NSC LMZ10503EXTTZX

LMZ10503EXT
3A SIMPLE SWITCHER® Power Module with 5.5V Maximum
Input Voltage for Military and Rugged Applications
Easy to Use 7 Pin Package
Performance Benefits
■ Operates at high ambient temperatures
■ Low radiated emissions (EMI) complies with EN55022
class B standard (Note 2)
■ Passes 10V/m radiated immunity EMI test standard
EN61000 4-3
■ Passes vibration standard
301182a4
TO-PMOD 7 Pin Package
10.16 x 13.77 x 4.57 mm (0.4 x 0.39 x 0.18 in)
θJA = 20°C/W, θJC = 1.9°C/W (Note 1)
RoHS Compliant
Electrical Specifications
■
■
■
■
■
■
15W maximum total output power
Up to 3A output current
Input voltage range 2.95V to 5.5V
Output voltage range 0.8V to 5V
±1.63% feedback voltage accuracy over temperature
Efficiency up to 96%
MIL-STD-883 Method 2007.2 Condition A
JESD22-B103B Condition 1
■ Passes drop standard
MIL-STD-883 Method 2002.3 Condition B
JESD22-B110 Condition B
System Performance
Current Derating (VOUT = 3.3V)
Key Features
■ Integrated shielded inductor
■ Flexible startup sequencing using external soft-start,
tracking, and precision enable
■ Protection against in-rush currents and faults such as input
UVLO and output short-circuit
301182a5
Efficiency (VOUT = 3.3V)
■ -55°C to +125°C junction temperature operating range
■ Single exposed pad and standard pinout for easy
mounting and manufacturing
■ Pin-to-pin compatible with
LMZ10504EXT (4A/20W max)
LMZ10505EXT (5A/25W max)
■ Fully enable for WEBENCH® and Power Designer
■ Low output voltage ripple of 10 mV allows for powering
noise-sensitive transceiver and signaling ICs
■ Fast transient response for powering FPGAs and ASICs
Applications
■
■
■
■
30118271
Radiated Emissions (EN 55022, Class B)
Point-of-load conversions from 3.3V and 5V rails
Space constrained applications
Extreme temperatures/no air flow environments
Noise sensitive applications (i.e. transceiver, medical)
301182a6
Note 1: θ JA measured on a 2.25” x 2.25” (5.8 cm x 5.8 cm) four layer board. Refer to PCB Layout Diagrams or Evaluation Board Application Note: AN-2074.
Note 2: EN 55022:2006, +A1:2007, FCC Part 15 Subpart B: 2007. See Figure 5 and layout for information on device under test.
© 2010 National Semiconductor Corporation
301182
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LMZ10503EXT 3A SIMPLE SWITCHER® Power Module with 5.5V Maximum Input Voltage for
Military and Rugged Applications
July 30, 2010
LMZ10503EXT
Typical Application Circuit
30118201
Connection Diagram
30118272
Top View
7-Lead TO-PMOD
Ordering Information
Order Number
Supplied As
Package Type
NSC Package Drawing
Package Marking
LMZ10503EXTTZ
250 Units in Tape and Reel
TO-PMOD-7
TZA07A
LMZ10503EXT
LMZ10503EXTTZX
500 Units in Tape and Reel
LMZ10503EXTTZE
45 Units in a Rail
Pin Descriptions
Pin Number
Name
Description
1
VIN
A low ESR input capacitance should be located as close as possible to VIN pin and GND pin.
2
EN
Active high enable input for the device.
3
SS
Soft-start control pin. An internal 2 uA current source charges and external capacitor connected
between this pin and GND (pin 4) to set the output voltage ramp rate during startup. This pin can also
be used to configure the tracking feature.
4
GND
Power ground and signal ground. Connect the bottom feedback resistor between this pin and the
feedback pin.
Feedback pin. This is the inverting input of the error amplifier used for sensing the output voltage.
5
FB
6, 7
VOUT
This is the output of the internal inductor. Connect an external resistor voltage divider from VOUT to
FB to ground.
EP
Exposed
Pad
Exposed pad thermal connection. Connect this pad to the PC board ground plane in order to reduce
thermal resistance value. It also provides an electrical connection to the input and output capacitors
ground terminals.
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2
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
VIN, VOUT, EN, FB, SS to GND
ESD Susceptibility (Note 5)
Power Dissipation
Junction Temperature
Operating Ratings
-0.3V to 6.0V
±2 kV
Internally Limited
150°C
(Note 5)
VIN to GND
Junction Temperature (TJ)
2.95V to 5.5V
-55°C to 125°C
Electrical Characteristics Specifications with standard typeface are for TJ = 25°C only; limits in bold face type
apply over the operating junction temperature range TJ of -55°C to 125°C. Minimum and maximum limits are guaranteed through
test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for
reference purposes only. VIN = VEN = 3.3V, unless otherwise indicated in the conditions column.
