kbps -5.0 -7.5 120kbps -10.0 -12.5 0 0 1000 2000 3000 4000 LOAD CAPACITANCE (pF) 4 IDD, 120kbps 5 ISS, 240kbps -15 15 MAX1406 TOC-3 IDD, 20kbps 5 TRANSMITTER OUTPUT VOLTAGE (V) SUPPLY CURRENT (mA) IDD, 120kbps IDD, 240kbps 20 SUPPLY CURRENT (mA) IDD, 240kbps 15 10 25 MAX1406 TOC-1 20 MAX1406 TOC-2 SUPPLY CURRENT vs. LOAD CAPACITANCE SUPPLY CURRENT vs. SUPPLY VOLTAGE SLEW RATE (V/µs) MAX1406 ±15kV ESD-Protected, EMC-Compliant, 230kbps, 3-Tx/3-Rx RS-232 IC 5000 0 1000 2000 3000 4000 LOAD CAPACITANCE (pF) _______________________________________________________________________________________ 5000 ±15kV ESD-Protected, EMC-Compliant, 230kbps, 3-Tx/3-Rx RS-232 IC PIN NAME FUNCTION 1 VDD 3, 5, 7 T1OUT, T2OUT,T3OUT 2, 4, 6 R1IN, R2IN, R3IN 8 VSS Supply-Voltage Input, -10.8V to -13.2V 9 GND Ground. Connect to system ground. 10, 12, 14 T3IN, T2IN, T1IN 11, 13, 15 R3OUT, R2OUT, R1OUT 16 VCC Supply-Voltage Input, +10.8V to +13.2V Transmitter Outputs, swing between VDD and VSS Receiver Inputs Transmitter Inputs. Tie unused inputs to GND or VCC. Receiver Outputs, swing between GND and VCC Supply-Voltage Input, +4.5V to +5.5V When the power is off, the MAX1406 outputs are permitted to be driven up to ±15V. The transmitter inputs do not have internal pull-up resistors. Connect unused inputs to GND or VCC. 3.0V DRIVER INPUT 0V 1.5V tPHL tPLH VOH 3.3V 3.0V VOUT 0V ±15kV ESD Protection -3.0V -3.3V tF2 tR2 tF1 tR1 VOL SIGNAL GENERATOR RS-232 Receivers The receiver inputs invert and convert the RS-232 signals to CMOS-logic output levels. The MAX1406 has hysteresis of 650mV. The receiver output swings between GND and VCC. RL CL Figure 1. Slew-Rate Test Circuit and Timing Diagram _______________Detailed Description RS-232 Transmitters The transmitters are inverting level translators that convert CMOS-logic input levels to an EIA/TIA-232 voltage between ±5V and ±13.2V, into a load between 3kΩ and 7kΩ. The MAX1406 guarantees a 230kbps data rate with a worst-case load of 3kΩ and 1000pF, providing compatibility with PC-to-PC communication software. As with all Maxim devices, electrostatic discharge (ESD) protection structures are incorporated on all pins to protect against ESD encountered during handling and assembly. The MAX1406 driver outputs and receiver inputs have extra protection against static electricity found in normal operation. Maxim’s engineers developed state-of-the-art structures to protect these pins against ±15kV ESD without damage. After an ESD event, the MAX1406 continues working without latchup. ESD protection can be tested in several ways. The transmitter outputs and the receiver inputs are characterized for protection to the following: 1) ±15kV using the Human Body Model 2) ±8kV using the Contact-Discharge method specified in IEC1000-4-2 (formerly IEC801-2) 3) ±15kV using the Air-Gap Discharge method specified in IEC1000-4-2 (formerly IEC801-2) ESD Test Conditions ESD performance depends on a number of conditions. Contact Maxim for a reliability report that documents test setup, methodology, and results. _______________________________________________________________________________________ 5 MAX1406 ______________________________________________________________Pin Description Human Body Model Figure 2a shows the Human Body Model, and Figure 2b shows the current waveform it generates when discharged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest, which is then discharged into the device through a 1.5kΩ resistor. IEC1000-4-2 The IEC1000-4-2 standard covers ESD testing and performance of finished equipment; it does not specifically refer to integrated circuits. The MAX1406 helps you design equipment that meets Level 4 (the highest level) of IEC1000-4-2, without additional ESD-protection components. The main difference between tests done using the Human Body Model and IEC1000-4-2 is higher peak current in IEC1000-4-2 (Figure 3). Because series resistance is lower in the IEC1000-4-2 ESD test model, the RC 1M CHARGE-CURRENT LIMIT RESISTOR HIGHVOLTAGE DC SOURCE Cs 100pF ESD withstand