Product Specification PE3342 2.7 GHz Integer-N PLL with Field-Programmable EEPROM Product Description Features Peregrine’s PE3342 is a high performance integer-N PLL with embedded EEPROM capable of frequency synthesis up to 2700 MHz with a speed-grade option to 3000 MHz. The EEPROM allows designers to permanently store control bits, allowing easy configuration of self-starting synthesizers. The superior phase noise performance of the PE3342 is ideal for applications such as wireless base stations, fixed wireless, and RF instrumentation systems. • Field-programmable EEPROM for self- starting applications • Standard 2700 MHz operation, 3000 MHz speed-grade option • ÷10/11 dual modulus prescaler • Internal phase detector • Serial programmable The PE3342 features a ÷10/11 dual modulus prescaler, counters, and a phase comparator as shown in Figure 1. Counter values are programmable through a three-wire serial interface. • Low power — 20 mA at 3 V • Ultra-low phase noise • Available in 24-lead TSSOP or 20-lead 4x4 mm QFN package The PE3342 UltraCMOS™ Phase Locked-Loop is manufactured in Peregrine’s patented Ultra Thin Silicon (UTSi®) CMOS process, offering excellent RF performance with the economy and integration of conventional CMOS. Figure 1. Block Diagram Fin Fin ENH Enhancement Register (8-bit) E_WR Data Clock Serial Interface Mux Primary Register (20-bit) 13 20 EE Register (20-bit) EELoad M Counter ÷2 to ÷512 Prescaler ÷10/11 Secondary Register (20-bit) PD_D 20 6 20 LD Transfer Logic 2k 6 VPP S_WR fr PD_U Phase Detector Cext EEPROM EESel FSel Document No. 70-0091-03 │ www.psemi.com R Counter ÷1 to ÷64 ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 1 of 17 PE3342 Product Specification Figure 2. Pin Configurations (Top View) Figure 3. Package Types Clock 6 19 VDD GND 24-lead TSSOP 7 18 Dout FSel 8 17 E_WR 9 16 EELoad VPP 10 15 Cext VDD 11 14 GND Fin 12 13 Fin PD_U PD_D EESel 20 16 5 S_WR 1 15 PD_D Data 2 14 VDD Clock 3 13 Dout FSel 4 LD E_WR 20-lead QFN 4x4mm Exposed Solder Pad (Bottom Side) 5 10 Data FINX PD_U CEXT 21 fr 4 17 S_WR 9 EESel VDD 22 18 3 8 ENH FIN GND ENH 23 19 2 7 GND 6 fr VPP 24 VDD 1 20 24-lead TSSOP, 20-lead QFN VDD 12 LD 11 EELoad Table 2. Pin Descriptions Pin No. TSSOP Pin No. QFN 1 19 2 Pin Name Type Description VDD (Note 1) Power supply input. Input may range from 2.85 V to 3.15 V. Bypassing required. GND (Note 2) Ground. 3 20 ENH Input Enhancement mode control line. When asserted LOW, enhancement register bits are functional. Internal 70 kΩ pull-up resistor. 4 1 S_WR Input Secondary Register WRITE input. Primary Register contents are copied to the Secondary Register on S_WR rising edge. Also used to control Serial Port operation and EEPROM programming. 5 2 Data Input Binary serial data input. Input data entered LSB (B0) first. 6 3 Clock Input Serial clock input. Data is clocked serially into the 20-bit Primary Register, the 20-bit EE Register, or the 8-bit Enhancement Register on the rising edge of Clock. Also used to clock EE Register data out Dout port. GND (Note 2) Ground. 7 8 4 FSel Input Frequency Register selection control line. Internal 70 kΩ pull-down resistor. 9 5 E_WR Input Enhancement Register write enable. Also functions as a Serial Port control line. Internal 70 kΩ pull-down resistor. 10 6 VPP Input EEPROM erase/write programming voltage supply pin. Requires a 100pF bypass capacitor connected to GND. 11 7 VDD (Note 1) Same as pin 1. 12 8 Fin Input Prescaler input from the VCO. 13 9 Fin Input Prescaler complementary input. A series 50 Ω resistor and DC blocking capacitor should be placed as close as possible to this pin and connected to the ground plane. GND (Note 2) Ground. 