CYPRESS CY62147DV30LL

CY62147DV30
4-Mbit (256K x 16) Static RAM
Features
vanced circuit design to provide ultra-low active current. This
is ideal for providing More Battery Life™ (MoBL®) in portable
applications such as cellular telephones. The device also has
an automatic power-down feature that significantly reduces
power consumption. The device can also be put into standby
mode reducing power consumption by more than 99% when
deselected (CE HIGH or both BLE and BHE are HIGH). The
input/output pins (I/O0 through I/O15) are placed in a high-impedance state when: deselected (CE HIGH), outputs are disabled (OE HIGH), both Byte High Enable and Byte Low Enable
are disabled (BHE, BLE HIGH), or during a write operation (CE
LOW and WE LOW).
• Temperature Ranges
— Industrial: –40°C to +85°C
— Automotive-A: –40°C to +85°C
— Automotive-E: –40°C to +125°C
• Very high speed: 45 ns
• Wide voltage range: 2.20V–3.60V
• Pin-compatible with CY62147CV25, CY62147CV30, and
CY62147CV33
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is
written into the location specified on the address pins (A0
through A17). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O8 through I/O15) is written into the location
specified on the address pins (A0 through A17).
• Ultra-low active power
— Typical active current: 1.5 mA @ f = 1 MHz
— Typical active current: 8 mA @ f = fmax
• Ultra low standby power
• Easy memory expansion with CE, and OE features
• Automatic power-down when deselected
Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is
LOW, then data from memory will appear on I/O8 to I/O15. See
the truth table at the back of this data sheet for a complete
description of read and write modes.
• CMOS for optimum speed/power
• Available in Pb-free and non Pb-free 48-ball VFBGA and
non Pb-free 44-pin TSOPII
• Byte power-down feature
Functional Description[1]
The CY62147DV30 is available in a 48-ball VFBGA, 44 Pin
TSOPII packages.
The CY62147DV30 is a high-performance CMOS static RAM
organized as 256K words by 16 bits. This device features ad-
Logic Block Diagram
SENSE AMPS
DATA IN DRIVERS
ROW DECODER
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
256K x 16
RAM Array
I/O0–I/O7
I/O8–I/O15
BHE
WE
CE
OE
BLE
A17
A13
A14
A15
A16
A11
A12
COLUMN DECODER
CE
Power -Down
Circuit
BHE
BLE
Note:
1. For best practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05340 Rev. *F
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised August 31, 2006
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CY62147DV30
Pin Configuration[2, 3, 4]
VFBGA (Top View)
44 TSOP II (Top View)
1
2
3
4
5
6
BLE
OE
A0
A1
A2
NC
A
I/O8
BHE
A3
A4
CE
I/O0
B
I/O9
I/O10
A5
A6
I/O1
I/O2
C
VSS
I/O11
A17
A7
I/O3
Vcc
D
VCC
I/O12 DNU
A16
I/O4
Vss
E
I/O14
I/O13
A14
A15
I/O5
I/O6
F
I/O15
NC
A12
A13
WE
I/O7
G
NC
A8
A9
A10
A11
NC
A4
A3
A2
A1
A0
CE
I/O0
I/O1
I/O2
I/O3
VCC
VSS
I/O4
I/O5
I/O6
I/O7
WE
A17
A16
A15
A14
A13
H
1
44
2
3
43
42
4
41
40
39
38
5
6
7
8
9
10
11
12
37
36
35
34
33
32
31
30
29
28
27
13
14
15
16
17
18
19
20
21
22
26
25
24
23
A5
A6
A7
OE
BHE
BLE
I/O15
I/O14
I/O13
I/O12
VSS
VCC
I/O11
I/O10
I/O9
I/O8
NC
A8
A9
A10
A11
A12
Product Portfolio
Power Dissipation
Product
Range
VCC Range (V)
Min.
Typ.[5]
Max.
Speed
(ns)
Operating ICC (mA)
f = 1MHz
f = fmax
Standby ISB2
(µA)
Typ.[5]
Max.
Typ.[5]
Max.
Typ.[5]
Max.
