ETC RM807

RM807
Power Amplifier Module for TDMA PCS (1850–1910 MHz)
The RM807 Power Amplifier Module (PAM) for Personal Communications Service
(PCS) is a fully matched 6-pin surface mount module developed for PCS and wireless
local loop applications. This small and efficient power amplifier packs a full
1850–1910 MHz bandwidth coverage into a single compact package. This device
meets the stringent spectral linearity requirements of Time Division Multiple Access
(TDMA) PCS transmission with high power added efficiency to output power of
29.5 dBm. A single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit
(MMIC) contains all active circuitry in the module. The MMIC contains onboard bias
circuitry as well as input and interstage matching circuits. The output match is
realized off-chip within the module package to optimize efficiency and power
performance into a 50 ohm load. This device is manufactured with Skyworks’ GaAs
Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage
DC supply operation while maintaining high efficiency and good linearity. Primary bias
to the RM807 can be supplied directly from a three-cell nickel cadmium, single cell
lithium ion, or other suitable battery with output in the 3–4 volts range. Power down is
accomplished by setting the voltage on the low current reference pin to zero volts. No
external supply side switch is needed as typical “off” leakage is a few microamperes
with full primary voltage supplied from the battery.
Distinguishing Features
•
•
•
•
•
•
Low voltage positive bias supply
Good linearity
High efficiency
Large dynamic range
6-pin LCC package
(6 x 6 x 1.5 mm)
Power down control
Applications
•
•
Personal Communications
Services (TDMA)
Wireless Local Loop (WLL)
Functional Block Diagram
VREF
(3)
VCC2
(4)
VCC1
(1)
Driver
Stage Bias
RF
Input
(2)
Input
Match
Power
Stage Bias
Inter
Stage
Match
DA
PA
Output
Match
RF
Output
(5)
MMIC
MODULE
(6, 7)
GND
Data Sheet
© 2001, Skyworks Solutions, Inc., All Rights Reserved.
(6, 7)
GND
100409F
February 7, 2002
RM807
Electrical Specifications
Power Amplifier Module for TDMA PCS (1850–1910 MHz)
Electrical Specifications
The following tables list the electrical characteristics for the RM807 Power Amplifier. Table 1 lists
the absolute maximum rating for continuous operation. Table 2 lists the recommended operating
conditions for achieving the electrical performance listed in Table 3, which contains the electrical
performance data of the RM807 Power Amplifier under recommended operating conditions.
Table 1. Absolute Maximum Ratings(1)
Parameter
RF Input Power
Symbol
Minimum
Nominal
Maximum
Unit
Pin
—
3.0
8.0
dBm
Volts
Supply Voltage
Vcc
—
3.5
5.0(2)
Reference Voltage
Vref
—
3.1
3.3
Volts
Tc
–30
+25
+110
°C
Tstg
–55
—
+125
°C
Case Operating Temperature
Storage Temperature
NOTE(S):
(1)
No damage assuming only one parameter is set at limit at a time with all other parameters set at or below
nominal value.
(2) Under pulsed TDMA modulated mode, operation at maximum supply voltage of 6.2 V up to 100 ms.
Table 2. Recommended Operating Conditions
Parameter
2
Symbol
Minimum
Nominal
Maximum
Unit
Supply Voltage
Vcc
3.0
3.5
4.2
Volts
Reference Voltage
Vref
3.0
3.1
3.3
Volts
Operating Frequency
Fo
1850
1880
1910
MHz
Operating Temperature
To
–30
+25
+85
°C
Skyworks
100409F
February 7, 2002
RM807
Electrical Specifications
Power Amplifier Module for TDMA PCS (1850–1910 MHz)
Table 3. Electrical Specifications for TDMA/PCS Nominal Operating Conditions(1)
Characteristic
Condition
Symbol
Minimum
Typical
Maximum
Unit
Quiescent current
—
Iq
—
120.0
140.0
mA
Reference current
—
Iref
—
2.0
3.0
mA
—
4.5
25.0
µA
Leakage current
PA off
Gain
Po = 0 dBm
Po = 29.5 dBm
G
Gp
26.0
26.0
30.0
29.0
31.5
31.5
dB
dB
—
PAED
32.0
37.0
—
%
Po ≤ 29.5 dBm
Po ≤ 29.5 dBm
Po ≤ 29.5 dBm
ACP1
ACP2
ACP3
—
—
—
–30.0
–51.0
–55.0
–28.5
–47.0
—
dBc
dBc
dBc
Po ≤ 29.5 dBm
Po ≤ 29.5 dBm
DFo2
DFo3
—
—
–49.0
–60.0
—
—
dBc
dBc
PA “Turn off time”
—
—
—
10.0
—
µS
PA “Turn on time”
—
—
—
10.0
—
µS
Po ≤ 29.5 dBm
Np
—
–136.5
–136.0
dBm/Hz
Noise Figure
—
NF
—
6.0
—
dB
Input Voltage Standing Wave Ratio
—
VSWR
—
1.5:1
1.8:1
—
Stability (spurious output)
5:1 VSWR all
phases
S
—
—
–60.0
dBc
Ruggedness—no damage
Po ≤ 29.5 dBm
Ru
—
—
10:1
VSWR
Power Added Efficiency
Adjacent Channel Power
–30 kHz offset
–60 kHz offset
–90 kHz offset
Harmonics
Second
Third
Noise Power in RX band
1930 – 1990 MHz(2)
NOTE(S):
(1)
(2)
TDMA MODE, Vcc = +3.5 V, Vref = +3.1 V, Freq = 1880 MHz, Tc = +25 °C.