14 15 10 CEXT Output 16 11 EELoad Input 17 12 LD Output, OD ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 2 of 17 Logical “NAND” of PD_U and PD_D terminated through an on-chip, 2 kΩ series resistor. Connecting CEXT to an external capacitor will low pass filter the input to the inverting amplifier used for driving LD. Control line for Serial Data Port, Frequency Register selection, EE Register parallel loading, and EEPROM programming. Internal 70 kΩ pull-down resistor. Lock detect output, an open-drain logical inversion of C EXT. When the loop is in lock, LD is high impedance; otherwise, LD is a logic LOW. Document No. 70-0091-03 │ UltraCMOS™ RFIC Solutions PE3342 Product Specification Pin No. TSSOP Pin No. QFN Pin Name Type Description Data out function. Dout is defined with the Enhancement Register and enabled with 18 13 Dout Output 19 14 VDD (Note 1) Same as pin 1. 20 15 PD_D Output Phase detector output. PD_D pulses negatively when fp leads fc. 21 16 PD_U Output 22 17 EESel Input Phase detector output. PD_U pulses negatively when fc leads fp. Control line for Frequency Register selection, EE Register parallel loading, and EEPROM programming. Internal 70 kΩ pull-up resistor. GND (Note 2) Ground. fr Input Reference frequency input. 23 24 18 ENH. Notes 1: V DD pins 1, 11, and 19 (TSSOP) or pins 6, 14 and 19 (QFN), are connected by diodes and must be supplied with the same positive voltage level. 2: Ground connections are made through the exposed solder pad. The solder pad must be soldered to the ground plane for proper operation . Table 4. ESD Ratings Table 2. Absolute Maximum Ratings Symbol VDD VI TStg Parameter/Conditions Min Supply voltage –0.3 +4.0 V –0.3 VDD+0.3 V –65 +85 °C Voltage on any digital input Storage temperature range Max Units Symbol Parameter/Conditions VESD ESD voltage human body model (Note 1) ESD voltage human body model (Note 1) VESD (VPP) Min Max Units 1000 V 200 V Note 1: Periodically sampled, not 100% tested. Tested per MILSTD-883, M3015 C2 Absolute Maximum Ratings are those values listed in the above table. Exceeding these values may cause permanent device damage. Functional operation should be restricted to the limits in the DC and AC Characteristics table. Exposure to absolute maximum ratings for extended periods may affect device reliability. Electrostatic Discharge (ESD) Precautions When handling this UltraCMOS™ device, observe the same precautions that you would use with other ESD-sensitive devices. Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to avoid exceeding the specified rating in Table 4. Table 3. DC Electrical Specifications Latch-Up Avoidance Symbol Parameter/Conditions Min Max Units VDD Supply voltage 2.85 3.15 V TA Operating ambient temperature range -40 85 °C Document No. 70-0091-03 │ www.psemi.com Unlike conventional CMOS devices, UltraCMOS™ devices are immune to latch-up. ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 3 of 17 PE3342 Product Specification Table 5. DC Characteristics VDD = 3.0 V, -40° C < TA < 85° C, unless otherwise specified Symbol IDD Parameter Operational supply current; Prescaler enabled Digital Inputs: S_WR, Data, Clock Conditions Min VDD = 2.85 to 3.15 V VIH High-level input voltage VDD = 2.85 to 3.15 V VIL Low-level input voltage VDD = 2.85 to 3.15 V IIH High-level input current VIH = VDD = 3.15 V IIL Low-level input current VIL = 0, VDD = 3.15 V -1 0.7 x VDD Typ Max Units 20 30 mA 0.7 x VDD V 0.3 x VDD V +1 µA µA Digital inputs: ENH, EESel (contains a 70 kΩ pull-up resistor) VIH High-level input voltage VDD = 2.85 to 3.15 V VIL Low-level input voltage VDD = 2.85 to 3.15 V IIH High-level input current VIH = VDD = 3.15 V IIL Low-level input current VIL = 0, VDD = 3.15 V V 0.3 x VDD V +1 µA -100 µA 0.7 x VDD V Digital inputs: FSel, EELoad, E_WR (contains a 70 kΩ pull-down resistor) VIH High-level input voltage VDD = 2.85 to 3.15 V VIL Low-level input voltage VDD = 2.85 to 3.15 V IIH High-level input current VIH = VDD = 3.15 V IIL Low-level input current VIL = 0, VDD = 3.15 V 0.3 x VDD V +100 µA µA -1 EE Memory Programming Voltage and Current: VPP, IPP VPP_WRITE EEPROM write voltage 12.5 V VPP_ERASE EEPROM erase voltage -8.5 V IPP_WRITE IPP_ERASE 30 EEPROM write cycle current -10 EEPROM erase cycle current mA mA Reference Divider input: fr IIHR High-level input current VIH = VDD = 3.15 V IILR Low-level input current VIL = 0, VDD = 3.15 V +100 µA µA -100 Counter output: Dout VOLD Output voltage LOW Iout = 6 mA VOHD Output voltage