MOTOROLA MRFIC1807

Order this document
by MRFIC1807/D
SEMICONDUCTOR TECHNICAL DATA
The MRFIC Line
Designed primarily for use in DECT, Japan Personal Handy System (PHS)
and other wireless Personal Communication Systems (PCS) applications.
The MRFIC1807 includes a single–stage power amplifier and transmit/receive
switch in a low–cost SOIC–16 package. The amplifier portion employs a
depletion mode power GaAs MESFET and produces up to +27 dBm output
with +19 dBm input. On–chip power control circuitry allows bias adjustment for
optimum performance. The T/R switch is capable of handling up to +28 dBm
through the transmit path without significant increase in insertion loss. The
switch is controlled by CMOS logic level signals — no negative control voltage
required. The MRFIC1807 is sized to be driven by the MRFIC1806 Driver/
Ramp IC.
Together with the rest of the MRFIC1800 GaAs ICs, this family offers the
complete transmit and receive functions, less LO and filters, needed for a
typical 1.8 GHz cordless telephone.
• Usable 1500 – 2200 MHz
• 8.0 dB Gain Including Switch
• +26 dBm Minimum Output Power at Antenna Port
• 1.0 dB Typ RX Path Insertion Loss
• Simple Off–Chip Matching for Maximum Flexibility
• 3.0 to 5.0 V Supply
• No Spurious Outputs for Load VSWR up to 8:1
• CMOS Level Switching Signal for T/R Switch
1.8 GHz POWER AMPLIFIER
AND TRANSMIT/RECEIVE
SWITCH
GaAs MONOLITHIC
INTEGRATED CIRCUIT
CASE 751B–05
(SO–16)
• Order MRFIC1807R2 for Tape and Reel.
R2 Suffix = 2,500 Units per 16 mm, 13 inch Reel.
• Device Marking = M1807
ANTENNA
1
16 REG VDD
GND
2
15 GND
TX IN
3
14 RX OUT
PA OUT
4
13 VSS
GND
5
GND
6
RF IN
7
GND
8
REG VDD
GATE
BIAS
12 GND
11 GND
10 TX/RX
9
PCNTRL
Figure 1. Pin Connection and Functional Block Diagram
REV 2
MOTOROLA RF DEVICE DATA
 Motorola, Inc. 1997
MRFIC1807
1
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ABSOLUTE MAXIMUM RATINGS (TA = 25°C Unless Otherwise noted)
Rating
Symbol
Limit
Unit
VDD
6.0
Vdc
Supply Voltage
REG VDD
4.5
Vdc
Supply Voltage
VSS
– 4.0
Vdc
RF Input Power
Pin
+25
dBm
TX/RX
6.0
Vdc
PCNTRL
3.0
Vdc
TA
–10 to +70
°C
Storage Temperature Range
Tstg
– 65 to +150
°C
Thermal Resistance, Junction to Case
θJC
24
°C/W
PA Supply Voltage
Switch Control Voltage
PA Control Voltage
Ambient Operating Temperature
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RECOMMENDED OPERATING RANGES
Symbol
Value
Unit
RF Input Frequency
Parameter
fRF
1.5 to 2.2
GHz
PA Supply Voltage
VDD
3.0 to 5.0
Vdc
Supply Voltage
REG VDD
2.9 to 3.1
Vdc
Supply Voltage
VSS
– 2.75 to – 2.25
Vdc
RF Input Power
PIN
+5.0 to +23
dBm
Switch Control Voltage, High (TX Mode)
TX/RX
2.8 to 3.5
Vdc
Switch Control Voltage, Low (RX Mode)
TX/RX
– 0.2 to 0.2
Vdc
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PA Control Voltage
PCNTRL
0.0 to 2.5
Vdc
ELECTRICAL CHARACTERISTICS (1)
Transmit Mode (VDD = 3.5 V, REG VDD = 3.0 V, TA = 25°C, VSS = – 2.5 V, PCNTRL 0 V to 2.5 V, PIN = 20 dBm @ 1.9 GHz,
TX/RX = 3 V, POUT Measured at ANT Port)
Characteristic
Min
Typ
Max
Unit
Small Signal Gain (PIN = 0 dBm, PCNTRL set for IDDQ = 180 mA)
7.0
8.0
—
dB
Output Power (PCNTRL adjusted for efficiency ≥ 35%)
26
26.8
—
dBm
Output 1.0 dB Compression (PCNTRL set for IDDQ = 180 mA)
—
25
—
dBm
Harmonic Output (PCNTRL set for POUT = 26 dBm)
—
– 40
—
dBc
Switch RX to TX Switching Time
—
0.1
—
µsec
TX/RX Control Input Current, Pin 10
—
0.2
—
mA
Drain Efficiency (Pout = 26 dBm) (2)
—
40
—
%
Supply Current, ISS
—
0.8
1.2
mA
Supply Current, REG IDD
—
0.8
1.2
mA
PCNTRL Control Input Current (Pin 9)
—
15
—
µA
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Leakage Power at RX Port
—
–1
+6
dBm
Unit
Receive Mode (VDD = 0 V, REG VDD = 3.0 V, VSS = – 2.5 V, TX/RX = 0 V, TA = 25°C, Freq = 1.9 GHz)
Characteristic
Min
Typ
Max
ANT to RX Insertion Loss
—
1.0
1.3
dB
Switch TX to RX Switching Time
—
1.0
—
µsec
Supply Current, REG IDD
—
60
250
µA
Supply Current, ISS
—
60
250
µA
NOTES:
