MAXIM MAX9996ETP+TD

KIT
ATION
EVALU
E
L
B
AVAILA
19-3531; Rev 0; 12/04
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
Features
The MAX9996 high-linearity downconversion mixer provides 8.3dB gain, +26.5dBm IIP3, and 9.7dB NF for
1700MHz to 2200MHz UMTS/WCDMA, DCS, and PCS
base-station receiver applications. With a 1900MHz to
2400MHz LO frequency range, this particular mixer is
ideal for high-side LO injection receiver architectures.
Low-side LO injection is supported by the MAX9994,
which is pin-for-pin and functionally compatible with the
MAX9996.
In addition to offering excellent linearity and noise performance, the MAX9996 also yields a high level of component integration. This device includes a doublebalanced passive mixer core, an IF amplifier, a dualinput LO selectable switch, and an LO buffer. On-chip
baluns are also integrated to allow for single-ended RF
and LO inputs. The MAX9996 requires a nominal LO
drive of 0dBm, and supply current is guaranteed to be
below 240mA.
♦ 1700MHz to 2200MHz RF Frequency Range
♦ 1900MHz to 2400MHz LO Frequency Range
(MAX9996)
♦ 1400MHz to 2000MHz LO Frequency Range
(MAX9994)
♦ 40MHz to 350MHz IF Frequency Range
♦ 8.3dB Conversion Gain
♦ +26.5dBm Input IP3
♦ +12.6dBm Input 1dB Compression Point
♦ 9.7dB Noise Figure
♦ 72dBc 2LO-2RF Spurious Rejection at
PRF = -10dBm
♦ Integrated LO Buffer
♦ Integrated RF and LO Baluns for Single-Ended
Inputs
♦ Low -3dBm to +3dBm LO Drive
♦ Built-In SPDT LO Switch with 43dB LO1 to LO2
Isolation and 50ns Switching Time
♦ Pin Compatible with MAX9984/MAX9986 815MHz
to 995MHz Mixers
♦ Functionally Compatible with MAX9993
♦ External Current-Setting Resistors Provide Option
for Operating Mixer in Reduced Power/Reduced
Performance Mode
♦ Lead-Free Package Available
The MAX9994/MAX9996 are pin compatible with the
MAX9984/MAX9986 815MHz to 995MHz mixers, making this entire family of downconverters ideal for applications where a common PC board layout is used for
both frequency bands. The MAX9996 is also functionally compatible with the MAX9993.
The MAX9996 is available in a compact, 20-pin, thin
QFN package (5mm x 5mm) with an exposed paddle.
Electrical performance is guaranteed over the extended
-40°C to +85°C temperature range.
Ordering Information
Applications
UMTS/WCDMA Base Stations
PART
TEMP RANGE PIN-PACKAGE
DCS1800/PCS1900 EDGE Base Stations
cdmaOne™ and cdma2000® Base Stations
PHS/PAS Base Stations
Predistortion Receivers
Fixed Broadband Wireless Access
MAX9996ETP
-40°C to +85°C
20 Thin QFN-EP*
T2055-3
5mm × 5mm
MAX9996ETP-T
-40°C to +85°C
20 Thin QFN-EP*
T2055-3
5mm × 5mm
MAX9996ETP+D
-40°C to +85°C
20 Thin QFN-EP*
T2055-3
5mm × 5mm
MAX9996ETP+TD -40°C to +85°C
20 Thin QFN-EP*
T2055-3
5mm × 5mm
Wireless Local Loop
Private Mobile Radios
Military Systems
Microwave Links
PKG
CODE
*EP = Exposed paddle.
+ = Lead free. D = Dry pack. T = Tape-and-reel.
Digital and Spread-Spectrum Communication
Systems
cdma2000 is a registered trademark of Telecommunications
Industry Association.
cdmaOne is a trademark of CDMA Development Group.
Pin Configuration/Functional Diagram and Typical
Application Circuit appear at end of data sheet.
