1bCY7C185 CY7C185 8K x 8 Static RAM Functional Description[1] Features • High speed The CY7C185 is a high-performance CMOS static RAM organized as 8192 words by 8 bits. Easy memory expansion is provided by an active LOW chip enable (CE1), an active HIGH chip enable (CE2), and active LOW output enable (OE) and tri-state drivers. This device has an automatic power-down feature (CE1 or CE2), reducing the power consumption by 70% when deselected. The CY7C185 is in a standard 300-mil-wide DIP, SOJ, or SOIC package. — 15 ns • Fast tDOE • Low active power — 715 mW • Low standby power — 85 mW An active LOW write enable signal (WE) controls the writing/reading operation of the memory. When CE1 and WE inputs are both LOW and CE2 is HIGH, data on the eight data input/output pins (I/O0 through I/O7) is written into the memory location addressed by the address present on the address pins (A0 through A12). Reading the device is accomplished by selecting the device and enabling the outputs, CE1 and OE active LOW, CE2 active HIGH, while WE remains inactive or HIGH. Under these conditions, the contents of the location addressed by the information on address pins are present on the eight data input/output pins. • CMOS for optimum speed/power • Easy memory expansion with CE1, CE2 and OE features • TTL-compatible inputs and outputs • Automatic power-down when deselected • Available in non Pb-free 28-pin (300-Mil) Molded SOJ, 28-pin (300-Mil) Molded SOIC and both Pb-free and non Pb-free in 28-pin (300-Mil) Molded DIP The input/output pins remain in a high-impedance state unless the chip is selected, outputs are enabled, and write enable (WE) is HIGH. A die coat is used to insure alpha immunity. Logic Block Diagram Pin Configurations DIP/SOJ Top View I/O0 INPUT BUFFER I/O2 SENSE AMPS A1 A2 A3 A4 A5 A6 A7 A8 ROW DECODER I/O1 8K x 8 ARRAY I/O3 I/O4 I/O5 I/O6 CE1 CE2 WE COLUMN DECODER POWER DOWN NC A4 A5 A6 A7 A8 A9 A10 A11 A12 I/O0 I/O1 I/O2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VCC WE CE2 A3 A2 A1 OE A0 CE1 I/O7 I/O6 I/O5 I/O4 I/O3 I/O7 A12 A11 A10 A0 A9 OE Selection Guide -15 15 130 15 Maximum Access Time (ns) Maximum Operating Current (mA) Maximum CMOS Standby Current (mA) -20 20 110 15 -25 25 100 15 -35 35 100 15 Notes: 1. For guidelines on SRAM system design, please refer to the ‘System Design Guidelines’ Cypress application note, available on the internet at www.cypress.com. Cypress Semiconductor Corporation Document #: 38-05043 Rev. *B • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised July 24, 2006 [+] Feedback CY7C185 Maximum Ratings Output Current into Outputs (LOW)............................. 20 mA (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ................................. –65°C to +150°C Ambient Temperature with Power Applied............................................. –55°C to +125°C Static Discharge Voltage........................................... >2001V (per MIL-STD-883, Method 3015) Latch-Up Current .................................................... >200 mA Operating Range Supply Voltage to Ground Potential ............... –0.5V to +7.0V Range DC Voltage Applied to Outputs in High Z State[2] ............................................ –0.5V to +7.0V Commercial DC Input Voltage[2] ......................................... –0.5V to +7.0V Industrial Ambient Temperature VCC 0°C to +70°C 5V ± 10% –40°C to +85°C 5V ± 10% Electrical Characteristics Over the Operating Range –15 Parameter Description Test Conditions Min. –20 Max. Min. 2.4 –25, -35 Max. Min. VOH Output HIGH Voltage VCC = Min., IOH = –4.0 mA 2.4 VOL Output LOW Voltage VCC = Min., IOL = 8.0 mA VIH Input HIGH Voltage 2.2 VCC + 0.3V 2.2 VCC + 0.3V VIL Input LOW Voltage[2] –0.5 0.8 –0.5 IIX Input Leakage Current GND ≤ VI ≤ VCC –5 +5 IOZ Output Leakage GND ≤ VI ≤ VCC, Current Output Disabled –5 +5 ICC VCC Operating VCC = Max., Supply Current IOUT = 0 mA 130 ISB1 Automatic Power-Down Current Max. VCC, CE1 ≥ VIH or CE2 ≤ VIL Min. Duty Cycle =100% ISB2 Automatic Power-Down Current Max. VCC, CE1 ≥ VCC – 0.3V, or CE2 ≤ 0.3V VIN ≥ VCC – 0.3V or VIN ≤ 0.3V 0.4 Max. 2.4 0.4 Unit V 0.4 V 2.2 VCC + 0.3V V 0.8 –0.5 0.8 V –5 +5 –5 +5 µA –5 +5 –5 +5 µA 110 100 mA 40 20 20 mA 15 15 15 mA Capacitance[3] Parameter Description CIN Input Capacitance COUT Output Capacitance Test Conditions TA = 25°C, f = 1 MHz, VCC = 5.0V Max. Unit 7 pF 7 pF Notes: 2. Minimum voltage is equal to –3.0V for pulse durations less than 30 ns. 3. Tested initially and after any design or process changes that may affect these parameters. Document #: 38-05043 Rev. *B Page 2 of 12 [+] Feedback CY7C185 AC Test Loads and Waveforms R1 481 Ω 5V OUTPUT 30 pF INCLUDING JIG AND SCOPE R1 481 Ω 5V OUTPUT 5 pF R2 255Ω INCLUDING JIGAND SCOPE (a) ALL INPUT PULSES 3.0V 10% GND R2 255Ω 90% 10% 90% ≤ 5 ns ≤ 5 ns Equivalent to: (b) THÉVENIN EQUIVALENT 167Ω 1.73V OUTPUT Switching Characteristics Over the Operating Range[4] -15 Parameter Description Min. -20 Max. Min. -25 Max. Min. -35 Max. Min. Max. Unit Read Cycle tRC Read Cycle Time tAA Address to Data Valid 15 20 tOHA Data Hold from Address Change tACE1 CE1 LOW to Data Valid 15 20 25 35 ns tACE2 CE2 HIGH to Data Valid 15 20 25 35 ns tDOE OE LOW to Data Valid 8 9 12 15 ns tLZOE OE LOW to Low Z 15 3 5 3 Z[5] 25 20 5 3 7 35 25 5 3 ns 3 ns OE HIGH to High tLZCE1 CE1 LOW to Low Z[6] 3 5 5 5 ns tLZCE2 CE2 HIGH to Low Z 3 3 3 3 ns tHZCE CE1 HIGH to High CE2 LOW to High Z tPU CE1 LOW to Power-Up CE2 to HIGH to Power-Up tPD CE1 HIGH to Power-Down CE2 LOW to Power-Down 7 0 10 ns tHZOE Z[5, 6] 8 ns 35 8 0 15 10 10 0 20 10 0 20 ns ns ns 20 ns Write Cycle[7] tWC Write Cycle Time 15 20 25 35 ns tSCE1 CE1 LOW to Write End 12 15 20 20 ns tSCE2 CE2 HIGH to Write End 12 15 20 20 ns tAW Address Set-up to Write End 12 15 20 25 ns tHA Address Hold from Write End 0 0 0 0 ns tSA Address Set-up to Write Start 0 0 0 0 ns tPWE WE Pulse Width 12 15 15 20 ns tSD Data Set-up to Write End 8 10 10 12 ns tHD Data Hold from Write End 0 tHZWE WE LOW to High Z[5] tLZWE WE HIGH to Low Z 0 7 3 0 7 5 0 7 5 ns 8 5 ns ns Notes: 4. Test conditions assume signal transition time of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified IOL/IOH and 30-pF load capacitance. 5. tHZOE, tHZCE, and tHZWE are specified with CL = 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady state voltage. 6. At any given temperature and voltage condition, tHZCE is less than tLZCE1 and tLZCE2 for any given device. 