Order this document by MRFIC1813/D SEMICONDUCTOR TECHNICAL DATA The MRFIC Line Designed primarily for use in wireless Personal Communication Systems (PCS) applications such as Digital European Cordless Telephone (DECT), Japan’s Personal Handy System (PHS) and the emerging North American systems. The MRFIC1813 is also applicable to 2.4 GHz ISM equipment. The device combines a balanced upmixer and a transmit exciter amplifier in a low-cost TSSOP–16 package. Minimal off-chip matching is required while allowing for maximum flexibility and efficiency. The mixer is optimized for low–side injection and provides more than 12 dB of conversion gain with over 0 dBm output at 1 dB gain compression. Image filtering is implemented off-chip to allow maximum flexibility. A CMOS compatible ENABLE pin allows standby operation where the current drain is less than 250 mA. Together with other devices from the MRFIC180X or the MRFIC240X series, this GaAs IC family offers the complete transmit and receive functions, less LO and filters, needed for a typical 1.8 GHz cordless telephone or 2.4 GHz ISM band equipment. 1.9 GHz UPMIXER AND EXCITER AMPLIFIER CASE 948C–03 (TSSOP–16) • Usable Frequency Range = 1.7 to 2.5 GHz • 15 dB Typ IF to RF Conversion Gain • 3 dBm Power Output Typ, 0 dBm Minimum at 1 dB Gain Compression • Simple Off-chip Matching for Maximum Flexibility • Low Power Consumption = 75 mW (Typ) • Single Bias Supply = 2.7 to 4.5 Volts • Low LO Power Requirement = – 5 dBm (Typ) • Low Cost Surface Mount Plastic Package • Order MRFIC1813R2 for Tape and Reel. R2 Suffix = 2,500 Units per 16 mm, 13 inch Reel. • Device Marking = M1813 VDD1 1 16 TX ENABLE N/C 2 15 N/C N/C 3 14 IF IN GND 4 13 GND LO IN 5 12 VDD3 GND 6 11 GND RF OUT 7 10 N/C VDD2 8 9 N/C MIXER EXCITER Pin Connections and Functional Block Diagram REV 2 Motorola, Inc. 1997 MOTOROLA RF DEVICE DATA MRFIC1813 1 MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Ratings Symbol Limit Unit VDD1, VDD2, VDD3 5.5 Vdc IF Input Power PIF 3 dBm LO Input Power PLO 3 dBm Enable Voltage TX ENABLE 5.5 Vdc Tstg – 65 to +150 °C TA – 30 to + 85 °C Symbol Value Unit RF Output Frequency fRF 1.7 to 2.5 GHz LO Input Frequency fLO 1.5 to 2.4 GHz Supply Voltage Storage Temperature Range Operating Ambient Temperature RECOMMENDED OPERATING RANGES Parameter IF Input Frequency fIF 70 to 350 MHz VDD 2.7 to 4.5 Vdc TX Enable Voltage, ON TX ENABLE 2.7 to VDD Vdc TX Enable Voltage, OFF TX ENABLE 0 to 0.2 Vdc Supply Voltage ELECTRICAL CHARACTERISTICS (VDD1,2,3, TX ENABLE= 3 V, TA = 25°C, fLO = 1.65 GHz @ – 5 dBm, fIF = 250 MHz @ –15 dBm) Characteristic Min Typ Max Unit IF to RF Small Signal Conversion Gain (PRF = –35 dBm) 12 15 — dB RF Output 1 dB Gain Compression 0 3 — dBm RF Output 