Philips Components Product specification Aluminium electrolytic capacitors SMD (Chip) Standard 085 CS FEATURES • Polarized aluminium electrolytic capacitors, non-solid, self healing handbook, 2 columns • SMD-version, rectangular case, insulated • Miniaturized, high CV per unit volume, low height • Flexible terminals, reflow and wave solderable CCB059 • Charge and discharge proof Fig.1 Component outline. • Supplied in blister tape on reel. APPLICATIONS • SMD technology, boards with restricted mounting height handbook, halfpage • General applications, consumer electronics, low profile and lightweight equipment 085 CS longer life 139 CLL CCB004 • Decoupling, smoothing, filtering and buffering. QUICK REFERENCE DATA DESCRIPTION VALUE Nominal case sizes (L × W × H in mm) 8.8 × 3.7 × 3.9 and 11.9 × 3.7 × 3.9 0.47 to 22 µF Rated capacitance range, CR −10 to +50% or ±20% Tolerance on CR Rated voltage range, UR 6.3 to 63 V −40 to +85 °C Category temperature range Endurance test at 85 °C 1000 hours Useful life at 85 °C 1500 hours Useful life at 40 °C, 1.4 × IR applied 40000 hours Shelf life at 0 V, 85 °C 500 hours Resistance to soldering heat test immersion in solder: 10 s at 260 °C or 20 s at 215 °C Based on sectional specification IEC 384-18/CECC 32300 Climatic category IEC 68 1998 Jan 29 40/085/56 86 Philips Components Product specification Aluminium electrolytic capacitors SMD (Chip) Standard 085 CS Selection chart for CR, UR and relevant nominal case sizes (L × W × H in mm) Preferred types in bold. UR (V) CR (µF) 6.3 10 16 25 40 63 0.47 − − − − − 8.8 × 3.7 × 3.9 1.0 − − − − − 8.8 × 3.7 × 3.9 2.2 − − − − 8.8 × 3.7 × 3.9 11.9 × 3.7 × 3.9 3.3 − − − 8.8 × 3.7 × 3.9 − 11.9 × 3.7 × 3.9 4.7 − − 8.8 × 3.7 × 3.9 − 11.9 × 3.7 × 3.9 − 6.8 − 8.8 × 3.7 × 3.9 − 11.9 × 3.7 × 3.9 − − 10 8.8 × 3.7 × 3.9 − 11.9 × 3.7 × 3.9 − − − 15 − 11.9 × 3.7 × 3.9 − − − − 22 11.9 × 3.7 × 3.9 − − − − − SMD 1998 Jan 29 87 Philips Components Product specification Aluminium electrolytic capacitors SMD (Chip) Standard 085 CS MECHANICAL DATA handbook, halfpage handbook, halfpage 2 max 2 max 2.7 max 3.9 max 2.7 max 2.7 max 4.1 max 3.9 max 7.5 9 max 3.9 2 max max 2 max 2.7 max 4.1 max 3.9 max 10.8 12.2 max MGB099 - 1 a. MGB100 - 1 b. Dimensions in mm. a. Case size 8.8 × 3.7 × 3.9 mm. b. Case size 11.9 × 3.7 × 3.9 mm. Fig.2 Dimensional outlines. Examples for Cnom; UR marking: PACKAGING QUANTITIES MARKING • Tape on reel packaging: 2000 per reel. The capacitors are marked (where possible) with the following information: • Rated capacitance (in µF) H22 represents 0.22 µF; 63 V 2G2 represents 2.2 µF; 40 V 22C represents 22 µF; 6.3 V. • Rated voltage code (see Table 1), the UR code letter indicates the position of the decimal point in the capacitance value • Name of manufacturer (PHILIPS) • ‘−’ sign indicating the cathode. The anode is identified by bevelled edges. Table 1 Rated voltage marking code UR (V) Code letter 1998 Jan 29 6.3 10 16 25 40 63 C D E F G H 88 Philips Components Product specification Aluminium electrolytic capacitors SMD (Chip) Standard 085 CS Optimum dimensions of soldering pads depend upon soldering method, mounting accuracy, print lay-out and/or adjacent components. MOUNTING The capacitors are designed for automatic placement on printed-circuit boards or hybrid circuits. For recommended pad dimensions, refer to Fig.3 and