19-3363; Rev 1; 3/11 1.5Msps, Single-Supply, Low-Power, TrueDifferential, 10-Bit ADCs with Internal Reference The MAX1077/MAX1079 are low-power, high-speed, serial-output, 10-bit, analog-to-digital converters (ADCs) that operate at up to 1.5Msps and have an internal reference. These devices feature true-differential inputs, offering better noise immunity, distortion improvements, and a wider dynamic range over single-ended inputs. A standard SPI™/QSPI™/MICROWIRE™ interface provides the clock necessary for conversion. These devices easily interface with standard digital signal processor (DSP) synchronous serial interfaces. The MAX1077/MAX1079 operate from a single +2.7V to +3.6V supply voltage. The MAX1077/MAX1079 include a 2.048V internal reference. The MAX1077 has a unipolar analog input, while the MAX1079 has a bipolar analog input. These devices feature a partial power-down mode and a full power-down mode for use between conversions, which lower the supply current to 2mA (typ) and 1µA (max), respectively. Also featured is a separate power-supply input (VL), which allows direct interfacing to +1.8V to VDD digital logic. The fast conversion speed, low-power dissipation, excellent AC performance, and DC accuracy (±0.5 LSB INL) make the MAX1077/MAX1079 ideal for industrial process control, motor control, and base-station applications. The MAX1077/MAX1079 come in a 12-pin TQFN package, and are available in the extended (-40°C to +85°C) temperature range. Applications Data Acquisition Communications Bill Validation Portable Instruments Features o 1.5Msps Sampling Rate o Only 22mW (typ) Power Dissipation o Only 1µA (max) Shutdown Current o High-Speed, SPI-Compatible, 3-Wire Serial Interface o 61dB S/(N + D) at 525kHz Input Frequency o Internal True-Differential Track/Hold (T/H) o Internal 2.048V Reference o No Pipeline Delays o Small 12-Pin TQFN Package Ordering Information PART TEMP RANGE PINPACKAGE MAX1077ETC+T -40°C to +85°C 12 TQFN-EP* Unipolar MAX1079ETC+T -40°C to +85°C 12 TQFN-EP* Bipolar INPUT +Denotes a lead(Pb)-free/RoHS-compliant package. T = Tape and reel. *EP = Exposed pad. Motor Control Typical Operating Circuit Pin Configuration TOP VIEW + AIN+ N.C. SCLK 12 11 10 0.01µF 10µF AIN- 1 REF 2 RGND MAX1077 MAX1079 3 EP +1.8V TO VDD +2.7V TO +3.6V 9 CNVST 8 DOUT 7 0.01µF VDD DIFFERENTIAL + INPUT VOLTAGE - AIN+ DOUT AIN- MAX1077 CNVST MAX1079 VL 10µF VL µC/DSP SCLK 4 5 6 VDD N.C. GND REF 4.7µF 0.01µF RGND GND TQFN SPI/QSPI are trademarks of Motorola, Inc. MICROWIRE is a trademark of National Semiconductor Corp. ________________________________________________________________ Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. MAX1077/MAX1079 General Description MAX1077/MAX1079 1.5Msps, Single-Supply, Low-Power, TrueDifferential, 10-Bit ADCs with Internal Reference ABSOLUTE MAXIMUM RATINGS VDD to GND ..............................................................-0.3V to +6V VL to GND ................-0.3V to the lower of (VDD + 0.3V) and +6V Digital Inputs to GND .................-0.3V to the lower of (VDD + 0.3V) and +6V Digital Output to GND ....................-0.3V to the lower of (VL + 0.3V) and +6V Analog Inputs and REF to GND..........-0.3V to the lower of (VDD + 0.3V) and +6V RGND to GND .......................................................-0.3V to +0.3V Maximum Current into Any Pin............................................50mA Continuous Power Dissipation (TA = +70°C) 12-Pin TQFN (derate 16.9mW/°C above +70°C) ......1349mW Operating Temperature Range MAX107_ ETC.................................................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-60°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) .......................................+260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VDD = +2.7V to +3.6V, VL = VDD, fSCLK = 24MHz, 50% duty cycle, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC ACCURACY Resolution 10 Bits Relative Accuracy INL (Note 1) -0.5 +0.5 LSB Differential Nonlinearity DNL (Note 2) -0.5 +0.5 LSB ±2 LSB Offset Error Offset-Error Temperature Coefficient ±1 Gain Error Offset nulled ppm/°C ±2 Gain Temperature Coefficient LSB ±2 ppm/°C 61 dB DYNAMIC SPECIFICATIONS (fIN = 525kHz sine wave, VIN = VREF, unless otherwise noted.) Signal-to-Noise Plus Distortion Total Harmonic Distortion SINAD Spurious-Free Dynamic Range SFDR Intermodulation Distortion THD IMD 60 Up to the 5th harmonic fIN1 = 250kHz, fIN2 = 300kHz -80 -74 -80 -74 -78 dB dB dB Full-Power Bandwidth -3dB point, small-signal method 15 MHz Full-Linear Bandwidth S/(N + D) > 56dB, single ended 1.2 MHz CONVERSION RATE Minimum Conversion Time tCONV (Note 3) Maximum Throughput Rate Minimum Throughput Rate Track-and-Hold Acquisition Time (Note 4) tACQ (Note 5) Aperture Delay Aperture Jitter External Clock Frequency 2 (Note 6) fSCLK 0.667 µs 1.5 Msps 10 ksps 125 ns 5 ns 30 ps (Note 7) _______________________________________________________________________________________ 