With NADC modulation applied.
100409F
February 7, 2002
Skyworks
3
RM807
Electrical Specifications
Power Amplifier Module for TDMA PCS (1850–1910 MHz)
Table 4. Electrical Specifications for TDMA/PCS Recommended Operating Conditions(1)
Characteristic
Condition
Symbol
Minimum
Maximum
Unit
Quiescent current
—
Iq
—
150.0
mA
Reference current
—
Iref
—
9.0
mA
—
25.0
µA
Leakage
current(3)
PA off
Gain
Po = 0 dBm
Po = 29.5 dBm
G
Gp
24.0
23.0
32.5
34.0
dB
dB
—
PAED
30.0
—
%
Po ≤ 29.5 dBm
Po ≤ 29.5 dBm
Po ≤ 29.5 dBm
ACP1
ACP2
ACP3
—
—
—
–26.0
–46.0
–50.0
dBc
dBc
dBc
Po ≤ 29.5 dBm
Po ≤ 29.5 dBm
DFo2
DFo3
—
—
–35.0
–35.0
dBc
dBc
PA “Turn off time”
—
—
—
30.0
µS
PA “Turn on time”
—
—
—
30.0
µS
Po ≤ 29.5 dBm
Np
—
–133.0
dBm/Hz
—
VSWR
—
2.3:1
—
5:1 VSWR all
phases
S
—
–60.0
dBc
Po ≤ 29.5 dBm
Ru
—
10:1
VSWR
Power Added Efficiency
Adjacent Channel Power
–30 kHz offset
–60 kHz offset
–90 kHz offset
Harmonics
Second
Third
Noise Power in RX band 1930 –
1990 MHz(2)
Input Voltage Standing Wave Ratio
(3)
Stability (spurious output)
Ruggedness—no damage(3)
NOTE(S):
(1)
TDMA MODE, Vcc = +3.5 V, Vref = +3.1 V, Freq = 1850 – 1910 MHz, Tc = –30 °C to +85 °C.
With NADC modulation applied.
(3) Tc = +25 °C.
(2)
4
Skyworks
100409F
February 7, 2002
RM807
Characterization Data
Power Amplifier Module for TDMA PCS (1850–1910 MHz)
Characterization Data
The following charts illustrate the characteristics of a typical RM807 Power Amplifier tested in the
evaluation board described in the following section. The amplifier was selected by characterizing a
group of devices and choosing a part with average electrical performance at both nominal and
worst case conditions. Figures 1 through 5 illustrate the digital signal characteristics of the RM807.