CY62147DV30LL
Industrial
2.2V
3.0
3.6
45
1.5
3
10
20
2
8
CY62147DV30LL
Industrial
2.2V
3.0
3.6
55
1.5
3
8
15
2
8
2.2V
3.0
3.6
70
1.5
3
8
15
2
CY62147DV30L
Auto-E
CY62147DV30LL
Industrial
CY62147DV30LL
Auto-A
25
8
8
Notes:
2. NC pins are not internally connected on the die.
3. DNU pins have to be left floating or tied to VSS to ensure proper application.
4. Pins H1, G2, and H6 in the VFBGA package are address expansion pins for 8 Mb, 16 Mb, and 32 Mb, respectively.
5. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ.), TA = 25°C.
Document #: 38-05340 Rev. *F
Page 2 of 12
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CY62147DV30
Maximum Ratings
Output Current into Outputs (LOW)............................. 20 mA
Static Discharge Voltage........................................... >2001V
(per MIL-STD-883, Method 3015)
(Above which the useful life may be impaired. For user guidelines, not tested.)
Latch-up Current...................................................... >200 mA
Storage Temperature ................................. –65°C to +150°C
Operating Range
Ambient Temperature with
Power Applied............................................. –55°C to +125°C
Supply Voltage to Ground
Potential ......................................–0.3V to + VCC(MAX) + 0.3V
Device
Range
CY62147DV30L
DC Voltage Applied to Outputs
in High-Z State[6,7] ..........................–0.3V to VCC(MAX) + 0.3V
Ambient
Temperature
[TA][9]
CY62147DV30LL
DC Input Voltage[6,7] ..................... –0.3V to VCC(MAX) + 0.3V
Automotive-E –40°C to +125°C
Industrial
–40°C to +85°C
Automotive-A –40°C to +85°C
VCC
2.20V
to
3.60V
Electrical Characteristics (Over the Operating Range)
–45
Parameter Description
VOH
VOL
VIH
VIL
IIX
IOZ
Test Conditions
Min.
Typ.[5]
–55/–70
Max.
ISB1
ISB2
Max.
Unit
Output HIGH IOH = –0.1 mA
Voltage
IOH = –1.0 mA
VCC = 2.20V
2.0
2.0
V
VCC = 2.70V
2.4
2.4
V
Output LOW
Voltage
IOL = 0.1 mA
VCC = 2.20V
0.4
0.4
V
IOL = 2.1 mA
VCC = 2.70V
0.4
0.4
V
Input HIGH
Voltage
VCC = 2.2V to 2.7V
1.8
VCC + 0.3V
1.8
VCC + 0.3V
V
VCC= 2.7V to 3.6V
2.2
VCC + 0.3V
2.2
VCC + 0.3V
V
Input LOW
Voltage
VCC = 2.2V to 2.7V
–0.3
0.6
–0.3
0.6
V
VCC= 2.7V to 3.6V
–0.3
0.8
–0.3
0.8
V
–1
+1
Input Leakage GND < VI < VCC
Current
Output
Leakage
Current
GND < VO < VCC,
Output Disabled
–1
+1
µA
Auto-A[9]
–1
+1
µA
Auto-E[9]
–4
+4
µA
Ind’l
–1
+1
µA
[9]
–1
+1
µA
[9]
–4
+4
µA
–1
Ind’l
+1
Auto-A
Auto-E
ICC
Min. Typ.[5]
VCC Operating f = fMAX = 1/tRC
Supply
f = 1 MHz
Current
VCC = VCCmax
IOUT = 0 mA
CMOS levels
10
20
8
15
mA
1.5
3
1.5
3
mA
8
µA
Automatic CE
Power-Down
Current —
CMOS Inputs
Ind’l
LL
CE > VCC−0.2V,
VIN>VCC–0.2V, VIN<0.2V)
[9] LL
Auto-A
f = fMAX (Address and
Data Only),
Auto-E[9] L
f = 0 (OE, WE, BHE and
BLE), VCC = 3.60V
8
Automatic CE
Power-Down
Current —
CMOS Inputs
CE > VCC – 0.2V,
VIN > VCC – 0.2V or
VIN < 0.2V,
f = 0, VCC = 3.60V
8
Ind’l
LL
8
25
8
Auto-A[9] LL
8
Auto-E[9] L
25
µA
Notes:
6. VIL(min.) = –2.0V for pulse durations less than 20 ns.
7. VIH(max.) = VCC + 0.75V for pulse durations less than 20 ns.
8. Full device AC operation assumes a 100-µs ramp time from 0 to VCC(min) and 200-µs wait time after VCC stabilization.
9. Auto-A is available in –70 and Auto-E is available in –55.
Document #: 38-05340 Rev. *F
Page 3 of 12
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CY62147DV30
Capacitance (for all packages)[10]
Parameter
Description
CIN
Input Capacitance
COUT
Output Capacitance
Test Conditions
Max.