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1
MAX9996
General Description
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
ABSOLUTE MAXIMUM RATINGS
θJA .................................................................................+38°C/W
θJC .................................................................................+13°C/W
Operating Temperature Range (Note A) ....TC = -40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
VCC to GND ...........................................................-0.3V to +5.5V
IF+, IF-, LOBIAS, LOSEL, IFBIAS to GND...-0.3V to (VCC + 0.3V)
TAP ........................................................................-0.3V to +1.4V
LO1, LO2, LEXT to GND........................................-0.3V to +0.3V
RF, LO1, LO2 Input Power .............................................+12dBm
RF (RF is DC shorted to GND through a balun) .................50mA
Continuous Power Dissipation (TA = +70°C)
20-Pin Thin QFN-EP (derate 26.3mW/°C above +70°C)...........2.1W
Note A: TC is the temperature on the exposed paddle of the package.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(MAX9996 Typical Application Circuit, VCC = +4.75V to +5.25V, no RF signal applied, IF+ and IF- outputs pulled up to VCC through
inductive chokes, R1 = 806Ω, R2 = 549Ω, TC = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +5V, TC =
+25°C, unless otherwise noted.)
PARAMETER
SYMBOL
Supply Voltage
VCC
Supply Current
ICC
LO_SEL Input-Logic Low
VIL
LO_SEL Input-Logic High
VIH
CONDITIONS
MIN
TYP
MAX
UNITS
4.75
5.00
5.25
V
206
240
mA
0.8
V
2
V
AC ELECTRICAL CHARACTERISTICS
(MAX9996 Typical Application Circuit, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50Ω sources, PLO = -3dBm to
+3dBm, PRF = -5dBm, fRF = 1700MHz to 2200MHz, fLO = 1900MHz to 2400MHz, fIF = 200MHz, fLO > fRF, TC = -40°C to +85°C,
unless otherwise noted. Typical values are at VCC = +5V, PRF = -5dBm, PLO = 0dBm, fRF = 1900MHz, fLO = 2100MHz, fIF = 200MHz,
TC = +25°C, unless otherwise noted.) (Notes 1, 2)
PARAMETER
RF Frequency Range
LO Frequency Range
SYMBOL
fRF
fLO
IF Frequency Range
fIF
Conversion Gain
GC
Input Third-Order Intercept Point
Input IP3 Variation Over
Temperature
2
MIN
TYP
MAX
UNITS
MHz
(Note 3)
1700
2200
(Note 3)
1900
2400
MAX9994
1400
2000
40
PRF < +2dBm, TA = +25°C
7.0
8.3
MHz
350
MHz
9.0
dB
TC = -40°C to +85°C
±0.75
dB
P1dB
(Note 4)
12.6
dBm
IIP3
Two tones:
fRF1 = 2000MHz, fRF2 = 2001MHz,
PRF = -5dBm/tone, fLO = 2200MHz,
PLO = 0dBm, TA = +25°C
26.5
dBm
±0.5
dB
Gain Variation Over Temperature
Input Compression Point
CONDITIONS
TC = -40°C to +85°C
23.5
_______________________________________________________________________________________
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
(MAX9996 Typical Application Circuit, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50Ω sources, PLO = -3dBm to
+3dBm, PRF = -5dBm, fRF = 1700MHz to 2200MHz, fLO = 1900MHz to 2400MHz, fIF = 200MHz, fLO > fRF, TC = -40°C to +85°C,
unless otherwise noted. Typical values are at VCC = +5V, PRF = -5dBm, PLO = 0dBm, fRF = 1900MHz, fLO = 2100MHz, fIF = 200MHz,
TC = +25°C, unless otherwise noted.) (Notes 1, 2)
PARAMETER
Noise Figure
SYMBOL
NF
Noise Figure Under-Blocking
CONDITIONS
MIN
TYP
Single sideband
9.7
dB
19
dB
-3
2LO-2RF
Spurious Response at IF
3x3
UNITS
PRF = 5dBm, fRF = 2000MHz,
fLO = 2190MHz, fBLOCK = 2100MHz (Note 5)
LO Drive
2x2
MAX
3LO-3RF
+3
PRF = -10dBm
72
PRF = -5dBm
67
PRF = -10dBm
87
PRF = -5dBm
77
dBm
dBc
LO2 selected, 1900MHz < fLO < 2100MHz
49
LO1 selected, 1900MHz < fLO < 2100MHz
43
Maximum LO Leakage at RF Port
PLO = +3dBm
-20
dBm
Maximum LO Leakage at IF Port
PLO = +3dBm
-30
dBm
40
dB
50
ns
15
dB
LO1 to LO2 Isolation
Minimum RF-to-IF Isolation
LO Switching Time
50% of LOSEL to IF settled to within 2°
RF Port Return Loss
LO1/2 port selected,
LO2/1 and IF terminated
16
LO1/2 port unselected,
LO2/1 and IF terminated
26
LO driven at 0dBm, RF terminated into 50Ω,
differential 200Ω
20
dB
LO Port Return Loss
IF Port Return Loss
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
dB
dB
Guaranteed by design and characterization.
