NSC LM27A

LM27A
±3°C Accurate, 120°C-150°C Factory Preset Thermostat
(LM27 in Die Form)
General Description
This datasheet applies to the LM27A, which is the die form of
the LM27. The LM27 is available in the SOT23-5 package.
Please refer to the LM27 datasheet for detailed specifications
pertaining to the packaged part.
The LM27A is a precision, single digital-output, low-power
thermostat comprised of an internal reference, DAC, temperature sensor and comparator. Utilizing factory programming,
it can be manufactured with different trip points as well as
different digital output functionality. The trip point (TOS) can
be preset at the factory to any temperature in the range of
+120°C to +150°C in 1°C increments. The LM27A has two
digital output pads, one digital input (HYST) and one analog
output (VTEMP). One digitial output is an active-high, push-pull
output and the other is an active-low, open-drain output. Either of the outputs (but not both) are available.
The LM27A is available in either an overtemperature shutdown or an undertemperature shutdown option. An LM27A
with overtemperature shutdown is configured so that its thermostat outputs (OS and OS) will go active when a rising
temperature crosses the trip point and the hysteresis will apply to a falling temperature. The thermostat outputs of an
LM27A with an undertemperature shutdown (US and US) will
trip on a falling temperature and hysteresis will apply on a
rising temperature. For example, when the LM27A is preset
as an overtemperature shutdown, the active-high output (OS)
will go HIGH and the active-low output (OS) will go LOW to
indicate that the die temperature is over the internally preset
TOS . The outputs will reset to their normal states when the
temperature goes below (TOS–THYST). Similarly, when preprogrammed as an undertemperature shutdown the activehigh output (US) will go HIGH and the active-low output
(US) will go LOW to indicate that the temperature is below
TUS . The outputs will reset when the temperature is above
(TUS+THYST). The typical hysteresis, THYST, can be set to 2°C
or 10°C and is controlled by the state of the HYST pin. The
VTEMP analog output provides a voltage that is proportional to
temperature and has a −10.7mV/°C output slope.
© 2007 National Semiconductor Corporation
201530
Standard parts are available, see ordering information for details. For other part options, contact a National Semiconductor
Distributor or Sales Representative for information on minimum-order qualification.
Applications
■
■
■
■
■
■
■
Microprocessor Thermal Management
Appliances
Portable Battery Powered Systems
Fan Control
Industrial Process Control
HVAC Systems
Electronic System Protection
Features
■ Internal comparator with pin selectable 2°C or 10°C
hysteresis
■ No external components required
■ Open-drain or push-pull digital output; supports CMOS
■
■
■
■
■
logic levels
Internal temperature sensor with VTEMP output pin
VTEMP output allows after-assembly system testing
Internal voltage reference and DAC for trip-point setting
Excellent power supply noise rejection
AEC-Q100 Qualified
Key Specifications
■ Power Supply Voltage
2.7V to 5.5V
■ Power Supply Current
40µA(max)
15µA(typ)
■ Hysteresis Temperature
■ Temperature Trip Point Accuracy
2°C or 10°C(typ)
±3°C (max)
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LM27A SOT-23, ±3°C Accurate, 120°C-150°C Factory Preset Thermostat (LM27 in Die Form)
July 2007
LM27A
Ordering Information
For more detailed information on the suffix meaning see the part number template at the end of the Electrical Characteristics
Section. Contact National Semiconductor for other set points and output options.
Order Number
LM27-2PL MDA
NS Package Number
Trip Point Setting
Output Function
Transport Media
Die form, no package
145°C
Push-Pull (OS)
Open-Drain (OS)
400 units in waffle
trays
Connection Diagram
LM27A
Bond Pad Layout
20153002
TOP VIEW
1130µm x 902µm
Bond Pad Mechanical Dimensions
Dimensions of bond pad coordinates are in micrometers.
Origin of coordinates: center of die.
X-Direction is in the longitudinal axis of the die.
Coordinates refer to center of Bond Pad.
Opening sizes for bond pads 1 through 6 are 85 µm × 85 µm.
Pin#
X
Y
1
–437 µm
+225 µm
2
–437 µm
0
3
–437 µm
–220 µm
4
+437 µm
–220 µm
5
+437 µm
+5 µm
6
+437 µm
+225 µm
BACK
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2
LM27A
Pin Descriptions
Pin Number
Pin Name
1
HYST
2
(Note 8)
3
(Note 8)
4
Function
Connection
Hysteresis control, digital input
GND for 10°C or V+ for 2°C
OS
Overtemperature Shutdown pushpull active-high thermostat digital
output
Controller interrupt, system or power supply shutdown
US
Undertemperature Shutdown pushpull active-high thermostat digital
output
System or power supply shutdown
OS
Overtemperature Shutdown opendrain active-low thermostat digital
output
Controller interrupt, system or power supply shutdown;
US
Undertemperature Shutdown opendrain active low thermostat digital
output
System or power supply shutdown; pull-up resistor ≥
10kΩ
V+
Supply input
2.7V to 5.5V with a 0.1µF bypass capacitor. For PSRR
information see Section Titled NOISE
CONSIDERATIONS.