Symbol
Parameter
Conditions
Min
(Note 7)
Typ
(Note 8)
Max
(Note 7)
Units
SYSTEM PARAMETERS
V FB
Total Feedback Voltage Variation
Including Line and Load Regulation
VIN = 2.95V to 5.5V
VOUT = 2.5V
IOUT = 0A to 3A
0.78
0.8
0.82
V
V FB
Feedback Voltage Variation
VIN = 3.3V, VOUT = 2.5V
IOUT = 0A
0.787
0.8
0.812
V
V FB
Feedback Voltage Variation
VIN = 3.3V, VOUT = 2.5V
IOUT = 3A
0.785
0.798
0.81
V
2.6
2.95
V
1.7
3
mA
260
500
µA
5.2
6.7
A
VIN(UVLO)
Input UVLO Threshold (Measured at VIN Rising
pin)
Falling
ISS
Soft-Start Current
Charging Current
IQ
Non-Switching Input Current
VFB = 1V
ISD
Shut Down Quiescent Current
VIN = 5.5V, VEN = 0V
IOCL
Output Current Limit (Average Current)
VOUT = 2.5V
fFB
Frequency Fold-back
In current limit
1.95
2.4
2
3.8
µA
250
kHz
PWM SECTION
fSW
Drange
Switching Frequency
700
PWM Duty Cycle Range
1000
0
1160
kHz
100
%
1.8
V
ENABLE CONTROL
VEN-IH
EN Pin Rising Threshold
VEN-IF
EN Pin Falling Threshold
1.23
1.06
V
TJ for Thermal Shutdown
145
°C
Hysteresis for Thermal Shutdown
10
°C
0.8
THERMAL CONTROL
TSD
TSD-HYS
THERMAL RESISTANCE
θJA
Junction to Ambient
(Note 1)
20
°C/W
θJC
Junction to Case
No air flow
1.9
°C/W
3
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LMZ10503EXT
Storage Temperature Range
-65°C to 150°C
For Soldering Specs see:
www.national.com/ms/MS/MS-SOLDERING.pdf
Absolute Maximum Ratings (Note 5)
LMZ10503EXT
Electrical Characteristics Specifications with standard typeface are for TJ = 25°C only; limits in bold face type
apply over the operating junction temperature range TJ of -55°C to 125°C. Minimum and maximum limits are guaranteed through
test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for
reference purposes only. VIN = VEN = 3.3V, unless otherwise indicated in the conditions column.
Symbol
Parameter
Conditions
Min
(Note 7)
Typ
(Note 8)
Max
(Note 7)
Units
PERFORMANCE PARAMETERS
ΔVOUT
Output Voltage Ripple
Refer to Table 3
VOUT = 2.5V
Bandwidth Limit = 2 MHz
7
mVpk-pk
ΔVOUT
Output Voltage Ripple
Refer to Table 5
Bandwidth Limit = 20 MHz
5
mVpk-pk
Feedback Voltage Line Regulation
ΔVIN = 2.95V to 5.5V
0.04
%
0.04
%
ΔVFB / VFB
IOUT = 0A
ΔVOUT / VOUT
Output Voltage Line Regulation
ΔVIN = 2.95V to 5.5V
IOUT = 0A, VOUT = 2.5V
ΔVFB / VFB
ΔVOUT / VOUT
Feedback Voltage Load Regulation
IOUT = 0A to 3A
0.25
%
Output Voltage Load Regulation
IOUT = 0A to 3A
VOUT = 2.5V
0.25
%
Efficiency
η
η
η
η
Peak Efficiency (1A) VIN = 5V
Peak Efficiency (1A) VIN = 3.3V
Full Load Efficiency (3A) VIN = 5V
Full Load Efficiency (3A) VIN = 3.3V
VOUT = 3.3V
96.3
VOUT = 2.5V
94.9
VOUT = 1.8V
93.3
VOUT = 1.5V
92.2
VOUT = 1.2V
90.5
VOUT = 0.8V
86.9
VOUT = 2.5V
95.7
VOUT = 1.8V
94.0
VOUT = 1.5V
92.9
VOUT = 1.2V
91.3
VOUT = 0.8V
87.9
VOUT = 3.3V
94.8
VOUT = 2.5V
93
VOUT = 1.8V
90.8
VOUT = 1.5V
89.3
VOUT = 1.2V
87.1
VOUT = 0.8V
82.3
VOUT = 2.5V
92.4
VOUT = 1.8V
89.8
VOUT = 1.5V
88.2
VOUT = 1.2V
85.9
VOUT = 0.8V
80.8
%
%
%
%
Note 3: θ JA measured on a 2.25” x 2.25” (5.8 cm x 5.8 cm) four layer board, with one ounce copper, thirty six 10mil thermal vias, no air flow, and 1W power
dissipation. Refer to or Evaluation Board Application Note: AN-2074.
Note 4: EN 55022:2006, +A1:2007, FCC Part 15 Subpart B: 2007. See Table 9 and layout for information on device under test.
Note 5: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the
device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 6: The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. Test method is per JESD22-AI14S.