24 MHz 1.5Msps, Single-Supply, Low-Power, TrueDifferential, 10-Bit ADCs with Internal Reference (VDD = +2.7V to +3.6V, VL = VDD, fSCLK = 24MHz, 50% duty cycle, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS ANALOG INPUTS (AIN+, AIN-) Differential Input Voltage Range VIN AIN+ - AIN-, MAX1077 0 VREF AIN+ - AIN-, MAX1079 -VREF / 2 +VREF / 2 0 VDD Absolute Input Voltage Range DC Leakage Current ±1 V V µA Input Capacitance Per input pin 16 pF Input Current (Average) Time averaged at maximum throughput rate 75 µA REFERENCE OUTPUT (REF) REF Output Voltage Range Static, TA = +25°C 2.038 Voltage Temperature Coefficient 2.048 2.058 ±50 Load Regulation Line Regulation ISOURCE = 0 to 2mA 0.35 ISINK = 0 to 100µA 1.0 VDD = 2.7V to 3.6V, static 0.25 V ppm/°C mV/mA mV/V DIGITAL INPUTS (SCLK, CNVST) Input Voltage Low VIL Input Voltage High VIH Input Leakage Current 0.3 x VL 0.7 x VL IIL V V 0.05 ±10 µA 30 pF 0.4 V ±10 µA DIGITAL OUTPUT (DOUT) Output Load Capacitance COUT For stated timing performance Output Voltage Low VOL ISINK = 5mA, VL ≥ 1.8V Output Voltage High VOH ISOURCE = 1mA, VL ≥ 1.8V Output Leakage Current IOL Output high impedance VL - 0.5V V ±0.2 POWER REQUIREMENTS Analog Supply Voltage VDD 2.7 3.6 V Digital Supply Voltage VL 1.8 VDD V Analog Supply Current, Normal Mode IDD Analog Supply Current, Partial Power-Down Mode IDD Analog Supply Current, Full Power-Down Mode IDD Digital Supply Current (Note 8) Static, fSCLK = 24MHz 6 8 Static, no SCLK 5 7 Operational, 1.5Msps 7 9 fSCLK = 24MHz 2 No SCLK 2 fSCLK = 24MHz PSR mA 1 µA No SCLK 0.3 1 Operational, full-scale input at 1.5Msps 0.3 1 Static, fSCLK = 24MHz 0.15 0.5 Partial/full power-down mode, fSCLK = 24MHz 0.1 0.3 0.1 ±0.2 1 µA ±3.0 mV Static, no SCLK (all modes) Positive-Supply Rejection mA VDD = 3V +20% -10%, full-scale input mA _______________________________________________________________________________________ 3 MAX1077/MAX1079 ELECTRICAL CHARACTERISTICS (continued) MAX1077/MAX1079 1.5Msps, Single-Supply, Low-Power, TrueDifferential, 10-Bit ADCs with Internal Reference TIMING CHARACTERISTICS (VDD = +2.7V to +3.6V, VL = VDD, fSCLK = 24MHz, 50% duty cycle, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) PARAMETER SYMBOL CONDITIONS MIN VL = 2.7V to VDD SCLK Pulse-Width High tCH VL = 1.8V to VDD, minimum recommended (Note 7) tCL SCLK Rise to DOUT Transition tDOUT MAX UNITS ns 22.5 VL = 2.7V to VDD SCLK Pulse-Width Low TYP 18.7 18.7 VL = 1.8V to VDD, minimum recommended (Note 7) ns 22.5 CL = 30pF, VL = 2.7V to VDD 17 CL = 30pF, VL = 1.8V to VDD 24 ns DOUT Remains Valid After SCLK tDHOLD VL = 1.8V to VDD 4 ns CNVST Fall to SCLK Fall tSETUP VL = 1.8V to VDD 10 ns tCSW VL = 1.8V to VDD 20 CNVST Pulse Width ns Power-Up Time; Full Power-Down tPWR-UP 2 ms Restart Time; Partial Power-Down tRCV 16 Cycles Note 1: Relative accuracy is the deviation of the analog value at any code from its theoretical value after the gain error and the offset error have been nulled. Note 2: No missing codes over temperature. Note 3: Conversion time is defined as the number of clock cycles (16) multiplied by the clock period. Note 4: At sample rates below 10ksps, the input full-linear bandwidth is reduced to 5kHz. Note 5: The listed value of three SCLK cycles is given for full-speed continuous conversions. Acquisition time begins on the 14th rising edge of SCLK and terminates on the next falling edge of CNVST. The IC idles in acquisition mode between conversions. Note 6: Undersampling at the maximum signal bandwidth requires the minimum jitter spec for SINAD performance. Note 7: 1.5Msps operation guaranteed for VL > 2.7V. See the Typical Operating Characteristics section for recommended sampling speeds for VL < 2.7V. Note 8: Digital supply current is measured with the VIH level equal to VL, and the VIL level equal to GND. VL CNVST tCSW tSETUP tCL tCH SCLK DOUT tDHOLD tDOUT 6kΩ DOUT DOUT 6kΩ 4 GND GND a) HIGH-Z TO VOH, VOL TO VOH, AND VOH TO HIGH-Z Figure 1. Detailed Serial-Interface Timing CL CL b) HIGH-Z TO VOL, VOH TO VOL, AND VOL TO HIGH-Z Figure 2. Load Circuits for Enable/Disable Times _______________________________________________________________________________________ 1.5Msps, Single-Supply, Low-Power, TrueDifferential, 10-Bit ADCs with Internal Reference INTEGRAL NONLINEARITY vs. DIGITAL OUTPUT CODE (MAX1077) 0.10 19 17 2.1 2.4 2.7 3.0 3.3 0.10 0.05 0 -0.05 -0.05 -0.10 -0.10 -0.15 -0.15 3.6 -0.20 0 256 512 768 1024 -512 -256 0 256 512 VL (V) DIGITAL OUTPUT CODE DIGITAL OUTPUT CODE DIFFERENTIAL NONLINEARITY vs. DIGITAL OUTPUT CODE (MAX1077) DIFFERENTIAL NONLINEARITY vs. DIGITAL OUTPUT CODE (MAX1079) OFFSET ERROR vs. TEMPERATURE (MAX1077) 0.10 DNL (LSB) 0.05 0 0.05 0 -0.05 -0.05 -0.10 -0.10 -0.15 -0.15 -0.20 0 256 512 768 1024 -1.00 -2.00 -512 -256 0 256 512 -40 -15 10 35 60 DIGITAL OUTPUT CODE DIGITAL OUTPUT CODE TEMPERATURE (°C) OFFSET ERROR vs. TEMPERATURE (MAX1079) GAIN ERROR vs. TEMPERATURE (MAX1077) GAIN ERROR vs. TEMPERATURE (MAX1079) -1.00 -1.50 0 10 35 TEMPERATURE (°C) 60 85 MAX1077/79 toc09 0 -1.00 -1.00 -15 85 -0.50 -0.50 -2.00 0.50 GAIN ERROR (LSB) 0.50 GAIN ERROR (LSB) -0.50 1.00 MAX1077/79 toc08 1.00 MAX1077/79 toc07 0 -40 -0.50 -1.50 -0.20 0 MAX1077/79 toc06 0.10 0.15 OFFSET ERROR (LSB) 0.15 MAX1077/79 toc05 0.20 MAX1077/79 toc04 0.20 DNL (LSB) 0 -0.20 1.8 OFFSET ERROR (LSB) 0.05 0.15 INL (LSB) 21 0.20 MAX1077/79 toc02 0.15 INL (LSB) 23 fSCLK (MHz) 0.20 MAX1077/79 toc01 25 INTEGRAL NONLINEARITY vs. DIGITAL OUTPUT CODE (MAX1079) MAX1077/79 toc03 MAXIMUM RECOMMENDED fSCLK vs. VL -40 -15 10 35 TEMPERATURE (°C) 60 85 -40 -15 10 35 60 85 TEMPERATURE (°C) _______________________________________________________________________________________ 5 MAX1077/MAX1079 Typical Operating Characteristics (VDD = +3V, VL = VDD, fSCLK = 24MHz, fSAMPLE = 1.5Msps, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) Typical Operating Characteristics (continued) (VDD = +3V, VL = VDD, fSCLK = 24MHz, fSAMPLE = 1.5Msps, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) 60.0 61.0 MAX1079 400 500 -96 100 ANALOG INPUT FREQUENCY (kHz) 200 MAX1077 -40 300 400 500 FFT PLOT (MAX1079) fIN = 500kHz SINAD = 61.2dB SNR = 61.2dB THD = -81.7dB SFDR = 83.5dB -20 AMPLITUDE (dB) MAX1079 SFDR (dB) 200 ANALOG INPUT FREQUENCY (kHz) FFT PLOT (MAX1077) 88 86 100 500 0 MAX1077/79 toc13 90 400 ANALOG INPUT FREQUENCY (kHz) SFDR vs. INPUT FREQUENCY 92 300 0 -60 -80 fIN = 500kHz SINAD = 61.2dB SNR = 61.2dB THD = -91.3dB SFDR = 88.7dB -20 AMPLITUDE (dB) 300 MAX1077/79 toc14 200 -88 -92 60.5 60.0 100 MAX1077 -84 MAX1077/79 toc15 60.5 SNR AND SINAD 61.5 THD (dB) 61.0 -80 MAX1077/79 toc11 SNR AND SINAD 61.5 THD vs. INPUT FREQUENCY 62.0 DYNAMIC PERFORMANCE (dB) MAX1077/79 toc10 DYNAMIC PERFORMANCE (dB) 62.0 DYNAMIC PERFORMANCE vs. INPUT FREQUENCY (MAX1079) MAX1077/79 toc12 DYNAMIC PERFORMANCE vs. INPUT FREQUENCY (MAX1077) -40 -60 -80 -100 -100 -120 -120 84 -140 300 400 -140 0 500 TOTAL HARMONIC DISTORTION vs. SOURCE IMPEDANCE 375 500 625 750 0 TWO-TONE IMD PLOT (MAX1077) AMPLITUDE (dB) fIN = 500kHz -70 -80 fIN = 100kHz -40 fIN1 fIN2 -60 250 375 500 625 750 TWO-TONE IMD PLOT (MAX1079) fIN1 = 250.102kHz fIN2 = 299.966kHz IMD = -86.6dB -20 125 ANALOG INPUT FREQUENCY (kHz) 0 MAX1077/79 toc16 -60 250 ANALOG INPUT FREQUENCY (kHz) ANALOG INPUT FREQUENCY (kHz) -50 125 0 -80 fIN1 = 250.102kHz fIN2 = 299.966kHz IMD = -83.4dB -20 AMPLITUDE (dB) 200 MAX1077/79 toc17 100 MAX1077/79 toc18 82 THD (dB) MAX1077/MAX1079 1.5Msps, Single-Supply, Low-Power, TrueDifferential, 10-Bit ADCs with Internal Reference -40 fIN2 fIN1 -60 -80 -100 -100 -120 -120 -90 -100 -140 10 100 SOURCE IMPEDANCE (Ω) 6 1000 -140 0 125 250 375 500 625 ANALOG INPUT FREQUENCY (kHz) 750 0 125 250 375 500 625 ANALOG INPUT FREQUENCY (kHz) _______________________________________________________________________________________ 750 1.5Msps, Single-Supply, Low-Power, TrueDifferential, 10-Bit ADCs with Internal Reference VL, NO SCLK VDD, NO SCLK 0.40 VDD, SCLK = 24MHz VL, = 1.8V, SCLK = 24MHz VL, = 3V, SCLK = 24MHz 50 25 7.5 6.0 4.5 3.0 PARTIAL POWER-DOWN 1.5 0 0 -15 10 35 60 -40 85 -15 10 35 60 -40 85 10 35 60 TEMPERATURE (°C) TEMPERATURE (°C) VDD SUPPLY CURRENT vs. CONVERSION RATE VL SUPPLY CURRENT vs. TEMPERATURE VL SUPPLY CURRENT vs. CONVERSION RATE 4 2 CONVERSION, VL = 3V 0.30 CONVERSION, VL = 1.8V 0.20 500 750 1000 1250 1500 VL = 3V 150 100 VL = 1.8V 0 0 250 200 50 0.10 0 MAX1077/79 toc24 0.40 -40 -15 10 35 60 0 85 250 500 750 1000 1250 fSAMPLE (kHz) TEMPERATURE (°C) fSAMPLE (kHz) REFERENCE VOLTAGE vs. TEMPERATURE REFERENCE VOLTAGE vs. LOAD CURRENT (SOURCE) REFERENCE VOLTAGE vs. LOAD CURRENT (SINK) 2.03 2.02 2.03 2.02 MAX1077/79 toc27 2.04 1500 2.08 REFERENCE VOLTAGE (V) 2.04 MAX1077/79 toc26 2.05 2.05 REFERENCE VOLTAGE (V) MAX1077/79 toc25 2.06 85 250 VL SUPPLY CURRENT (µA) 6 0.50 MAX1077/79 toc23 MAX1077/79 toc22 8 0 -15 TEMPERATURE (°C) VL SUPPLY CURRENT (mA) -40 VDD SUPPLY CURRENT (mA) MAX1077/79 toc21 CONVERSION 0.20 0 REFERENCE VOLTAGE (V) 75 9.0 VDD SUPPLY CURRENT (mA) 0.60 MAX1077/79 toc20 0.80 100 VL SUPPLY CURRENT (µA) MAX1077/79 toc19 VDD/VL SUPPLY CURRENT (µA) 1.00 VDD SUPPLY CURRENT vs. TEMPERATURE VL PARTIAL/FULL POWER-DOWN SUPPLY CURRENT vs. TEMPERATURE VDD/VL FULL POWER-DOWN SUPPLY CURRENT vs. TEMPERATURE 2.07 2.06 2.05 2.01 2.00 -40 -15 10 35 TEMPERATURE (°C) 60 85 2.04 2.01 0 2 4 LOAD CURRENT (mA) 6 8 0 50 100 150 200 LOAD CURRENT (µA) _______________________________________________________________________________________ 7 MAX1077/MAX1079 Typical Operating Characteristics (continued) (VDD = +3V, VL = VDD, fSCLK = 24MHz, fSAMPLE = 1.5Msps, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) 1.5Msps, Single-Supply, Low-Power, TrueDifferential, 10-Bit ADCs with Internal Reference MAX1077/MAX1079 Pin Description PIN NAME FUNCTION 1 AIN- Negative Analog Input 2 REF Reference Voltage Output. Internal 2.048V reference output. Bypass REF with a 0.01µF capacitor and a 4.7µF capacitor to RGND. 3 RGND Reference Ground. Connect RGND to GND. VDD Positive Analog Supply Voltage (+2.7V to +3.6V). Bypass VDD with a 0.01µF capacitor and a 10µF capacitor to GND. 5, 11 N.C. No Connection 6 GND Ground. GND is internally connected to EP. 7 VL 8 DOUT Serial Data Output. Data is clocked out on the rising edge of SCLK. 9 CNVST Convert Start. Forcing CNVST high prepares the part for a conversion. Conversion begins on the falling edge of CNVST. The sampling instant is defined by the falling edge of CNVST. 