3rd Order Intercept — 11 — dBm LO Feedthrough to RF Port — –15 –10 dBm Noise Figure — 11 — dB Lower Sideband Output Power at RF Port — –10 –6 dBm Supply Current TX Mode — 25 35 mA Supply Current Standby Mode (TX ENABLE = 0 V, LO Off) — 100 250 mA TX Enable Current — 3 — mA VDD1 C2 C1 LO IN 1 16 2 15 3 14 4 13 5 12 6 RF OUT MIXER 8 C3 R1 L1 C5 11 IF IN VDD3 T2 C4 C6 10 7 VDD2 TX ENABLE EXCITER 9 T1 C1, C2, C3, C4 15 pF C6 1 µF R1 300 Ω T1, T2 MICROSTRIP, Z0 = 73 Ω, θ = 29° @ 1.9 GHz BOARD MATERIAL – GLASS/EPOXY, εr = 4.45, DIELECTRIC THICKNESS = 0.018 INCH IF Frequency 110 MHz 250 MHz 350 MHz L1 180 nH 68 nH 39 nH C5 12 pF 5.6 pF 3.9 pF Figure 1. Applications Circuit Configuration MRFIC1813 2 MOTOROLA RF DEVICE DATA 18 18 VDD = 3 Vdc 16 15 G C , CONVERSION GAIN (dB) G C , CONVERSION GAIN (dB) 17 4 & 4.5 Vdc 14 13 12 fRF = 1.9 GHz fIF = 250 MHz PIF = –35 dBm TA = 25°C 11 10 25°C 16 85°C 14 12 TA = –35°C 10 fRF = 1.9 GHz fIF = 250 MHz PIF = –35 dBm 8.0 9.0 8.0 –10 –8.0 –6.0 –4.0 –2.0 6.0 –10 0 –2.0 0 Figure 2. Conversion Gain versus LO Power Figure 3. Conversion Gain versus LO Power 16 15 18 250 MHz G C , CONVERSION GAIN (dB) G C , CONVERSION GAIN (dB) –4.0 PLO, LO INPUT POWER (dBm) 20 16 350 MHz IF = 110 MHz 14 12 fRF = 1.9 GHz PIF = –35 dBm VDD = 3 Vdc TA = 25°C 10 8.0 6.0 –10 14 4 Vdc VDD = 3 Vdc 13 12 4.5 Vdc 11 10 9.0 8.0 PRF = –35 dBm fIF = 250 MHz PLO = –5 dBm TA = 25°C 7.0 –8.0 –6.0 –4.0 –2.0 0 1700 1800 1900 2000 2100 2200 2300 2400 PLO, LO POWER (dBm) fRF, RF FREQUENCY (MHz) Figure 4. Conversion Gain versus LO Power Figure 5. Conversion Gain versus RF Frequency IF = 110 MHz G C , CONVERSION GAIN (dB) 15 14 25°C TA = –35°C 13 12 85°C 11 10 9.0 8.0 7.0 6.0 1700 2500 18 16 G C , CONVERSION GAIN (dB) –6.0 –8.0 PLO, LO INPUT POWER (dBm) fIF = 250 MHz PIF = –35 dBm PLO = –5 dBm VDD = 3 Vdc 16 14 250 MHz 12 10 PIF = –35 dBm PLO = –5 dBm TA = 25°C 350 MHz 8.0 6.0 1800 1900 2000 2100 2200 2300 2400 2500 1700 1800 1900 2000 2100 2200 2300 2400 fRF, RF FREQUENCY (MHz) fRF, RF FREQUENCY (GHz) Figure 6. Conversion Gain versus RF Frequency Figure 7. Conversion Gain versus RF Frequency MOTOROLA RF DEVICE DATA 2500 MRFIC1813 3 10 10 5.0 PRF , RF OUTPUT POWER (dBm) P RF , RF OUTPUT POWER (dBm) 4 & 4.5 Vdc VDD = 3 Vdc 0 –5.0 –10 fRF = 1.9 GHz fIF = 250 MHz PLO = –5 dBm TA = 25°C –15 –20 –35 –30 –25 –20 –15 –10 –5.0 –5.0 TA = –35°C –10 25 & 85°C fRF = 1.9 GHz fIF = 250 MHz PLO = –5 dBm VDD = 3 Vdc –15 –20 –30 –25 –20 –15 –10 –5.0 PIF, IF INPUT POWER (dBm) PIF, IF INPUT POWER (dBm) Figure 8. RF Output versus Input Power Figure 9. RF Output Power versus IF Input Power 0 5.0 POUT, RF OUTPUT POWER (dBm) 5.0 P RF, OUTPUT POWER (dBm) 0 –25 –35 0 10 0 –5.0 IF = 110 MHz –10 250 & 350 MHz fRF = 1.9 GHz PLO = –5 