18–23 GHz Power Amplifier AA022P1-65 Features ■ 15 dB Gain ■ +24 dBm Output Power ■ Hermetic Package with Solderable Leads ■ Single Voltage Operation ■ 100% RF and DC Testing Description The AA022P1-65 is a broadband millimeterwave amplifier in a hermetic package. The amplifier is designed for use in millimeterwave communication and sensor systems as the transmitter front-end, transmitter gain stage, or local oscillator gain stage when high gain and high power are required. The solder-sealed hermetic package provides excellent electrical performance, excellent thermal performance, and complete environmental protection for long-term reliability. A single supply voltage simplifies bias requirements. All amplifiers are screened at the operating frequencies prior to shipment for guaranteed performance. The amplifier is targeted for millimeterwave point-to-point and point-to-multipoint wireless communications systems. Pin Out N/C N/C AA022P1-65 RF In RF In RF Out RF Out YYWW VDD VD Electrical Specifications at 25°C (VD = 5.5 V) RF Parameter Symbol Min. Typ. Max. Unit BW 18 17–24 23 GHz G 13 15 dB dB Bandwidth Small Signal Gain Input Return Loss RLI 9 Output Return Loss RLO 9 dB Output Power at Saturation PSAT 25 dBm Output Power at 1 dB Gain Compression P1 dB 24 dBm Temperature Coefficient of Gain dG/dT -0.019 dB/C 22 DC Symbol Min. Typ. Max. Drain Current (Small Signal) Parameter ID 260 360 420 Drain Current (At Saturation) ID-SAT 325 Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email [email protected] • www.alphaind.com Specifications subject to change without notice. 2/00A Unit mA mA 1 18–23 GHz Power Amplifier AA022P1-65 Typical Performance Data 0 20 Return Loss (dB) -55˚C Gain (dB) 15 +85˚C 10 +25˚C 5 S22 -10 S11 -15 0 -20 12 16 20 24 12 16 20 24 Frequency (GHz) Frequency (GHz) Gain vs. Frequency Return Loss vs. Frequency Absolute Maximum Ratings 26 Output Power (dBm) -5 Characteristic 24 22 Operating Temperature (TC) -55°C to +90°C Storage Temperature (TST) -65°C to +150°C Bias Voltage (VD) Power In (PIN) 20 Value 7 VDC 20 dBm 24 GHz P1 dB = 22.4 dBm 18 20 GHz P1 dB = 23.7 dBm 22 GHz P1 dB = 23.9 dBm 16 0 4 8 12 16 Input Power (dBm) Output Power vs. Input Power Outline 0.388 (9.86 mm) ∅ 0.070 (1.78 mm) 0.115 (2.92 mm) ± 0.002 KOVAR 0.164 (4.16 mm) 0.328 (8.33 mm) 0.075 (1.91 mm) ± 0.010 0.194 (4.92 mm) 0.010 (0.25 mm) ± 0.001 0.378 (9.60 mm) ± 0.003 0.065 (1.65 mm) MAX. 0.005 (0.13 mm) ± 0.001 0.053 (1.35 mm) 0.445 (11.30 mm) ± 0.002 0.272 (6.91 mm) ± 0.002 0.318 (8.08 mm) ± 0.002 CERAMIC 0.010 (0.25 mm) ± 0.002 2 0.015 (0.38 mm) 0.053 CW-10 (1.35 mm) MATERIAL 0.106 (2.69 mm) Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email [email protected] • www.alphaind.com Specifications subject to change without notice. 2/00A 18–23 GHz Power Amplifier AA022P1-65 Typical S-Parameters at 25°C (VD = 5.5 V) S11 S21 Frequency (GHz) Mag. Ang. Mag. 5.0 -1.09 -74.68 7.0 -3.99 20.09 S12 Ang. Mag. -10.27 119.56 -22.66 -148.84 S22 Ang. Mag. Ang. -52.69 -53.88 -0.02 9.33 -51.25 111.93 -1.62 126.08 9.0 -4.24 88.86 -4.30 -62.19 -50.26 174.57 -6.40 -179.76 11.0 -11.05 -156.14 0.51 37.75 -54.44 -30.60 -8.73 -103.47 13.0 -11.92 137.17 4.81 139.77 -45.58 -153.34 -9.10 42.33 14.0 -12.67 56.24 7.65 15.62 -40.67 116.81 -14.46 -45.55 15.0 -14.93 12.78 10.55 -122.97 -45.10 54.49 -20.97 151.51 16.0 -17.37 77.71 12.93 92.53 -38.93 -44.52 -21.63 99.72 17.0 -7.28 -11.33 12.63 -49.25 -36.17 -126.49 -10.34 34.51 18.0 -10.07 -84.35 13.49 -179.48 -33.77 136.88 -9.47 -60.49 19.0 -11.94 -77.63 15.56 33.54 -33.81 18.17 -10.67 -75.12 20.0 -12.10 -128.79 14.74 -108.18 -37.71 -91.39 -7.69 -168.58 21.0 -8.97 -175.15 14.76 113.18 -47.71 127.29 -10.92 111.42 22.0 -9.80 127.70 15.88 -27.30 -42.87 -128.42 -14.53 59.76 23.0 -7.12 50.83 16.08 172.99 -37.02 129.56 -13.43 -22.85 24.0 -7.95 -67.08 13.97 6.27 -35.31 44.33 -11.04 -88.28 25.0 -10.21 163.03 8.48 -141.45 -34.85 -46.25 -11.68 73.18 26.0 -10.38 131.18 2.53 49.03 -26.43 -132.35 -6.22 39.36 28.0 -11.23 -84.36 -2.81 132.15 -28.98 31.32 -4.53 -140.76 29.0 -4.83 -161.74 -9.96 -38.18 -27.13 -74.60 -6.46 120.95 30.0 -3.14 100.08 -21.41 -175.00 -28.16 -175.36 -4.55 15.97 32.0 -5.27 -101.79 -21.92 -8.83 -28.98 -27.58 -0.83 -164.50 34.0 -1.69 79.93 -44.55 150.61 -41.07 153.00 -1.11 50.91 36.0 -3.82 -126.96 -41.01 -52.33 -38.75 -61.13 -3.09 -155.22 38.0 -1.95 -172.40 -43.58 172.24 -42.55 -143.03 -0.81 -2.02 40.0 -4.62 -63.91 -29.46 -87.77 -29.96 -84.18 -1.70 -147.57 Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email [email protected] • www.alphaind.com Specifications subject to change without notice. 2/00A 3 18–23 GHz Power Amplifier AA022P1-65 Leaded Millimeterwave Package Handling and Mounting The leaded millimeterwave package requires careful mounting design to maintain optimal performance. Handling The leaded millimeterwave package is extremely rugged. Care should be exercised when handling with metal tools. Only personnel trained in both ESD precautions and handling precautions should be allowed to handle these packages. package to minimize the gap between package and printed circuit board. The gap should be no more than 0.005" (0.127 mm). The base of the package should be mounted directly to a surface that provides a good ground plane for the printed circuit board and provides a good thermal ground. Mounting the Package The construction of the leaded millimeterwave package consists of a metal base and ceramic walls. The package is topped by a solder-sealed metal lid. All metal parts are gold-plated. The leaded millimeterwave package should be attached to its mounting surface using a silver-filled conductive paste epoxy or solder. Care should be taken to ensure that there are no voids or gaps in the epoxy or solder underfill so that a good ground contact is maintained. Screw hardware attachment should be used in addition to epoxy or solder in situations where additional mechanical integrity is desired. Care should be exercised when tightening screws because over-tightening could deform the package base. Mounting Design Connecting the Package The leaded millimeterwave package is mounted by placing it in a hole cut in a printed circuit board. The bottom of the package leads should be in the same plane as the top surface of the printed circuit board traces. The hole should be cut as close as possible to the outer dimensions of the Connection of the package leads to the printed circuit board traces is accomplished with solder. Attached leads should lie flat upon the printed circuits board traces. Package leads can be trimmed if desired. Package Construction Soldered Leads Printed Circuit Board Rogers 4003 0.008" (0.20 mm) Thick RF Out Minimize RF Gap Widths 0–80 Screw RF In Electrically & Thermally Conductive Ground Plane DC Connection Leaded Millimeterwave Package Mounting 4 Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email [email protected] • www.alphaind.com Specifications subject to change without notice. 2/00A