10 SCLK Serial Clock Input. Clocks data out of the serial interface. SCLK also sets the conversion speed. 12 AIN+ Positive Analog Input — EP 4 Positive Logic Supply Voltage (1.8V to VDD). Bypass VL with a 0.01µF capacitor and a 10µF capacitor to GND. Exposed Paddle. EP is internally connected to GND. Detailed Description The MAX1077/MAX1079 use an input T/H and successive-approximation register (SAR) circuitry to convert an analog input signal to a digital 10-bit output. The serial interface requires only three digital lines (SCLK, CNVST, and DOUT) and provides easy interfacing to microprocessors (µPs) and DSPs. Figure 3 shows the simplified internal structure for the MAX1077/MAX1079. True-Differential Analog Input T/H The equivalent circuit of Figure 4 shows the input architecture of the MAX1077/MAX1079, which is composed of a T/H, a comparator, and a switched-capacitor digital-toanalog converter (DAC). The T/H enters its tracking mode on the 14th SCLK rising edge of the previous conversion. Upon power-up, the T/H enters its tracking mode immediately. The positive input capacitor is connected to AIN+. The negative input capacitor is connected to AIN-. The T/H enters its hold mode on the falling edge of CNVST and the difference between the sampled positive and negative input voltages is converted. The time required for the T/H to acquire an input signal is determined by how quickly its input capacitance is charged. If the input signal’s source impedance is high, the acquisition time lengthens. The acquisition time, tACQ, is the minimum 8 time needed for the signal to be acquired. It is calculated by the following equation: tACQ ≥ 8 × (RS + RIN) × 16pF where RIN = 200Ω, and RS is the source impedance of the input signal. Note: tACQ is never less than 125ns, and any source impedance below 12Ω does not significantly affect the ADC’s AC performance. Input Bandwidth The ADC’s input-tracking circuitry has a 15MHz smallsignal bandwidth, making it possible to digitize highspeed transient events and measure periodic signals with bandwidths exceeding the ADC’s sampling rate by using undersampling techniques. To avoid high-frequency signals being aliased into the frequency band of interest, anti-alias filtering is recommended. Analog Input Protection Internal protection diodes that clamp the analog input to VDD and GND allow the analog input pins to swing from GND - 0.3V to VDD + 0.3V without damage. Both inputs must not exceed VDD or be lower than GND for accurate conversions. _______________________________________________________________________________________ 1.5Msps, Single-Supply, Low-Power, TrueDifferential, 10-Bit ADCs with Internal Reference VL CIN+ REF MAX1077/MAX1079 VDD CAPACITIVE DAC RIN+ AIN+ REF 2.048V AIN+ 10-BIT SAR ADC T/H AIN- OUTPUT BUFFER DOUT VAZ COMP CONTROL LOGIC AIN- RGND CONTROL LOGIC AND TIMING CNVST CIN- RIN- CIN+ RIN+ ACQUISITION MODE SCLK MAX1077 MAX1079 GND CAPACITIVE DAC AIN+ Figure 3. Functional Diagram VAZ Serial Interface Initialization After Power-Up and Starting a Conversion Upon initial power-up, the MAX1077/MAX1079 require a complete conversion cycle to initialize the internal calibration. Following this initial conversion, the part is ready for normal operation. This initialization is only required after a hardware power-up sequence and is not required after exiting partial or full power-down mode. To start a conversion, pull CNVST low. At CNVST’s falling edge, the T/H enters its hold mode and a conversion is initiated. SCLK runs the conversion, and the data can then be shifted out serially on DOUT. Timing and Control Conversion-start and data-read operations are controlled by the CNVST and SCLK digital inputs. Figures 1 and 5 show timing diagrams, which outline the serialinterface operation. A CNVST falling edge initiates a conversion sequence: the T/H stage holds the input voltage, the ADC begins to convert, and DOUT changes from high impedance to logic low. SCLK is used to drive the conversion process, and it shifts data out as each bit of the conversion is determined. SCLK begins shifting out the data after the 4th rising edge of SCLK. DOUT transitions t DOUT after each SCLK’s rising edge and remains valid 4ns (tDHOLD) after the next rising edge. The 4th rising clock edge produces the MSB of the conversion at DOUT, and the MSB remains valid 4ns after the 5th rising edge. Since there