Figure 1. Digital Gain vs. Output Power
Vref = 3.1V, Vcc = 3.5V
40
35
Gain (dB)
30
25
20
15
10
0
5
1850 [email protected] C
1880 [email protected] C
1910 [email protected] C
100409F
February 7, 2002
10
15
Output Pow er (dBm )
1850 [email protected]+85 C
1880 [email protected]+85 C
1910 [email protected]+85 C
Skyworks
20
25
30
1850 [email protected]+25 C
1880 [email protected]+25 C
1910 [email protected]+25 C
5
RM807
Characterization Data
Power Amplifier Module for TDMA PCS (1850–1910 MHz)
Figure 2. Digital Adjacent Channel Power vs. Output Power
Vref = 3.1V, Vcc = 3.5V
0
ACPR1 (dBc)
-10
-20
-30
-40
-50
0
5
10
15
20
25
30
20
25
30
Output Pow er (dBm )
Figure 3. Digital Alternate Channel Power vs. Output Power
Vref = 3.1V, Vcc = 3.5V
-30
ACPR2 (dBc)
-40
-50
-60
-70
-80
0
5
10
15
Output Pow er (dBm )
1850 [email protected] C
1880 [email protected] C
1910 [email protected] C
6
1850 [email protected]+85 C
1880 [email protected]+85 C
1910 [email protected]+85 C
Skyworks
1850 [email protected]+25 C
1880 [email protected]+25 C
1910 [email protected]+25 C
100409F
February 7, 2002
RM807
Characterization Data
Power Amplifier Module for TDMA PCS (1850–1910 MHz)
Figure 4. Digital Power Added Efficiency vs. Output Power
Vref = 3.1V, Vcc = 3.5V
50
DPAE (%)
40
30
20
10
0
0
5
10
15
Output Pow er (dBm )
20
25
30
20
25
30
Figure 5. Analog Second Order Harmonic Suppression vs. Output Power
Vref = 3.1V, Vcc = 3.5V
0
-10
DFo2 (dBc)
-20
-30
-40
-50
-60
0
5
10
15
Output Pow er (dBm )
1850 [email protected] C
1880 [email protected] C
1910 [email protected] C
100409F
February 7, 2002
1850 [email protected]+85 C
1880 [email protected]+85 C
1910 [email protected]+85 C
Skyworks
1850 [email protected]+25 C
1880 [email protected]+25 C
1910 [email protected]+25 C
7
RM807
Evaluation Board Description
Power Amplifier Module for TDMA PCS (1850–1910 MHz)
Evaluation Board Description
The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the
interface testing of the RM807, the evaluation board schematic and diagrams are included for
preliminary analysis and design. Figure 6 shows the basic schematic of the board for the 1850 MHz
to 1910 MHz range. Figure 7 illustrates the board layout.
Figure 6. Evaluation Board Schematic
VCC
C5
10,000 pF
50 W
Transmission
Line
(40 mils)
50 W
Transmission
Line
GND
6
VCC
1
RM807
RFIN
RFIN
2
C1
18 pF
50 W
Transmission
Line
RFOUT
RFOUT
5
3
VREF
4
VCC2
C3
1,000 pF
C2
4.7 µF
C4
1,000 pF
VREF
VCC
NOTE: Both Vcc may be tied together at the supply.
100409_003
Figure 7. Evaluation Board Diagram
C5
J1
C1
RF IN
J2
C2
C3
C4
RF OUT
SKYWORKS
GND
Vcc
GND
Vref
J3
REF
DESIGNATIONS VALUES
C1
18 pF
4.7 µF
C2
C3
1,000 pF
C4
1,000 pF
10,000 pF
C5
QTY
1
1
1
1
1
100409_004
8
Skyworks
100409F
February 7, 2002
RM807
Package Dimensions and Pin Description
Power Amplifier Module for TDMA PCS (1850–1910 MHz)
Package Dimensions and Pin Description
The RM807 is a multi-layer laminate base, overmold encapsulated modular package designed for
surface mount solder attachment to a printed circuit board.
Figure 8. RM807 Package Drawing
2.870 (2x)
1.981 (2x)
1.219 (2x)
PIN 1
INDICATOR
1
6
6
(PIN 7)
2.500
(4x)
2
5
3
4
5.92/6.15
2
5
3
4
- TOP VIEWS -
.762 6x
R .500 TYP
5.92/6.15
NOTE: Solder mask pattern pad layout as seen
from top looking through package.
1.500 TYP
All dimensions in millimeters.
FRONT VIEW
100409_002
Table 5. Pin Description
Pin #
Function
1
VCC1(1)
2
RF Input
3
VREF
4
VCC2(1)
5
RF Output
6
GND
(7) GND PAD
GND(2)
NOTE(S):
(1)
(2)
All supply pins may be connected together at the supply.
Package underside is GND.
100409F
February 7, 2002
Skyworks
9
RM807
Package and Handling Information
Power Amplifier Module for TDMA PCS (1850–1910 MHz)
Package and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum packed
prior to shipment. Instructions on the shipping container label must be followed regarding exposure
to moisture after the container seal is broken, otherwise, problems related to moisture absorption
may occur when the part is subjected to high temperature during solder assembly.
The RM807 is capable of withstanding an MSL 3/225 °C solder reflow. Care must be taken when
attaching this product, whether it is done manually or in a production solder reflow environment. If
the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 °C per second;
maximum temperature should not exceed 225 °C. If the part is manually attached, precaution
should be taken to insure that the part is not subjected to temperatures exceeding 225 °C for more
than 10 seconds. For details on both attachment techniques, precautions, and handling procedures
recommended by Conexant, please refer to Application Note: PCB Design and SMT
Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles
can also be found in the JEDEC Standard J–STD–020A.
