ETC CS5253B-8/D

CS5253B-8
3.0 A LDO 5-Pin 2.5 V Fixed
Linear Regulator for
Remote Sense Applications
This new very low dropout linear regulator reduces total power
dissipation in the application. To achieve very low dropout, the
internal pass transistor is powered separately from the control
circuitry. Furthermore, with the control and power inputs tied together,
this device can be used in single supply configuration and still offer a
better dropout voltage than conventional PNP–NPN based LDO
regulators. In this mode the dropout is determined by the minimum
control voltage.
The CS5253B–8 is offered in a five–terminal D2PAK package,
which allows for the implementation of a remote–sense pin permitting
very accurate regulation of output voltage directly at the load, where it
counts, rather than at the regulator. This remote sensing feature
virtually eliminates output voltage variations due to load changes and
resistive voltage drops. Typical load regulation measured at the sense
pin is less than 1.0 mV for an output voltage of 2.5 V with a load step
of 10 mA to 3.0 A.
The CS5253B–8 has a very fast transient loop response.
Internal protection circuitry provides for “bust–proof” operation,
similar to three–terminal regulators. This circuitry, which includes
overcurrent, short circuit, and overtemperature protection will self
protect the regulator under all fault conditions.
The CS5253B–8 is ideal for generating a 2.5 V supply to power
graphics controllers used on VGA cards. Its remote sense and low
value capacitance requirements make this a low cost high performance
solution. The CS5253B–8 is optimized from the CS5253–1 to allow a
lower value of output capacitor to be used at the expense of a slower
transient response.
Features
VOUT Fixed @ 2.5 V ± 1.5%
VPOWER Dropout < 0.40 V @ 3.0 A
VCONTROL Dropout < 1.05 V @ 3.0 A
1.5% Trimmed Reference
Fast Transient Response
Remote Voltage Sensing
Thermal Shutdown
Current Limit
Short Circuit Protection
Drop–In Replacement for EZ1582
Backwards Compatible with 3–Pin Regulators
Very Low Dropout Reduces Total Power Consumption
•
•
•
•
•
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 Semiconductor Components Industries, LLC, 2001
March, 2001 – Rev. 2
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1
5
D2PAK
5–PIN
DP SUFFIX
CASE 936F
Tab = VOUT
Pin 1. VSENSE
2. GND
3. VOUT
4. VCONTROL
5. VPOWER
MARKING DIAGRAM
CS
5253B–8
AWLYWW
1
A
WL, L
YY, Y
WW, W
= Assembly Location
= Wafer Lot
= Year
= Work Week
ORDERING INFORMATION
Device
Package
Shipping
CS5253B–8GDP5
D2PAK*
50 Units/Rail
CS5253B–8GDPR5
D2PAK*
750 Tape & Reel
*5–Pin.
1
Publication Order Number:
CS5253B–8/D
CS5253B–8
RDIS
VCONTROL
+5.0 V
2.5 V @ 3.0 A
VOUT
VSENSE
CS5253B–8
+3.3 V
10 µF
10 V
VPOWER
GND
33 µF
5.0 V
CLOAD
(Optional)
100 µF
5.0 V
GND
GND
RDIS
Figure 1. Application Diagram
ABSOLUTE MAXIMUM RATINGS*
Rating
Value
Unit
VPOWER Input Voltage
6.0
V
VCONTROL Input Voltage
13
V
0 to 150
°C
–65 to +150
°C
2.0
kV
230 peak
°C
Operating Junction Temperature Range, TJ
Storage Temperature Range
ESD Damage Threshold
Lead Temperature Soldering:
Reflow: (SMD styles only) (Note 1.)
1. 60 second maximum above 183°C.
*The maximum package power dissipation must be observed.
ELECTRICAL CHARACTERISTICS (0°C ≤ TA ≤ 70°C; 0°C ≤ TJ ≤ 150°C; VSENSE = VOUT and GND = 0 V; unless
otherwise specified.)