System ground
pull-up resistor ≥ 10kΩ
5
GND
Power supply ground
6
VTEMP
Analog output voltage proportional to Leave floating or connect to a high impedance node.
temperature
7 - 14
NC
Do not connect
BACK
Backside
Can go to GND connection (Note: GND must be
connected. The back is not a system ground connection).
Note: Only connect to one of the output pads, Pad 2 or Pad 3, not both. Either push-pull (Pad 2) or open-drain (Pad 3) can be used
but they can not both be used on the same die.
3
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LM27A
Absolute Maximum Ratings (Note 1)
Input Voltage
Input Current at any pin (Note 2)
Package Input Current(Note 2)
Storage Temperature
ESD Susceptibility (Note 3)
Human Body Model
Machine Model
Operating Ratings
6.0V
5mA
20mA
−65°C to + 175°C
(Note 1)
TMIN ≤ TA ≤ TMAX
Specified Temperature Range
−40°C ≤ TA ≤ +150°C
LM27A
Positive Supply Voltage (V+)
Maximum VOUT
+2.7V to +5.5V
+5.5V
2500V
250V
LM27A Electrical Characteristics
The following specifications apply for V+ = 2.7VDC to 5.5VDC, and VTEMP load current = 0µA unless otherwise specified. Boldface
limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C unless otherwise specified.
Symbol
Parameter
Conditions
Typical
(Note 4)
LM27A
Limits
Units
(Limits)
(Note 5)
Temperature Sensor
Trip Point Accuracy (Includes VREF, DAC, +120°C<TA<+150°C
Comparator Offset, and Temperature
Sensitivity errors)
Trip Point Hysteresis
HYST = GND
HYST =
V+
VTEMP Output Temperature Sensitivity
VTEMP Temperature Sensitivity Error to
Equation:
VO = (−3.552×10−6×(T−30)2+
(−10.695×10−3×(T−30))+
1.8386V
VTEMP Load Regulation
±3
10
2.7V ≤
2
°C
mV/°C
4.5V ≤
Source ≤ 1 μA
IS
+2.7V ≤
°C (max)
±3
°C (max)
±2.5
°C (max)
≤ 5.5V
TA = 25°C
0.070
Sink ≤ 40 μA
VTEMP Line Regulation
±3
≤ 5.5V
−55°C ≤ TA ≤ 150°C,
V+
°C
−10.82
−30°C ≤ TA ≤ 150°C,
V+
°C (max)
≤ +5.5V,
−30°C ≤ TA ≤ +120°C
V+
Supply Current
mV
mV (max)
0.7
−0.2
mV/V
15
22
40
µA (max)
µA (max)
0.001
1
µA (max)
0.4
V (max)
ISOURCE = 500µA, V+ ≥ 2.7V
0.8 × V+
V (min)
ISOURCE = 800µA, V+≥4.5V
V+ −
1.5
V (min)
V+
V (min)
Digital Output and Input
IOUT(“1”)
Logical “1” Output Leakage Current (Note V+ = +5.0V
7)
VOUT(“0”)
Logical “0” Output Voltage
IOUT = +1.2mA and
≥2.7V; IOUT = +3.2mA
V+
and V+≥4.5V; (Note 6)
VOUT(“1”)
Logical “1” Push-Pull Output Voltage
VIH
HYST Input Logical ”1“ Threshold
Voltage
0.8 ×
VIL
HYST Input Logical ”0“ Threshold
Voltage
0.2 × V+
V (max)
tEN
tENABLE: Time from Power-On to Digital
Output (OS or OS) Enabled
350
µs (min)
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VDD = 3.3V ±5%
4
LM27A
Definition of tENABLE
20153024
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V+), the current at that pin should be limited to 5mA. The 20mA
maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5mA to four. Under normal
operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5mA each.
Note 3: The human body model is a 100pF capacitor discharge through a 1.5kΩ resistor into each pin. The machine model is a 200pF capacitor discharged
directly into each pin.
Note 4: Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
Note 5: Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
Note 6: Care should be taken to include the effects of self heating when setting the maximum output load current. Self heating is not included in the trip point
accuracy specification.
Note 7: The 1µA limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the current for every
15°C increase in temperature. For example, the 1nA typical current at 25°C would increase to 16nA at 85°C.
Note 8: Only connect to one of the output pads, number 2 or number 3, not both. Either push-pull (Pad 2) or open-drain (Pad 3) can be used but they can not
both be used on the same die.
