ETC IMSSG559AYB

SG559
Mobile Pentium Processor Application Clock Generator with SSCG, USB and Power
Management Support
Approved Product
FREQUENCY TABLE
PRODUCT FEATURES
„
„
„
„
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„
„
„
®
Supports clock requirements for Mobile Pentium
Processor
2 Host and 5 PCI clocks
Separate supply pins for mixed (3.3/2.5V) voltage
application.
<175ps skew among CPU clocks.
< 250ps skew among PCI clocks.
48mhz for USB.
28-pin SSOP package for minimum board space.
Power management capabilities
SEL100/66#
CPU
PCI
0
66.4 Mhz*
33.3 Mhz
1
99.8 Mhz**
33.2 MHz
*Down Spread 1.25% (total); **Down Spread .5% (total)
BLOCK DIAGRAM
VDDR
XIN
REF
OSC
XOUT
CPU_STOP#
PLL
VDDC
CPUCLK (0:1)
PCI_STOP#
VDDP
SEL1066#
PCI (1:5)
PWR_DWN#
PCI_F
PLL
48 MHz
INTERNATIONAL MICROCIRCUITS, INC. 525 LOS COCHES ST.
MILPITAS, CA 95035 TEL: 408-263-6300 ext. 275 FAX 408-263-6571
CONNECTION DIAGRAM
XIN
XOUT
VSS
PCI_F
PCI1
VDDP
PCI2
PCI3
VDDP
PCI4
PCI5
VSS
VDD
VSS
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
Rev. 1.0
VSS
VDDR
REF
VDDC
CPU0
CPU1
VSS
VDD
VSS
PCI_STOP#
CPU_STOP#
PWR_DWN#
48M
SEL100/66#
4/12/1999
Page 1 of 8
SG559
Mobile Pentium Processor Application Clock Generator with SSCG, USB and Power
Management Support
Approved Product
PIN DESCRIPTION
PIN No.
1
Pin Name
XIN
PWR
VDD
I/O
I
TYPE
OSC1
2
XOUT
VDD
O
OSC1
15
SEL100/66#
-
I
23, 24
CPUCLK
(0:1)
PCI_F
VDDC
O
PADI4
PU
BUF1
VDDP
O
BUF4
4
Description
On-chip reference oscillator input pin. Requires either an
external parallel resonant crystal (nominally 14.318 MHz) or
externally generated reference signal
On-chip reference oscillator output pin. Drives an external
parallel resonant crystal. When an externally generated
reference signal is used at Xin, this pin is left unconnected
Frequency select input pins. See frequency select table on
page 1.This pin has internal pull-up.
Clock outputs. CPU frequency table specified on page 1.
16
5, 7, 8,
10, 11
26
19
48M
PCI(1:5)
VDD48
VDDP
O
O
BUF3
BUF4
Free running PCI clock. When PCI_STP# = 0, this clock does
NOT stop.
48 MHz fixed clock.
PCI bus clocks. See frequency select table on page 1.
REF
PCI_STOP#
VDDR
-
O
I
18
CPU_STOP#
-
I
17
PWR_DWN#
-
I
13, 21
3, 12,
14, 20,
22, 28
9, 6
VDD
VSS
-
P
P
BUF3
PAD
PU
PAD
PU
PAD
PU
-
Buffered outputs of on-chip reference oscillator.
When driven to a logic low level, this pin will synchronously stop
all PCI clocks (except PCI_F) at a logic low level.
When driven to a logic low level, this pin will synchronously stop
all CPU clocks at a logic low level.
This pin is active low. When asserted low, the device is in
shutdown mode. VCO’s, Crystal, and outputs are turned off.
3.3 volt power supply for core logic.
Ground pins for the device.
VDDP
-
P
-
25
27
VDDC
VDDR
-
P
P
-
3.3 Volt power supply pins for PCI (1:5) and PCI_F clock output
buffers.
3.3 or 2.5 Volt power supply for CPUCLK (0:1) outputs.
3.3 Volt power supply pins for reference clock output buffers
and crystal circuit.
INTERNATIONAL MICROCIRCUITS, INC. 525 LOS COCHES ST.
