ETC 2SK3653

DATA SHEET
JUNCTION FIELD EFFECT TRANSISTOR
2SK3653
N-CHANNEL SILICON JUNCTION FIELD EFFECT TRANSISTOR
FOR IMPEDANCE CONVERTER OF ECM
PACKAGE DRAWING (Unit: mm)
DESCRIPTION
The 2SK3653 is suitable for converter of ECM.
+0.1
0.3 ±0.05
0.13 –0.05
FEATURES
• High forward transfer admittance
1000 µS TYP. (IDSS = 100 µA)
1600 µS TYP. (IDSS = 200 µA)
0~0.05
G
0.8 ±0.1
1.2 ±0.1
• Compact package
D
S
• Includes diode and high resistance at G - S
0.9
1.4 ±0.1
ORDERING INFORMATION
MAX. 0.4
PART NUMBER
PACKAGE
2SK3653
3pinXSOF (0814)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Drain to Source Voltage
Note1
0.2 +0.1
–0
VDSX
20
V
VGDO
–20
V
ID
10
mA
IG
10
mA
PT
80
mW
Junction Temperature
Tj
125
°C
Storage Temperature
Tstg
–55 to +125
°C
Gate to Drain Voltage
Drain Current
Gate Current
Total Power Dissipation
Note2
EQUIVALENT CIRCUIT
Drain
Gate
Source
Notes 1. VGS = –1.0 V
2
2. Mounted on ceramic substrate of 3.0 cm x 0.64 mm
Remark Please take care of ESD (Electro Static Discharge) when you handle the device in this document.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No.
D16293EJ1V0DS00 (1st edition)
Date Published June 2002 NS CP(K)
Printed in Japan
©
2002
2SK3653
ELECTRICAL CHARACTERISTICS (TA = 25°C)
CHARACTERISTICS
SYMBOL
TEST CONDITIONS
Zero Gate Voltage Drain Cut-off Current
IDSS1
VDS = 2.0 V, VGS = 0 V
Zero Gate Voltage Drain Cut-off Current
IDSS2
VDS = 5.0 V, VGS = 0 V
MIN.
TYP.
MAX.
UNIT
38
570
µA
40
600
µA
−1.0
V
Gate Cut-off Voltage
VGS(off)
VDS = 5.0 V, ID = 1.0 µA
−0.1
Forward Transfer Admittance
| yfs1 |
VDS = 5.0 V, ID = 30 µA, f = 1.0 kHz
350
µS
Forward Transfer Admittance
| yfs2 |
VDS = 5.0 V, VGS = 0 V, f = 1.0 kHz
350
µS
Input Capacitance
Ciss
VDS = 5.0 V, VGS = 0 V, f = 1.0 MHz
7.0
8.0
pF
Noise Voltage
NV
See Test Circuit
1.8
3.0
µV
IDSS RANK
MARKING
J2
J3
J4
J5
J6
J7
38 to 65
56 to 105
85 to 170
140 to 280
185 to 425
280 to 570
IDSS1 (µA)
VDS = 2.0 V
NOISE VOLTAGE TEST CIRCUIT
+4.5 V
R = 1 kΩ
JIS A
NV (r.m.s)
C = 10 pF
2
Data Sheet D16293EJ1V0DS
2SK3653
TYPICAL CHARACTERISTICS (TA = 25°C)
GATE TO SOURCE CURRENT vs.
GATE TO SOURCE VOLTAGE
40
DERATING FACTOR OF
POWER DISSIPATION
IG - Gate Current - µA
dT - Derating Factor - %
30
100
80
60
40
20
10
−1.0 −0.8 −0.6 −0.4 −0.2
−30
−40
0
0
20
40
60
80
100
120 140 160
VGS - Gate to Source Voltage - V
TA - Ambient Temperature - ˚C
INPUT CAPACITANCE vs.
DRAIN TO SOURCE VOLTAGE
DRAIN CURRENT vs.
GATE TO SOURCE VOLTAGE
100
VDS = 0 V
f = 1.0 MHz
IDS IDSS =
S
= 2 30 0 µ
=1
0
00 µ 0 µ A A
A
0.8
CiSS - Input Capacitance - pF
VDS = 5.0 V
0.6
S
0.4
IDS
ID - Drain Current - mA
0.2 0.4 0.6 0.8 1.0
−20
20
1
0
−10
0.2
−0.6
−0.4
−0.2
0
50
20
10
5
2
1
1
+0.2
2
5
10
20
50
100
VDS - Drain to Source Voltage - V
VGS - Gate to Source Voltage - V
VGS (off) - Gate Cut-off Voltage - V
|yfs| - Forward Transfer Admittance - µ S
GATE CUT-OFF VOLTAGE AND FORWARD
TRANSFER ADMITTANCE vs. ZERO-GATE
VOLTAGE DRAIN CURRENT CO-RELATION
10
VDS = 5.0 V
5
2
|yfs|
1
0.5
0.2
VGS (off)
0.1
0.05
0.02
0.01
10
20
50
100
200
500
1000
Zero-Gate Voltage Drain Current - µ A
Data Sheet D16293EJ1V0DS
3
2SK3653
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
RANK: J2
ID - Drain Current - µA
0.10 V
150
0.05 V
100
VGS = 0 V
50
−0.15 V
−0.05 V
−0.10 V
0
2
4
6
2
6
8
0.10 V
300
0.05 V
ID - Drain Current - µA
400
−0.15 V
4
6
8
0.15 V
VGS = 0 V
200
−0.05 V
100
0
2
10
−0.10 V
0
2
4
−0.15 V
6
8
VDS - Drain to Source Voltage - V
VDS - Drain to Source Voltage - V
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
RANK: J6
0.15 V
0.05 V
420
VGS = 0 V
280
−0.05 V
−0.10 V
−0.15 V
140
2
4
6
10
RANK: J7
900
0.10 V
560
10
RANK: J5
0.15 V
0.10 V
720
0.05 V
540
VGS = 0 V
−0.05 V
360
−0.10 V
180
−0.15 V
8
10
0
0
VDS - Drain to Source Voltage - V
4
4
0.10 V
−0.10 V
ID - Drain Current - µA
0
500
−0.05 V
0
−0.15 V
−0.05 V
−0.10 V
0.15 V
VGS = 0 V
700
VGS = 0 V
60
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
0.05 V
0
0.05 V
120
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
80
0
0.10 V
180
VDS - Drain to Source Voltage - V
240
160
240
0
10
0.15 V
VDS - Drain to Source Voltage - V
320
0
8
RANK: J4
400
RANK: J3
300
200
0
ID - Drain Current - µA
0.15 V
ID - Drain Current - µA
ID - Drain Current - µA
250
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
2
4
6
8
VDS - Drain to Source Voltage - V
Data Sheet D16293EJ1V0DS
10
2SK3653
[MEMO]
Data Sheet D16293EJ1V0DS
5
2SK3653
• The information in this document is current as of June, 2002. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
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third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
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agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
• NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4