7. The internal write time of the memory is defined by the overlap of CE1 LOW, CE2 HIGH, and WE LOW. All 3 signals must be active to initiate a write and either signal can terminate a write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write. Document #: 38-05043 Rev. *B Page 3 of 12 [+] Feedback CY7C185 Switching Waveforms Read Cycle No.1[8,9] tRC ADDRESS tOHA DATA OUT tAA PREVIOUS DATA VALID DATA VALID Read Cycle No.2[10,11] tRC CE1 CE2 tACE OE OE tHZOE tDOE DATA OUT tLZOE HIGH IMPEDANCE tHZCE HIGH IMPEDANCE DATA VALID tLZCE VCC SUPPLY CURRENT tPD tPU ICC 50% 50% ISB Notes: 8. Device is continuously selected. OE, CE1 = VIL. CE2 = VIH. 9. WE is HIGH for read cycle. 10. Data I/O is High Z if OE = VIH, CE1 = VIH, WE = VIL, or CE2=VIL. 11. The internal write time of the memory is defined by the overlap of CE1 LOW, CE2 HIGH and WE LOW. CE1 and WE must be LOW and CE2 must be HIGH to initiate write. A write can be terminated by CE1 or WE going HIGH or CE2 going LOW. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write. Document #: 38-05043 Rev. *B Page 4 of 12 [+] Feedback CY7C185 Switching Waveforms (continued) Write Cycle No. 1 (WE Controlled)[9,11] tWC ADDRESS tSCEI CE1 tAW tHA tSCE2 CE CE 2 tSA WE tPWE OE tSD DATA I/O tHD DATA IN VALID NOTE 12 tHZOE Write Cycle No. 2 (CE Controlled)[11,12,13] tWC ADDRESS tSCE1 CE1 tSA tSCE2 CE2 tAW tHA WE tSD DATA I/O tHD DATA IN VALID Notes: 12. During this period, the I/Os are in the output state and input signals should not be applied. 13. The minimum write cycle time for write cycle #3 (WE controlled, OE LOW) is the sum of tHZWE and tSD. Document #: 38-05043 Rev. *B Page 5 of 12 [+] Feedback CY7C185 Switching Waveforms (continued) Write Cycle No. 3(WE Controlled, OE LOW)[11,12,13,14] tWC ADDRESS CE1 tSCE1 CE2 tSCE2 tAW tHA tSA WE tSD DATA I/O NOTE 12 tHD DATA IN VALID tHZWE tLZWE Note: 14. If CE1 goes HIGH or CE2 goes LOW simultaneously with WE HIGH, the output remains in a high-impedance state. Document #: 38-05043 Rev. *B Page 6 of 12 [+] Feedback CY7C185 NORMALIZED SUPPLY CURRENT vs. AMBIENT TEMPERATURE NORMALIZED SUPPLY CURRENT vs. SUPPLY VOLTAGE 1.2 SB 1.2 I CC 0.8 0.6 0.4 4.5 5.0 0.8 0.6 0.4 V CC=5.0V V IN=5.0V 5.5 ISB 0.0 –55 6.0 NORMALIZED ACCESS TIME vs. AMBIENT TEMPERATURE NORMALIZED ACCESS TIME vs. SUPPLY VOLTAGE 1.6 1.4 1.3 NORMALIZED tAA NORMALIZED t AA 125 1.2 1.1 TA =25°C 1.0 1.4 1.2 1.0 VCC =5.0V 0.8 0.9 0.8 4.0 4.5 5.0 5.5 SUPPLY VOLTAGE (V) 0.6 –55 6.0 2.5 25.0 DELTA tAA (ns) 30.0 2.0 1.5 1.0 0.5 25 3.0 4.0 SUPPLY VOLTAGE (V) Document #: 38-05043 Rev. *B 80 VCC =5.0V TA =25°C 60 40 20 0 0.0 5.0 2.0 3.0 4.0 OUTPUT VOLTAGE (V) OUTPUT SINK CURRENT vs. OUTPUT VOLTAGE 140 120 100 VCC =5.0V TA =25°C 80 60 40 20 0 0.0 125 20.0 15.0 10.0 0.0 1.0 1.0 2.0 3.0 OUTPUT VOLTAGE (V) 4.0 NORMALIZED I CC vs. CYCLE TIME 1.25 VCC =4.5V TA =25°C 5.0 2.0 100 TYPICAL ACCESS TIME CHANGE vs. OUTPUT LOADING 3.0 1.0 120 AMBIENT TEMPERATURE (°C) TYPICAL POWER-ON CURRENT vs. SUPPLY VOLTAGE 0.0 0.0 OUTPUT SOURCE CURRENT vs. OUTPUT VOLTAGE AMBIENT TEMPERATURE (°C) SUPPLY VOLTAGE (V) NORMALIZED I PO 25 OUTPUT SINK CURRENT (mA) 0.0 4.0 I CC 0.2 I SB 0.2 1.0 0 200 400 600 800 1000 CAPACITANCE (pF) NORMALIZED I CC 1.0 NORMALIZED I,CC I NORMALIZED I,CCI SB 1.4 OUTPUT SOURCE CURRENT (mA) Typical DC and AC Characteristics VCC =5.0V TA =25°C VCC =0.5V 1.00 0.75 0.50 10 20 30 40 CYCLE FREQUENCY (MHz) Page 7 of 12 [+] Feedback CY7C185 Truth Table CE1 CE2 WE OE H X X X High Z Input/Output Deselect/Power-Down Mode X L X X High Z Deselect/Power-Down L H H L Data Out Read L H L X Data In Write L H H H High Z Deselect Address Designators Address Name Address Function Pin Number A4 X3 2 A5 X4 3 A6 X5 4 A7 X6 5 A8 X7 6 A9 Y1 7 A10 Y4 8 A11 Y3 