Note 7: Min and Max limits are 100% production tested at an ambient temperature (TA) of 25°C. Limits over the operating temperature range are guaranteed
through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate National’s Average Outgoing Quality Level (AOQL).
Note 8: Typical numbers are at 25°C and represent the most likely parametric norm.
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4
Load Transient Response
VIN = 3.3V, VOUT = 2.5V, IOUT = 0.3A to 2.7A to 0.3A step
20 MHz Bandwidth Limited
Refer to Table 5 for BOM, includes optional components
Load Transient Response
VIN = 5.0V, VOUT = 2.5V, IOUT = 0.3A to 2.7A to 0.3A step
20 MHz Bandwidth Limited
Refer to Table 5 for BOM, includes optional components
30118263
30118262
Output Voltage Ripple
VIN = 3.3V, VOUT = 2.5V, IOUT = 3A, 20 mV/DIV
Refer to Table 5 for BOM
Output Voltage Ripple
VIN = 5.0V, VOUT = 2.5V, IOUT = 3A, 20 mV/DIV
Refer to Table 5 for BOM
30118264
30118265
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LMZ10503EXT
Typical Performance Characteristics Unless otherwise specified, the following conditions apply: VIN =
VEN = 5.0V, CIN is 47 µF 10V X5R ceramic capacitor; TAMBIENT = 25°C for efficiency curves and waveforms.
LMZ10503EXT
Efficiency
VOUT = 3.3V
Efficiency
VOUT = 2.5V
30118271
30118270
Efficiency
VOUT = 1.8V
Efficiency
VOUT = 1.5V
30118269
301182a0
Efficiency
VOUT = 1.2V
Efficiency
VOUT = 0.8V
30118267
30118268
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LMZ10503EXT
Current Derating
VIN = 5V, θJA = 20°C / W
Current Derating
VIN = 3.3V, θJA = 20°C / W
301182b3
301182b4
Radiated Emissions (EN55022, Class B)
VIN = 5V, VOUT = 2.5V, IOUT = 3A
Evaluation board
Startup
VOUT = 2.5V, IOUT = 0A
30118256
301182a6
Pre-biased Startup
VOUT = 2.5V, IOUT = 0A
30118255
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LMZ10503EXT
Block Diagram
30118236
5. Estimate the power dissipation and board thermal requirements.
6. Follow the PCB design guideline.
7. Learn about the LMZ10503EXT features such as enable,
input UVLO, soft-start, tracking, pre-biased startup, current
limit, and thermal shutdown.
General Description
The LMZ10503EXT SIMPLE SWITCHER® power module is
a complete, easy-to-use DC-DC solution capable of driving
up to a 3A load with exceptional power conversion efficiency,
output voltage accuracy, line and load regulation. The
LMZ10503EXT is available in an innovative package that enhances thermal performance and allows for hand or machine
soldering.
The LMZ10503EXT can accept an input voltage rail between
2.95V and 5.5V and deliver an adjustable and highly accurate
output voltage as low as 0.8V. One megahertz fixed frequency PWM switching provides a predictable EMI characteristic.
Two external compensation components can be adjusted to
set the fastest response time, while allowing the option to use
ceramic and/or electrolytic output capacitors. Externally programmable soft-start capacitor facilitates controlled startup.
The LMZ10503EXT is a reliable and robust solution with the
following features: lossless cycle-by-cycle peak current limit
to protect for over current or short-circuit fault, thermal shutdown, input under-voltage lock-out, and pre-biased startup.
Design Example
For this example the following application parameters exist.
• VIN = 5V
• VOUT = 2.5V
• IOUT = 3A
• ΔVOUT = 20 mVpk-pk
• ΔVo_tran = ±20 mVpk-pk
Input Capacitor Selection
A 22 µF or 47 µF high quality dielectric (X5R, X7R) ceramic
capacitor rated at twice the maximum input voltage is typically
sufficient. The input capacitor must be placed as close as
possible to the VIN pin and GND exposed pad to substantially
eliminate the parasitic effects of any stray inductance or resistance on the PC board and supply lines.
Neglecting capacitor equivalent series resistance (ESR), the
resultant input capacitor AC ripple voltage is a triangular
waveform. The minimum input capacitance for a given peakto-peak value (ΔVIN) of VIN is specified as follows:
Design Guideline And Operating
Description
Design Steps
LMZ10503EXT is fully supported by Webench® and offers
the following: component selection, performance, electrical,
and thermal simulations as well as the Build-It board, for a
reduced design time. On the other hand, all external components can be calculated by following the design procedure
below.
1. Determine the input voltage and output voltage. Also, make
note of the ripple voltage and voltage transient requirements.
2. Determine the necessary input and output capacitance.
3. Calculate the feedback resistor divider.
4. Select the optimized compensation component values.
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where the PWM duty cycle, D, is given by:
If ΔVIN is 1% of VIN, this equals to 50 mV and fSW = 1 MHz
8
The minimum output capacitance requirement due to the
PWM ripple voltage is:
With this high AC current present in the input capacitor, the
RMS current rating becomes an important parameter. The
maximum input capacitor ripple voltage and RMS current occur at 50% duty cycle. Select an input capacitor rated for at
least the maximum calculated ICin(RMS).