Table 2. G handbook, full pagewidth G ,,, ,,, ,,, ,,, ,,, ,,, ,,, ,,, D D E B A F E ,,, ,,, ,,, ,,, ,,, ,,, ,,, ,,, ,, , , ,, ,, ,, ,, C solder land/ solder paste pattern occupied area solder resist pattern A B F SMD C CCB102 tracks or dummy tracks Fig.3 Recommended pad dimensions for reflow and wave soldering; see Table 2. Table 2 Recommended soldering pad dimensions in mm (placement accuracy ±0.25 mm); see Fig.3 NOMINAL CASE SIZE L×W×H (mm) FOR REFLOW SOLDERING A B C D E F FOR WAVE SOLDERING G A B C D E F G 8.8 × 3.7 × 3.9 9.7 3.5 2.9 2.5 3.0 10.1 4.4 13.5 4.1 4.7 3.7 2.9 14.0 8.4 11.9 × 3.7 × 3.9 12.9 6.5 2.9 2.5 6.0 13.3 4.4 16.8 7.4 4.7 3.7 6.1 17.3 8.4 1998 Jan 29 89 Philips Components Product specification Aluminium electrolytic capacitors SMD (Chip) Standard 085 CS a handbook, full pagewidth + c + flow-direction of solder d b + + MGB101 For dimensions a, b, c and d, refer to Table 3. Flow direction of solder preferably onto side-walls or plus-side of the capacitors. Fig.4 Minimum distances between 085 CS capacitors on a printed-circuit board for wave soldering. Soldering Table 3 Minimum distances between capacitors; see Fig.4 Soldering conditions are defined by the curve, temperature versus time. The temperature is that measured on the soldering pad during processing. NOMINAL CASE SIZE L×W×H (mm) amin (mm) bmin (mm) cmin (mm) dmin (mm) 8.8 × 3.7 × 3.9 12 12 6.8 6.8 For maximum conditions of different soldering methods see Figs 5, 6 and 7. 11.9 × 3.7 × 3.9 15 15 6.8 6.8 Any temperature/time curve which does not exceed the specified maximum curves may be applied. After soldering under maximum conditions, some drift of the electrical parameters may occur. Typical behaviour which can be expected under these circumstances is shown in Fig.8. Maximum temperature load Table 4 Curing conditions for SMD-glue MAX. Tamb (°C) 125 10 140 3 150 1 160 0.5 AS A GENERAL PRINCIPLE, TEMPERATURE AND DURATION SHALL BE THE MINIMUM NECESSARY REQUIRED TO ENSURE GOOD SOLDERING CONNECTIONS. 1998 Jan 29 MAX. EXPOSURE TIME (minutes) 90 Philips Components Product specification Aluminium electrolytic capacitors SMD (Chip) Standard 085 CS MBC488 280 handbook, 4 columns T PAD (o C) 260 240 220 200 180 160 140 120 100 80 0 50 100 150 200 t (s) 250 Fig.5 Maximum temperature load during infrared reflow soldering. SMD MBC489 280 handbook, 4 columns T PAD o ( C) 260 240 220 200 180 160 140 120 100 80 0 50 100 150 200 t (s) 250 Fig.6 Maximum temperature load during vapour phase reflow soldering. 1998 Jan 29 91 Philips Components Product specification Aluminium electrolytic capacitors SMD (Chip) Standard 085 CS MBC490 280 handbook, 4 columns T PAD o ( C) 260 240 220 200 180 160 140 120 100 80 0 50 100 150 200 t (s) 250 Fig.7 Maximum temperature load during (double-) wave soldering. andbook, full pagewidth values before soldering MGB102 4 ∗ C0 0 ∆C C (%) IL I L0 (%) ∗I –4 –8 300 200 without voltage applied 100 L0 with rated voltage applied 0 tan δ 300 tan δ 0 200 (%) ∗ tan δ 100 0 0 Z Z0 (%) ∗Z 300 200 100 0 0 8 minutes 1 hour 10 hours 100 hours recovery duration soldering & cooling time Fig.8 Typical drift of electrical parameters after soldering under maximum conditions, and subsequent recovery. 