HIGH Iout = -3 mA 0.4 VDD - 0.4 V V Lock detect outputs: (CEXT, LD) VOLC Output voltage LOW, CEXT Iout = 0.1 mA VOHC Output voltage HIGH, CEXT Iout = -0.1 mA VOLLD Output voltage LOW, LD Iout = 1 mA ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 4 of 17 0.4 VDD - 0.4 V V 0.4 V Document No. 70-0091-03 │ UltraCMOS™ RFIC Solutions PE3342 Product Specification Table 6. AC Characteristics VDD = 3.0 V, -40° C < TA < 85° C, unless otherwise specified Symbol Parameter Conditions Min Max Units 10 MHz Control Interface and Registers (see Figure 4) fClk Serial data clock frequency tClkH Serial clock HIGH time (Note 1) 30 ns tClkL Serial clock LOW time 30 ns tDSU Data set-up time to Clock rising edge 10 ns tDHLD Data hold time after Clock rising edge 10 ns tPW S_WR pulse width 30 ns tCWR Clock rising edge to S_WR rising edge 30 ns Clock falling edge to E_WR transition 30 ns tCE tWRC tEC S_WR falling edge to Clock rising edge 30 ns E_WR transition to Clock rising edge 30 ns 500 ns EEPROM Erase/Write Programming (see Figures 5 & 6) tEESU EELoad rising edge to VPP rising edge tEEPW VPP pulse width tVPP VPP pulse rise and fall times 25 (Note 2) 30 ms µs 1 Main Divider (Including Prescaler) FIn Operating frequency FIn Operating frequency Speed-grade option (Note 3) PFIn Input level range External AC coupling 300 2700 MHz 300 3000 MHz -5 5 dBm Main Divider (Prescaler Bypassed) FIn Operating frequency (Note 4) 50 270 MHz PFIn Input level range External AC coupling (Note 4) -5 5 dBm 100 MHz Reference Divider fr Operating frequency (Note 5) Pfr Reference input power (Note 4) Single ended input Comparison frequency (Note 6) -2 dBm Phase Detector fc 20 MHz SSB Phase Noise (Fin = 1.3 GHz, fr = 10 MHz, fc = 1.25 MHz, LBW = 70 kHz, V DD = 3.0 V, Temp = -40° C) Note 1: 100 Hz Offset -75 dBc/Hz 1 kHz Offset -85 dBc/Hz fClk is verified during the functional pattern test. Serial programming sections of the functional pattern are clocked at 10 MHz to verify fClk specification. Note 2: Rise and fall times of the VPP programming voltage pulse must be greater than 1 µs. Note 3: The maximum frequency of operation can be extended to 3.0 GHz by ordering a special speed-grade option. Please refer to Table 14, Ordering Information, for ordering details. Note 4: CMOS logic levels can be used to drive FIn input if DC coupled and used in Prescaler Bypass mode. Voltage input needs to be a minimum of 0.5 Vp-p. For optimum phase noise performance, the reference input falling edge rate should be faster than 80 mV/ns. No minimum frequency limit exists when operated in this mode. Note 5: CMOS logic levels can be used to drive reference input if DC coupled. Voltage input needs to be a minimum of 0.5 Vp-p. For optimum phase noise performance, the reference input falling edge rate should be faster than 80 mV/ns. Note 6: Parameter is guaranteed through characterization only and is not tested. Document No. 70-0091-03 │ www.psemi.com ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 5 of 17 PE3342 Product Specification Functional Description The PE3342 consists of a dual modulus prescaler, three programmable counters, a phase detector and control logic with EEPROM memory (see Figure 1). The dual modulus prescaler divides the VCO frequency by either 10 or 11, depending on the state of the internal modulus select logic. The R and M counters divide the reference and prescaler outputs by integer values stored in one of three selectable registers. The modulus select logic uses the 4-bit A counter. The phase-frequency detector generates up and down frequency control signals and are also used to enable a lock detect circuit. Frequency control data is loaded into the device via the Serial Data Port, and can be placed in three separate frequency registers. One of these registers (EE register) is used to load from and write to the non-volatile 20-bit EEPROM. Various operational and test modes are available through the enhancement register, which is only accessible through the Serial Data Port (it cannot be loaded from the EEPROM). Main Counter Chain The main counter