Characteristic
Test Conditions
Min
Typ
Max
Unit
Output Voltage
VCONTROL = 3.9 V to 12 V, VPOWER = 3.13 V to 5.5 V,
IOUT = 10 mA to 3.0 A
2.463
(–1.5%)
2.5
2.538
(+1.5%)
V
Line Regulation
VCONTROL = 3.9 V to 12 V, VPOWER = 3.13 V to 5.5 V,
IOUT = 10 mA
–
0.02
0.2
%
Load Regulation
VCONTROL = 3.9 V, VPOWER = 3.13 V,
IOUT = 10 mA to 3.0 A, with Remote Sense
–
0.04
0.3
%
Minimum Load Current (Note 2.)
VCONTROL = 5.0 V, VPOWER = 3.3 V, ∆VOUT = +1.0%
–
0
0
mA
Control Pin Current (Note 3.)
VCONTROL = 3.9 V, VPOWER = 3.13 V, IOUT = 100 mA
VCONTROL = 3.9 V, VPOWER = 3.13 V, IOUT = 3.0 A
–
–
6.0
35
10
120
mA
mA
Ground Pin Current
VCONTROL = 3.9 V, VPOWER = 3.13 V, IOUT = 10 mA
–
7
10
mA
Current Limit
VCONTROL = 3.9 V, VPOWER = 3.13 V, ∆VOUT = –4.0%
3.1
4.0
–
A
Short Circuit Current
VCONTROL = 3.9 V, VPOWER = 3.13 V, VOUT = 0 V
2.0
3.5
–
A
CS5253B–8
2. The minimum load current is the minimum current required to maintain regulation.
3. The VCONTROL pin current is the drive current required for the output transistor. This current will track output current with roughly a 1:100
ratio. The minimum value is equal to the quiescent current of the device.
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CS5253B–8
ELECTRICAL CHARACTERISTICS (continued) (0°C ≤ TA ≤ 70°C; 0°C ≤ TJ ≤ 150°C; VSENSE = VOUT and GND = 0 V; unless
otherwise specified.)
Characteristic
Test Conditions
Min
Typ
Max
Unit
CS5253B–8
Ripple Rejection (Note 4.)
VCONTROL = VPOWER = 3.9 V, VRIPPLE = 1.0 VP–P @
120 Hz, IOUT = 3.0 A
60
80
–
dB
Thermal Regulation
30 ms Pulse, TA = 25°C
–
0.002
–
%/W
VCONTROL Dropout Voltage
(Minimum VCONTROL – VOUT)
(Note 5.)
VPOWER = 3.13 V, IOUT = 100 mA
VPOWER = 3.13 V, IOUT = 1.0 A
VPOWER = 3.13 V, IOUT = 3.0 A
–
–
–
0.90
1.00
1.05
1.15
1.15
1.30
V
V
V
VPOWER Dropout Voltage
(Minimum VPOWER – VOUT)
(Note 5.)
VCONTROL = 3.9 V, IOUT = 100 mA
VCONTROL = 3.9 V, IOUT = 1.0 A
VCONTROL = 3.9 V, IOUT = 3.0 A
–
–
–
0.05
0.15
0.40
0.15
0.25
0.60
V
V
V
RMS Output Noise
Freq = 10 Hz to 10 kHz, TA = 25°C
–
0.003
–
%VOUT
Temperature Stability
–
0.5
–
–
%
Thermal Shutdown (Note 6.)
–
150
180
210
°C
Thermal Shutdown Hysteresis
–
–
25
–
°C
VCONTROL Supply Only Output
Current
VCONTROL = 13 V, VPOWER Not Connected,
GND = VOUT = VSENSE = 0 V
–
–
50
mA
VPOWER Supply Only Output
Current
VPOWER = 6.0 V, VCONTROL Not Connected,
GND = VOUT = VSENSE = 0 V
–
0.1
1.0
mA
4. This parameter is guaranteed by design and is not 100% production tested.
5. Dropout is defined as either the minimum control voltage (VCONTROL) or minimum power voltage (VPOWER) to output voltage differential
required to maintain 1.5% regulation at a particular load current.
6. This parameter is guaranteed by design, but not parametrically tested in production. However, a 100% thermal shutdown functional test
is performed on each part.