1. Measured with circuit configuration shown in Figure 2.
2. Includes switch loss.
MRFIC1807
2
MOTOROLA RF DEVICE DATA
C5
4.7 pF
ANT
50 OHM
1
VDD
3.5 V
C5
.01 µF
C4
C3
100 pF 22 pF
T1 (FR4)
Zo = 100
L = 22 mm
C2
2.2 pF
RF IN
50 OHM
C1
2.2 pF
ANT
REG VDD
2
GND
3
TX IN
RX OUT
VSS
5
PA
OUT
GND
6
GND
7
RF IN
4
8
REG VDD
3V
16
C7
22 pF
GND 15
REG VDD
GATE
BIAS
MRFIC1807
VSS
– 2.5 V
13
RX OUT
50 OHM
C6
1.8 pF
GND 12
GND 11
3 V (TX)
TX/RX
GND
14
PCNTRL
10
TX/RX
0 V (RX)
9
T2 (FR4)
Zo = 70
L = 2 mm
PCNTRL
1 V TYP
Figure 2. 1.9 GHz Applications Circuit Configuration
Table 1. Small Signal S – Parameters
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(VDD = 3.5 V, IDDQ = 180 mA, TA = 25°C, no input or output matching)
S11
S21
S12
S22
Freq (GHz)
Mag
Angle
Mag
Angle
Mag
Angle
Mag
Angle
1.5
0.614
–171.5
2.203
82.6
0.104
74.5
0.741
175.4
1.6
0.695
175.7
1.871
71.7
0.110
69.2
0.746
171.5
1.7
0.747
167.3
1.647
63.4
0.108
64.0
0.745
167.4
1.8
0.777
160.3
1.473
56.2
0.106
58.7
0.746
163.0
1.9
0.799
154.2
1.341
49.2
0.120
54.0
0.753
158.9
2.0
0.814
148.3
1.230
43.0
0.118
49.6
0.758
154.8
2.1
0.826
142.5
1.128
36.8
0.114
45.2
0.764
150.6
2.2
0.835
137.0
1.041
31.2
0.120
40.6
0.767
146.7
2.3
0.842
131.4
0.959
26.4
0.127
37.0
0.780
143.4
2.4
0.856
126.6
0.895
21.1
0.124
33.8
0.796
139.8
2.5
0.870
121.7
0.840
16.0
0.126
30.4
0.808
136.4
MOTOROLA RF DEVICE DATA
MRFIC1807
3
400
f = 1.9 GHz
VDD = 3.5 V
IDDQ = 180 mA
25
350
IDD , SUPPLY CURRENT (mA)
Pout , OUTPUT POWER (dBm)
30
–10°C
20
70°C
15
TA = 25°C
10
5
–3
0
3
6
9
12
15
PIN, INPUT POWER (dBm)
18
21
25°C
250
200
150
Figure 3. Output Power versus Input Power
–10°C
TA = 70°C
0
3
6
9
12
15
PIN, INPUT POWER (dBm)
18
21
24
500
5V
450
25
IDD , SUPPLY CURRENT (mA)
Pout , OUTPUT POWER (dBm)
25°C
Figure 4. Supply Current versus Input Power
30
3.5 V
VDD = 3 V
20
15
TA = 25°C
f = 1.9 GHz
PCNTRL Set For
IDDQ = 180 mA @ 3.5 V
10
5
–3
0
3
6
9
12
15
PIN, INPUT POWER (dBm)
18
21
400
350
250
5V
200
3.5 V
100
–3
24
300
IDD , SUPPLY CURRENT (mA)
25
20
PCNTRL = 2 V
15
0V
1V
0
3
6
9
12
15
PIN, INPUT POWER (dBm)
18
21
24
Figure 6. Supply Current versus Input Power
350
5
VDD = 3 V
150
30
10
f = 1.9 GHz
TA = 25°C
PCNTRL Set For
IDDQ = 180 mA @ 3.5 V
300
Figure 5. Output Power versus Input Power
Pout , OUTPUT POWER (dBm)
–10°C
300
100
–3
24
VDD = 3.5 V
f = 1.9 GHz
IDDQ = 180 mA
VDD = 3.5 V
f = 1.9 GHz
TA = 25°C
2V
250
200
150
1V
100
VDD = 3.5 V
TA = 25°C
f = 1.9 GHz
50
0
PCNTRL = 0 V