9 A12 Y0 10 A0 Y2 21 A1 X0 23 A2 X1 24 A3 X2 25 Ordering Information Speed (ns) 15 Ordering Code CY7C185-15VC Package Name 51-85031 CY7C185-15VI 20 CY7C185-20PC 51-85014 CY7C185-20PXC 25 35 Package Type 28-pin (300-Mil) Molded SOJ Commercial 28-pin (300-Mil) Molded SOJ Industrial 28-pin (300-Mil) Molded DIP Commercial 28-pin (300-Mil) Molded DIP (Pb-free) CY7C185-20VC 51-85031 28-pin (300-Mil) Molded SOJ CY7C185-25PC 51-85014 28-pin (300-Mil) Molded DIP CY7C185-25VC 51-85031 28-pin (300-Mil) Molded SOJ CY7C185-35PC 51-85014 28-pin (300-Mil) Molded DIP CY7C185-35SC 51-85026 28-pin (300-Mil) Molded SOIC Document #: 38-05043 Rev. *B Operating Range Commercial Commercial Page 8 of 12 [+] Feedback CY7C185 Package Diagrams 28-pin (300-Mil) PDIP (51-85014) SEE LEAD END OPTION 14 1 DIMENSIONS IN INCHES [MM] MIN. MAX. REFERENCE JEDEC MO-095 0.260[6.60] 0.295[7.49] 15 PACKAGE WEIGHT: 2.15 gms 28 0.030[0.76] 0.080[2.03] SEATING PLANE 1.345[34.16] 1.385[35.18] 0.290[7.36] 0.325[8.25] 0.120[3.05] 0.140[3.55] 0.140[3.55] 0.190[4.82] 0.115[2.92] 0.160[4.06] 0.015[0.38] 0.060[1.52] 0.090[2.28] 0.110[2.79] 0.009[0.23] 0.012[0.30] 0.055[1.39] 0.065[1.65] 0.310[7.87] 0.385[9.78] 0.015[0.38] 0.020[0.50] LEAD END OPTION 3° MIN. SEE LEAD END OPTION 51-85014-*D (LEAD #1, 14, 15 & 28) Document #: 38-05043 Rev. *B Page 9 of 12 [+] Feedback CY7C185 Package Diagrams (continued) 28-pin (300-Mil) Molded SOIC (51-85026) NOTE : PIN 1 ID 1. JEDEC STD REF MO-119 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT 14 DOES INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE. 1 MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE 3. DIMENSIONS IN INCHES 0.291[7.39] MIN. MAX. 4. PACKAGE WEIGHT 0.85gms 0.300[7.62] 0.394[10.01] * 0.419[10.64] 15 28 PART # S28.3 STANDARD PKG. SZ28.3 LEAD FREE PKG. 0.026[0.66] 0.032[0.81] SEATING PLANE 0.697[17.70] 0.713[18.11] 0.092[2.33] 0.105[2.67] 0.004[0.10] 0.050[1.27] 0.013[0.33] 0.004[0.10] 0.019[0.48] 0.0118[0.30] * 0.015[0.38] 0.050[1.27] 0.0091[0.23] 0.0125[3.17] * TYP. 51-85026-*D Document #: 38-05043 Rev. *B Page 10 of 12 [+] Feedback CY7C185 Package Diagrams (continued) 28-pin (300-Mil) Molded SOJ (51-85031) NOTE : 1. JEDEC STD REF MO088 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.006 in (0.152 mm) PER SIDE MIN. MAX. 3. DIMENSIONS IN INCHES DETAIL A EXTERNAL LEAD DESIGN PIN 1 ID 14 1 0.291 0.300 15 0.330 0.350 28 OPTION 1 0.697 0.713 0.014 0.020 OPTION 2 SEATING PLANE 0.120 0.140 0.050 TYP. 0.026 0.032 0.013 0.019 A 0.007 0.013 0.004 0.025 MIN. 0.262 0.272 51-85031-*C All product and company names mentioned in this document may be the trademarks of their respective holders. Document #: 38-05043 Rev. *B Page 11 of 12 © Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. [+] Feedback CY7C185 Document History Page Document Title: CY7C185 8K x 8 Static RAM Document Number: 38-05043 REV. ECN NO. Issue Date Orig. of Change Description of Change ** 107145 09/10/01 SZV Change from Spec number: 38-00037 to 38-05043 *A 116470 09/16/02 CEA Add applications foot note to data sheet *B 486744 See ECN NXR Changed Low standby power from 220mW to 85mW Changed the description of IIX from Input Load Current to Input Leakage Current in DC Electrical Characteristics table Removed IOS parameter from DC Electrical Characteristics table Updated the Ordering Information table Document #: 38-05043 Rev. *B Page 12 of 12 [+] Feedback