are 10 data bits, 2 sub-bits (S1 and S0), and 3 leading zeros, at least 16 rising clock edges are need- COMP CONTROL LOGIC AINCIN- RIN- HOLD/CONVERSION MODE Figure 4. Equivalent Input Circuit ed to shift out these bits. For continuous operation, pull CNVST high between the 14th and the 16th SCLK rising edges. If CNVST stays low after the falling edge of the 16th SCLK cycle, the DOUT line goes to a highimpedance state on either CNVST’s rising edge or the next SCLK’s rising edge. Partial Power-Down and Full Power-Down Modes Power consumption can be reduced significantly by placing the MAX1077/MAX1079 in either partial powerdown mode or full power-down mode. Partial powerdown mode is ideal for infrequent data sampling and fast wake-up time applications. Pull CNVST high after the 3rd SCLK rising edge and before the 14th SCLK rising edge to enter and stay in partial power-down mode (see Figure 6). This reduces the supply current to 2mA. While in partial power-down mode, the reference remains enabled to allow valid conversions once the IC is returned to normal mode. Drive CNVST low and allow at least 14 SCLK cycles to elapse before driving CNVST high to exit partial power-down mode. Full power-down mode is ideal for infrequent data sampling and very low supply-current applications. The MAX1077/MAX1079 have to be in partial power-down mode to enter full power-down mode. Perform the SCLK/CNVST sequence described above to enter _______________________________________________________________________________________ 9 MAX1077/MAX1079 1.5Msps, Single-Supply, Low-Power, TrueDifferential, 10-Bit ADCs with Internal Reference CNVST tSETUP tACQUIRE POWER-MODE SELECTION WINDOW 1 SCLK 2 3 4 HIGH IMPEDANCE 8 D9 DOUT D8 D7 CONTINUOUS-CONVERSION 16 SELECTION WINDOW 14 D6 D5 D4 D3 D2 D1 S1 D0 S0 Figure 5. Interface-Timing Sequence CNVST MUST GO HIGH AFTER THE 3RD BUT BEFORE THE 14TH SCLK RISING EDGE CNVST ONE 8-BIT TRANSFER SCLK DOUT GOES HIGH IMPEDANCE ONCE CNVST GOES HIGH 1ST SCLK RISING EDGE DOUT 0 0 0 MODE D9 D8 D7 D6 D5 NORMAL PPD REF ENABLED (2.048V) Figure 6. SPI Interface—Partial Power-Down Mode EXECUTE PARTIAL POWER-DOWN TWICE CNVST FIRST 8-BIT TRANSFER SECOND 8-BIT TRANSFER SCLK 1ST SCLK RISING EDGE DOUT MODE 0 0 0 DOUT ENTERS TRI-STATE ONCE CNVST GOES HIGH 1ST SCLK RISING EDGE D9 D8 D7 D6 NORMAL REF 0 D5 PPD 0 0 0 0 0 0 RECOVERY 0 FPD ENABLED (2.048V) DISABLED Figure 7. SPI Interface—Full Power-Down Mode partial power-down mode. Then repeat the same sequence to enter full power-down mode (see Figure 7). Drive CNVST low, and allow at least 14 SCLK cycles to elapse before driving CNVST high to exit full powerdown mode. While in full power-down mode, the reference is disabled to minimize power consumption. Be sure to allow at least 2ms recovery time after exiting full power-down mode for the reference to settle. In 10 partial/full power-down mode, maintain a logic low or a logic high on SCLK to minimize power consumption. Transfer Function Figure 8 shows the unipolar transfer function for the MAX1077. Figure 9 shows the bipolar transfer function for the MAX1079. The MAX1077 output is straight binary, while the MAX1079 output is two’s complement. ______________________________________________________________________________________ 1.5Msps, Single-Supply, Low-Power, TrueDifferential, 10-Bit ADCs with Internal Reference Internal Reference The MAX1077/MAX1079 have an on-chip voltage reference trimmed to 2.048V. The internal reference output is connected to REF and also drives the internal capacitive DAC. The output can be used as a reference voltage source for other components and can source up to 2mA. Bypass REF with a 0.01µF capacitor and a 4.7µF capacitor to RGND. OUTPUT CODE 111...110 111...101 000...011 How to Start a Conversion 000...010 Connection to Standard Interfaces The MAX1077/MAX1079 serial interface is fully compatible with SPI/QSPI and MICROWIRE (see Figure 11). If a serial interface is available, set the CPU’s serial interface in master mode so the CPU generates the serial clock. Choose a clock frequency up to 24MHz. SPI and MICROWIRE When using SPI or MICROWIRE, the MAX1077/MAX1079 are compatible with all four modes programmed with the CPHA and CPOL bits in the SPI or MICROWIRE control register. Conversion begins with a CNVST falling edge. DOUT goes low, indicating a conversion is in progress. Two consecutive 1-byte reads are required to get the full 10 bits from the ADC. DOUT transitions on SCLK rising edges. DOUT is guaranteed to be valid tDOUT later and FULL-SCALE TRANSITION 111...111 The internal reference is continuously powered up during both normal and partial power-down modes. In full power-down mode, the internal reference is disabled. Be sure to allow at least 2ms recovery time after hardware power-up or exiting full power-down mode for the reference to reach its intended value. An analog-to-digital conversion is initiated by CNVST and clocked by SCLK, and