–5
–3
0
3
6
9
12
15
PIN, INPUT POWER (dBm)
18
21
Figure 7. Output Power versus Input Power
MRFIC1807
4
24
0
–3
0
3
6
9
12
15
PIN, INPUT POWER (dBm)
18
21
24
Figure 8. Supply Current versus Input Power
MOTOROLA RF DEVICE DATA
350
27.5
70°C
300
TA = 25°C
275
250
225
Pin = 20 dBm
VDD = 3.5 V
IDDQ = 180 mA
200
175
150
1.5
1.7
1.6
–10°C
27
–10°C
Pout , OUTPUT POWER (dBm)
IDD , SUPPLY CURRENT (mA)
325
26.5
26
70°C
25.5
70°C
25
24.5
Pin = 20 dBm
VDD = 3.5 V
IDDQ = 180 mA
24
1.9
1.8
f, FREQUENCY (GHz)
2
2.1
23.5
1.5
2.2
600
1.7
1.8
1.9
f, FREQUENCY (GHz)
2
2.1
2.2
10
VDD = 3.5 V
400
70°C
300
TA = 25°C
200
–10°C
9
500
–10°C
100
8
TA = 25°C
7
5
Pin = 0 dBm
VDD = 3.5 V
IDDQ = 180 mA
4
0
0.5
1
1.5
PCNTRL (VOLTS)
3
2.5
2
1.5
1.6
1.7
1.8
1.9
f, FREQUENCY (GHz)
2
2.1
2.2
Figure 12. Small Signal Gain versus Frequency
1.5
3
–10°C
2
Pout = 26 dBm
VDD = 3.5 V
IDDQ = 180 mA
TA = 25°C
TA = 25°C
REG VDD = 3 V
TX/RX = 0 V
1.4
INSERTION LOSS (dB)
1
0
70°C
6
Figure 11. Quiescent Supply Current versus PCNTRL
LEAKAGE POWER (dBm)
1.6
Figure 10. Output Power versus Frequency
SMALL SIGNAL GAIN (dBm)
I DDQ , QUIESCENT SUPPLY CURRENT (mA)
Figure 9. Supply Current versus Frequency
0
TA = 25°C
70°C
–1
–2
1.3
1.2
1.1
–3
–4
1.5
1.6
1.7
1.8
1.9
FREQUENCY (GHz)
2
2.1
Figure 13. Leakage Power at RX Port in TX
Mode versus Frequency
MOTOROLA RF DEVICE DATA
2.2
1
1.5
1.6
1.7
1.8
1.9
FREQUENCY (GHz)
2
2.1
2.2
Figure 14. RX Path Insertion Loss in RX Mode
versus Frequency
MRFIC1807
5
27.5
f = 1.9 GHz
VDD = 3.5 V
Pin = 20 dBm
400
27.4
375
Pout , OUTPUT POWER (dBm)
IDD , SUPPLY CURRENT (mA)
425
70°C
350
325
–10°C
300
275
TA = 25°C
0
0.5
27.3
–10°C
27.2
27.1
25°C
27.0
26.9
TA = 70°C
26.8
f = 1.9 GHz
VDD = 3.5 V
Pin = 20 dBm
26.7
26.6
1
1.5
PCNTRL (VOLTS)
2
2.5
26.5
0
Figure 15. Supply Current versus PCNTRL
0.5
1
1.5
PCNTRL (VOLTS)
2.5
Figure 16. Output Power versus PCNTRL
– 40
28
Pout , OUTPUT POWER (dBm)
2
VDD = 3.5 V
f = 1.9 GHz
Mod = 384 kb / s π / 4 DQPSK
TA = 25°C
IDDQ = 180 mA
26
24
Pout
– 45
– 50
600 kHz OFFSET
– 55
22
20
– 60
900 kHz OFFSET
18
– 65
16
10
12
14
16
18
PIN, INPUT POWER (dBm)
20
– 70
22
Figure 17. Output Power and Adjacent Channel
Power Ratio versus Input Power
MRFIC1807
6
MOTOROLA RF DEVICE DATA
DESIGN AND APPLICATIONS INFORMATION
DESIGN PHILOSOPHY
The MRFIC1807 is designed to operate with the MRFIC1806
Driver/Ramp IC in 1.9 GHz Personal Communication System
(PCS) applications such as Europe’s DECT and Japan’s PHS.