All limits include external component losses. Output measurements taken at IF output of the Typical Application Circuit.
Operation outside this range is possible, but with degraded performance of some parameters.
Compression point characterized. It is advisable not to operate continuously the mixer RF input above +12dBm.
Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects of all
SNR degradations in the mixer, including the LO noise as defined in Maxim Application Note 2021.
_______________________________________________________________________________________
3
MAX9996
AC ELECTRICAL CHARACTERISTICS (continued)
Typical Operating Characteristics
(MAX9996 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 200MHz, unless otherwise noted.)
CONVERSION GAIN vs. RF FREQUENCY
TC = +85°C
TC = +25°C
MAX9996 toc02
9
PLO = -3dBm, 0dBm, +3dBm
8
7
1700
1900
2100
INPUT IP3 vs. RF FREQUENCY
27
INPUT IP3 (dBm)
25
TC = -25°C
2100
2300
1500
TC = +85°C
1700
1900
2100
2300
RF FREQUENCY (MHz)
INPUT IP3 vs. RF FREQUENCY
INPUT IP3 vs. RF FREQUENCY
26
24
1900
28
MAX9996 toc05
TC = +25°C
1700
28
MAX9996 toc04
27
VCC = 4.75V, 5.0V, 5.25V
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
28
8
6
1500
2300
26
27
INPUT IP3 (dBm)
1500
9
7
6
6
INPUT IP3 (dBm)
10
25
PLO = -3dBm, 0dBm, +3dBm
24
VCC = 4.75V, 5.0V
MAX9996 toc06
8
CONVERSION GAIN vs. RF FREQUENCY
11
CONVERSION GAIN (dB)
9
7
10
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
MAX9996 toc01
TC = -25°C
10
11
MAX9996 toc03
CONVERSION GAIN vs. RF FREQUENCY
11
26
25
VCC = 5.25V
24
23
23
23
22
22
21
1900
2100
1500
2300
RF FREQUENCY (MHz)
9
TC = -25°C
PLO = 0dBm
PLO = -3dBm
11
NOISE FIGURE (dB)
TC = +25°C
10
8
1500
2300
1700
1900
2100
2300
RF FREQUENCY (MHz)
NOISE FIGURE vs. RF FREQUENCY
TC = +85°C
11
2100
12
MAX9996 toc07
12
1900
RF FREQUENCY (MHz)
NOISE FIGURE vs. RF FREQUENCY
13
1700
NOISE FIGURE vs. RF FREQUENCY
12
VCC = 5.25V
11
NOISE FIGURE (dB)
1700
MAX9996 toc08
1500
10
PLO = +3dBm
9
8
10
MAX9996 toc09
22
NOISE FIGURE (dB)
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
VCC = 5.0V
VCC = 4.75V
9
8
7
7
6
1500
1700
1900
2100
RF FREQUENCY (MHz)
4
2300
7
1500
1700
1900
2100
RF FREQUENCY (MHz)
2300
1500
1700
1900
2100
RF FREQUENCY (MHz)
_______________________________________________________________________________________
2300
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
65
60
55
75
50
70
65
60
PLO = -3dBm
55
45
1900
2100
2300
RF FREQUENCY (MHz)
85
80
75
70
TC = +25°C
65
1900
2100
PRF = -5dBm
90
TC = -25°C
60
1500
2100
80
75
70
PLO = -3dBm, 0dBm, +3dBm
65
PRF = -5dBm
90
80
75
70
VCC = 5.0V
65
VCC = 5.25V
1700
1900
2100
2300
1500
INPUT P1dB (dBm)
14
TC = +25°C
TC = -25°C
1900
2100
2300
INPUT P1dB vs. RF FREQUENCY
15
MAX9996 toc17
15
1700
RF FREQUENCY (MHz)
INPUT P1dB vs. RF FREQUENCY
13
12
85
RF FREQUENCY (MHz)
MAX9996 toc16
TC = +85°C
VCC = 4.75V
55