the resulting data is clocked out on DOUT by SCLK. With SCLK idling high or low, a falling edge on CNVST begins a conversion. This causes the analog input stage to transition from track to hold mode and DOUT to transition from high impedance to being actively driven low. A total of 16 SCLK cycles are required to complete a normal conversion. If CNVST is low during the 16th falling SCLK edge, DOUT returns to high impedance on the next rising edge of CNVST or SCLK, enabling the serial interface to be shared by multiple devices. If CNVST returns high after the 14th, but before the 16th SCLK rising edge, DOUT remains active so continuous conversions can be sustained. The highest throughput is achieved when performing continuous conversions. Figure 10 illustrates a conversion using a typical serial interface. MAX1077/MAX1079 Applications Information FS = VREF ZS = 0 V 1 LSB = REF 1024 000...001 000...000 0 1 2 3 FS DIFFERENTIAL INPUT VOLTAGE (LSB) FS - 3/2 LSB Figure 8. Unipolar Transfer Function (MAX1077 Only) OUTPUT CODE FULL-SCALE TRANSITION V FS = REF 2 ZS = 0 -VREF - FS = 2 VREF 1 LSB = 1024 011...111 011...110 000...010 000...001 000...000 111...111 111...110 111...101 100...001 100...000 -FS 0 DIFFERENTIAL INPUT VOLTAGE (LSB) FS FS - 3/2 LSB Figure 9. Bipolar Transfer Function (MAX1079 Only) ______________________________________________________________________________________ 11 MAX1077/MAX1079 1.5Msps, Single-Supply, Low-Power, TrueDifferential, 10-Bit ADCs with Internal Reference CNVST SCLK 1 14 16 1 DOUT 0 0 0 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 S1 S0 0 Figure 10. Continuous Conversion with Burst/Continuous Clock I/O SCK MISO +3V TO +5V CNVST SCLK DOUT MAX1077 MAX1079 SS A) SPI CS SCK MISO +3V TO +5V CNVST SCLK DOUT MAX1077 MAX1079 SS B) QSPI I/O SK SI CNVST SCLK DOUT MAX1077 MAX1079 C) MICROWIRE Figure 11. Common Serial-Interface Connections to the MAX1077/MAX1079 12 ______________________________________________________________________________________ 0 1.5Msps, Single-Supply, Low-Power, TrueDifferential, 10-Bit ADCs with Internal Reference MAX1077/MAX1079 CNVST 8 1 9 16 SCLK DOUT HIGH-Z D9 D8 D5 D6 D7 D4 D3 D2 D1 S1 D0 HIGH-Z S0 Figure 12. SPI/MICROWIRE Serial-Interface Timing—Single Conversion (CPOL = CPHA = 0), (CPOL = CPHA = 1) CNVST SCLK 14 1 0 DOUT 0 0 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 16 S1 S0 1 0 0 Figure 13. SPI/MICROWIRE Serial-Interface Timing—Continuous Conversion (CPOL = CPHA = 0), (CPOL = CPHA = 1) CNVST DOUT 16 2 SCLK HIGH-Z HIGH-Z D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 S1 S0 Figure 14. QSPI Serial-Interface Timing—Single Conversion (CPOL = 1, CPHA = 1) remains valid until tDHOLD after the following SCLK rising edge. When using CPOL = 0 and CPHA = 0 or CPOL = 1 and CPHA = 1, the data is clocked into the µP on the following rising edge. When using CPOL = 0 and CPHA = 1 or CPOL = 1 and CPHA = 0, the data is clocked into the µP on the next falling edge. See Figure 11 for connections and Figures 12 and 13 for timing. See the Timing Characteristics section to determine the best mode to use. QSPI Unlike SPI, which requires two 1-byte reads to acquire the 10 bits of data from the ADC, QSPI allows the minimum number of clock cycles necessary to clock in the data. The MAX1077/MAX1079 require 16 clock cycles from the µP to clock out the 10 bits of data. Figure 14 shows a transfer using CPOL = 1 and CPHA = 1. The conversion result contains three zeros, followed by the 10 data bits, 2 sub-bits, and a trailing zero with the data in MSB-first format. DSP Interface to the TMS320C54_ The MAX1077/MAX1079 can be directly connected to the TMS320C54_ family of DSPs from Texas Instruments, Inc. Set the DSP to generate its own clocks or use external clock signals. Use either the standard or buffered serial port. Figure 15 shows the simplest interface between the MAX1077/MAX1079 and the TMS320C54_, where the transmit serial clock (CLKX) drives the receive serial clock (CLKR) and ______________________________________________________________________________________ 13 MAX1077/MAX1079 1.5Msps, Single-Supply, Low-Power, TrueDifferential, 10-Bit ADCs with Internal Reference VL MAX1077 SCLK MAX1079 CNVST DVDD CLKX TMS320C54_ CLKR DVDD CLKR TMS320C54_ CNVST FSR DOUT DR FSX FSR DOUT VL MAX1077 MAX1079 SCLK DR CLOCK CONVERT Figure 15. Interfacing to the TMS320C54_ Internal Clocks Figure 16. Interfacing to the TMS320C54_ External Clocks SCLK, and the transmit frame sync (FSX) drives the receive frame sync (FSR) and CNVST. For continuous conversion, set the serial port to transmit a clock, and pulse the frame sync signal for a clock period before data transmission. The serial-port configuration (SPC) register should be set up with internal frame sync (TXM = 1), CLKX driven by an on-chip clock source (MCM = 1), burst mode (FSM = 1), and 16-bit word length (FO = 0). This setup allows continuous conversions provided that