ONSEMI MBRS240LT3

MBRS240LT3
Surface Mount
Schottky Power Rectifier
SMB Power Surface Mount Package
These devices employ the Schottky Barrier principle in a
metal−to−silicon power rectifier. Features epitaxial construction with
oxide passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies; free wheeling
diodes and polarity protection diodes.
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SCHOTTKY BARRIER
RECTIFIER
2.0 AMPERES, 40 VOLTS
Features
•
•
•
•
•
Compact Package with J−Bend Leads Ideal for Automated Handling
Highly Stable Oxide Passivated Junction
Guard−Ring for Overvoltage Protection
Low Forward Voltage Drop
Pb−Free Package is Available
SMB
CASE 403A
PLASTIC
Mechanical Characteristics
•
•
•
•
•
•
Case: Molded Epoxy
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 95 mg (Approximately)
Cathode Polarity Band
Maximum Temperature of 260°C/10 Seconds for Soldering
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
MARKING DIAGRAM
AYWW
2BL4G
G
MAXIMUM RATINGS
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Rating
VRRM
VRWM
VR
40
V
Average Rectified Forward Current
(At Rated VR, TC = 100°C)
IO
2.0
A
Peak Repetitive Forward Current
(At Rated VR, Square Wave,
20 kHz, TC = 105°C)
IFRM
4.0
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
IFSM
25
A
Storage/Operating Case Temperature
Operating Junction Temperature
Voltage Rate of Change
(Rated VR, TJ = 25°C)
ORDERING INFORMATION
Tstg, TC
−55 to +150
°C
Device
Package
Shipping †
TJ
−55 to +125
°C
MBRS240LT3
SMB
2500/Tape & Reel
dv/dt
10,000
V/ms
SMB
(Pb−Free)
2500/Tape & Reel
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 4
2BL4
= Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
1
MBRS240LT3G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
MBRS240LT3/D
MBRS240LT3
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 3)
Symbol
Value
Unit
RqJL
RqJA
18
78
°C/W
ELECTRICAL CHARACTERISTICS
VF
Maximum Instantaneous Forward Voltage (Note 2)
TJ = 25°C
TJ = 125°C
0.43
0.54
0.375
0.55
TJ = 25°C
TJ = 100°C
2.0
0.5
60
40
(IF = 2.0 A)
(IF = 4.0 A)
see Figure 2
IR
Maximum Instantaneous Reverse Current (Note 2)
(VR = 40 V)
(VR = 20 V)
see Figure 4
V
mA
1. Mounted with minimum recommended pad size, PC Board FR4.
2. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%.
3. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
TYPICAL CHARACTERISTICS
10
1.0
TJ = 125°C
25°C
85°C
0.1
0.0
0.1
−40 °C
0.2
0.3
0.4
0.5
0.6
0.7
0.8
TJ = 125°C
85°C
0.1
0.0
0.1
25°C
0.2
0.3
0.4
0.5
0.6
0.7
0.8
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
100E−3
IR , MAXIMUM REVERSE CURRENT (AMPS)
IR , REVERSE CURRENT (AMPS)
1.0
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
100E−3
TJ = 125°C
10E−3
85°C
1.0E−3
100°C
10E−3
1.0E−3
25°C
100E−6
100E−6
25°C
10E−6
10
0
10
20
30
40
10E−6
0
10
20
30
VR, REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
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2
40
MBRS240LT3
3.5
PFO , AVERAGE POWER DISSIPATION (WATTS)
IO , AVERAGE FORWARD CURRENT (AMPS)
TYPICAL CHARACTERISTICS
FREQ = 20 kHz
3.0
dc
2.5
SQUARE WAVE
2.0
Ipk/Io = p
1.5
Ipk/Io = 5.0
1.0
Ipk/Io = 10
Ipk/Io = 20
0.5
0
0
20
40
60
80
120
100
1.6
dc
1.4
SQUARE WAVE
Ipk/Io = p
1.2
Ipk/Io = 5.0
1.0
Ipk/Io = 10
0.8
Ipk/Io = 20
0.6
0.4
0.2
0
140
0
0.5
1.0
1.5
2.0
2.5
3.0
TL, LEAD TEMPERATURE (°C)
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating
Figure 6. Forward Power Dissipation
3.5
1000
1000
SURGE CURRENT (AMPS)
C, CAPACITANCE (pF)
TJ = 25°C
100
10
R T, TRANSIENT THERMAL RESISTANCE (NORMALIZED)
1.0
0
1.0E+00
1.0E−01
1.0E−02
5.0
10
15
20
25
30
35
100
10
40
1.0
10
100
1000
VR, REVERSE VOLTAGE (VOLTS)
PULSE WIDTH (mSEC)
Figure 7. Capacitance
Figure 8. Maximum Non−Repetitive
Forward Surge Current
10000
50%
20%
10%
5.0%
2.0%
1.0%
1.0E−03
Rtjl(t) = Rtjl*r(t)
1.0E−04
0.00001
0.0001
0.001
0.01
0.1
t, TIME (s)
Figure 9. Thermal Response
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3
1.0
10
100
1000
MBRS240LT3
PACKAGE DIMENSIONS
SMB
PLASTIC PACKAGE
CASE 403A−03
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
HE
E
b
DIM
A
A1
b
c
D
E
HE
L
L1
D
MIN
1.90
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
NOM
MAX
2.13
2.41
0.10
0.15
2.03
2.11
0.23
0.30
3.56
3.81
4.32
4.57
5.44
5.59
1.02
1.27
0.51 REF
MIN
0.075
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.084
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.095
0.006
0.083
0.012
0.150
0.180
0.220
0.050
A
L
L1
A1
c
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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Email: [email protected]
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For additional information, please contact your
local Sales Representative.
MBRS240LT3/D