SKYWORKS CX77144

DATA SHEET
CX77144: Power Amplifier Module for CDMA (887–925 MHz)
Applications
Description
• CDMA for Japan
The CX77144 Power Amplifier Module (PAM) is a fully matched, 10-pin surface mount module
developed for cellular handset applications utilizing Code Division Multiple Access (CDMA) and
Wireless Local Loop (WLL). This small and efficient power amplifier module packs a full 887–925 MHz
bandwidth coverage into a single compact package. The device meets the stringent IS95
requirements up 27.5 dBm output power and up to 27 dBm for CDMA2000. A low current digital pin
(VCONT) provides improved efficiency for the low RF power range of operation.
• Wireless Local Loop (WLL)
Features
• Low voltage positive bias
supply
- 3.2 V to 4.2 V
• Low VREF
- 2.85 V, nominal
• Good linearity
• High efficiency
• Large dynamic range
• 10-pin package
- 4 mm x 4 mm x 1.5 mm
• Power down control
The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active
circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage
matching circuits. The output match is realized off-chip and within the module package to optimize
efficiency and power performance into a 50 Ω load. This device is manufactured with Skyworks’ GaAs
Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage DC supply
operation while maintaining high efficiency and good linearity. Primary bias to the CX77144 is
supplied directly from a three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output
in the range of 3.2 to 4.2 volts. Power down is accomplished by setting the voltage on the low current
reference pin to zero volts. No external supply side switch is needed as typical “off” leakage is a few
microamperes with full primary voltage supplied from the battery.
• Low power–state control
• InGaP
• CDMA2000 / IS95
Figure 1. Functional Block Diagram
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DATA SHEET • CX77144
POWER AMPLIFIER MODULE FOR CDMA (887–925 MHZ)
Electrical Specifications
The following tables list the electrical characteristics of the
CX77144 Power Amplifier. Table 1 shows the absolute maximum
ratings and Table 2 lists the recommended operating conditions
for achieving the electrical performance listed in Table 4. Table 5
shows the specifications for recommended operating conditions.
Table 3 lists the settings for the power ranges.
Table 1. Absolute Maximum Ratings (1)
Characteristic
Symbol
Minimum
Nominal
Maximum
Unit
RF Input Power
PIN
—
0.0
7.0
dBm
Supply Voltage
VCC
—
3.5
6.0
Volts
Reference Voltage
VREF
—
2.85
3.1
Volts
Case Operating Temperature (2)
TC
–30
+25
+85
°C
Case Storage Temperature
TSTG
–55
—
+125
°C
Unit
(1) No damage assuming only one parameter is set at limit at a time with all other parameters set at nominal value.
(2) Case Operating Temperature refers to the temperature of the GROUND PAD at the underside of the package.
Table 2. Recommended Operating Conditions
Characteristic
Symbol
Supply Voltage
Minimum
Nominal
Maximum
VCC1
1.4
3.5
4.2
VCC2
1.4
3.5
4.2
Volts
VBIAS
3.2
3.5
4.2
PA ON
VREF
2.75
2.85
2.95
PA OFF
VREF
—
—
< 0.5
High Bias Mode VCONT
0.0
—
0.5
Low Bias Mode
VCONT
2.5
—
3.0
Operating Frequency
FO
887
906
925
MHz
Case Operating Temperature (1)
TC
–30
—
+85
°C
Reference Voltage
Mode Input Impedance > 2.5 kΩ
Volts
Volts
(1) Case Operating Temperature refers to the temperature of the GROUND PAD at the underside of the package.
Table 3. Power Range Truth Table
VREF
VCONT
Output Power
High Power
Power Setting
2.85 V
0.0 V–0.5 V
18 dBm to 27 dBm
Low Power
2.85 V
2.5 V–3.0 V
≤ 18 dBm
Shut Down
0.0 V
0.0 V
—
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POWER AMPLIFIER MODULE FOR CDMA (887–925 MHZ)
DATA SHEET • CX77144
Table 4. Electrical Specifications for CDMA Nominal Operating Conditions (1)
Characteristics
Symbol
Typical
Maximum
24.0
26.0
VCONT ≥ 2.5 V
PO = 18 dBm
22.0
GHIGH
VCONT ≤ 0.5 V
PO = 27 dBm
26.5
27.5
29.0
PAELOW (2)
VCONT ≥ 2.5 V
PO = 18 dBm
26.0
30.0