the data-transmit register (DXR) and the data-receive register (DRR) are serviced before the next conversion. Alternatively, autobuffering can be enabled when using the buffered serial port to execute conversions and read the data without CPU intervention. Connect the VL pin to the TMS320C54_ supply voltage when the MAX1077/MAX1079 are operating with an analog supply voltage higher than the DSP supply voltage. The word length can be set to 8 bits with FO = 1 to implement the power-down modes. The CNVST pin must idle high to remain in either power-down state. Another method of connecting the MAX1077/MAX1079 to the TMS320C54_ is to generate the clock signals external to either device. This connection is shown in Figure 16 where serial clock (CLOCK) drives the CLKR and SCLK and the convert signal (CONVERT) drives the FSR and CNVST. The serial port must be set up to accept an external receive-clock and external receive-frame sync. The SPC register should be written as follows: TXM = 0, external frame sync MCM = 0, CLKX is taken from the CLKX pin FSM = 1, burst mode 14 FO = 0, data transmitted/received as 16-bit words This setup allows continuous conversion, provided that the DRR is serviced before the next conversion. Alternatively, autobuffering can be enabled when using the buffered serial port to read the data without CPU intervention. Connect the VL pin to the TMS320C54_ supply voltage when the MAX1077/MAX1079 are operating with an analog supply voltage higher than the DSP supply voltage. The MAX1077/MAX1079 can also be connected to the TMS320C54_ by using the data transmit (DX) pin to drive CNVST and the CLKX generated internally to drive SCLK. A pullup resistor is required on the CNVST signal to keep it high when DX goes high impedance and 0001hex should be written to the DXR continuously for continuous conversions. The power-down modes can be entered by writing 00FFhex to the DXR (see Figures 17 and 18). DSP Interface to the ADSP21_ _ _ The MAX1077/MAX1079 can be directly connected to the ADSP21_ _ _ family of DSPs from Analog Devices, Inc. Figure 19 shows the direct connection of the MAX1077/MAX1079 to the ADSP21_ _ _. There are two modes of operation that can be programmed to interface with the MAX1077/MAX1079. For continuous conversions, idle CNVST low and pulse it high for one clock cycle during the LSB of the previous transmitted word. The ADSP21_ _ _ STCTL and SRCTL registers should be configured for early framing (LAFR = 0) and for an active-high frame (LTFS = 0, LRFS = 0) signal. In this mode, the data-independent frame-sync bit (DITFS = 1) can be selected to eliminate the need for writing to the ______________________________________________________________________________________ 1.5Msps, Single-Supply, Low-Power, TrueDifferential, 10-Bit ADCs with Internal Reference MAX1077/MAX1079 CNVST SCLK DOUT 1 S0 0 1 0 0 0 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 S1 S0 0 0 Figure 17. DSP Interface—Continuous Conversion CNVST SCLK DOUT 1 1 0 0 0 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 S1 S0 0 0 0 Figure 18. DSP Interface—Single-Conversion, Continuous/Burst Clock transmit-data register more than once. For single conversions, idle CNVST high and pulse it low for the entire conversion. The ADSP21_ _ _ STCTL and SRCTL registers should be configured for late framing (LAFR = 1) and for an active-low frame (LTFS = 1, LRFS = 1) signal. This is also the best way to enter the power-down modes by setting the word length to 8 bits (SLEN = 1001). Connect the VL pin to the ADSP21_ _ _ supply voltage when the MAX1077/MAX1079 are operating with a supply voltage higher than the DSP supply voltage (see Figures 17 and 18). Layout, Grounding, and Bypassing For best performance, use PC boards. Wire-wrap boards are not recommended. Board layout should ensure that digital and analog signal lines are separated from each other. Do not run analog and digital (especially clock) lines parallel to one another, or digital lines underneath the ADC package. Figure 20 shows the recommended system ground connections. Establish a single-point analog ground (star ground point) at GND, separate from the logic ground. Connect all other analog grounds and DGND to this star ground point for further noise reduction. The ground return to the power supply for this ground should be low impedance and as short as possible for noise-free operation. High-frequency noise in the VDD power supply can affect the ADC’s high-speed comparator. Bypass this supply to the single-point analog ground with 0.01µF and 10µF bypass capacitors. Minimize capacitor lead lengths for best supply-noise rejection. Definitions Integral Nonlinearity Integral nonlinearity (INL) is the deviation of the values on an actual transfer function from a straight line. This straight line can be either a best-straight-line fit or a line drawn between the end points of the transfer function, once offset and gain errors