MILPITAS, CA 95035 TEL: 408-263-6300 ext. 275 FAX 408-263-6571
Rev. 1.0
4/12/1999
Page 2 of 8
SG559
Mobile Pentium Processor Application Clock Generator with SSCG, USB and Power
Management Support
Approved Product
POWER MANAGEMENT FUNCTIONS
All PCI (excluding PCI_F) and CPU clocks can be enabled or stopped via the PCI_STOP# and CPU_STOP# input pins.
All clocks are stopped in the low state. All clocks maintain a valid high period on transitions from running to stopped and
on transitions from stopped to running when the chip was not powered down. On power up, the VCOs will stabilize to
the correct pulse widths within 0.2 mS. The CPU and PCI clocks transition between running and stopped by waiting for
one positive edge on PCI_F followed by a negative edge on the clock of interest, after which high levels of the output are
either enabled or disabled.
PWR_DWN#
1
1
1
1
0
CPU_STOP#
0
0
1
1
x (don’t care)
PCI_STOP#
0
1
0
1
x (don’tcare)
CPUCLK
LOW
LOW
RUNNING
RUNNING
LOW
PCICLK
LOW
RUNNING
LOW
RUNNING
LOW
OTHER CLKs
RUNNING
RUNNING
RUNNING
RUNNING
LOW
XTAL & VCOs
RUNNING
RUNNING
RUNNING
RUNNING
OFF
POWER MANAGEMENT TIMING
PCI_F
PCI_STOP#
PCICLK(1:5)
CPU_STOP#
CPUCLK(0:1)
POWER MANAGEMENT TIMING
Signal
Signal State
Latency
No. of rising edges of free
running PCICLK (PCIF)
CPU_ST0P#
0 (disabled)
1
1 (enabled)
1
PCI_ST0P#
0 (disabled)
1
1 (enabled)
1
NOTES:
1. Clock on/off latency is defined in the number of rising edges of free running PCI CLOCK between the clock disable
goes low/high to the first valid clock comes out of the device.
INTERNATIONAL MICROCIRCUITS, INC. 525 LOS COCHES ST.
MILPITAS, CA 95035 TEL: 408-263-6300 ext. 275 FAX 408-263-6571
Rev. 1.0
4/12/1999
Page 3 of 8
SG559
Mobile Pentium Processor Application Clock Generator with SSCG, USB and Power
Management Support
Approved Product
SPECTRUM SPREAD CLOCKING
Down Spread
Amplitude
(dB)
Without Spectrum Spread
With Spectrum Spread
Frequency (MHz)
Center
Spectrum Analysis
MAXIMUM RATINGS
Voltage Relative to VSS:
-0.3V
Voltage Relative to VDD:
0.3V
Storage Temperature:
Operating Temperature:
Maximum Power Supply:
-65ºC to + 150ºC
-40ºC to +85ºC
7V
This device contains circuitry to protect the inputs
against damage due to high static voltages or electric
field; however, precautions should be taken to avoid
application of any voltage higher than the maximum
rated voltages to this circuit. For proper operation, Vin
and Vout should be constrained to the range:
VSS<(Vin or Vout)<VDD
Unused inputs must always be tied to an appropriate
logic voltage level (either VSS or VDD).
INTERNATIONAL MICROCIRCUITS, INC. 525 LOS COCHES ST.