1998 Jan 29 92 Electrolytic capacitor 085 series 10 µF/16 V; −10/+50% DESCRIPTION Nominal case size: 11.9 × 3.7 × 3.9 mm; Form BR CR rated capacitance at 100 Hz (tolerance −10 to +50% or ±20%) IR rated RMS ripple current at 100 Hz, 85 °C IL1 max. leakage current after 1 minute at UR IL5 max. leakage current after 5 minutes at UR Tan δ max. dissipation factor at 100 Hz ESR equivalent series resistance at 100 Hz (calculated from tan δmax and CR) Z max. impedance at 10 kHz Table 5 Electrical data and catalogue numbers; preferred types in bold CR UR 100 Hz (V) (µF) 93 6.3 10.0 22 10 6.8 15 16 Catalogue number: 2222 085 25109. 4.7 10 NOMINAL CASE SIZE L×W×H (mm) IR IL5 ESR Z IL1 CASE 100 Hz Tan δ 1 min 5 min 100 Hz 10 kHz CODE 85 °C 100 Hz (µA) (µA) (Ω) (Ω) (mA) CATALOGUE NUMBER 2222 . . . . . . . . −10/+50% ±20% BLISTER TAPE ON REEL FORM BR BLISTER TAPE ON REEL FORM BR 8.8 × 3.7 × 3.9 1a 11 4 3.1 0.30 48 20 085 23109 085 63109 11.9 × 3.7 × 3.9 1 20 6 3.3 0.30 22 9 085 23229 085 63229 8.8 × 3.7 × 3.9 1a 10 4 3.1 0.25 59 24 085 24688 085 64688 11.9 × 3.7 × 3.9 1 18 6 3.3 0.25 27 11 085 24159 085 64159 8.8 × 3.7 × 3.9 1a 9 5 3.2 0.20 68 26 085 25478 085 65478 11.9 × 3.7 × 3.9 1 16 6 3.3 0.20 32 12 085 25109 085 65109 1a 8 5 3.2 0.18 87 27 085 26338 085 66338 1 14 6 3.3 0.18 42 13 085 26688 085 66688 40 2.2 8.8 × 3.7 × 3.9 1a 7 5 3.2 0.16 120 32 085 27228 085 67228 4.7 11.9 × 3.7 × 3.9 1 13 7 3.4 0.16 54 15 085 27478 085 67478 63 0.47 8.8 × 3.7 × 3.9 1a 4 4 3.1 0.10 340 120 085 28477 085 68477 1.0 8.8 × 3.7 × 3.9 1a 6 4 3.1 0.12 190 55 085 28108 085 68108 2.2 11.9 × 3.7 × 3.9 1 11 6 3.3 0.14 87 25 085 28228 085 68228 3.3 11.9 × 3.7 × 3.9 1 13 7 3.4 0.14 68 17 085 28338 085 68338 Product specification 8.8 × 3.7 × 3.9 11.9 × 3.7 × 3.9 085 CS 3.3 6.8 25 Philips Components SYMBOL Ordering example Aluminium electrolytic capacitors SMD (Chip) Standard 1998 Jan 29 ELECTRICAL DATA AND ORDERING INFORMATION Unless otherwise specified, all electrical values in Table 5 apply at Tamb = 20 °C, P = 86 to 106 kPa, RH = 45 to 75%. SMD Philips Components Product specification Aluminium electrolytic capacitors SMD (Chip) Standard 085 CS Additional electrical data PARAMETER CONDITIONS VALUE Voltage Surge voltage for short periods Us ≤ 1.15 × UR Reverse voltage Urev ≤ 1 V Current Leakage current after 1 minute at UR IL1 ≤ 0.02CR × UR + 3 µA after 5 minutes at UR IL5 ≤ 0.002CR × UR + 3 µA nominal case size 8.8 × 3.7 × 3.9 mm typ. 11 nH nominal case size 11.9 × 3.7 × 3.9 mm typ. 13 nH Inductance Equivalent series inductance (ESL) 1998 Jan 29 94 Philips Components Product specification Aluminium electrolytic capacitors SMD (Chip) Standard 085 CS Capacitance (C) MGB103 1.2 handbook, 4 columns C C0 1 2 3 1.0 3 0.8 2 0.6 1 Curve 1: 6.3 V. Curve 2: 25 V. Curve 3: 63 V. C0 = capacitance at 20 °C, 100 Hz. 0.4 40 20 0 20 40 60 80 100 T amb ( oC) Fig.9 Typical multiplier of capacitance as a function of ambient temperature. SMD MGB104 handbook, 4 columns 1 1.1 2 C C0 3 1.0 0.9 3 0.8 2 0.7 1 0.6 Curve 1: 6.3 V. Curve 2: 25 V. Curve 3: 63 V. C0 = capacitance at 20 °C, 100 Hz. 10 2 10 10 3 f (Hz) Fig.10 Typical multiplier of capacitance as a function of frequency. 