Additional bulk capacitance with higher ESR may be required
to damp any resonance effects of the input capacitance and
parasitic inductance.
Three miliohms is a typical RESR value for ceramic capacitors.
The following equation provides a good first pass capacitance
requirement for a load transient:
Output Capacitor Selection
In general, 22 µF to 100 µF high quality dielectric (X5R, X7R)
ceramic capacitor rated at twice the maximum output voltage
is sufficient given the optimal high frequency characteristics
and low ESR of ceramic dielectrics. Although, the output capacitor can also be of electrolytic chemistry for increased
capacitance density.
Two output capacitance equations are required to determine
the minimum output capacitance. One equation determines
the output capacitance (CO) based on PWM ripple voltage.
The second equation determines CO based on the load transient characteristics. Select the largest capacitance value of
the two.
The minimum capacitance, given the maximum output voltage ripple (ΔVOUT) requirement, is determined by the following equation:
Where Istep is the peak to peak load step (for this example
Istep = 10% to 90% of the maximum load), VFB = 0.8V, and
ΔVo_tran is the maximum output voltage deviation, which is
±20 mV.
Therefore the capacitance requirement for the given design
parameters is:
Co ≥ 42 µF
In this particular design the output capacitance is determined
by the load transient requirements.
Table 1 lists some examples of commercially available capacitors that can be used with the LMZ10503EXT.
Where the peak to peak inductor current ripple (ΔiL) is equal
to:
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LMZ10503EXT
RESR is the total output capacitor ESR, L is the inductance
value of the internal power inductor, where L = 2.2 µH, and
fSW = 1 MHz. Therefore, per the design example:
A second criteria before finalizing the Cin bypass capacitor is
the RMS current capability. The necessary RMS current rating of the input capacitor to a buck regulator can be estimated
by
LMZ10503EXT
TABLE 1. Recommended Output Filter Capacitors
CO (µF)
Voltage (V), RESR (mΩ)
Make
Manufacturer
Part Number
Case Size
22
6.3, < 5
Ceramic, X5R
TDK
C3216X5R0J226M
1206
47
6.3, < 5
Ceramic, X5R
TDK
C3216X5R0J476M
1206
47
6.3, < 5
Ceramic, X5R
TDK
C3225X5R0J476M
1210
47
10.0, < 5
Ceramic, X5R
TDK
C3225X5R1A476M
1210
100
6.3, < 5
Ceramic, X5R
TDK
C3225X5R0J107M
1210
100
6.3, 50
Tantalum
AVX
TPSD157M006#0050
D, 7.5 x 4.3 x 2.9 mm
100
6.3, 25
Organic Polymer
Sanyo
6TPE100MPB2
B2, 3.5 x 2.8 x 1.9 mm
150
6.3, 18
Organic Polymer
Sanyo
6TPE150MIC2
C2, 6.0 x 3.2 x 1.8 mm
330
6.3, 18
Organic Polymer
Sanyo
6TPE330MIL
D3L, 7.3 x 4.3 x 2.8 mm
470
6.3, 23
Niobium Oxide
AVX
NOME37M006#0023
E, 7.3 x 4.3 x 4.1 mm
optimized area of operation is 30° to 60° of phase margin, with
a bandwidth of 100 kHz ±20 kHz.
Output Voltage Setting
A resistor divider network from VOUT to the FB pin determines
the desired output voltage as follows:
Rfbt is defined based on the voltage loop requirements and
Rfbb is then selected for the desired output voltage. Resistors
are normally selected as 0.5% or 1% tolerance. Higher accuracy resistors such as 0.1% are also available.
The feedback voltage (at VOUT = 2.5V) is accurate to within
-2.5% / +2.5% over temperature and over line and load regulation. Additionally, the LMZ10503EXT contains error nulling
circuitry to substantially eliminate the feedback voltage variation over temperature as well as the long term aging effects
of the internal amplifiers. In addition the zero nulling circuit
dramatically reduces the 1/f noise of the bandgap amplifier
and reference. The manifestation of this circuit action is that
the duty cycle will have two slightly different but distinct operating points, each evident every other switching cycle.
30118248
TABLE 2. LMZ10503EXT Compensation Component
Values
VIN CO (µF)
(V)
Loop Compensation
The LMZ10503EXT preserves flexibility by integrating the
control components around the internal error amplifier while
utilizing three small external compensation components from
VOUT to FB. An integrated type II (two pole, one zero) voltagemode compensation network is featured. To ensure stability,
an external resistor and small value capacitor can be added
across the upper feedback resistor as a pole-zero pair to
complete a type III (three pole, two zero) compensation network. The compensation components recommended in Table
2 provide type III compensation at an optimal control loop
performance. The typical phase margin is 45° with a bandwidth of 80 kHz. Calculated output capacitance values not
listed in Table 2 should be verified before designing into production. A detailed application note is available to provide
verification support, AN-2013. In general, calculated output
capacitance values below the suggested value will have reduced phase margin and higher control loop bandwidth. Output capacitance values above the suggested values will
experience a lower bandwidth and increased phase margin.