MILPITAS, CA 95035 TEL: 408-263-6300 ext. 275 FAX 408-263-6571
Rev. 1.0
4/12/1999
Page 4 of 8
SG559
Mobile Pentium Processor Application Clock Generator with SSCG, USB and Power
Management Support
Approved Product
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Input Low Voltage
Input High Voltage
Input Low Current
Input High Current
Output Low Voltage
IOL = 4mA
Output High Voltage
IOH = 4mA
Tri-State leakage Current
Dynamic Supply Current
Static Supply Current
Short Circuit Current
Min
Typ
VIL
VIH
IIL
IIH
VOL
2.0
-
-
VOH
Max
Units
-
0.8
-66
5
0.4
Vdc
Vdc
µA
µA
Vdc
2.4
-
-
Vdc
Ioz
Idd
Isdd
-
-
10
140
70
µA
mA
ISC
25
-
-
Conditions
µA
mA
-
All Outputs (see buffer spec)
All Outputs Using 3.3V Power
(see buffer spec)
CPU = 66.6 MHz, PCI = 33.3 MHz
pwr_dwn# (PIN17) = 0
1 output at a time - 30 seconds
VDD = VDDP=VDDR =3.3V ±5%, VDDC = 2.5V ±5%,, TA = -40ºC to +85ºC
SWITCHING CHARACTERISTICS
Characteristic
Symbol
Min
Typ
Max
Units
Conditions
Output Duty Cycle
-
45
50
55
%
Measured at 1.5V
CPU to PCI Offset
tOFF
1
3
4
ns
15 pf Load Measured at 1.5V
tSKEW
-
-
250
ps
15 pf Load Measured at 1.5V
∆Period Adjacent Cycles
∆P
-
-
+250
ps
-
Jitter Spectrum 20 dB
Bandwidth from Center
BW J
500
KHz
Buffer out Skew All CPU
and PCI Buffer Outputs
VDD = VDDP =VDDR =3.3V ±5%, VDDC = 2.5V ±5%,, TA = -40ºC to +85ºC
INTERNATIONAL MICROCIRCUITS, INC. 525 LOS COCHES ST.
MILPITAS, CA 95035 TEL: 408-263-6300 ext. 275 FAX 408-263-6571
Rev. 1.0
4/12/1999
Page 5 of 8
SG559
Mobile Pentium Processor Application Clock Generator with SSCG, USB and Power
Management Support
Approved Product
BUFFER 1 CHARACTERISTICS FOR CPUCLK(0:1)
Characteristic
Symbol
Min
Typ
Max
Units
Pull-Up Current Min
IOHmin
-27
Pull-Up Current Max
IOHmax
-
Pull-Down Current Min
IOLmin
Pull-Down Current Max
Conditions
-
-
mA
Vout = 1.0 V
-
-27
mA
Vout = 2.6 V
27
-
-
mA
Vout = 1.2 V
IOLmax
-
-
27
mA
Vout = 0.3 V
Dynamic Output Impedance
Zo
10
-
15
Ohms
66 and 100 MHz
Rise Time Between
0.4 V and 2.0 V
TR
0.4
-
1.6
nS
20 pF Load
Fall Time
Between 0.4 V and 2.0 V
TF
0.5
-
1.6
nS
20 pF Load
VDD = VDDP= VDDR =3.3V ±5%, VDDC = 2.5V ±5%,, TA = -40ºC to +85ºC
BUFFER 3 CHARACTERISTICS FOR REF, 48M
Characteristic
Symbol
Min
Typ
Max
Units
Conditions
Pull-Up Current Min
IOHmin
-29
-
-
mA
Vout = 1.0 V
Pull-Up Current Max
IOHmax
-
-
-23
mA
Vout = 3.135 V
Pull-Down Current Min
IOLmin
29
-
-
mA
Vout = 1.95 V
Pull-Down Current Max
IOLmax
-
-
27
mA
Vout = 0.4 V
Dynamic Output Impedance
Zo
18
-
25
Ohms
66 and 100 MHz
Rise Time
Between 0.4 V and 2.4 V
TR
0.5
-
2.0
nS
20 pF Load
Fall Time
Between 0.4 V and 2.4 V
TF
0.5
-
2.0
nS
20 pF Load
VDD = VDDP= VDDR =3.3V ±5%, VDDC = 2.5V ±5%,, TA = -40ºC to +85ºC
INTERNATIONAL MICROCIRCUITS, INC. 525 LOS COCHES ST.