chain divides the RF input frequency, Fin, by an integer derived from the user-defined values in the M and A counters. It operates in two modes: High Frequency Mode Setting PB (prescaler bypass) LOW enables the ÷10/11 prescaler, providing operation to 2.7 GHz. In this mode, the output from the main counter chain, fp, is related to the VCO frequency, Fin, by the following equation: fp = Fin / [10 x (M + 1) + A] where 0 ≤ A ≤ 15 and A ≤ M + 1; 1 ≤ M ≤ 511 (1) A consequence of the upper limit on A is that Fin must be greater than or equal to 90 x (fr / (R+1)) to obtain contiguous channels. Programming the M counter with the minimum value of 1 will result in a minimum M counter divide ratio of 2. Programming the M and A counters with their maximum values provides a divide ratio of 5135. Prescaler Bypass Mode Setting the PB bit of a frequency register HIGH allows Fin to bypass the ÷10/11 prescaler. In this mode, the prescaler and A counter are powered down, and the input VCO frequency is divided by the M counter directly. The following equation relates Fin to the reference frequency fr: Fin = (M + 1) x (fr / (R+1)) where 1 ≤ M ≤ 511 (3) Reference Counter The reference counter chain divides the reference frequency, fr, down to the phase detector comparison frequency, fc. The output frequency of the 6-bit R Counter is related to the reference frequency by the following equation: fc = fr / (R + 1) where 0 ≤ R ≤ 63 (4) Note that programming R with 0 will pass the reference frequency, fr, directly to the phase detector. Phase Detector The phase detector is triggered by rising edges from the main counter (fp) and the reference counter (fc). It has two outputs, PD_U, and PD_D. If the divided VCO leads the divided reference in phase or frequency (fp leads fc), PD_D pulses LOW. If the divided reference leads the divided VCO in phase or frequency (fc leads fp), PD_U pulses LOW. The width of either pulse is directly proportional to the phase offset between the fp and fc signals. When the loop is locked, Fin is related to the reference frequency, fr, by the following equation: Fin = [10 x (M + 1) + A] x (fr / (R+1)) where 0 ≤ A ≤ 15 and A ≤ M + 1; 1 ≤ M ≤ 511 ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 6 of 17 (2) Document No. 70-0091-03 │ UltraCMOS™ RFIC Solutions PE3342 Product Specification Lock Detect Output Serial Data Port A lock detect signal is provided at pin LD, via the pin CEXT (see Figure 1). CEXT is the logical “NAND” of PD_U and PD_D waveforms, driven through a series 2k ohm resistor. When the loop is locked, this output will be HIGH with narrow pulses LOW. Connecting CEXT to an external shunt capacitor provides integration of this signal. The Serial Data Port allows control data to be entered into the device. This data can be directed into one of three registers: the Enhancement register, the Primary register, and the EE register. Table 7 defines the control line settings required to select one of these destinations. The CEXT signal is sent to the LD pin through an internal inverting comparator with an open drain output. Thus LD is an “AND” function of PD_U and PD_D. Input data presented on pin 5 (Data) is clocked serially into the designated register on the rising edge of Clock. Data is always loaded LSB (B0) first into the receiving register. Figure 4 defines the timing requirements for this process . Table 7. Serial Interface S_WR E_WR EELoad Register Loaded 0 0 0 Primary Register 0 1 0 Enhancement Register 0 X 1 EE Register Figure 4. Serial Interface Timing Diagram Data E_WR EELoad tEC tCE Clock S_WR tDSU Document No. 70-0091-03 │ www.psemi.com tDHLD tClkH tClkL tCWR tPW tWRC ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 7 of 17 PE3342 Product Specification Frequency Registers EE Register There are three independent frequency registers, any one of which can be selected to control the operation of the device. Each register is 20 bits in length, and provides data to the three counters and the prescaler bypass control. Table 8 defines these bit assignments. The EE Register is a serial/parallel-in, serial/ parallel-out register, and provides the interface to the EEPROM. It is loaded from the Serial Data Port to provide the parallel data source when writing to the EEPROM. It also accepts stored data from the EEPROM for controlling the PLL. Primary Register Serial loading of the EE Register is done as shown in Table 7 and Figure 4. Parallel loading of the register from EEPROM is accomplished as shown in Table 10. The Primary Register is a serial shift register, loaded through the Serial Data Port. It can be selected to control the PLL as shown in Table 9. It is not buffered, thus when this register is selected to control the PLL, its data is continuously presented to the counters during a load operation. The EE register can be selected to control the PLL as shown in Table 9. Note that it cannot be selected to control the PLL using data that has been loaded serially. This is because it must first go through one of the two conditions in Table 10 that causes the EEPROM data to be copied into the EE Register. The effect of this is that only EEPROM data is used when the EE Register is selected. This register is also used to perform a parallel load of data into the Secondary Register. Secondary Register The Secondary Register is a parallel-load register. Data is copied into this register from the Primary Register on the rising edge of S_WR, according to the timing diagrams shown in Figure 4. It can be selected to control the PLL as shown in Table 9. The contents of the EE register can also be shifted out serially through the Dout pin. This mode is enabled by appropriately programming the Enhancement Register. In this mode, data exits the register on the rising edge of Clock, LSB (B0) first, and is replaced with the data present on the Data input pin. Tables 7 and 12 define the settings required to enable this mode. Table 8. Primary / Secondary / EE Register Bit Assignments R5 R4 M8 M7 PB M6 M5 M4 M3 M2 M1 M0 R3 R2 R1 R0 A3 A2 A1 A0 B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 Table 9. Frequency Register Selection EESel FSel EELoad Register Selected 0 1 0 Primary Register 0 0 0 Secondary Register 1 X 0 EE Register ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 8 of 17 Table 10. EE Register Load from EEPROM EESel EELoad Function _⁄ ¯ 0 EEPROM → EE Register 1 ¯\_ EEPROM → EE Register Document No. 70-0091-03 │ UltraCMOS™ RFIC Solutions PE3342 Product Specification Enhancement Register The Enhancement Register is buffered to prevent inadvertent control changes during serial loading. Data that has been loaded into the register is captured in the buffer and made available to the PLL on the falling edge of E_WR. A separate control line is provided to enable and disable the Enhancement mode. Functions are enabled by taking the ENH control line LOW. Note: The enhancement register bit values are unknown during power up. To avoid enabling the enhancement mode during power up, set the Enh pin high (“1”) until the enhancement register bit values are programmed to a known state. The Enhancement Register is a buffered serial shift register, loaded from the Serial Data Port. It activates special test and operating modes in the PLL. The bit assignments for these modes are shown in Table 11. The functions of these Enhancement Register bits are shown in Table 12. A function becomes active when its corresponding bit is set HIGH. Note that bits 1, 2, 5, and 6 direct various data to the Dout pin, and for valid operation no more than one should be set HIGH simultaneously . Table 11. Enhancement Register Bit Assignments Reserved EE Register Output fp output Power down Counter load MSEL output fc output Reserved B0 B1 B2 B3 B4 B5 B6 B7 Table 12. Enhancement Register Functions Bit Function Description Bit 0 Reserved Program to 0 Bit 1 EE Register Output Bit 2 fp output Bit 3 Power down Powers down all functions except programming interface. Bit 4 Counter load Immediate and continuous load of counter programming. Bit 5 MSEL output Provides the internal dual modulus prescaler modulus select (MSEL) at Dout. Bit 6 fc output