INPUT P1dB vs. RF FREQUENCY
14
2300
60
RF FREQUENCY (MHz)
15
2100
3LO-3RF RESPONSE vs. RF FREQUENCY
85
1500
2300
1900
95
VCC = 5.25V
14
INPUT P1dB (dBm)
1900
1700
RF FREQUENCY (MHz)
55
1700
VCC = 4.75V
55
2300
60
55
1500
60
3LO-3RF RESPONSE vs. RF FREQUENCY
3LO-3RF RESPONSE (dBc)
3LO-3RF RESPONSE (dBc)
TC = +85°C
1700
95
MAX9996 toc13
PRF = -5dBm
90
VCC = 5.0V
65
RF FREQUENCY (MHz)
3LO-3RF RESPONSE vs. RF FREQUENCY
95
VCC = 5.25V
70
45
1500
3LO-3RF RESPONSE (dBc)
1700
MAX9996 toc14
1500
75
50
50
45
INPUT P1dB (dBm)
MAX9996 toc11
PLO = 0dBm
TC = -25°C
PRF = -5dBm
80
MAX9996 toc15
70
PLO = +3dBm
13
PLO = -3dBm, 0dBm, +3dBm
12
MAX9996 toc18
TC = +25°C
2LO-2RF RESPONSE vs. RF FREQUENCY
85
2LO-2RF RESPONSE (dBc)
TC = +85°C
75
PRF = -5dBm
80
2LO-2RF RESPONSE (dBc)
2LO-2RF RESPONSE (dBc)
MAX9996 toc10
PRF = -5dBm
80
2LO-2RF RESPONSE vs. RF FREQUENCY
85
MAX9996 toc12
2LO-2RF RESPONSE vs. RF FREQUENCY
85
13
VCC = 5.0V
12
VCC = 4.75V
11
11
10
11
10
1500
1700
1900
2100
RF FREQUENCY (MHz)
2300
10
1500
1700
1900
2100
RF FREQUENCY (MHz)
2300
1500
1700
1900
2100
2300
RF FREQUENCY (MHz)
_______________________________________________________________________________________
5
MAX9996
Typical Operating Characteristics (continued)
(MAX9996 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 200MHz, unless otherwise noted.)
Typical Operating Characteristics (continued)
(MAX9996 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 200MHz, unless otherwise noted.)
LO SWITCH ISOLATION
vs. LO FREQUENCY
TC = +25°C
35
40
PLO = -3dBm, 0dBm, +3dBm
35
30
30
1900
2100
2300
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
2300
2500
1700
-40
-45
PLO = +3dBm
-35
-40
PLO = 0dBm
-45
-50
TC = +25°C
-60
-25
1900
2100
2300
2500
-35
-40
VCC = 4.75V
PLO = -3dBm
-50
-55
1700
1900
2100
2300
2500
1700
1900
2100
2300
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
-30
MAX9996 toc26
-15
-20
-25
2100
2300
LO FREQUENCY (MHz)
2500
2500
-15
VCC = 5.25V
-20
VCC = 4.75V
-25
VCC = 5.0V
PLO = -3dBm, 0dBm, +3dBm
-30
-30
1900
-10
LO LEAKAGE AT RF PORT (dBm)
TC = -25°C, +25°C, +85°C
-10
LO LEAKAGE AT RF PORT (dBm)
MAX9996 toc25
-20
1700
VCC = 5.0V
LO FREQUENCY (MHz)
-15
-25
VCC = 5.25V
-30
LO FREQUENCY (MHz)
-10
2500
-45
-60
1700
2300
-20
-55
TC = +85°C
2100
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
LO LEAKAGE (dBm)
-35
1900
LO FREQUENCY (MHz)
-30
LO LEAKAGE (dBm)
LO LEAKAGE (dBm)
2100
-25
-50
6
1900
-20
-30
-55
35
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
MAX9996 toc22
TC = -25°C
-25
VCC = 4.75V, 5.0V, 5.25V
LO FREQUENCY (MHz)
LO FREQUENCY (MHz)
-20
40
30
1700
2500
45
MAX9996 toc27
1700
MAX9996 toc21
MAX9996 toc20
45
MAX9996 toc24
TC = +85°C
LO SWITCH ISOLATION (dB)
40
50
MAX9996 toc23
LO SWITCH ISOLATION (dB)
TC = -25°C
45
LO SWITCH ISOLATION
vs. LO FREQUENCY
50
LO SWITCH ISOLATION (dB)
50
MAX9996 toc19
LO SWITCH ISOLATION
vs. LO FREQUENCY