Part Number Template
The series of digits labeled xyz in the part number LM27-xyz MDA, describe the set point value and the function of the output as
follows:
The place holders xy describe the set point temperature as shown in the following table.
x (10x)
x (10x)
y (1x)
Temperature (°C)
y (1x)
Temperature (°C)
-
H
0
-
S
7
-
J
1
-
T
8
-
K
2
-
V
9
-
L
3
Z
-
12
-
N
4
1
-
13
-
P
5
2
-
14
-
R
6
3
-
15
The value of z describes the assignment/function of the output as shown in the following table:
Value of z
Digital Output Function
L
Overtemperature shutdown: active-high OS output or active-low OS output
N
Undertemperature shutdown: active-high US or active-low US output.
For example:
•
•
The part number LM27-2SL MDA would have TOS = 147°C, and is programmed as an overtemperature shutdown output.
The part number LM27-ZLN MDA would have TUS = 123°C, and is programmed as an undertemperature shutdown output.
Active-high open-drain and active-low push-pull options are available, please contact National Semiconductor for more information.
5
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LM27A
same value resistor will work for either placement of the resistor. If an additional capacitive load is placed directly on the
LM27A output, rather than across CLOAD, it should be at least
a factor of 10 smaller than CLOAD.
Applications Hints
AFTER-ASSEMBLY PCB TESTING
The LM27A's VTEMP output allows after-assembly PCB testing
by following a simple test procedure. Simply measuring the
VTEMP output voltage will verify that the LM27A has been assembled properly and that its temperature sensing circuitry is
functional. The VTEMP output has very weak drive capability
that can be overdriven by 1.5mA. Therefore, one can simply
force the VTEMP voltage to cause the digital output to change
state, thereby verifying that the comparator and output circuitry function after assembly. Here is a sample test procedure that can be used to test a part that would have the part
number LM27-2HJ MDA, which would have a 140°C trip point.
1. Turn on V+ and measure VTEMP. Then calculate the
temperature reading of the LM27A using the equation:
VO = (−3.552×10−6×(T−30)2) +
(−10.69576×10−3×(T−30)) + 1.8386V
TABLE 1. Resistive compensation for capacitive loading
of VTEMP
CLOAD
R (Ω)
≤100pF
0
1nF
8200
10nF
3000
100nF
1000
≥1µF
430
(1)
or
2.
(2)
Verify that the temperature measured in step one is
within (±3°C + error of reference temperature sensor) of
the ambient/board temperature. The ambient/board
temperature (reference temperature) should be
measured using an extremely accurate calibrated
temperature sensor, which is in close proximity to and
mounted on the same PCB as the LM27A perhaps even
touching the GND lead of the LM27A if possible. The
LM27A will sence the board temperature not the ambient
temperature.
20153017
a) R in series with capacitor
3.
A. Observe that OS is high.
B. Drive VTEMP to ground.
C. Observe that OS is now low.
D. Release the VTEMP pin.
E. Observe that OS is now high.
4.
20153018
A.
B.
C.
D.
E.
Observe that OS is high.
Drive VTEMP voltage down gradually.
When OS goes low, note the VTEMP voltage.
VTEMPTrig = VTEMP at OS trigger (HIGH->LOW)
Calculate Ttrig using Equation 2.
A.
Gradually raise VTEMP until OS goes HIGH. Note
VTEMP.
Calculate THYST using Equation 2.
b) R in series with signal path
FIGURE 1. Resistor placement for capacitive loading
compensation of VTEMP
NOISE CONSIDERATIONS
The LM27A has excellent power supply noise rejection. Listed
below is a variety of signals used to test the LM27A power
supply rejection. False triggering of the output was not observed when these signals where coupled into the V+ pin of
the LM27A.
• square wave 400kHz, 1Vp-p
• square wave 2kHz, 200mVp-p
• sine wave 100Hz to 1MHz, 200mVp-p
Testing was done while maintaining the temperature of the
LM27A one degree centigrade way from the trip point with the
output not activated.
5.
B.
VTEMP LOADING
The VTEMP output has very weak drive capability (1 µA source,
40 µA sink). So care should be taken when attaching circuitry
to this pin. Capacitive loading may cause the VTEMP output to
oscillate. Simply adding a resistor in series as shown in Figure
1 will prevent oscillations from occurring. To determine the
value of the resistor follow the guidelines given in Table 1. The
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6
LM27A
Typical Applications
20153003
Note: The fan's control pin has internal pull-up. The 10k pull-down sets a slow fan speed. When the output of the LM27A goes low, the fan will speed up.
FIGURE 2. Two Speed Fan Speed Control
20153020
FIGURE 3. Fan High Side Drive
20153021
FIGURE 4. Fan Low Side Drive
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LM27A
20153022
FIGURE 5. Audio Power Amplifier Thermal Protection
20153023
FIGURE 6. Simple Thermostat
Physical Dimensions for Die Product
20153002
Order Number LM27-2PL MDA
Bare Die
TOP VIEW
1130µm × 902µm
For Bond Pad Mechanical Dimensions, see Connection Diagram Section
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8
LM27A
9
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LM27A SOT-23, ±3°C Accurate, 120°C-150°C Factory Preset Thermostat (LM27 in Die Form)
Notes
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Copyright© 2007 National Semiconductor Corporation
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