dBm VDD = 3 Vdc TA = 25°C –15 –20 –25 –35 fIF = 110 MHz 0 –5.0 350 MHz –10 250 MHz fRF = 2.45 GHz PLO = –5 dBm VDD = 3 Vdc TA = 25°C –15 –20 –25 –30 –25 –20 –15 –10 –5.0 0 –30 –25 –20 –15 –10 –5.0 PIF, IF INPUT POWER (dBm) PIF, IF INPUT POWER (dBm) Figure 10. RF Output versus IF Input Power Figure 11. Output Power versus IF Input Power 29 0 26.0 28 25.5 4.5 Vdc 27 26 I DD , SUPPLY CURRENT (mA) I DD, SUPPLY CURRENT (mA) 5.0 4 Vdc 25 24 VDD = 3 Vdc 23 fRF = 1.9 GHz fIF = 250 MHz PLO = –5 dBm TA = 25°C 22 21 20 –35 –30 –25 25.0 –35°C 24.5 24.0 fRF = 1.9 GHz fIF = 250 MHz PLO = –5 dBm VDD = 3 Vdc 23.5 23.0 85°C TA = 25°C 22.5 –20 –15 –10 –5.0 0 –35 –30 –25 –20 –15 –10 –5.0 PIF, IF INPUT POWER (dBm) PIF, IF INPUT POWER (dBm) Figure 12. Supply Current versus IF Input Power Figure 13. Supply Current versus IF Input Power MRFIC1813 4 0 MOTOROLA RF DEVICE DATA 0 24.0 –5.0 23.5 LO–RF FEEDTHROUGH (dBm) I DD , SUPPLY CURRENT (mA) 24.5 250 MHz 23.0 IF = 110 MHz 350 MHz 22.5 fRF = 1.9 GHz PLO = –5 dBm VDD = 3 Vdc TA = 25°C 22.0 21.5 21.0 –35 IF = 110 MHz –10 250 MHz –15 PLO = –5 dBm VDD = 3 Vdc TA = 25°C –20 –25 350 MHz –30 –30 –25 –20 –15 –10 –5.0 0 1300 1400 1500 1600 1700 1800 1900 2000 2100 PIF, IF INPUT POWER (dBm) FLO, LO FREQUENCY (MHz) Figure 14. Supply Current versus IF Input Power Figure 15. LO to RF Feedthrough versus LO Frequency 25 0 –4.0 –6.0 I DD , SUPPLY CURRENT (mA) P LSB, LSB POWER (dBm) –2.0 4 & 4.5 Vdc –8.0 –10 –12 –14 fIF = 250 MHz PIF = –15 dBm PLO = –5 dBm TA = 25°C VDD = 3 Vdc –16 –18 –20 1700 1800 20 15 10 VDD = 3 Vdc TA = 25°C 5.0 0 1900 2000 2100 2200 2300 2400 2500 0 0.5 1.0 1.5 2.0 2.5 fRF, RF FREQUENCY (MHz) TX EN (VOLTS) Figure 16. Lower Side Band Power versus RF Frequency Figure 17. Supply Current versus Transmit Enable Voltage MOTOROLA RF DEVICE DATA 3.0 MRFIC1813 5 IF Input f RF Output (1) LO Input (MHz) R jX 70 8.3 –452.4 R jX R jX 100 7.3 –318.5 150 7.1 –211.3 200 6.6 –156.4 250 6.5 –123.1 300 6.1 –100.7 350 5.7 –84.2 1100 62.5 3.1 1200 58.1 4.3 1300 53.7 4.7 1400 50.2 4.2 1500 47.3 3.9 1600 44.4 3.2 1700 42.0 1800 40.6 1.6 30.4 33.6 0.5 42.6 1900 16.9 39.6 –0.7 49.1 2.3 2000 38.7 –2.2 40.6 14.2 2100 38.2 –3.6 33.8 17.7 2200 38.4 –5.1 33.3 15.7 2300 38.9 –6.5 32.9 13.7 2400 39.5 –7.8 29.6 13.2 27.4 11.9 2500 (1) Includes T1 shown in Figure 1. Table 1. Port Impedances versus Frequency (VD1, VD2, VD3, TX EN = 3 Vdc) APPLICATIONS INFORMATION DESIGN CONSIDERATIONS The MRFIC1813 combines a single–balanced MESFET mixer with an exciter amplifier. It is usable for transmit frequencies from 1.7 to 2.5 GHz and IF frequencies from 70 to 350 MHz. The design is optimized for low–side local oscillator injection in hetrodyne transmit applications. Minimal off–chip matching is required