The design incorporates a depletion mode GaAs power MESFET with a high–power transmit/receive switch and
associated bias circuitry in one low–cost SOIC–16 package.
The power MESFET is sized to produce at least 27 dBm
saturated output power, including switch loss, from a 3.5 V
supply, but the output power can be controlled using the
PCNTRL input. This control voltage also allows setting of the
quiescent current of the FET. PCNTRL can be set to give
best efficiency or linearity for the particular system application.
The TX/RX control pin allows fast switching of the T/R switch
for TDMA applications. When switching from transmit to
receive, the battery supply voltage should be removed from
the PA (Pin 4), to avoid excessive current drain. This is usually accomplished using an external pass transistor controlled by the TX/RX signal. Alternatively, if PCNTRL is
reduced to 0 V during RX mode, the bias current is reduced
to nearly zero.
The Transmit/Receive switch is a reflective MESFET
design which is optimized for low loss and power handling in
transmit mode. The design can handle 28 dBm of transmit
power without significant increase in insertion loss. A regulated 3.0 Volt supply is required at pin 16 for the T/R switch
and the bias and control circuitry.
DECT APPLICATIONS
Figure 2 shows the component values for a DECT implementation of the MRFIC1807. For use in equipment designed
for DECT, the power amplifier is operated close to saturation
to improve device efficiency. Maximum power output at the
antenna connector is 24 dBm during a burst. The constant envelope characteristics of the GMSK modulation allow non–linear amplification without spectral regrowth. The transmit
signal must be shaped or “ramped” to meet system transmit
turn on time requirements of 10 msec minimum while not splattering into adjacent channels. A turn on time on greater than
MOTOROLA RF DEVICE DATA
2.0 msec has been shown to give adequate adjacent channel
power performance. Most DECT realizations have the modulation applied to the transmit VCO so the most straight forward way of implementing this ramping function is at the
power amplifier. The MRFIC1806 Driver/Ramp IC has an
on–chip ramping circuit specifically designed for DECT.
When ramped in this manner, the MRFIC1806 will supply the
appropriately ramped RF signal to the MRFIC1807 which
only has to be turned on and off with TX/RX. Alternate off–
chip ramping can be implemented either with external components or at baseband. Consult the MRFIC1806 datasheet
for more information.
PHS APPLICATIONS
For Japan’s Personal Handy System applications, the
modulation is p/4 DQPSK. When amplified with a non–linear
amplifier, the signal will regrow the sidebands which have
been carefully filtered at baseband, resulting in adjacent
channel interference. To avoid this spectral regrowth, the
amplifier must be operated “backed off” from saturation. The
amount of backoff required has been shown to be a function
of amplifier saturated output capability and may be as high
as 5.0 dB. The PHS specification calls for a maximum average power during a burst to be 19 dBm. This is consistent
with 5.0 dB backoff from the DECT operating point so the
same DECT operating condition could be used. Alternatively,
PCNTRL can be adjusted for a lower bias point to improve
efficiency or higher bias for better linearity. With p/4 DQPSK
modulation, ramping can be accomplished in the encoder so
no external ramp circuit is needed. See the MRFIC1806 data
sheet for further details.
EVALUATION BOARDS
Evaluation boards are available for RF Monolithic Integrated Circuits by adding a “TF” suffix to the device type.
For a complete list of currently available boards and ones
in development for newly introduced product, please contact your local Motorola Distributor or Sales Office.
MRFIC1807
7
PACKAGE DIMENSIONS
–A–
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
–T–
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
CASE 751B–05
ISSUE J
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
Mfax is a trademark of Motorola, Inc.
How to reach us:
USA / EUROPE / Locations Not Listed: Motorola Literature Distribution;
P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447
JAPAN: Nippon Motorola Ltd.: SPD, Strategic Planning Office, 4–32–1,
Nishi–Gotanda, Shinagawa–ku, Tokyo 141, Japan. 81–3–5487–8488
Mfax: [email protected] – TOUCHTONE 602–244–6609
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
– US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
INTERNET: http://motorola.com/sps
MRFIC1807
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MRFIC1807/D
MOTOROLA RF DEVICE
DATA