LO LEAKAGE AT RF PORT (dBm)
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
1700
1900
2100
2300
LO FREQUENCY (MHz)
2500
1700
1900
2100
2300
LO FREQUENCY (MHz)
_______________________________________________________________________________________
2500
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
RF-TO-IF ISOLATION
vs. RF FREQUENCY
45
TC = +25°C
TC = -25°C
35
50
45
40
PLO = -3dBm, 0dBm, +3dBm
1700
1900
2100
2300
45
40
VCC = 4.75V, 5.0V, 5.25V
30
1500
1700
1900
2100
1500
2300
1900
2100
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF PORT RETURN LOSS
vs. RF FREQUENCY
IF PORT RETURN LOSS
vs. IF FREQUENCY
LO SELECTED RETURN LOSS
vs. LO FREQUENCY
10
15
20
PLO = -3dBm, 0dBm, +3dBm
30
15
20
25
30
VCC = 4.75V, 5.0V, 5.25V
35
40
35
50
2100
2300
100
150
RF FREQUENCY (MHz)
200
250
300
PLO = +3dBm
20
PLO = -3dBm
25
PLO = 0dBm
30
1500
350
1700
IF FREQUENCY (MHz)
5
2100
2300
2500
SUPPLY CURRENT
vs. TEMPERATURE (TC)
230
MAX9996 toc34
0
1900
LO FREQUENCY (MHz)
LO UNSELECTED RETURN LOSS
vs. LO FREQUENCY
VCC = 5.25V
220
SUPPLY CURRENT (mA)
10
15
PLO = -3dBm, 0dBm, +3dBm
20
15
40
50
2500
10
25
30
MAX9996 toc35
1900
LO UNSELECTED RETURN LOSS (dB)
1700
5
35
45
40
MAX9996 toc33
10
LO SELECTED RETURN LOSS (dB)
IF PORT RETURN LOSS (dB)
5
2300
0
MAX9996 toc32
0
MAX9996 toc31
5
1500
1700
RF FREQUENCY (MHz)
0
25
50
35
30
1500
RF PORT RETURN LOSS (dB)
55
35
30
MAX9996 toc30
55
RF-TO-IF ISOLATION (dB)
50
60
MAX9996 toc29
55
RF-TO-IF ISOLATION (dB)
TC = +85°C
RF-TO-IF ISOLATION (dB)
60
MAX9996 toc28
60
40
RF-TO-IF ISOLATION
vs. RF FREQUENCY
RF-TO-IF ISOLATION
vs. RF FREQUENCY
210
200
190
VCC = 5.0V
VCC = 4.75V
180
35
170
40
1500
1700
1900
2100
LO FREQUENCY (MHz)
2300
2500
-30
-10
10
30
50
70
90
TEMPERATURE (°C)
_______________________________________________________________________________________
7
MAX9996
Typical Operating Characteristics (continued)
(MAX9996 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 200MHz, unless otherwise noted.)
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
MAX9996
Pin Description
PIN
NAME
FUNCTION
1, 6, 8, 14
VCC
2
RF
Single-Ended 50Ω RF Input. This port is internally matched and DC shorted to GND through a balun.
Requires an external DC-blocking capacitor.
3
TAP
Center Tap of the Internal RF Balun. Bypass to GND with capacitors close to the IC, as shown in the
Typical Application Circuit.
4, 5, 10, 12,
13, 17
GND
Ground
7
LOBIAS
9
LOSEL
11
LO1
15
LO2
Local Oscillator Input 2. Drive LOSEL high to select LO2.
16
LEXT
External Inductor Connection. Connect a low-ESR, 10nH inductor from LEXT to GND. This inductor
carries approximately 100mA DC current.
18, 19
IF-, IF+
Differential IF Outputs. Each output requires external bias to VCC through an RF choke (see the
Typical Application Circuit).
20
IFBIAS
IF Bias Resistor Connection for IF Amplifier. Connect an 806Ω resistor from IFBIAS to GND.