Bit 7 Reserved Allows the contents of the EE Register to be serially shifted out Dout, LSB (B0) first. Data is shifted on rising edge of Clock. Provides the M counter output at Dout. Provides the R counter output at Dout. Program to 0 Document No. 70-0091-03 │ www.psemi.com ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 9 of 17 PE3342 Product Specification EEPROM Programming Write Cycle Frequency control data that is present in the EE Register can be written to the non-volatile EEPROM. All 20 bits are written simultaneously in a parallel operation. The EEPROM is guaranteed for at least 100 erase/write cycles. Using the Serial Data Port, the EE Register is first loaded with the desired data. The EEPROM is then programmed with this data by taking the S_WR input HIGH and EESel input LOW, then applying one WRITE programming voltage pulse to the VPP input. The voltage source for this operation must be capable of supplying the EEPROM write cycle current (IPP_WRITE, Table 5). The timing diagram of this operation is shown in Figure 6. Programming is completed by taking the EELoad input LOW. Erase Cycle The EEPROM should be taken through an erase cycle before writing data, since the write operation performs a logical AND of the EEPROM’s current contents with the data in the EE Register. Erasing the EEPROM is accomplished by holding the S_WR, EESel, and EELoad inputs HIGH, then applying one ERASE programming voltage pulse to the VPP input (see Table 13). The voltage source for this operation must be capable of supplying the EEPROM erase cycle current (IPP_ERASE, Table 5). The timing diagram is shown in Figure 5. Note that it is possible to erroneously overwrite the EE Register with the EEPROM contents before the write cycle begins by unneeded manipulation of the EELoad bit (see Table 10 ). Table 13. EEPROM Programming S_WR EESel EELoad VPP 1 1 1 25ms @ −8.5V 1 0 1 25ms @ +12.5V Function Erase cycle Write cycle Figure 5. EEPROM Erase Timing Diagram EELoad S_WR EESel tEESU tVPP tVPP tEESU 0V tEEPW VPP_ERASE -8.5V Figure 6. EEPROM Write Timing Diagram EESel 0V EELoad 3V S_WR tEESU tVPP tVPP tEESU tEEPW 12.5V VPP_WRITE 0V ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 10 of 17 Document No. 70-0091-03 │ UltraCMOS™ RFIC Solutions PE3342 Product Specification Gross EEPROM Programming Timing Grid between the Vpp_ERASE and Vpp_WRITE pulse has to be at least 100 ms if mechanical relays are used to avoid both being on at the same time. After EE programming, the contents of the EEPROM cells can be verified by setting Enhancement Register Bit 1. A procedure shown in Figure 8 is applied twice. The first time is to load the EE Register from EEPROM and the second time is to shift out the EE Register contents through Dout pin. Figure 7 shows a gross PE3342 EEPROM programming timing grid although each individual step has been described thoroughly in previous sections. It starts with EE Register load, and then together with other parameters a Vpp_ERASE negative pulse is applied to Vpp pin to erase the EEPROM contents and followed by a Vpp_WRITE pulse for EEPROM write cycle. The separation Figure 7. Gross PE3342 EEPROM Programming Timing Grid >=100 ms 3V EELoa d 0V 3V EESel 0V 3V S_WR 0V 3V E_WR 0V 3V Data CHANNEL CODE ENH code set's Dout mux to EE 0V 3V Clock 0V 3V The final set of Dout is EEPROM content Dout 0V 0V Vpp_ERASE 25 ms -8.5V 25 ms 12.5V Vpp_WRITE EE PROM Write EE PROM Erase Rough time scale 40 ms Note: ENH/ ( Pin 3 in TSSOP or Pin 20 in QFN) is at low (0) for this process. Document No. 70-0091-03 │ www.psemi.com EE v e r if y EE Register load EE Programming 0V EE Register load from EEPROM EE Register shifted out through Dout ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 11 of 17 PE3342 Product Specification Figure 8. Details of EE register contents loaded from EEPROM and then shifted out Serially through Dout pin - The procedure is performed twice. EELoa d 3V 0V 3V EESel 0V S_WR 0V 3V E_WR 0V 3V Data 0V 3V Clock 0V Dout (example) 0 1 0 1 0 0 1 1 1 1 1 0 0 0 1 1 1 0 0 1 3V 0V Enhancement Register Programming EE