voltage measured to this standard is generally lower than that measured using the Human Body Model. Figure 3b shows the current waveform for the ±8kV IEC1000-4-2 Level 4 ESD Contact-Discharge test. The Air-Gap test involves approaching the device with a charge probe. The Contact-Discharge method connects the probe to the device before the probe is energized. Machine Model The Machine Model for ESD testing uses a 200pF storage capacitor and zero-discharge resistance. It mimics the stress caused by handling during manufacturing and assembly. Of course, all pins (not just RS-232 inputs and outputs) require this protection during manufacturing. Therefore, the Machine Model is less relevant to the I/O ports than are the Human Body Model and IEC1000-4-2. RC 50M to 100M RD 1500Ω CHARGE-CURRENT LIMIT RESISTOR DISCHARGE RESISTANCE DEVICE UNDER TEST STORAGE CAPACITOR HIGHVOLTAGE DC SOURCE Cs 150pF RD 330Ω DISCHARGE RESISTANCE STORAGE CAPACITOR DEVICE UNDER TEST a) a) IP 100% 90% Ir I 100% 90% PEAK-TO-PEAK RINGING (NOT DRAWN TO SCALE) IPEAK MAX1406 ±15kV ESD-Protected, EMC-Compliant, 230kbps, 3-Tx/3-Rx RS-232 IC AMPERES 36.8% 10% 0 10% 0 tRL TIME b) Figure 2. Human Body ESD Test Model and ESD-Generator Current Waveform 6 tr = 0.7ns to 1ns tDL CURRENT WAVEFORM t 30ns 60ns b) Figure 3. IEC1000-4-2 Test Model and ESD-Generator Current Waveform _______________________________________________________________________________________ ±15kV ESD-Protected, EMC-Compliant, 230kbps, 3-Tx/3-Rx RS-232 IC Because the MAX1406 is not sensitive to power-supply sequencing, no external protection diodes are required. Any of the three supplies can power up first. However, use proper layout techniques to ensure other devices on your board are not damaged in case of an ESD event. • Minimize the ground-lead return path to the power supply, because currents as high as 60A can pass into the ground. • Use a separate return path to the power supply. • Make trace widths greater than 40 mils. • Bypass VCC, VDD, and VSS with 0.1µF capacitors as close to the MAX1406 as possible to ensure maximum ESD protection. • Tie any unused transmitter inputs to GND or VCC to minimize power consumption. ___________________Chip Topography 0.094" (2.38mm) VDD VCC R1OUT R1IN T1IN T1OUT R2IN R2OUT 0.153" T2OUT (3.89mm) T2IN R3OUT R3IN T3OUT T3IN VSS GND TRANSISTOR COUNT: 161 SUBSTRATE CONNECTED TO GND _______________________________________________________________________________________ 7 MAX1406 __________Applications Information MAX1406 ±15kV ESD-Protected, EMC-Compliant, 230kbps, 3-Tx/3-Rx, RS-232 IC ________________________________________________________Package Information D E DIM E1 A A1 A2 A3 B B1 C D1 E E1 e eA eB L A3 A A2 L A1 0° - 15° C e B1 eA B eB D1 Plastic DIP PLASTIC DUAL-IN-LINE PACKAGE (0.300 in.) INCHES MAX MIN 0.200 – – 0.015 0.175 0.125 0.080 0.055 0.022 0.016 0.065 0.045 0.012 0.008 0.080 0.005 0.325 0.300 0.310 0.240 – 0.100 – 0.300 0.400 – 0.150 0.115 PKG. DIM PINS P P P P P N D D D D D D 8 14 16 18 20 24 INCHES MIN MAX 0.348 0.390 0.735 0.765 0.745 0.765 0.885 0.915 1.015 1.045 1.14 1.265 MILLIMETERS MIN MAX – 5.08 0.38 – 3.18 4.45 1.40 2.03 0.41 0.56 1.14 1.65 0.20 0.30 0.13 2.03 7.62 8.26 6.10 7.87 2.54 – 7.62 – – 10.16 2.92 3.81 MILLIMETERS MIN MAX 8.84 9.91 18.67 19.43 18.92 19.43 22.48 23.24 25.78 26.54 28.96 32.13 21-0043A DIM D 0°- 8° A e B 0.101mm 0.004in. A1 C L A A1 B C E e H L INCHES MAX MIN 0.104 0.093 0.012 0.004 0.019 0.014 0.013 0.009 0.299 0.291 0.050 0.419 0.394 0.050 0.016 DIM PINS E H Wide SO SMALL-OUTLINE PACKAGE (0.300 in.) D D D D D 16 18 20 24 28 INCHES MIN MAX 0.398 0.413 0.447 0.463 0.496 0.512 0.598 0.614 0.697 0.713 MILLIMETERS MIN MAX 2.35 2.65 0.10 0.30 0.35 0.49 0.23 0.32 7.40 7.60 1.27 10.00 10.65 0.40 1.27 MILLIMETERS MIN MAX 10.10 10.50 11.35 11.75 12.60 13.00 15.20 15.60 17.70 18.10 21-0042A Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 8 ___________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600 © 1996 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.