PACKAGE PIN DESCRIPTION
PACKAGE PIN #
D2PAK
PIN SYMBOL
1
VSENSE
2
GND
This pin is connected to system ground.
3
VOUT
This pin is connected to the emitter of the power pass transistor and provides a
regulated voltage capable of sourcing 3.0 A of current.
4
VCONTROL
5
VPOWER
FUNCTION
This Kelvin sense pin allows for remote sensing of the output voltage at the
load for improved regulation. It is internally connected to the positive input of
the voltage sensing error amplifier.
This is the supply voltage for the regulator control circuitry. For the device to
regulate, this voltage should be between 0.9 V and 1.3 V (depending on the
output current) greater than the output voltage. The control pin current will be
about 1.0% of the output current.
This is the power input voltage. This pin is physically connected to the collector
of the power pass transistor. For the device to regulate, this voltage should be
between 0.1 V and 0.6 V greater than the output voltage depending on the output current. The output load current of 3.0 A is supplied through this pin.
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CS5253B–8
VPOWER
VCONTROL
BIAS
and
TSD
–
+
VREF
EA
IA
+
–
VOUT
VSENSE
GND
Figure 2. Block Diagram
TYPICAL PERFORMANCE CHARACTERISTICS
2.501
5.0
4.0
2.499
Output Current (A)
Reference Voltage (V)
Measured at ∆VOUT = –1.5%
4.5
2.500
2.498
2.497
2.496
3.0
2.5
2.0
1.5
1.0
2.495
2.494
3.5
0.5
0
20
40
60
80
100
120
0
0
Junction Temperature (°C)
1
2
3
4
5
VPOWER – VOUT (V)
Figure 3. Output Voltage vs Junction Temperature
Figure 4. Output Current vs VPOWER – VOUT
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6
CS5253B–8
3.9
15 A/µs
Short Circuit Output current Limit (A)
VCONTROL = 5.0 V
VPOWER = 3.3 V
VOUT = 2.5 V
CCONTROL = 10 µF
CADJ = 0.1 µF
VOUT
CS5253–1
COUT = 330 µF
VOUT
CS5253B–8
COUT = 33 µF
80 A/µs
ILOAD
10 mA to 3.0 A
3.7
3.6
3.5
3.4
3.3
0
20
60
80
100
120
140
Figure 6. Short Circuit Output Current vs Junction
Temperature
0.12
12
0.10
10
VCONTROL = 13 V
VOUT = 0 V
VPOWER Not Connected
TJ = 120°C
8
0.08
0.06
TJ = 20°C
6
4
0.04
TJ = 0°C
2
0.02
0
0
0.5
1.0
1.5
2.0
2.5
0
3.0
0
20
Output Current (A)
40
60
80
100
120
140
Junction Temperature (°C)
Figure 7. Load Regulation vs Output Current
Figure 8. VCONTROL Only Output Current vs Junction
Temperature
30
500
VPOWER = 6.0 V
VOUT = 0 V
VCONTROL Not Connected
450
25
400
TJ = 120°C
350
20
IOUT (µA)
VPOWER Dropout Voltage (V)
40
Junction Temperature (°C)
IOUT (mA)
Load Regulation (%)
Figure 5. Transient Response Comparison between
CS5253–1 and CS5253B–8
VCONTROL = 5.0 V
VPOWER = 3.3 V
3.8
300
TJ = 0°C
250
200
TJ = 20°C
150
15
10
100
5
50
0
0
0
0.5
1.0
1.5
2.0
2.5
3.0
0
20
40
60
80
100
120
140
Junction Temperature (°C)
Output Current (A)
Figure 10. VPOWER Only Output Current vs Junction
Temperature
Figure 9. VPOWER Dropout Voltage vs Output Current
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CS5253B–8
90
5.0
VPOWER = 3.3 V
VCONTROL = 5.0 V
VOUT = 2.5 V
TA = 25°C
70
Current Limit (A)
Ripple Rejection (dB)
80
60
50
VIN – VOUT = 2.0 V
IOUT = 3.0 A
VRIPPLE = 1.0 VP–P
COUT = 22 µF
CADJ = 0.1 µF
40
30
20
10
101
102
103
104
105
4.5
4.0
3.5
106
0
0.5
1.0
Frequency (Hz)
2.0
1100
3.0
40
VPOWER = 2.05 V
VCONTROL = 3.9 V
VPOWER = 3.13 V
35
TJ = 0°C
IOUT = 3.0 A
ICONTROL (mA)
30
1000
TJ = 20°C
900
25
20
15
IOUT = 1.0 A
10
TJ = 120°C
IOUT = 100 mA
5
800
2.5
Figure 12. Current Limit vs VOUT
Figure 11. Ripple Rejection vs Frequency
0
0.5
1.0
1.5
2.0
0
3.0
2.5
0
20