Higher bandwidth is associated with faster system response
to sudden changes such as load transients. Phase margin
changes the characteristics of the response. Lower phase
margin is associated with underdamped ringing and higher
phase margin is associated with overdamped response. Losing all phase margin will cause the system to be unstable; an
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5.0
3.3
ESR (mΩ)
Rfbt
Min
Max
(kΩ)
Ccomp
(pF)
Rcomp
22
2
20
47
2
20
143
39
8.06
100
100
100
1
8.25
10
71.5
180
150
4.32
1
5
56.2
270
2.1
150
10
25
59
270
10.8
150
26
50
66.5
270
23.7
220
15
30
53.6
360
14
220
31
60
59
360
30.1
22
2
20
100
56.2
5.62
47
2
20
66.5
150
5.49
100
1
10
45.3
270
2.8
150
1
5
40.2
360
1.5
150
10
25
40.2
360
7.32
150
26
50
43.2
360
15.4
220
15
30
40.2
470
10.5
220
31
60
40.2
470
20.5
(kΩ)
Note: In the special case where the output voltage is 0.8V, it is recommended to remove Rfbb and keep Rfbt, Rcomp, and Ccomp for a type III
compensation.
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LMZ10503EXT
Estimate Power Dissipation And
Board Thermal Requirements
Use the current derating curves in the typical performance
characteristics section to obtain an estimate of power loss
(PIC_LOSS). For the design case of VIN = 5V, VOUT = 2.5V,
IOUT = 3A, TA(MAX) = 85°C , and TJ(MAX) = 125°C, the device
must see a thermal resistance from case to ambient (θCA) of
less than:
301182b5
FIGURE 1. High Current Loops
1. Minimize area of switched current loops.
From an EMI reduction standpoint, it is imperative to minimize
the high di/dt current paths. The high current that does not
overlap contains high di/dt, see Figure 1. Therefore physically
place input capacitor (Cin1) as close as possible to the
LMZ10503EXT VIN pin and GND exposed pad to avoid observable high frequency noise on the output pin. This will
minimize the high di/dt area and reduce radiated EMI. Additionally, grounding for both the input and output capacitor
should consist of a localized top side plane that connects to
the GND exposed pad (EP).
2. Have a single point ground.
The ground connections for the feedback, soft-start, and enable components should be routed only to the GND pin of the
device. This prevents any switched or load currents from
flowing in the analog ground traces. If not properly placed,
poor grounding can result in degraded load regulation or erratic output voltage ripple behavior. Provide the single point
ground connection from pin 4 to EP.
3. Minimize trace length to the FB pin.
Both feedback resistors, Rfbt and Rfbb, and the compensation
components, Rcomp and Ccomp, should be located close to the
FB pin. Since the FB node is high impedance, keep the copper
area as small as possible. This is most important as relatively
high value resistors are used to set the output voltage.
4. Make input and output bus connections as wide as
possible.
This reduces any voltage drops on the input or output of the
converter and maximizes efficiency. To optimize voltage accuracy at the load, ensure that a separate feedback voltage
sense trace is made at the load. Doing so will correct for voltage drops and provide optimum output accuracy.
5. Provide adequate device heat-sinking.
Use an array of heat-sinking vias to connect the exposed pad
to the ground plane on the bottom PCB layer. If the PCB has
multiple copper layers, thermal vias can also be employed to
make connection to inner layer heat-spreading ground
planes. For best results use a 6 x 6 via array with minimum
via diameter of 10mils (254 μm) thermal vias spaced 59mils
(1.5 mm). Ensure enough copper area is used for heat-sinking
to keep the junction temperature below 125°C.
Given the typical thermal resistance from junction to case
(θJC) to be 1.9°C/W (typ.). Continuously operating at a TJ
greater than 125°C will have a shorten life span.
To reach θCA = 69.5°C/W, the PCB is required to dissipate
heat effectively. With no airflow and no external heat, a good
estimate of the required board area covered by 1oz. copper
on both the top and bottom metal layers is:
As a result, approximately 7.2 square cm of 1oz. copper on
top and bottom layers is required for the PCB design.
The PCB copper heat sink must be connected to the exposed
pad (EP). Approximately thirty six, 10mils (254 μm) thermal
vias spaced 59mils (1.5 mm) apart must connect the top copper to the bottom copper. For an extended discussion and
formulations of thermal rules of thumb, refer to AN-2020. For
an example of a high thermal performance PCB layout with
θJA of 20°C/W, refer to the evaluation board application note
AN-2074 and for results of a study of the effects of the PCB
designs, refer to AN-2026.