Production quantities of this product are shipped in the standard tape-and-reel format. For
packaging details, refer to Application Note: Tape and Reel, Document Number 101568.
Figure 9. Typical Case Markings
SKYWORKS
Mark Pin 1
Identifier
RM807-NN
NXXXXX.XX
YYWW MEX
Manufacturing Part Number-Revision Number
Lot Number
YY = Manufacture Year
WW = Week Package Sealed
MEX = Country Code
100409_006
10
Skyworks
100409F
February 7, 2002
RM807
Electrostatic Discharge Sensitivity
Power Amplifier Module for TDMA PCS (1850–1910 MHz)
Electrostatic Discharge Sensitivity
The RM807 is a Class I device. Figure 10 lists the Electrostatic Discharge (ESD) immunity level
for each pin of the RM807 product. The numbers in Figure 10 specify the ESD threshold level for
each pin where the I-V curve between the pin and ground starts to show degradation. The ESD
testing was performed in compliance with MIL-STD-883E Method 3015.7 using the Human Body
Model. Since 2000 volts represents the maximum measurement limit of the test equipment used,
pins marked > 2000 V pass 2000V ESD stress.
Figure 10. ESD Sensitivity Areas
> +2000 V
< –2000 V
VCC1
1
6
GND
> +2000 V
< –2000 V
RFIN
2
5
RFOUT
> +2000 V
< –2000 V
> +2000 V VREF
< –2000 V
3
4
VCC2
> +2000 V
< –2000 V
100409_008
Various failure criteria can be utilized when performing ESD testing. Many vendors employ
relaxed ESD failure standards which fail devices only after “the pin fails the electrical specification
limits” or “the pin becomes completely non-functional”. Skyworks employs most stringent criteria,
fails devices as soon as the pin begins to show any degradation on a curve tracer.
To avoid ESD damage, latent and visible, it is very important that the product assembly and test
areas follow the Class-1 ESD handling precautions listed in Table 6.
Table 6. Precautions for GaAs ICs with ESD Thresholds Greater Than 200V But Less Than 2000V
Personnel Grounding
Wrist Straps
Conductive Smocks, Gloves and Finger Cots
Antistatic ID Badges
Facility
Relative Humidity Control and Air Ionizers
Dissipative Floors (less than 109 Ω to GND)
Protective Workstation
Dissipative Table Tops
Protective Test Equipment (Properly Grounded)
Grounded Tip Soldering Irons
Conductive Solder Suckers
Static Sensors
Protective Packaging & Transportation
Bags and Pouches (Faraday Shield)
Protective Tote Boxes (Conductive Static Shielding)
Protective Trays
Grounded Carts
Protective Work Order Holders
100409F
February 7, 2002
Skyworks
11
RM807
Electrostatic Discharge Sensitivity
Power Amplifier Module for TDMA PCS (1850–1910 MHz)
12
Skyworks
100409F
February 7, 2002
Ordering Information
Model Number
Manufacturing
Part Number
Product Revision
Package
Operating
Temperature
RM807
RM807-15
15
6x6LM–6
–30 °C to +85 °C
Revision History
Revision
Level
Date
Description
A
March 2000
Initial Release
B
March 2000
Amend Title, Added Package Drawing
C
March 2001
Add Soldering and Temperature Change Guidelines, Evaluation Board
information, Case Marking drawing, ESD data
D
April 2001
Revise: Manufacturing Part Number; Figure 3; ESD Data
Add: Table 4; Figures 1 through 5, Packaging and Handling Information
Section
E
September 2001
Revise: Add footnote to Table 1
F
February 7, 2002
Revise: Table 1 footnote 2.
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752
Application Note: Tape and Reel, Document Number 101568
JEDEC Standard J–STD–020A
© 2002, Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are
provided by Skyworks as a service to its customers and may be used for informational purposes only. Skyworks assumes no
responsibility for errors or omissions in these materials. Skyworks may make changes to its products, specifications and product
descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility
whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its products and product descriptions.
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may be provided in Skyworks' Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever.
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OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS.
SKYWORKS SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES,
INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE
MATERIALS.
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Product names or services listed in this publication are for identification purposes only, and may be trademarks of third parties. Thirdparty brands and names are the property of their respective owners.
Additional information, posted at www.skyworksinc.com, is incorporated by reference.
General Information:
Skyworks Solutions, Inc.
4311 Jamboree Rd.
Newport Beach, CA. 92660-3007
www.skyworksinc.com