while allowing for flexibility and performance optimization. An active balun is employed at the IF port which gives good balance down to at least 70 MHz. A passive splitter is used at the LO input to complete the single–balanced configuration. conversion gain is reduced to about 8 dB. Microstrip inductors T1 and T2 combine with inductance internal to the device to form RF chokes. Some tuning of the RF output can be achieved with T1. As with all RF devices, circuit layout is important. Controlled impedance lines should be used for all RF and IF interconnects. As shown in Figure 1, power supply by–passing should be used to avoid device instability. Ground vias should be included near all ground connections indicated in the schematic. Off–chip components should be mounted as close to the IC leads as possible. CIRCUIT CONSIDERATIONS Figure 1 shows the application circuit used to gather the data presented in the characterization curves. As shown in Table 1, the IF port impedance is very high. Three hundred ohms was chosen for R1 to shunt the IF port as a compromise of gain and bandwidth. A 50 Ω resistor can be used and L1 and C5 eliminated to provide a broadband match. The MRFIC1813 6 EVALUATION BOARDS Evaluation boards are available for RF Monolithic Integrated Circuits by adding a “TF” to the device type. For a complete list of currently available boards and one in development for newly introduced products, please contact your local Motorola Distributor or Sales Office. MOTOROLA RF DEVICE DATA PACKAGE DIMENSIONS A -P- 16x K REF 0.200 (0.008) 16 M T 9 B L PIN 1 IDENTIFICATION 1 8 -U- C 0.100 (0.004) -T- M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSIONS A AND B ARE TO BE DETERMINED AT DATUM PLANE –U–. D H G SEATING PLANE A K K1 J1 M DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX ––– 5.10 4.30 4.50 ––– 1.20 0.05 0.25 0.45 0.55 0.65 BSC 0.22 0.23 0.09 0.24 0.09 0.18 0.16 0.32 0.16 0.26 6.30 6.50 0° 10 ° INCHES MIN MAX ––– 0.200 0.169 0.177 ––– 0047 0.002 0.010 0.018 0.022 0.026 BSC 0.009 0.010 0.004 0.009 0.004 0.007 0.006 0.013 0.006 0.010 0.248 0.256 0° 10 ° J A SECTION A–A F CASE 948C–03 ISSUE B MOTOROLA RF DEVICE DATA MRFIC1813 7 Motorola reserves the right to make changes without further notice to any products herein. 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Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 JAPAN: Nippon Motorola Ltd.: SPD, Strategic Planning Office, 4–32–1, Nishi–Gotanda, Shinagawa–ku, Tokyo 141, Japan. 81–3–5487–8488 Mfax: [email protected] – TOUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, – US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 INTERNET: http://motorola.com/sps MRFIC1813 8 ◊ MRFIC1813/D MOTOROLA RF DEVICE DATA