40
Output Current (A)
VPOWER = 3.3 V
VCONTROL = 5.0 V
ILOAD = 0 to 3.0 A
VOUT = 2.5 V
VOUT Shorted to VSENSE
TJ = 0°C to 150°C
4
Unstable
3
2
Stable Region
1
0
0
10
80
100
120
Figure 14. VCONTROL Supply Current vs Junction
Temperature
6
5
60
Junction Temperature (°C)
Figure 13. VCONTROL Dropout Voltage vs Output
Current
ESR (Ω)
VCONTROL Dropout Voltage (mV)
1.5
VOUT (V)
20
30
40
50
60
70
Capacitance (µF)
Figure 15. Stability vs ESR
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80
90
100
140
CS5253B–8
APPLICATIONS NOTES
THEORY OF OPERATION
DESIGN GUIDELINES
The CS5253B–8 linear regulator is fixed at 2.5 V at
currents up to 3.0 A. The regulator is protected against short
circuits, and includes a thermal shutdown circuit with
hysteresis. The output, which is current limited, consists of
a PNP–NPN transistor pair and requires an output capacitor
for stability.
Remote Sense
Remote sense operation can be easily obtained with the
CS5253B–8 but some care must be paid to the layout and
positioning of the filter capacitors around the part. The
ground side of the input capacitors on the +5.0 V and +3.3 V
lines and the local VOUT–to–ground output capacitor on the
IC must be tied close to the ground pin of the regulator. This
will establish the stability of the part. The IC ground may
then be connected to ground remotely at the load, giving the
ground portion remote sense operation.
The VSENSE line can then be tied remotely at the positive
load connection, giving the feedback remote sense
operation. The remote sense lines should be Kelvin
connected so as to eliminate the effect of load current
voltage drop. An optional bypass capacitor may be used at
the load to reduce the effect of load variations and spikes.
VPOWER Function
The CS5253B–8 utilizes a two supply approach to
maximize efficiency. The collector of the power device is
brought out to the VPOWER pin to minimize internal power
dissipation under high current loads. VCONTROL provides
for the control circuitry and the drive for the output NPN
transistor. VCONTROL should be at least 1.0 V greater than
the output voltage. Special care has been taken to ensure that
there are no supply sequencing problems. The output
voltage will not turn on until both supplies are operating. If
the control voltage comes up first, the output current will be
limited to about three milliamperes until the power input
voltage comes up. If the power input voltage comes up first,
the output will not turn on at all until the control voltage
comes up. The output can never come up unregulated.
The CS5253B–8 can also be used as a single supply device
with the control and power inputs tied together. In this mode,
the dropout will be determined by the minimum control
voltage.
Current Limit
The internal current limit circuit limits the output current
under excessive load conditions.
Short Circuit Protection
The device includes short circuit protection circuitry that
clamps the output current at approximately 500mA less than
its current limit value. This provides for a current foldback
function, which reduces power dissipation under a direct
shorted load.
Output Voltage Sensing
The CS5253B–8 five terminal linear regulator includes a
dedicated VSENSE function. This allows for true Kelvin
sensing of the output voltage. This feature can virtually
eliminate errors in the output voltage due to load regulation.
Regulation will be optimized at the point where the sense pin
is tied to the output.