—
PAEHIGH
VCONT ≤ 0.5 V
PO = 27 dBm
37.0
40.0
—
ICC_LOW (2)
PO = 18 dBm
—
150
175
ICC_HIGH
PO = 27 dBm
—
355
390
IQ_LOW (2)
VCONT ≥ 2.5 V
50
60
70
IQ_HIGH
VCONT ≤ 0.5 V
65
80
95
Power Added Efficiency
Quiescent current
Minimum
GLOW (2)
Gain conditions Digital Mode
Total Supply current
Condition
dB
%
mA
mA
Reference Current
IREF
—
2.5
5.0
mA
Control Current
ICONT
VCONT = 2.5 V
—
0.315
0.5
mA
Total Supply current in Power-down Mode
IPD
VREF = 0 V
VCONT = 0 V
—
2.0
5.0
µA
ACP1LOW (2)
VCONT ≥ 2.5 V
PO ≤ 18 dBm
—
–50.0
–47.7
ACP1HIGH
VCONT ≤ 0.5 V
PO ≤ 27 dBm
—
–50.0
–47.0
ACP2LOW (2)
VCONT ≥ 2.5 V
PO ≤ 18 dBm
—
–62.0
–58.5
ACP2HIGH
VCONT ≤ 0.5 V
PO ≤ 27 dBm
—
–60.0
–58.5
Second
FO2
PO ≤ 27 dBm
—
—
–35.0
Third
FO3
PO ≤ 27 dBm
—
—
–40.0
Noise Power in RX Band 832-870 MHz
RxBN
PO ≤ 27 dBm
—
–138
–137
dBm/Hz
Noise Figure
NF
—
—
4.5
5.0
dB
Input Voltage Standing Wave Ratio
VSWR
—
—
1.5:1
2.0:1
—
Stability (Spurious output)
S
5:1 VSWR
All phases
—
—
–60.0
dBc
Ruggedness – No damage (5)
Ru
PO ≤ 27 dBm
10:1
—
—
VSWR
885 kHz offset
Adjacent Channel Power (3)(4)
1.98 MHz offset
Harmonic Suppression
—
Unit
dBc
dBc
(1) VCC1 = +3.5 V, VBIAS = +3.5 V, VREF = +2.85 V, Freq = 906 MHz, TC = +25 °C, unless otherwise specified.
(2) For low power mode, VCC1 and VCC2 = 1.4 V
(3) ACP is specified per CDMA2000 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW.
(4) CDMA2000 is configured as DCCH = 9600, SCHO = 9600, PCH (Walsh 0) = –3.75 dB, and Peak-to-Average Ratio (CCDF = 1%) = 4.5 dB.
For IS95, PO = 27.5 dBm is acceptable to meet the specified ACPR values.
(5) All phases, time = 10 seconds.
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DATA SHEET • CX77144
POWER AMPLIFIER MODULE FOR CDMA (887–925 MHZ)
Table 5. Electrical Specifications for CDMA Recommended Operating Conditions (1)
Characteristics
Symbol
Condition
Min.
Max.
27.5
GLOW (2)
VCONT ≥ 2.5 V
PO = 18 dBm
20.8
GHIGH
VCONT ≤ 0.5 V
PO = 27 dBm
25.4
Reference Current
IREF
—
—
5.0
mA
Control Current
ICONT
VCONT = 2.5 V
—
0.5
mA
Total Supply current in Power-down Mode
IPD
VREF = 0 V
VCONT = 0 V
—
5.0
µA
ACP1LOW (2)
VCONT ≥ 2.5 V
PO ≤ 18 dBm
—
–44.0
ACP1HIGH
VCONT ≤ 0.5 V
PO ≤ 27 dBm
—
–44.0
ACP2LOW (2)
VCONT ≥ 2.5 V
PO ≤ 18 dBm
—
–56.0
ACP2HIGH
VCONT ≤ 0.5 V
PO ≤ 27 dBm
—
–56.0
Second
FO2
PO ≤ 27 dBm
—
–35.0
Third
FO3
PO ≤ 27 dBm
—
–40.0
Noise Power in RX Band 832-870 MHz
RxBN
PO ≤ 27 dBm
—
–136
dBm/Hz
Noise Figure
NF
—
—
6.0
dB
Input Voltage Standing Wave Ratio
VSWR
—
—
2.0:1
—
—
–60.0
dBc
10:1
—
VSWR
Gain conditions Digital Mode
885 kHz offset
Adjacent Channel Power (3)(4)
1.98 MHz offset
Harmonic Suppression
Stability (Spurious output)
S
5:1 VSWR
All phases
Ruggedness – No damage (5)
Ru
PO ≤ 27 dBm
dB
30.7
(1) Per Table 2, unless otherwise specified.
(2) For low power mode, VCC1 and VCC2 = 1.4 V
(3) ACP is specified per CDMA2000 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW.
(4) CDMA2000 is configured as DCCH = 9600, SCHO = 9600, PCH (Walsh 0) = –3.75 dB, and Peak-to-Average Ratio (CCDF = 1%) = 4.5 dB.
For IS95, PO = 27.5 dBm is acceptable to meet the specified ACPR values.
(5) All phases, time = 10 seconds.
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Unit
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dBc
dBc
POWER AMPLIFIER MODULE FOR CDMA (887–925 MHZ)
Characterization Data
The charts in Figure 2 through Figure 6 illustrate the
characteristics of a typical CX77144 power amplifier designed for
operation in the CDMA frequency band (887–925 MHz). Shown
are power sweep characteristics for key performance parameters
over temperature and frequency, up to 27 dBm output power.
DATA SHEET • CX77144
Each chart shows two sets of data to illustrate the characteristics
in Low Mode and High Mode. This amplifier was selected by
characterizing a group of devices and choosing a part with
average electrical performance for both nominal and the full
range of recommended operating conditions, including worst case
limits.