EP
GND
Power-Supply Connection. Bypass each VCC pin to GND with capacitors as shown in the Typical
Application Circuit.
Bias Resistor for Internal LO Buffer. Connect a 549Ω ±1% resistor from LOBIAS to the power supply.
Local Oscillator Select. Logic control input for selecting LO1 or LO2.
Local Oscillator Input 1. Drive LOSEL low to select LO1.
Exposed Ground Paddle. Solder the exposed paddle to the ground plane using multiple vias.
Detailed Description
The MAX9996 high-linearity downconversion mixer provides 8.3dB of conversion gain and 26.5dBm of IIP3,
with a typical 9.7dB noise figure. The integrated baluns
and matching circuitry allow for 50Ω single-ended interfaces to the RF and the two LO ports. A single-pole, double-throw (SPDT) switch provides 50ns switching time
between the two LO inputs with 43dB of LO-to-LO isolation. Furthermore, the integrated LO buffer provides a
high drive level to the mixer core, reducing the LO drive
required at the MAX9996’s inputs to a -3dBm to +3dBm
range. The IF port incorporates a differential output,
which is ideal for providing enhanced IIP2 performance.
Specifications are guaranteed over broad frequency
ranges to allow for use in UMTS, cdma2000, and
2G/2.5G/3G DCS1800 and PCS1900 base stations. The
MAX9996 is specified to operate over a 1700MHz to
2200MHz RF frequency range, a 1900MHz to 2400MHz
LO frequency range, and a 40MHz to 350MHz IF frequency range. Operation beyond these ranges is possible; see the Typical Operating Characteristics for
additional details.
8
This device can operate in low-side LO injection applications with an extended LO range, but performance
degrades as f LO continues to decrease. The
MAX9994—a variant of the MAX9996—provides better
low-side performance since it is tuned for a lower LO
range of 1400MHz to 2000MHz.
RF Input and Balun
The MAX9996 RF input is internally matched to 50Ω,
requiring no external matching components. A DCblocking capacitor is required because the input is
internally DC shorted to ground through the on-chip
balun. Input return loss is typically 15dB over the entire
1700MHz to 2200MHz RF frequency range.
LO Inputs, Buffer, and Balun
The MAX9996 can be used for either high-side or lowside injection applications with a 1900MHz to 2400MHz
LO frequency range. For a device with a 1400MHz to
2000MHz LO frequency range, refer to the MAX9994
data sheet. As an added feature, the MAX9996 includes
an internal LO SPDT switch that can be used for frequency-hopping applications. The switch selects one of
the two single-ended LO ports, allowing the external
oscillator to settle on a particular frequency before it is
_______________________________________________________________________________________
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
High-Linearity Mixer
The core of the MAX9996 is a double-balanced, highperformance passive mixer. Exceptional linearity is provided by the large LO swing from the on-chip LO
buffer. When combined with the integrated IF amplifiers, the cascaded IIP3, 2LO-2RF rejection, and NF
performance is typically 26.5dBm, 72dBc, and 9.7dB,
respectively.
Differential IF Output Amplifier
The MAX9996 mixer has a 40MHz to 350MHz IF frequency range. The differential, open-collector IF output
ports require external pullup inductors to VCC. Note that
these differential outputs are ideal for providing
enhanced 2LO-2RF rejection performance. Singleended IF applications require a 4:1 balun to transform
the 200Ω differential output impedance to a 50Ω singleended output. After the balun, the IF return loss is better than 15dB.
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50Ω.
No matching components are required. Return loss at
the RF port is typically 15dB over the entire input range
(1700MHz to 2200MHz) and return loss at the LO ports
is typically better than 16dB (1900MHz to 2400MHz).
RF and LO inputs require only DC-blocking capacitors
for interfacing.
The IF output impedance is 200Ω (differential). For
evaluation, an external low-loss 4:1 (impedance ratio)
balun transforms this impedance down to a 50Ω singleended output (see the Typical Application Circuit).
Bias Resistors
Bias currents for the LO buffer and the IF amplifier are
optimized by fine tuning resistors R1 and R2. If
reduced current is required at the expense of performance, contact the factory for details. If the ±1% bias
resistor values are not readily available, substitute standard ±5% values.
