ea s ht e v tp is :// it pa fo na llo so win ni g c. U co R .jp L a /s bo em u ic t la on te /e st -in in de for x. ma ht t m ion l . M Di ain sc te on na tin nc ue e/ d DATA SHEET AN15861A Package Code No. QFP044-P-1010F Pl Part No. SEMICONDUCTOR COMPANY MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. Publication date: November 2005 SDB00112AEB 1 AN15861A Contents Features ………………………………………………….…………………………………………………………. 3 Applications .…………………………………………….…………………………………………………………. 3 Package ………………………………………………….…………………………………………………………. 3 Application Circuit Example ………………………………………………………………………………………….4 Block Diagram ………………………………………….…………………………………………………………. 5 M Di ain sc te on na tin nc ue e/ d Pin Description ………………………………………….…………………………………………………………. 6 Absolute Maximum Ratings ………………………….…………………………………………………………. 7 Pl ea s ht e v tp is :// it pa fo na llo so win ni g c. U co R .jp L a /s bo em u ic t la on te /e st -in in de for x. ma ht t m ion l . Operating Supply Voltage Range …………………….…………………………………………………………. 7 SDB00112AEB 2 AN15861A AN15861A AV Switch IC Features y 12-input 4-output channel audio switch IC Application M Di ain sc te on na tin nc ue e/ d y Color TV Package Pl ea s ht e v tp is :// it pa fo na llo so win ni g c. U co R .jp L a /s bo em u ic t la on te /e st -in in de for x. ma ht t m ion l . y Quad 44-pin plastic package (QFP type) SDB00112AEB 3 ea s ht e v tp is :// it pa fo na llo so win ni g c. U co R .jp L a /s bo em u ic t la on te /e st -in in de for x. ma ht t m ion l . Pl M Di ain sc te on na tin nc ue e/ d AN15861A Application Circuit Example SDB00112AEB 4 ea s ht e v tp is :// it pa fo na llo so win ni g c. U co R .jp L a /s bo em u ic t la on te /e st -in in de for x. ma ht t m ion l . Pl M Di ain sc te on na tin nc ue e/ d AN15861A Block Diagram SDB00112AEB 5 AN15861A Pin Descriptions Pin No. Description Pin No. Description L1 23 L-out4 2 R1 24 R-out4 3 L2 25 L-out3 4 R2 26 R-out3 5 VCC1 27 GND1 M Di ain sc te on na tin nc ue e/ d 1 VCC2 28 GND2 7 L3 29 L-out2 8 R3 30 R-out2 9 L4 31 ADR 10 R4 32 SCL 11 N.C. 33 SDA 12 L5 34 L-out1 13 R5 35 R-out1 14 L6 36 BIAS 15 R6 37 L9 16 L7 38 R9 17 R7 39 L10 18 L8 40 R10 19 R8 41 L11 20 Mute 42 R11 21 N.C. 43 L12 22 VD 44 R12 Pl ea s ht e v tp is :// it pa fo na llo so win ni g c. U co R .jp L a /s bo em u ic t la on te /e st -in in de for x. ma ht t m ion l . 6 SDB00112AEB 6 AN15861A Absolute Maximum Ratings No. Parameter 1 Supply voltage 2 Symbol Rating VCC1 14 VCC2 14 Unit Note — V — 3 Supply current ICC — mA — 4 Power dissipation PD 448 mW *1 5 Storage temperature Tstg –55 to +125 °C *2 Operating ambient temperature Topr –20 to +75 °C *2 7 Operating ambient atmospheric pressure Popr 1.013 × 105 ± 0.61 × 105 Pa — 8 Operating constant gravity Gopr 9 810 m/s2 — 9 Operating shock Sopr 4 900 m/s2 — M Di ain sc te on na tin nc ue e/ d 6 ea s ht e v tp is :// it pa fo na llo so win ni g c. U co R .jp L a /s bo em u ic t la on te /e st -in in de for x. ma ht t m ion l . Note) *1: The above power dissipation shows the package power dissipation for this IC mounted on PCB at Ta = 75°C, in free-air. *2: Except for the storage temperature and operating ambient temperature, all ratings are for Ta = 25°C. Operating Supply Voltage Range Operating Supply Voltage Range Symbol Range VCC1 8.1 to 9.9 VCC2 8.1 to 9.9 Unit Note — V — Pl Parameter SDB00112AEB 7 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. M Di ain sc te on na tin nc ue e/ d (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. ea s ht e v tp is :// it pa fo na llo so win ni g c. U co R .jp L a /s bo em u ic t la on te /e st -in in de for x. ma ht t m ion l . (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. Pl (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. Industrial Co., Ltd.