Figure 2. PAE vs. Output Power
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DATA SHEET • CX77144
POWER AMPLIFIER MODULE FOR CDMA (887–925 MHZ)
Figure 3. Gain vs. Output Power
Figure 4. Total Supply Current vs. Output Power
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POWER AMPLIFIER MODULE FOR CDMA (887–925 MHZ)
DATA SHEET • CX77144
Figure 5. ACPR1 vs. Output Power
Figure 6. ACPR2 vs. Output Power
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DATA SHEET • CX77144
POWER AMPLIFIER MODULE FOR CDMA (887–925 MHZ)
Evaluation Board Description
The evaluation board is a platform for testing and interfacing
design circuitry. To accommodate the interface testing of the
CX77144, the evaluation board schematic and diagrams are
included for preliminary analysis and design. Figure 7 shows the
basic schematic of the board for the 887 MHz to 925 MHz range
and Figure 8 is the assembly diagram.
Figure 7. Evaluation Board Schematic
Figure 8. Evaluation Board Assembly Diagram
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POWER AMPLIFIER MODULE FOR CDMA (887–925 MHZ)
Package Dimensions and Pin Descriptions
The CX77144 is a multi-layer laminate base, overmold
encapsulated modular package designed for surface mount solder
attachment to a printed circuit board. Figure 9 is a mechanical
DATA SHEET • CX77144
drawing of the pad layout for this package. Figure 10 shows the
pin names and the pin numbering convention, which starts with
pin 1 in the upper left and increments counter-clockwise around
the package. Figure 11 illustrates typical case markings.
Figure 9. CX77144 Package Dimensional Drawing – All Views
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DATA SHEET • CX77144
POWER AMPLIFIER MODULE FOR CDMA (887–925 MHZ)
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks’
Application Note: Tape and Reel, Document Number 101568.
Electrostatic Discharge Sensitivity
The CX77144 is a Class I device. Electrostatic Discharge (ESD)
immunity levels for each pin of the CX77144 product are shown in
Figure 12, using the Human Body Model, and in Figure 13, using
the Machine Model.
Figure 10. Pin Names and Configuration (Top View)
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards,
which fail devices only after “the pin fails the electrical
specification limits” or “the pin becomes completely nonfunctional”. Skyworks employs most stringent criteria, fails
devices as soon as the pin begins to show any degradation on a
curve tracer.
If ESD damage threshold magnitude is found to consistently
exceed 2000 volts on a given pin, this so is indicated. If ESD
damage threshold below 2000 volts is measured for either
polarity, numbers are indicated that represent the worst case
values observed in product characterization.
Human Body Model (HBM)
Figure 11. Typical Case Markings
The numbers in Figure 12 specify the ESD threshold level for each
pin where the I-V curve between the pin and ground starts to
show degradation. ESD testing was performed in compliance with
MIL-STD-883E Method 3015.7 using the Human Body Model
(HBM).
Package and Handling Information
Because of its sensitivity for moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The CX77144 is capable of withstanding an MSL3/250 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment. If
the part is attached in a reflow oven, the temperature ramp rate
should not exceed 5 °C per second; maximum temperature should
not exceed 250 °C. If the part is manually attached, precaution
should be taken to insure that the part is not subjected to
temperatures exceeding 250 °C for more than 10 seconds. For
details on both attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to Skyworks’
Figure 12. ESD Sensitivity Areas – Human Body Model (Top View)
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POWER AMPLIFIER MODULE FOR CDMA (887–925 MHZ)
Machine Model (MM)
The numbers in Figure 13 specify the ESD threshold level for each
pin where the I-V curve between the pin and ground starts to
show degradation. ESD testing was performed in compliance with
JESD22-A115B using the Machine Model (MM) and has met the
classification criteria for Class B
DATA SHEET • CX77144
To avoid ESD damage, both latent and visible, it is very important
that the product assembly and test areas observe the Class-1 ESD
practices for handling GaAs IC-based products to avoid induced
damage.
• Personnel Grounding
- Wrist Straps
- Conductive Smocks, Gloves and Finger Cots
- Anti-static ID Badges
• Facility
- Relative Humidity Control and Air Ionizers
- Dissipative Floors (less than 109 Ω to GND)
• Protective Workstation
- Dissipative Table Tops
- Protective Test Equipment (Properly Grounded)
- Grounded Tip Soldering Irons
- Conductive Solder Suckers
- Static Sensors
Figure 13. ESD Sensitivity Areas – Machine Model (Top View)
• Protective Packaging and Transportation
- Bags and Pouches (Faraday Shield)
- Protective Tote Boxes (Conductive Static Shielding)
- Protective Trays
- Grounded Carts
- Protective Work Order Holders
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Ordering Information
Model Number
Manufacturing
Part Number
Product Revision
Package
Operating Temperature
CX77144
CX77144–15
–15
4x4LM
–30 °C to +85 °C
Level
Date
Revision History
Revision
A
June 9, 2004
Description
Initial Release
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752.
Application Note: Tape and Reel, Document Number 101568
Standard SMT Reflow Profiles: JEDEC Standard J–STD–020.
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descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties
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