PC Board Layout Guidelines
PC board layout is an important part of DC-DC converter design. Poor board layout can disrupt the performance of a DCDC converter and surrounding circuitry by contributing to EMI,
ground bounce and resistive voltage drop in the traces. These
can send erroneous signals to the DC-DC converter resulting
in poor regulation or instability. Good layout can be implemented by following a few simple design rules.
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LMZ10503EXT
when sequencing the LMZ10503EXT with other power supplies.
In the event of either VIN or EN decreasing below the falling
UVLO or enable threshold respectively, the voltage on the
soft-start pin is collapsed by discharging the soft-start capacitor by a 14 µA (typ.) current sink to ground.
Additional Features
Enable
The LMZ10503EXT features an enable (EN) pin and associated comparator to allow the user to easily sequence the
LMZ10503EXT from an external voltage rail, or to manually
set the input UVLO threshold. The turn-on or rising threshold
and hysteresis for this comparator are typically 1.23V and
0.15V respectively. The precise reference for the enable comparator allows the user to guarantee that the LMZ10503EXT
will be disabled when the system demands it to be.
The EN pin should not be left floating. For always-on operation, connect EN to VIN.
Soft-Start Capacitor
Determine the soft-start capacitance with the following relationship
Enable AND UVLO
where VFB is the internal reference voltage (nominally 0.8V),
ISS is the soft-start charging current (nominally 2 µA) and
CSS is the external soft-start capacitance.
Thus, the required soft-start capacitor per unit output voltage
startup time is given by
Using a resistor divider from VIN to EN as shown in the
schematic diagram below, the input voltage at which the part
begins switching can be increased above the normal input
UVLO level according to
CSS = 2.5 nF / ms
For example, a 4 ms soft-start time will yield a 10 nF capacitance. The minimum soft-start capacitance is 680 pF.
Tracking
For example, suppose that the required input UVLO level is
3.69V. Choosing Renb = 10 kΩ, then we calculate Rent = 20
kΩ.
The LMZ10503EXT can track the output of a master power
supply during soft-start by connecting a resistor divider to the
SS pin. In this way, the output voltage slew rate of the
LMZ10503EXT will be controlled by a master supply for loads
that require precise sequencing. When the tracking function
is used, a small value soft-start capacitor should be connected to the SS pin to alleviate output voltage overshoot when
recovering from a current limit fault.
30118244
Alternatively, the EN pin can be driven from another voltage
source to cater to system sequencing requirements commonly found in FPGA and other multi-rail applications. The following schematic shows an LMZ10503EXT that is sequenced
to start based on the voltage level of a master system rail
(VOUT1).
30118257
Tracking - Equal Soft-Start Time
One way to use the tracking feature is to design the tracking
resistor divider so that the master supply output voltage,
VOUT1, and the LMZ10503EXT output voltage, VOUT2, both
rise together and reach their target values at the same time.
This is termed ratiometric startup. For this case, the equation
governing the values of tracking divider resistors Rtrkb and
Rtrkt is given by
30118245
Soft-Start
The LMZ10503EXT begins to operate when both the VIN and
EN, voltages exceed the rising UVLO and enable thresholds,
respectively. A controlled soft-start eliminates inrush currents
during startup and allows the user more control and flexibility
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The above equation includes an offset voltage, of 200 mV, to
ensure that the final value of the SS pin voltage exceeds the
reference voltage of the LMZ10503EXT. This offset will cause
the LMZ10503EXT output voltage to reach regulation slightly
12
Pre-Bias Startup Capability
At startup, the LMZ10503EXT is in a pre-biased state when
the output voltage is greater than zero. This often occurs in
many multi-rail applications such as when powering an ASIC,
FPGA, or DSP. The output can be pre-biased in these applications through parasitic conduction paths from one supply
rail to another. Even though the LMZ10503EXT is a synchronous converter, it will not pull the output low when a prebias condition exists. The LMZ10503EXT will not sink current
during startup until the soft-start voltage exceeds the voltage
on the FB pin. Since the device does not sink current it protects the load from damage that might otherwise occur if
current is conducted through the parasitic paths of the load.
Current Limit
When a current greater than the output current limit (IOCL) is
sensed, the on-time is immediately terminated and the low
side MOSFET is activated. The low side MOSFET stays on
for the entire next four switching cycles. During these skipped
pulses, the voltage on the soft-start pin is reduced by discharging the soft-start capacitor by a current sink on the softstart pin of nominally 14 µA. Subsequent over-current events
will drain more and more charge from the soft-start capacitor,
effectively decreasing the reference voltage as the output
droops due to the pulse skipping. Reactivation of the soft-start
circuitry ensures that when the over-current situation is removed, the part will resume normal operation smoothly.