1998 Jan 29 95 10 4 Philips Components Product specification Aluminium electrolytic capacitors SMD (Chip) Standard 085 CS Dissipation factor (tan δ) MGB105 10 handbook, 4 columns 1 2 3 4 tan δ 1 5 6 7 8 9 Curve 1: 6.3 V. Curve 2: 10 V. Curve 3: 16 V. Curve 4: 25 V. Curve 5: 40 V. Curve 6: 63 V, 1.5 µF to 3.3 µF. Curve 7: 63 V, 1 µF. Curve 8: 63 V, 0.22 µF to 0.47 µF. Curve 9: 0.1 µF. f = 100 Hz. 10 10 1 2 60 40 20 0 20 40 60 80 100 T amb ( oC) Fig.11 Typical tan δ as a function of ambient temperature. MGB106 10 handbook, 4 columns tan δ 1 2 3 4 5 6 1 7 8 9 Curve 1: 6.3 V. 10 1 Curve 2: 10 V. Curve 3: 16 V. Curve 4: 25 V. Curve 5: 40 V. Curve 6: 63 V, 1.5 µF to 3.3 µF. Curve 7: 63 V, 1 µF. Curve 8: 63 V, 0.22 µF to 0.47 µF. Curve 9: 0.1 µF. Tamb = 20 °C. 10 2 10 10 2 10 3 Fig.12 Typical tan δ as a function of frequency. 1998 Jan 29 96 10 4 f (Hz) 10 5 Philips Components Product specification Aluminium electrolytic capacitors SMD (Chip) Standard 085 CS Impedance (Z) MGB107 - 1 handbook, 4 columns 10 4 Z (Ω ) 103 1 2 3 4 102 Curve 1: 0.1 µF. Curve 2: 0.22 µF. Curve 3: 0.47 µF. Curve 4: 1 µF. Curve 5: 2.2 µF. Case size 8.8 × 3.7 × 3.9 mm. Tamb = 20 °C. 5 10 10 2 10 3 10 4 10 5 f (Hz) 10 6 Fig.13 Typical impedance as a function of frequency. SMD MGB108 - 1 103 handbook, 4 columns 1 Z (Ω ) 2 3 102 4 5 6 10 Curve 1: 2.2 µF. Curve 2: 3.3 µF. Curve 3: 4.7 µF. Curve 4: 6.8 µF. Curve 5: 10 µF. Curve 6: 15 µF. Case size 11.9 × 3.7 × 3.9 mm. Tamb = 20 °C. 1 10 2 10 3 10 4 Fig.14 Typical impedance as a function of frequency. 1998 Jan 29 97 10 5 f (Hz) 10 6 Philips Components Product specification Aluminium electrolytic capacitors SMD (Chip) Standard 085 CS RIPPLE CURRENT AND USEFUL LIFE Table 6 Multiplier of ripple current (IR) as a function of frequency IR MULTIPLIER FREQUENCY (Hz) UR = 6.3 to 16 V UR = 25 to 40 V UR = 63 V 50 0.8 0.75 0.7 100 1.0 1.0 1.0 300 1.2 1.3 1.55 1000 1.35 1.55 1.9 3000 1.45 1.7 2.3 1.5 1.8 2.5 ≥10000 MBC243 3.3 handbook, full pagewidth IA 3.2 IR 3.1 3.0 2.8 2.6 2.4 lifetime multiplier 2.2 0 1. 5 1. 2.0 0 2. 0 3. 1.8 0 4. 0 6. 1.6 15 20 (1) 30 50 70 1.2 1.0 0.8 0.5 0.0 10 1.4 40 50 60 70 80 90 100 T amb ( oC) IA = actual ripple current at 100 Hz. IR = rated ripple current at 100 Hz, 85 °C. (1) Useful life at 85 °C and IR applied: 1500 hours. Fig.15 Multiplier of useful life as a function of ambient temperature and ripple current load. 1998 Jan 29 98 Philips Components Product specification Aluminium electrolytic capacitors SMD (Chip) Standard 085 CS SPECIFIC TESTS AND REQUIREMENTS General tests and requirements are specified in this handbook, Section “Tests and Requirements”. Table 7 Test procedures and requirements TEST NAME OF TEST Mounting Endurance REFERENCE IEC 384-18, subclause 4.3 IEC 384-18/ CECC 32300, subclause 4.15 PROCEDURE (quick reference) REQUIREMENTS shall be performed prior to tests mentioned below; method: reflow or (double-) wave soldering; for maximum temperature load refer to Chapter “Mounting” ∆C/C: ±10% Tamb = 85 °C; UR applied; 1000 hours ∆C/C: ±20% tan δ ≤ spec. limit IL5 ≤ 2 × spec. limit tan δ ≤ 2 × spec. limit Z ≤ 3 × spec. limit IL5 ≤ spec. limit Useful life CECC 30301, subclause 1.8.1 Tamb = 85 °C; UR and IR applied; 1500 hours ∆C/C: ±50% tan δ ≤ 3 × spec. limit Z ≤ 3 × spec. limit IL5 ≤ spec. limit no short or open circuit total failure percentage: ≤3% Shelf life (storage at high temperature) 1998 Jan 29 IEC 384-18/ CECC 32300, subclause 4.17 Tamb = 85 °C; no voltage applied; 500 hours after test: UR to be applied for 30 minutes, 24 to 48 hours before measurement 99 ∆C/C, tan δ, Z: for requirements see ‘Endurance test’ above IL5 ≤ 2 × spec. limit SMD