MILPITAS, CA 95035 TEL: 408-263-6300 ext. 275 FAX 408-263-6571
Rev. 1.0
4/12/1999
Page 6 of 8
SG559
Mobile Pentium Processor Application Clock Generator with SSCG, USB and Power
Management Support
Approved Product
BUFFER 4 CHARACTERISTICS FOR PCI_F, PCI(1:5)
Characteristic
Symbol
Min
Typ
Max
Units
Pull-Up Current Min
IOHmin
-33
Pull-Up Current Max
IOHmax
-
Pull-Down Current Min
IOLmin
Pull-Down Current Max
Dynamic Output Impedance
Rise Time
Between 0.4 V and 2.4 V
Fall Time
Between 0.4 V and 2.4 V
Conditions
-
-
mA
Vout = 1.0 V
-
-33
mA
Vout = 3.135 V
30
-
-
mA
Vout = 1.95 V
IOLmax
Zo
TR
14
0.5
-
38
20
2.0
mA
Ohms
nS
Vout = 0.4 V
66 and 100 MHz
30 pF Load
TF
0.5
-
2.0
nS
30 pF Load
VDDP= VDDR =3.3V ±5%, VDDC = 2.5V ±5%,, TA = -40ºC to +85ºC
CRYSTAL AND REFERENCE OSCILLATOR PARAMETERS
Characteristic
Symbol
Min
Typ
Max
Units
Frequency
Fo
12.00
14.31818
16.00
MHz
Tolerance
TC
-
-
+/-100
PPM
TS
-
-
+/- 100
PPM
Stability (Ta -10 to +60C) note 1
TA
-
-
5
PPM
Aging (first year @ 25C) note 1
Mode
OM
-
-
-
Pin Capacitance
CP
DC Bias Voltage
VBIAS
0.3Vdd
Vdd/2
0.7Vdd
V
Startup time
Ts
-
-
30
µS
Load Capacitance
CL
-
20
-
pF
Effective Series
resonant
resistance
R1
-
-
40
Ohms
Power Dissipation
DL
-
-
0.10
mW
Shunt Capacitance
CO
-
--
7
pF
X1 and X2 Load
CL
5
Calibration note 1
Parallel Resonant
pF
17
Conditions
Capacitance of XIN and Xout pins
note 1
note 1
internal crystal loading capacitors on
each pin (to ground)
For maximum accuracy, the total circuit loading capacitance should be equal to CL. This loading capacitance is the
effective capacitance across the crystal pins and includes the device pin capacitance (CP) in parallel with any circuit
traces, the clock generator and any onboard discrete load capacitors.
Budgeting Calculations
Typical trace capacitance, (< half inch) is 4 pF, Load to the crystal is therefore
2.0 pF
Clock generator internal pin capacitance of 36 pF, Load to the crystal is therefore
18.0 pF
the total parasitic capacitance would therefore be
= 20.0 pF(matching CL)
Note 1: It is recommended but not mandatory that a crystal meets these specifications.
INTERNATIONAL MICROCIRCUITS, INC. 525 LOS COCHES ST.
MILPITAS, CA 95035 TEL: 408-263-6300 ext. 275 FAX 408-263-6571
pF
Rev. 1.0
4/12/1999
Page 7 of 8
SG559
Mobile Pentium Processor Application Clock Generator with SSCG, USB and Power
Management Support
Approved Product
PACKAGE DRAWING AND DIMENSIONS
28 PIN SSOP OUTLINE DIMENSIONS
C
L
SYMBOL
H
E
INCHES
D
a
A2
A
MILLIMETERS
MIN
NOM
MAX
MIN
NOM
MAX
A
0.068
0.073
0.078
1.73
1.86
1.99
A1
0.002
0.005
0.008
0.05
0.13
0.21
A2
0.066
0.068
0.070
1.68
1.73
1.78
B
0.010
0.012
0.015
0.25
0.30
0.38
C
0.005
0.006
0.009
0.13
0.15
0.22
D
0.397
0.402
0.407
10.07
10.20
10.33
E
0.205
0.209
0.212
5.20
5.30
5.38
A1
B
e
e
0.0256 BSC
0.65 BSC
H
0.301`
0.307
0.311
7.65
7.80
7.90
a
0°
4°
8°
0°
4°
8°
L
0.022
0.030
0.037
0.55
0.75
0.95
ORDERING INFORMATION
Part Number
Package Type
IMISG559AYB
28 PIN SSOP
Note:
Production Flow
Commercial, -40ºC to +85ºC
The ordering part number is formed by a combination of device number, device revision, package style, and
screening as shown below.
Marking: Example:
IMI
SG559AYB
Date Code, Lot #
IMISG559AYB
Flow
B = Commercial, -40ºC to + 85ºC
Package
Y = SSOP
Revision
IMI Device Number
INTERNATIONAL MICROCIRCUITS, INC. 525 LOS COCHES ST.
MILPITAS, CA 95035 TEL: 408-263-6300 ext. 275 FAX 408-263-6571
Rev. 1.0
4/12/1999
Page 8 of 8