30118259
Tracking - Equal Slew Rates
Alternatively, the tracking feature can be used to have similar
output voltage ramp rates. This is referred to as simultaneous
startup. In this case, the tracking resistors can be determined
based on the following equation
Over-Temperature Protection
When the LMZ10503EXT senses a junction temperature
greater than 145°C (typ.), both switching MOSFETs are
turned off and the part enters a standby state. Upon sensing
a junction temperature below 135°C (typ.), the part will reinitiate the soft-start sequence and begin switching once
again.
and to ensure proper overdrive of the SS pin
VOUT2 < 0.8 x V OUT1
For the example case of VOUT1 = 5V and VOUT2 = 2.5V, with
Rtrkt set to 33 kΩ as before, Rtrkb is calculated from the above
equation to be 15.5 kΩ. A timing diagram for the case of equal
slew rates is shown below.
30118261
13
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LMZ10503EXT
before the master supply. A value of 33 kΩ 1% is recommended for Rtrkt as a compromise between high precision and
low quiescent current through the divider while minimizing the
effect of the 2 µA soft-start current source.
For example, if the master supply voltage VOUT1 is 3.3V and
the LMZ10503EXT output voltage was 1.8V, then the value
of Rtrkb needed to give the two supplies identical soft-start
times would be 14.3 kΩ. A timing diagram for this example,
the equal soft-start time case, is shown below.
LMZ10503EXT
LMZ10503EXT Application Circuit Schematic and BOMs
This section provides several application solutions with an
associated bill of materials. The compensation for each solution was optimized to work over the full input range. Many
applications have a fixed input voltage rail. It is possible to
modify the compensation to obtain a faster transient response
for a given input voltage operating point.
30118254
FIGURE 2.
TABLE 3. Bill of Materials, VIN = 3.3V to 5V, VOUT = 2.5V, IOUT (MAX) = 3A, Optimized for Electrolytic Input and Output
Capacitance
Designator
Description
Case Size
Manufacturer
Manufacturer P/N
Quantity
U1
SIMPLE SWITCHER ®
TO-PMOD-7
National
Semiconductor
LMZ10503EXTTZ
1
Cin1
150 µF, 6.3V, 18 mΩ
C2, 6.0 x 3.2 x 1.8 mm
Sanyo
6TPE150MIC2
1
CO1
330 µF, 6.3V, 18 mΩ
D3L, 7.3 x 4.3 x 2.8 mm
Sanyo
6TPE330MIL
1
Rfbt
100 kΩ
0603
Vishay Dale
CRCW0603100KFKEA
1
Rfbb
47.5 kΩ
0603
Vishay Dale
CRCW060347K5FKEA
1
Rcomp
15 kΩ
0603
Vishay Dale
CRCW060315K0FKEA
1
Ccomp
330 pF, ±5%, C0G, 50V
0603
TDK
C1608C0G1H331J
1
CSS
10 nF, ±10%, X7R, 16V
0603
Murata
GRM188R71C103KA01
1
TABLE 4. Bill of Materials, VIN = 3.3V, VOUT = 0.8V, IOUT (MAX) = 3A, Optimized for Solution Size and Transient Response
Designator
Description
Case Size
Manufacturer
Manufacturer P/N
Quantity
U1
SIMPLE SWITCHER ®
TO-PMOD-7
National
Semiconductor
LMZ10503EXTTZ
1
Cin1, CO1
47 µF, X5R, 6.3V
1206
TDK
C3216X5R0J476M
2
Rfbt
110 kΩ
0402
Vishay Dale
CRCW0402100KFKED
1
Rcomp
1.0 kΩ
0402
Vishay Dale
CRCW04021K00FKED
1
Ccomp
27 pF, ±5%, C0G, 50V
0402
Murata
GRM1555C1H270JZ01
1
CSS
10 nF, ±10%, X7R, 16V
0402
Murata
GRM155R71C103KA01
1
In the case where the output voltage is 0.8V, it is recommended to remove Rfbb and keep Rfbt, Rcomp, and Ccomp for a type III compensation.
www.national.com
14
LMZ10503EXT
30118281
FIGURE 3.
TABLE 5. Bill of Materials, VIN = 3.3V to 5V, VOUT = 2.5V, IOUT (MAX) = 3A, Optimized for Low Input and Output Ripple Voltage
and Fast Transient Response
Designator
Description
Case Size
Manufacturer
Manufacturer P/N
Quantity
U1
SIMPLE SWITCHER®
TO-PMOD-7
National
Semiconductor
LMZ10503EXTTZ-ADJ
1
Cin1
22 µF, X5R, 10V
1210
AVX
1210ZD226MAT
2
Cin2
220 µF, 10V, AL-Elec
E
Panasonic
EEE1AA221AP
1*
CO1
4.7 µF, X5R, 10V
0805
AVX
0805ZD475MAT
1*
CO2
22 µF, X5R, 6.3V
1206
AVX
12066D226MAT
1*
CO3
100 µF, X5R, 6.3V
1812
AVX
18126D107MAT
1
Rfbt
75 kΩ
0402
Vishay Dale
CRCW040275K0FKED
1
34.8 kΩ
0402
Vishay Dale
CRCW040234K8FKED
1
Rcomp
1.0 kΩ
0402
Vishay Dale
CRCW04021K00FKED
1
Ccomp
220 pF, ±5%, C0G, 50V
0402
Murata
GRM1555C1H221JA01D
1
CSS
10 nF, ±10%, X7R, 16V
0402
Murata
GRM155R71C103KA01
1
Rfbb
* Optional components, include for low input and output voltage ripple.