Thermal Shutdown
The thermal shutdown circuitry is guaranteed by design to
activate above a die junction temperature of approximately
150°C and to shut down the regulator output. This circuitry
has 25°C of typical hysteresis, thereby allowing the
regulator to recover from a thermal fault automatically.
RDIS
+5.0 V
VCONTROL
+3.3 V
VPOWER
+Load
VOUT
VSENSE
CS5253B–8
+
10 µF
+
GND
100 µF
+
33 µF
Remote
Connections
+
Optional
Local
Connections
–Load
GND
RDIS
Figure 16. Remote Sense
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CS5253B–8
Calculating Power Dissipation and
Heat Sink Requirements
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air. Each material in the heat flow path
between the IC and the outside environment has a thermal
resistance which is measured in degrees per watt. Like series
electrical resistances, these thermal resistances are summed
to determine the total thermal resistance between the die
junction and the surrounding air, RΘJA. This total thermal
resistance is comprised of three components. These resistive
terms are measured from junction to case (RΘJC), case to
heat sink (RΘCS), and heat sink to ambient air (RΘSA). The
equation is:
High power regulators such as the CS5253B–8 usually
operate at high junction temperatures. Therefore, it is
important to calculate the power dissipation and junction
temperatures accurately to ensure that an adequate heat sink
is used. Since the package tab is connected to VOUT on the
CS5253B–8, electrical isolation may be required for some
applications. Also, as with all high power packages, thermal
compound in necessary to ensure proper heat flow. For
added safety, this high current LDO includes an internal
thermal shutdown circuit
The thermal characteristics of an IC depend on the
following four factors: junction temperature, ambient
temperature, die power dissipation, and the thermal
resistance from the die junction to ambient air. The
maximum junction temperature can be determined by:
RJA RJC RCS RSA
The value for RΘJC is 2.5°C/watt for the CS5253B–8 in
the D2PAK package. For a high current regulator such as the
CS5253B–8 the majority of heat is generated in the power
transistor section. The value for RΘSA depends on the heat
sink type, while the RΘCS depends on factors such as
package type, heat sink interface (is an insulator and thermal
grease used?), and the contact area between the heat sink and
the package. Once these calculations are complete, the
maximum permissible value of RΘJA can be calculated and
the proper heat sink selected. For further discussion on heat
sink selection, see our application note “Thermal
Management for Linear Regulators,” document number
SR006AN/D, available through the Literature Distribution
Center or via our website at http://www.onsemi.com.
TJ(max) TA(max) PD(max) RJA
The maximum ambient temperature and the power
dissipation are determined by the design while the
maximum junction temperature and the thermal resistance
depend on the manufacturer and the package type. The
maximum power dissipation for a regulator is:
PD(max) (VIN(max) VOUT(min))IOUT(max)
VIN(max) IIN(max)
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CS5253B–8
PACKAGE DIMENSIONS
D2PAK
5–PIN
DP SUFFIX
CASE 936F–01
ISSUE O
–T– SEATING
PLANE
B
M
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
B AND M.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAX.
C
E
DIM
A
B
C
D
E
F
G
H
J
K
M
N
A
1 2 3 4 5
K
F
G
D
H
5 PL
0.13 (0.005)
M
T B
J
M
INCHES
MIN
MAX
0.326
0.336
0.396
0.406
0.170
0.180
0.026
0.035
0.045
0.055
0.090
0.110
0.067 BSC
0.098
0.108
0.018
0.025
0.204
0.214
0.055
0.066
0.000
0.004
N
PACKAGE THERMAL DATA
Parameter
D2PAK, 5–Pin
Unit
RΘJC
Typical
2.5
°C/W
RΘJA
Typical
10–50*
°C/W
*Depending on thermal properties of substrate. RΘJA = RΘJC + RΘCA.
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MILLIMETERS
MIN
MAX
8.28
8.53
10.05
10.31
4.31
4.57
0.66
0.91
1.14
1.40
2.29
2.79
1.70 BSC
2.49
2.74
0.46
0.64
5.18
5.44
1.40
1.68
0.00
0.10
CS5253B–8
Notes
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CS5253B–8
Notes
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CS5253B–8
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
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including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
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CS5253B–8/D