LEXT Inductor
LEXT serves to improve the LO-to-IF and RF-to-IF leakage. The inductance value can be adjusted by the user to
optimize the performance for a particular frequency
band. Since approximately 100mA flows through this
inductor, it is important to use a low-DCR wire-wound coil.
If the LO-to-IF and RF-to-IF leakage are not critical
parameters, the inductor can be replaced by a short
circuit to ground.
Layout Considerations
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin
traces directly to the exposed pad under the package.
The PC board exposed pad MUST be connected to the
ground plane of the PC board. It is suggested that multiple vias be used to connect this pad to the lower level
ground planes. This method provides a good RF/thermal conduction path for the device. Solder the exposed
pad on the bottom of the device package to the PC
board. The MAX9996 Evaluation Kit can be used as a
reference for board layout. Gerber files are available
upon request at www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass each VCC pin and
TAP with the capacitors shown in the Typical Application
Circuit; see Table 1. Place the TAP bypass capacitor to
ground within 100 mils of the TAP pin.
_______________________________________________________________________________________
9
MAX9996
switched in. LO switching time is typically less than
50ns, which is more than adequate for virtually all GSM
applications. If frequency hopping is not employed, set
the switch to either of the LO inputs. The switch is controlled by a digital input (LOSEL): logic-high selects
LO2, logic-low selects LO1. To avoid damage to the
part, voltage must be applied to VCC before digital logic
is applied to LOSEL. LO1 and LO2 inputs are internally
matched to 50Ω, requiring only a 22pF DCblocking capacitor.
A two-stage internal LO buffer allows a wide input
power range for the LO drive. All guaranteed specifications are for an LO signal power from -3dBm to +3dBm.
The on-chip low-loss balun, along with an LO buffer,
drives the double-balanced mixer. All interfacing and
matching components from the LO inputs to the IF outputs are integrated on-chip.
be soldered to a ground plane on the PC board, either
directly or through an array of plated via holes.
Exposed Pad RF/Thermal Considerations
The exposed paddle (EP) of the MAX9996’s 20-pin thin
QFN-EP package provides a low thermal-resistance
path to the die. It is important that the PC board on
which the MAX9996 is mounted be designed to conduct heat from the EP. In addition, provide the EP with a
low-inductance path to electrical ground. The EP MUST
Chip Information
TRANSISTOR COUNT: 1414
PROCESS: SiGe BiCMOS
Table 1. Component List Referring to the Typical Application Circuit
COMPONENT
VALUE
DESCRIPTION
L1, L2
470nH
Wire-wound high-Q inductors (0805)
L3
10nH
Wire-wound high-Q inductor (0603)
C1
4pF
Microwave capacitor (0603)
C4
10pF
Microwave capacitor (0603)
C2, C6, C7, C8, C10, C12
22pF
Microwave capacitors (0603)
C3, C5, C9, C11
0.01µF
Microwave capacitors (0603)
C13, C14
150pF
Microwave capacitors (0603)
C15
150pF
Microwave capacitor (0402)
R1
806Ω
±1% resistor (0603)
R2
549Ω
±1% resistor (0603)
R3
7.15Ω
±1% resistor (1206)
T1
4:1 balun
IF balun
U1
MAX9996
Maxim IC
IFBIAS
IF+
IF-
GND
LEXT
Pin Configuration/Functional Diagram
20
19
18
17
16
VCC 1
15 LO2
RF 2
10
MAX9996
14 VCC
GND 5
11 LO1
6
7
8
9
10
GND
12 GND
LOSEL
GND 4
VCC
13 GND
LOBIAS
TAP 3
VCC
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
______________________________________________________________________________________
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
VCC
T1
3
IF
OUTPUT
6
R3
L1
2
L2
C14
C3
C2
GND
IF-
IF+
19
20
VCC
18
17
RF
C5
TAP
C4
GND
16
C12
1
15
C1
RF
INPUT
4
L3
IFBIAS
VCC
1
C15
R1
LEXT
C13
MAX9996
2
14
3
13
4
12
5
11
LO2
LO2
INPUT
VCC
VCC
C11
GND
GND
C10
LOSEL
LOBIAS
VCC
9
LO1
LO1
INPUT
10
GND
8
7
6
VCC
GND
R2
VCC
C6
LOSEL
INPUT
C7
C8
VCC
C9
______________________________________________________________________________________
11
MAX9996
Typical Application Circuit
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
QFN THIN.EPS
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
D2
D
MARKING
b
C
L
0.10 M C A B
D2/2
D/2
k
L
XXXXX
E/2
E2/2
C
L
(NE-1) X e
E
DETAIL A
PIN # 1
I.D.