Unit
10
pF
10
pF
TA = 25°C, f = 1 MHz,
VCC = VCC(typ)
Thermal Resistance[10]
Parameter
Description
ΘJA
Thermal Resistance
(Junction to Ambient)
ΘJC
Thermal Resistance
(Junction to Case)
Test Conditions
VFBGA
TSOP II
Unit
Still Air, soldered on a 3 × 4.5 inch, four-layer
printed circuit board
72
75.13
°C/W
8.86
8.95
°C/W
AC Test Loads and Waveforms[10]
R1
VCC
OUTPUT
VCC
50 pF
R2
10%
GND
Rise Time = 1 V/ns
INCLUDING
JIG AND
SCOPE
ALL INPUT PULSES
90%
90%
10%
Fall Time = 1 V/ns
Equivalent to:
THÉVENIN EQUIVALENT
RTH
OUTPUT
V
Parameters
2.50V
3.0V
Unit
R1
16667
1103
Ω
R2
15385
1554
Ω
RTH
8000
645
Ω
VTH
1.20
1.75
V
Data Retention Characteristics (Over the Operating Range)
Parameter
Description
VDR
VCC for Data Retention
ICCDR
Data Retention Current
Conditions
Min.
Typ.[5]
Max.
1.5
VCC= 1.5V
CE > VCC – 0.2V,
VIN > VCC – 0.2V or
VIN < 0.2V
tCDR[10]
Chip Deselect to Data Retention
Time
tR[12]
Operation Recovery Time
Unit
V
L (Auto-E)
15
LL (Ind’l/Auto-A)
6
µA
0
ns
tRC
ns
Data Retention Waveform[13]
DATA RETENTION MODE
VCC
VCC(min)
tCDR
VDR > 1.5 V
VCC(min)
tR
CE or
BHE.BLE
Notes:
10. Tested initially and after any design or process changes that may affect these parameters.
11. Test condition for the 45-ns part is a load capacitance of 30 pF.
12. Full device operation requires linear VCC ramp from VDR to VCC(min.) > 100 µs or stable at VCC(min.) > 100 µs.
13. BHE.BLE is the AND of both BHE and BLE. Chip can be deselected by either disabling the chip enable signals or by disabling both BHE and BLE.
Document #: 38-05340 Rev. *F
Page 4 of 12
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CY62147DV30
Switching Characteristics Over the Operating Range[14]
45 ns[11]
Parameter
Description
Min.
Max.
55 ns
Min.
70 ns
Max.
Min.
Max.
Unit
Read Cycle
tRC
Read Cycle Time
45
tAA
Address to Data Valid
tOHA
Data Hold from Address Change
tACE
CE LOW to Data Valid
45
55
70
ns
tDOE
OE LOW to Data Valid
25
25
35
ns
45
[15]
tLZOE
OE LOW to LOW Z
tHZOE
OE HIGH to High Z[15, 16]
tLZCE
CE LOW to Low
55
10
55
10
5
Z[15]
10
70
10
ns
25
10
ns
ns
tHZCE
CE HIGH to High
tPU
CE LOW to Power-Up
tPD
CE HIGH to Power-Down
45
55
70
ns
tDBE
BLE/BHE LOW to Data Valid
45
55
70
ns
tLZBE
tHZBE
BLE/BHE LOW to Low
0
Z[15]
BLE/BHE HIGH to HIGH
0
10
Z[15, 16]
20
ns
ns
5
20
20
ns
10
5
15
Z[15, 16]
70
0
10
15
25
ns
10
20
ns
ns
25
ns
Write Cycle[17]
tWC
Write Cycle Time
45
55
70
ns
tSCE
CE LOW to Write End
40
40
60
ns
tAW
Address Set-up to Write End
40
40
60
ns
tHA
Address Hold from Write End
0
0
0
ns
tSA
Address Set-up to Write Start
0
0
0
ns
tPWE
WE Pulse Width
35
40
45
ns
tBW
BLE/BHE LOW to Write End
40
40
60
ns
tSD
Data Set-up to Write End
25
25
30
ns
tHD
Data Hold from Write End
0
0
0
ns
tHZWE
tLZWE
WE LOW to
High-Z[15, 16]
WE HIGH to
Low-Z[15]
15
10
20
10
25
10
ns
ns
Notes:
14. Test conditions for all parameters other than tri-state parameters assume signal transition time of 3 ns (1 V/ns) or less, timing reference levels of VCC(typ)/2, input
pulse levels of 0 to VCC(typ.), and output loading of the specified IOL/IOH as shown in the “AC Test Loads and Waveforms” section.
15. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZBE is less than tLZBE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any
given device.
16. tHZOE, tHZCE, tHZBE, and tHZWE transitions are measured when the outputs enter a high impedence state.
17. The internal Write time of the memory is defined by the overlap of WE, CE = VIL, BHE and/or BLE = VIL. All signals must be ACTIVE to initiate a write and any
of these signals can terminate a write by going INACTIVE. The data input set-up and hold timing should be referenced to the edge of the signal that terminates
the write.
Document #: 38-05340 Rev. *F
Page 5 of 12
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CY62147DV30
Switching Waveforms
Read Cycle 1 (Address Transition Controlled)[18, 19]
tRC
ADDRESS
tOHA
DATA OUT
tAA
DATA VALID
PREVIOUS DATA VALID
Read Cycle No. 2 (OE Controlled)[19, 20]
ADDRESS
tRC
CE
tPD
tHZCE
tACE
OE
tHZOE
tDOE
BHE/BLE
tLZOE
tHZBE
tDBE
tLZBE
DATA OUT
HIGH IMPEDANCE
HIGH
IMPEDANCE
DATA VALID
tLZCE
VCC
SUPPLY
CURRENT
tPU
ICC
50%
50%
ISB
Notes:
18. The device is continuously selected. OE, CE = VIL, BHE and/or BLE = VIL.
19. WE is HIGH for read cycle.
20. Address valid prior to or coincident with CE and BHE, BLE transition LOW.
Document #: 38-05340 Rev. *F
Page 6 of 12
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CY62147DV30
Switching Waveforms (continued)
Write Cycle No. 1 (WE Controlled)[17, 21, 22]
tWC
ADDRESS
tSCE
CE
tAW
tHA
tSA
WE
tPWE
tBW
BHE/BLE
OE
tSD
DATA I/O
NOTE 23
tHD
DATAIN
tHZOE
Write Cycle No. 2 (CE Controlled)[17, 21, 22]
tWC
ADDRESS
tSCE
CE
tSA
tAW
tHA
tPWE
WE
tBW
BHE/BLE
OE
tSD
DATA I/O
tHD
DATAIN
NOTE 23
tHZOE
Notes:
21. Data I/O is high impedance if OE = VIH.
22. If CE goes HIGH simultaneously with WE = VIH, the output remains in a high-impedance state.
23. During this period, the I/Os are in output state and input signals should not be applied.
Document #: 38-05340 Rev. *F
Page 7 of 12
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CY62147DV30
Switching Waveforms (continued)
Write Cycle No. 3 (WE Controlled, OE LOW)[22]
tWC
ADDRESS
tSCE
CE
tBW
BHE/BLE
tAW
tHA
tSA
tPWE
WE
tSD
DATAI/O
NOTE 23
tHD
DATAIN
tHZWE
Write Cycle No. 4 (BHE/BLE Controlled, OE
tLZWE
LOW)[22]
tWC
ADDRESS
CE
tSCE
tAW
tHA
tBW
BHE/BLE
tSA
tPWE
WE
tHZWE
DATA I/O
NOTE 23
tSD
tHD
DATAIN
tLZWE
Document #: 38-05340 Rev. *F
Page 8 of 12
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CY62147DV30
Truth Table
CE
WE
OE
BHE
BLE
H
X
X
X
X
High Z
Inputs/Outputs
Deselect/Power-Down
Mode
Standby (ISB)
Power
X
X
X
H
H
High Z
Deselect/Power-Down
Standby (ISB)
L
H
L
L
L
Data Out (I/OO–I/O15)
Read
Active (ICC)
L
H
L
H
L
Data Out (I/OO–I/O7);
I/O8–I/O15 in High Z
Read
Active (ICC)
L
H
L
L
H
Data Out (I/O8–I/O15);
I/O0–I/O7 in High Z
Read
Active (ICC)
L
H
H
L
L
High Z
Output Disabled
Active (ICC)
L
H
H
H
L
High Z
Output Disabled
Active (ICC)
L
H
H
L
H
High Z
Output Disabled
Active (ICC)
L
L
X
L
L
Data In (I/OO–I/O15)
Write
Active (ICC)
L
L
X
H
L
Data In (I/OO–I/O7);
I/O8–I/O15 in High Z
Write
Active (ICC)