Register load from EEPROM EE Register shifted out through Dout Rough time scale 20 us Note: ENH/ ( Pin 3 in TSSOP or Pin 20 in QFN) is at low (0) for this process. In Figure 8, the first step is to program Enhancement Register to set Bit 1 high (“1”) to access EE Register Output Bit Function. Subsequent action, which includes 19 Clock pulses, allows the existing EE Register contents to be shifted out the Dout pin and the EEPROM contents are loaded to the EE Register. Since the initial data existing in the EE Register could be anything, the data must be flushed out before ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 12 of 17 clocking the contents of the EEPROM register out. After the same procedure is duplicated, the Dout output is the EEPROM contents. Note that only 19 Clock pulses are enough for the 20-bit EE Register because the first bit data is already present at Dout pin. Also ENH/ (Pin 3 in TSSOP or Pin 20 in QFN) is set to low (“0”) to access the Enhancement mode. Document No. 70-0091-03 │ UltraCMOS™ RFIC Solutions PE3342 Product Specification Application Information Evaluation and Programming Kit Support The PE3342 has been designed to allow a selfstarting PLL synthesizer to be built, removing the need to have a micro-controller or other programming source load data into the device on power-up. It can be used as a remotely controllable PLL as well, since the EEPROM circuitry has been added to a complete PLL core (PE3339). To provide easy evaluation of the PE3342 and to also enable programming of small evaluation quantities, Peregrine has developed complete evaluation kits and programming kits for the PE3342 EEPROM PLLs. The PE3342’s EEPROM can be programmed incircuit, or prior to assembly using a socketed fixture. It can be reprogrammed a minimum of 100 times, but is not designed to support constant reprogramming of the EEPROM by an application . Self-Starting Mode In self-starting applications, the EE Register is used to control the device and must be selected per Table 9. Additionally, the contents of the EEPROM must be copied to the EE Register per Table 10, and device power must be stable for this transfer to be reliably accomplished. These requirements can be met by connecting a capacitor of 50pF-10uF (evaluation design uses 3.3uF) from the EESel pin to ground. The delay of the rising edge on EESel, created by the RC time constant of its 70k ohm internal pull-up resistor and the external capacitor, will allow device power to stabilize first, ensuring proper data transfer. This edge is adaptable by capacitor value selection. The Vcc applied to the IC must be settled first. Document No. 70-0091-03 │ www.psemi.com Evaluation Kits The evaluation kits consist of an evaluation board and support software enabling the user to evaluate the full functionality of the part. The EEPROM can be loaded with user specified values and then placed in a self start-up mode. Please refer to Table 14, Ordering Information, for the specific order codes. Programming Kits The programming kits consist of a programming board and support software that enables the user to program small quantities of devices for prototype evaluation and for small pre-production runs. Please refer to Table 14, Ordering Information, for the specific order codes Large production quantities can be special programmed at Peregrine for an additional charge. Please contact Peregrine Sales for pricing and leadtime at [email protected]. ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 13 of 17 PE3342 Product Specification Figure 9. Package Drawing 24-lead TSSOP TOP VIEW 0.65BSC 24 23 22 21 20 19 18 17 16 15 14 13 12o REF 3.20 2X 0.20 R 0.90 MIN 4.40 ± 0.10 Ø1.00 ± 0.10 R 0.90 MIN GAGE PLANE 1.00 0.25 -B- 1.00 1 2 3 4 5 6 7 8 9 10 11 12 12o REF .20 C B A 0o 8o +.15 0.60 -.10 1.0 REF 0.325 -A- 7.80 ± 0.10 0.90 ± 0.05 1.10 MAX -C0.10 C 0.30 MAX 0.10 C B A FRONT VIEW ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 14 of 17 0.10 ± 0.05 6.40 SIDE VIEW Document No. 70-0091-03 │ UltraCMOS™ RFIC Solutions PE3342 Product Specification Figure 10. Package Drawing 20-lead QFN 4.00 INDEX AREA 2.00 X 2.00 2.00 4.00 2.00 -B- 0.25 C 0.90 -A- 0.10 C 0.08 C SEATING PLANE -C- 0.20 REF 0.50 TYP 0.55 2.00 TYP 0.020 EXPOSED PAD & TERMINAL PADS 2.00 1.00 0.435 1.00 10 2.00 11 4.00 0.435 0.18 6 5 0.18 1 15 20 DETAIL A EXPOSED PAD 16 DETAIL A 2 0.23 1 0.10 C A B 1. DIMENSION APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 FROM TERMINAL TIP. 2. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. Document No. 70-0091-03 │ www.psemi.com ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 15 of 17 PE3342 Product Specification Table 14. Ordering Information Order Code Part Marking Description Package Shipping Method 3342-01 PE3342 PE3342-24TSSOP-62A 24-lead TSSOP 62 units / Tube 3342-02 PE3342 PE3342-24TSSOP-2000C 24-lead TSSOP 2000 units / T&R 3342-03 PE3342 PE3342-20QFN4x4-92A 20-lead QFN 3342-04 PE3342 PE3342-20QFN4x4-3000C 20-lead QFN 3342-53 PE3342 PE3342G-20QFN4x4-92A Green 20-lead QFN 3342-54 PE3342 PE3342G-20QFN4x4-3000C Green 20-lead QFN 3000 units / T&R 3342-31 PE3342 PE3342-24TSSOP-62A (3GHz grade) 24-lead TSSOP 62 units / Tube 3342-32 PE3342 PE3342-24TSSOP-2000C (3GHz grade) 24-lead TSSOP 91 units / Tube 624 units / Tray 3000 units / T&R 91 units / Tube 624 units / Tray 2000 units / T&R 91 units / Tube 3342-33 PE3342 PE3342-20QFN4x4-92A (3GHz grade) 20-lead QFN 3342-34 PE3342 PE3342-20QFN4x4-3000C (3GHz grade) 20-lead QFN 3000 units / T&R 3342-00 PE3342-EK PE3342-24TSSOP-EK (TSSOP) Evaluation Kit 1 / Box 3342-05 PE3342-EK PE3342-20QFN4x4-EK (QFN) Evaluation Kit 1 / Box 3342-06 PE3342-PK PE3342-24TSSOP-PK (TSSOP) Programming Kit 1 / Box 3342-07 PE3342-PK PE3342-20QFN4x4-PK (QFN) Programming Kit 1 / Box ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 16 of 17 624 units / Tray Document No. 70-0091-03 │ UltraCMOS™ RFIC Solutions PE3342 Product Specification Sales Offices The Americas North Asia Pacific Peregrine Semiconductor Corporation Peregrine Semiconductor K.K. 9450 Carroll Park Drive San Diego, CA 92121 Tel 858-731-9400 Fax 858-731-9499 5A-5, 5F Imperial Tower 1-1-1 Uchisaiwaicho, Chiyoda-ku Tokyo 100-0011 Japan Tel: +81-3-3502-5211 Fax: +81-3-3502-5213 Europe Peregrine Semiconductor, Korea Peregrine Semiconductor Europe #B-2402, Kolon Tripolis, #210 Geumgok-dong, Bundang-gu, Seongnam-si Gyeonggi-do, 463-480 S. Korea Tel: +82-31-728-4300 Fax: +82-31-728-4305 Bâtiment Maine 13-15 rue des Quatre Vents F- 92380 Garches, France Tel: +33-1-47-41-91-73 Fax : +33-1-47-41-91-73 South Asia Pacific Space and Defense Products Peregrine Semiconductor, China Americas: Tel: 505-881-0438 Fax: 505-881-0443 Europe, Asia Pacific: 180 Rue Jean de Guiramand 13852 Aix-En-Provence cedex 3, France Tel: +33(0) 4 4239 3361 Fax: +33(0) 4 4239 7227 Shanghai, 200040, P.R. China Tel: +86-21-5836-8276 Fax: +86-21-5836-7652 For a list of representatives in your area, please refer to our Web site at: www.psemi.com Data Sheet Identification Advance Information The product is in a formative or design stage. The data sheet contains design target specifications for product development. Specifications and features may change in any manner without notice. Preliminary Specification The data sheet contains preliminary data. Additional data may be added at a later date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product. Product Specification The data sheet contains final data. In the event Peregrine decides to change the specifications, Peregrine will notify customers of the intended changes by issuing a DCN (Document Change Notice). Document No. 70-0091-03 │ www.psemi.com The information in this data sheet is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be entirely at the user’s own risk. No patent rights or licenses to any circuits described in this data sheet are implied or granted to any third party. Peregrine’s products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. The Peregrine name, logo, and UTSi are registered trademarks and UltraCMOS and HaRP are trademarks of Peregrine Semiconductor Corp. ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 17 of 17