Laser Diode LNCQ10PS AlGaInP-Red Laser Diode Unit : mm ■ Features • Oscillation wavelength: 657 nm • Radiant power: 50 mW (with 140 mW pulse) • Small package: φ5.6 mm φ2.0 (2) 1 X 3 (3) (1) 0.4 2 1.0 Y ■ Applications +0 φ5.6 -0.025 • DVD write/read Radiant power Reverse voltage 2.3 Rating Unit CW PO 50 mW Pulse PO 140 mW Laser VR 1.5 V PIN VR(PIN) 30 V Power dissipation PD(PIN) 60 mW Operating ambient temperature Topr −10 to +70 °C Storage temperature Tstg −40 to +80 °C Referance Plane 6.5 Symbol 1.2 ■ Absolute Maximum Ratings Ta = 25°C Parameter 0.25 φ1.0 3- φ0.45 1 : LD Anode 2 : Common Case 3 : PD Cathode L5 Package Internal Connection 2 LD 1 3 ■ Electro-Optical Characteristics Ta = 25°C ± 3°C Parameter Symbol Threshold current Conditions Ith CW Operating current IOP CW, PO = 50 mW Operating voltage VOP Min Typ Max Unit 20 35 50 mA 65 95 110 mA 2.0 2.5 3.0 V Oscillation wavelength λL 653 657 660 nm Differential efficiency η CW, PO = 45/IOP (50 mW) − IOP (5 mW) 0.85 1.00 1.2 W/A Horizontal θ// CW, PO = 50 mW 7.0 9.0 11.0 ° Vertical θ⊥ 15 17 20 ° X direction θX −1.5 +1.5 ° Y direction θY −2.5 +2.5 ° Beam radiation angle Optical axis accuracy Astigmatism difference As 2 10 µm Accuracy of emission point ∆X −60 +60 µm ∆Y −60 +60 µm ∆Z −60 +60 µm Publication date: November 2003 CW, PO = 3 mW SHB00003AED 1 Caution for Safety ■ This product contains Gallium Arsenide (GaAs). DANGER GaAs powder and vapor are hazardous to human health if inhaled or ingested. Do not burn, destroy, cut, cleave off, or chemically dissolve the product. Follow related laws and ordinances for disposal. The product should be excluded form general industrial waste or household garbage. ■ Do not touch or look into the laser beam directly. The laser beam may cause injury to the eye or skin, or loss of eyesight. Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2003 SEP