L
L
X
L
H
Data In (I/O8–I/O15);
I/O0–I/O7 in High Z
Write
Active (ICC)
Ordering Information
Speed
(ns)
Ordering Code
45
CY62147DV30LL-45BVXI
51-85150 48-ball (6 mm × 8mm × 1 mm) VFBGA (Pb-free)
CY62147DV30LL-45ZSXI
51-85087 44-pin TSOP II (Pb-free)
CY62147DV30LL-55BVI
51-85150 48-ball (6 mm × 8mm × 1 mm) VFBGA
55
CY62147DV30LL-55BVXI
70
Package
Diagram
Package Type
51-85087 44-pin TSOP II (Pb-free)
CY62147DV30L-55BVXE
51-85150 48-ball (6 mm × 8mm × 1 mm) VFBGA (Pb-free)
CY62147DV30L-55ZSXE
51-85087 44-pin TSOP II (Pb-free)
CY62147DV30LL-70BVI
51-85150 48-ball (6 mm × 8mm × 1 mm) VFBGA
Document #: 38-05340 Rev. *F
Industrial
Industrial
48-ball (6 mm × 8mm × 1 mm) VFBGA (Pb-free)
CY62147DV30LL-55ZSXI
CY62147DV30LL-70BVXA
Operating
Range
48-ball (6 mm × 8mm × 1 mm) VFBGA (Pb-free)
Automotive-E
Industrial
Automotive-A
Page 9 of 12
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CY62147DV30
Package Diagram
48-ball VFBGA (6 x 8 x 1 mm) (51-85150)
BOTTOM VIEW
TOP VIEW
A1 CORNER
Ø0.05 M C
Ø0.25 M C A B
A1 CORNER
Ø0.30±0.05(48X)
2
3
4
5
6
6
5
4
3
2
1
C
C
E
F
G
D
E
2.625
D
0.75
A
B
5.25
A
B
8.00±0.10
8.00±0.10
1
F
G
H
H
A
1.875
A
B
0.75
6.00±0.10
3.75
0.55 MAX.
6.00±0.10
0.15(4X)
0.10 C
0.21±0.05
0.25 C
B
51-85150-*D
C
Document #: 38-05340 Rev. *F
1.00 MAX
0.26 MAX.
SEATING PLANE
Page 10 of 12
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CY62147DV30
Package Diagram (continued)
44-Pin TSOP II (51-85087)
51-85087-*A
MoBL is a registered trademark, and More Battery Life is a trademark, of Cypress Semiconductor Corporation. All product and
company names mentioned in this document may be the trademarks of their respective holders.
Document #: 38-05340 Rev. *F
Page 11 of 12
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
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CY62147DV30
Document History Page
Document Title:CY62147DV30 MoBL® 4-Mbit (256K x 16) Static RAM
Document Number: 38-05340
REV.
ECN NO. Issue Date
Orig. of
Change
Description of Change
**
127481
06/17/03
HRT
New Data Sheet
*A
131010
01/23/04
CBD
Changed from Advance to Preliminary
*B
213252
See ECN
AJU
Changed from Preliminary to Final
Added 70 ns speed bin
Modified footnote 7 to include ramp time and wait time
Modified input and output capacitance values to 10 pF
Modified Thermal Resistance values on page 4
Added “Byte power-down feature” in the features section
Modified Ordering Information for Pb-free parts
*C
257349
See ECN
PCI
Modified ordering information for 70-ns Speed Bin
*D
316039
See ECN
PCI
Added 45-ns Speed Bin in AC, DC and Ordering Information tables
Added Footnote #10 on page #4
Added Pb-free package ordering information on page # 9
Changed 44-lead TSOP-II package name on page 11 from Z44 to ZS44
Standardized Icc values across ‘L’ and ‘LL’ bins
*E
330365
See ECN
AJU
Added Automotive product information
*F
498575
See ECN
NXR
Added Automotive-A range
Added note# 9 on page# 3
Updated ordering information table
Document #: 38-05340 Rev. *F
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