TABLE 6. Output Voltage Setting (Rfbt = 75 kΩ)
VOUT
Rfbb
3.3V
23.7 kΩ
2.5 V
34.8 kΩ
1.8 V
59 kΩ
1.5 V
84.5 kΩ
1.2 V
150 kΩ
0.9 V
590 kΩ
15
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LMZ10503EXT
30118280
FIGURE 4.
TABLE 7. Bill of Materials for Evaluation Board, VIN = 3.3V to 5V, VOUT = 2.5V, IOUT (MAX) = 3A
Designator
Description
Case Size
Manufacturer
Manufacturer P/N
Quantity
U1
SIMPLE SWITCHER®
TO-PMOD-7
National
Semiconductor
LMZ10503EXTTZ
1
Cin1
1 µF, X7R, 16V
0805
TDK
C2012X7R1C105K
1
Cin2, CO1
4.7 µF, X5R, 6.3V
0805
TDK
C2012X5R0J475K
2
Cin3, CO2
22 µF, X5R, 16V
1210
TDK
C3225X5R1C226M
2
Cin4
47 µF, X5R, 6.3V
1210
TDK
C3225X5R0J476M
1
Cin5
220 µF, 10V, AL-Elec
E
Panasonic
EEE1AA221AP
1
CO3
100 µF, X5R, 6.3V
1812
TDK
C4532X5R0J107M
1
Rfbt
75 kΩ
0805
Vishay Dale
CRCW080575K0FKEA
1
Rfbb
34.8 kΩ
0805
Vishay Dale
CRCW080534K8FKEA
1
Rcomp
1.1 kΩ
0805
Vishay Dale
CRCW08051K10FKEA
1
Ccomp
180 pF, ±5%, C0G, 50V
0603
TDK
C1608C0G1H181J
1
Ren1
100 kΩ
0805
Vishay Dale
CRCW0805100KFKEA
1
CSS
10 nF, ±5%, C0G, 50V
0805
TDK
C2012C0G1H103J
1
TABLE 8. Output Voltage Setting (Rfbt = 75 kΩ)
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VOUT
Rfbb
3.3V
23.7 kΩ
2.5 V
34.8 kΩ
1.8 V
59 kΩ
1.5 V
84.5 kΩ
1.2 V
150 kΩ
0.9 V
590 kΩ
16
LMZ10503EXT
301182b1
FIGURE 5.
TABLE 9. Bill of Materials, VIN = 5V, VOUT = 2.5V, IOUT (MAX) = 3A, Complies with EN55022 Class B Radiated Emissions
Designator
Description
Case Size
Manufacturer
Manufacturer P/N
Quantity
U1
SIMPLE SWITCHER®
TO-PMOD-7
National
Semiconductor
LMZ10503EXTTZ
1
Cin1
1 µF, X7R, 16V
0805
TDK
C2012X7R1C105K
1
Cin2
4.7 µF, X5R, 6.3V
0805
TDK
C2012X5R0J475K
1
Cin3
47 µF, X5R, 6.3V
1210
TDK
C3225X5R0J476M
1
CO1
100 µF, X5R, 6.3V
1812
TDK
C4532X5R0J107M
1
Rfbt
75 kΩ
0805
Vishay Dale
CRCW080575K0FKEA
1
Rfbb
34.8 kΩ
0805
Vishay Dale
CRCW080534K8FKEA
1
Rcomp
1.1 kΩ
0805
Vishay Dale
CRCW08051K10FKEA
1
Ccomp
180 pF, ±5%, C0G, 50V
0603
TDK
C1608C0G1H181J
1
CSS
10 nF, ±5%, C0G, 50V
0805
TDK
C2012C0G1H103J
1
TABLE 10. Output Voltage Setting (Rfbt = 75 kΩ)
VOUT
Rfbb
3.3 V
23.7 kΩ
2.5 V
34.8 kΩ
1.8 V
59 kΩ
1.5 V
84.5 kΩ
1.2 V
150 kΩ
0.9 V
590 kΩ
17
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LMZ10503EXT
PCB Layout Diagrams
The PCB design is available in the LMZ10503EXT product
folder at www.national.com.
30118276
FIGURE 6. Top Copper
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18
LMZ10503EXT
30118277
FIGURE 7. Internal Layer 1 (Ground)
30118278
FIGURE 8. Internal Layer 2 (Ground and Signal Traces)
19
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LMZ10503EXT
30118279
FIGURE 9. Bottom Copper
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20
LMZ10503EXT
Physical Dimensions inches (millimeters) unless otherwise noted
TO-PMOD-7 Pin Package
NS Package Number TZA07A
21
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LMZ10503EXT 3A SIMPLE SWITCHER® Power Module with 5.5V Maximum Input Voltage for
Military and Rugged Applications
Notes
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