E2
PIN # 1 I.D.
0.35x45∞
e
(ND-1) X e
DETAIL B
e
L
L1
C
L
C
L
L
L
e
e
0.10 C
A
C
0.08 C
A1 A3
PACKAGE OUTLINE,
16, 20, 28, 32L THIN QFN, 5x5x0.8mm
21-0140
-DRAWING NOT TO SCALE-
COMMON DIMENSIONS
A1
0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80
0
A3
b
D
E
L1
0
0.02 0.05
0
0.20 REF.
0.20 REF.
0.02 0.05
0
0.20 REF.
0.02 0.05
0.20 REF.
0.25 0.30 0.35 0.25 0.30 0.35 0.20 0.25 0.30 0.20 0.25 0.30
4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10
4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10
e
k
L
0.02 0.05
0.65 BSC.
0.80 BSC.
0.50 BSC.
0.50 BSC.
0.25 - 0.25 - 0.25 - 0.25
0.30 0.40 0.50 0.45 0.55 0.65 0.45 0.55 0.65 0.30 0.40 0.50
-
-
-
-
-
N
ND
NE
16
4
4
20
5
5
JEDEC
WHHB
WHHC
-
-
1
2
EXPOSED PAD VARIATIONS
PKG.
20L 5x5
28L 5x5
32L 5x5
16L 5x5
SYMBOL MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX.
A
G
-
-
-
28
7
7
WHHD-1
-
-
32
8
8
WHHD-2
NOTES:
1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES.
3. N IS THE TOTAL NUMBER OF TERMINALS.
D2
L
E2
PKG.
CODES
MIN.
NOM. MAX.
MIN.
NOM. MAX.
±0.15
T1655-1
T1655-2
T1655N-1
3.00
3.00
3.00
3.10 3.20 3.00
3.10 3.20 3.00
3.10 3.20 3.00
3.10 3.20
3.10 3.20
3.10 3.20
T2055-2
T2055-3
T2055-4
3.00
3.00
3.00
3.10 3.20 3.00
3.10 3.20 3.00
3.10 3.20 3.00
3.10 3.20
3.10 3.20
3.10 3.20
**
**
**
**
T2055-5
T2855-1
T2855-2
T2855-3
T2855-4
T2855-5
T2855-6
T2855-7
T2855-8
T2855N-1
T3255-2
T3255-3
T3255-4
T3255N-1
3.15
3.15
2.60
3.15
2.60
2.60
3.15
2.60
3.15
3.15
3.00
3.00
3.00
3.00
3.25
3.25
2.70
3.25
2.70
2.70
3.25
2.70
3.25
3.25
3.10
3.10
3.10
3.10
3.25
3.25
2.70
3.25
2.70
2.70
3.25
2.70
3.25
3.25
3.10
3.10
3.10
3.10
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL
CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE
OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1
IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE.
3.35
3.35
2.80
3.35
2.80
2.80
3.35
2.80
3.35
3.35
3.20
3.20
3.20
3.20
3.15
3.15
2.60
3.15
2.60
2.60
3.15
2.60
3.15
3.15
3.00
3.00
3.00
3.00
3.35
3.35
2.80
3.35
2.80
2.80
3.35
2.80
3.35
3.35
3.20
3.20
3.20
3.20
**
**
0.40
DOWN
BONDS
ALLOWED
NO
YES
NO
NO
YES
NO
Y
**
NO
NO
YES
YES
NO
**
**
0.40
**
**
**
**
**
NO
YES
Y
N
NO
YES
NO
NO
**
**
**
**
** SEE COMMON DIMENSIONS TABLE
5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm
FROM TERMINAL TIP.
6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.
7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION.
8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT EXPOSED PAD DIMENSION FOR T2855-1,
T2855-3 AND T2855-6.
10. WARPAGE SHALL NOT EXCEED 0.10 mm.
11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY.
12. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY.
PACKAGE OUTLINE,
16, 20, 28, 32L THIN QFN, 5x5x0.8mm
21-0140
-DRAWING NOT TO SCALE-
G
2
2
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2004 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products, Inc.