have been nullified. The static linearity parameters for the MAX1077/MAX1079 are measured using the end-points method. Differential Nonlinearity Differential nonlinearity (DNL) is the difference between an actual step width and the ideal value of 1 LSB. A DNL error specification of 1 LSB or less guarantees no missing codes and a monotonic transfer function. Aperture Jitter Aperture jitter (tAJ) is the sample-to-sample variation in the time between the samples. ______________________________________________________________________________________ 15 MAX1077/MAX1079 1.5Msps, Single-Supply, Low-Power, TrueDifferential, 10-Bit ADCs with Internal Reference VL MAX1077 SCLK MAX1079 CNVST VDDINT TCLK SUPPLIES ADSP21_ _ _ RCLK VDD VL TFS 10µF RFS DOUT GND 10µF DR 0.1µF 0.1µF Figure 19. Interfacing to the ADSP21_ _ _ VDD GND RGND VL DGND VL Aperture Delay Aperture delay (tAD) is the time defined between the falling edge of CNVST and the instant when an actual sample is taken. Signal-to-Noise Ratio For a waveform perfectly reconstructed from digital samples, signal-to-noise ratio (SNR) is the ratio of full-scale analog input (RMS value) to the RMS quantization error (residual error). The theoretical minimum analog-to-digital noise is caused by quantization error, and results directly from the ADC’s resolution (N bits): SNR = (6.02 x N + 1.76)dB In reality, there are other noise sources besides quantization noise, including thermal noise, reference noise, clock jitter, etc. Therefore, SNR is computed by taking the ratio of the RMS signal to the RMS noise, which includes all spectral components minus the fundamental, the first five harmonics, and the DC offset. Signal-to-Noise Plus Distortion Signal-to-noise plus distortion (SINAD) is the ratio of the fundamental input frequency’s RMS amplitude to the RMS equivalent of all other ADC output signals: SINAD(dB) = 20 x log (SignalRMS / NoiseRMS) Effective Number of Bits Effective number of bits (ENOB) indicates the global accuracy of an ADC at a specific input frequency and sampling rate. An ideal ADC’s error consists of quantization noise only. With an input range equal to the full-scale range of the ADC, calculate the ENOB as follows: ENOB = 16 DIGITAL CIRCUITRY MAX1077 MAX1079 Figure 20. Power-Supply Grounding Condition Total Harmonic Distortion Total harmonic distortion (THD) is the ratio of the RMS sum of the first five harmonics of the input signal to the fundamental itself. This is expressed as: ⎛ ⎞ V22 + V32 + V42 + V52 ⎜ ⎟ THD = 20 x log ⎜ ⎟ V 1 ⎜ ⎟ ⎝ ⎠ where V1 is the fundamental amplitude, and V2 through V5 are the amplitudes of the 2nd- through 5th-order harmonics. Spurious-Free Dynamic Range Spurious-free dynamic range (SFDR) is the ratio of the RMS amplitude of the fundamental (maximum signal component) to the RMS value of the next-largest distortion component. Full-Power Bandwidth Full-power bandwidth is the frequency at which the input signal amplitude attenuates by 3dB for a full-scale input. (SINAD − 1.76) 6.02 ______________________________________________________________________________________ 1.5Msps, Single-Supply, Low-Power, TrueDifferential, 10-Bit ADCs with Internal Reference Intermodulation Distortion Any device with nonlinearities creates distortion products when two sine waves at two different frequencies (f1 and f2) are input into the device. Intermodulation distortion (IMD) is the total power of the IM2 to IM5 intermodulation products to the Nyquist frequency relative to the total input power of the two input tones, f1 and f2. The individual input tone levels are at -7dBFS. The intermodulation products are as follows: • 2nd-order intermodulation products (IM2): f1 + f2, f2 - f1 • 3rd-order intermodulation products (IM3): 2f1 - f2, 2f2 - f1, 2f1 + f2, 2f2 + f1 • 4th-order intermodulation products (IM4): 3f1 - f2, 3f2 - f1, 3f1 + f2, 3f2 + f1 • 5th-order intermodulation products (IM5): 3f1 - 2f2, 3f2 - 2f1, 3f1 + 2f2, 3f2 + 2f1 Chip Information PROCESS: BiCMOS Package Information For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE 12 TQFN-EP PACKAGE CODE OUTLINE NO. LAND PATTERN NO. T1244+3 21-0139 90-0067 ______________________________________________________________________________________ 17 MAX1077/MAX1079 Full-Linear Bandwidth Full-linear bandwidth is the frequency at which the signal-to-noise plus distortion (SINAD) is equal to 56dB. MAX1077/MAX1079 1.5Msps, Single-Supply, Low-Power, TrueDifferential, 10-Bit ADCs with Internal Reference Revision History REVISION NUMBER REVISION DATE 0 8/04 Initial release 1 3/11 Removed commercial temperature grade parts from data sheet. Revised General Description, Ordering Information, Absolute Maximum Ratings, Chip Information, Package Information. DESCRIPTION PAGES CHANGED — 1, 2, 17, 18 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 18 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2011 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.