STMICROELECTRONICS STFV4N150_07

STFV4N150
N-channel 1500V - 5Ω - 4A - TO-220FH
Very high voltage PowerMESH™ Power MOSFET
General features
Type
VDSS
RDS(on)
ID
Pw
STFV4N150
1500V
<7Ω
4A
40W
■
Avalanche ruggedness
■
Gate charge minimized
■
Very low intrinsic capacitances
■
High speed switching
■
Fully plastic TO-220 package
■
Creepage distance path is > 4mm
1
2
3
TO-220FH
Description
Using the well consolidated high voltage MESH
OVERLAY™ process, STMicroelectronics has
designed an advanced family of Power MOSFETs
with outstanding performances. The strengthened
layout coupled with the Company’s proprietary
edge termination structure, gives the lowest
RDS(on) per area, unrivalled gate charge and
switching characteristics. The creepage path is
what makes this package unique from TO-220FP.
The creepage distance path between each lead
and between the leads and the heatsink has been
increased to >4.0mm, making this package met
all stringent safety norms in high voltage
applications.
Internal schematic diagram
Applications
■
Switching application
Order codes
Part number
Marking
Package
Packaging
STFV4N150
FV4N150
TO-220FH
Tube
March 2007
Rev 4
1/13
www.st.com
13
Contents
STFV4N150
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
............................. 6
3
Test circuit
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2/13
................................................ 9
STFV4N150
1
Electrical ratings
Electrical ratings
Table 1.
Absolute maximum ratings
Symbol
Value
Unit
Drain-source voltage (VGS = 0)
1500
V
Drain-gate voltage (RGS = 20 kΩ)
1500
V
VGS
Gate- source voltage
± 30
V
ID (1)
Drain current (continuous) at TC = 25°C
4
A
ID
Drain current (continuous) at TC = 100°C
2.5
A
Drain current (pulsed)
12
A
Total dissipation at TC = 25°C
40
W
Derating factor
0.32
W/°C
VISO
Insulation withstand voltage (RMS) from all three leads to
external heat sink (t=1s; TC=25°C)
2500
V
Tj
Tstg
Operating junction temperature
Storage temperature
-55 to 150
°C
Value
Unit
VDS
VDGR
IDM
(2)
PTOT
Parameter
1. Limited only by maximum temperature allowed
2. Pulse width limited by safe operating area
Table 2.
Thermal resistance
Symbol
Parameter
Rthj-case
Thermal resistance junction-case Max
3.12
°C/W
Rthj-amb
Thermal resistance junction-ambient Max
62.5
°C/W
Value
Unit
4
A
350
mJ
Table 3.
Symbol
Avalanche data
Parameter
IAR
Avalanche current, repetitive or not-repetitive
(pulse width limited by Tj max)
EAS
Single pulse avalanche energy
(starting Tj = 25°C, ID = IAR, VDD = 50V)
3/13
Electrical characteristics
2
STFV4N150
Electrical characteristics
(TCASE=25°C unless otherwise specified)
Table 4.
Symbol
Test conditions
ID = 1mA, VGS = 0
IDSS
Zero gate voltage
Drain current (VGS = 0)
VDS = Max rating
VDS = Max rating,TC = 125°C
IGSS
Gate-body leakage
current (VDS = 0)
VGS = ± 30V
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = 250µA
RDS(on)
Static drain-source on
resistance
VGS = 10V, ID = 2A
Table 5.
Symbol
4/13
Parameter
Drain-source breakdown
voltage
V(BR)DSS
1.
On/off states
Min.
Typ.
Max.
1500
3
Unit
V
10
500
µA
µA
± 100
nA
4
5
V
5
7
Ω
Typ.
Max.
Unit
Dynamic
Parameter
Test conditions
gfs (1)
Forward transconductance VDS = 30V , ID = 2A
Ciss
Coss
Crss
Input capacitance
Output capacitance
Reverse transfer
capacitance
Qg
Qgs
Qgd
Total gate charge
Gate-source charge
Gate-drain charge
Min.
3.5
S
VDS = 25V, f = 1MHz,
VGS = 0
1300
120
12
pF
pF
pF
VDD = 600V, ID = 4A,
VGS = 10V
(see Figure 15)
30
10
9
Pulsed: Pulse duration = 300 µs, duty cycle 1.5%.
50
nC
nC
nC
STFV4N150
Electrical characteristics
Table 6.
Switching times
Symbol
Parameter
td(on)
tr
td(off)
tf
Table 7.
Turn-on delay time
Rise time
Turn-off-delay time
Fall time
Parameter
ISD
Source-drain current
Source-drain current (pulsed)
ISDM
VSD (2)
trr
Qrr
IRRM
trr
Qrr
IRRM
Min.
Typ.
Max. Unit
35
30
45
45
VDD = 750V, ID = 2A,
RG = 4.7Ω, VGS = 10V
(see Figure 14)
ns
ns
ns
ns
Source drain diode
Symbol
(1)
Test conditions
Test conditions
Min
Typ.
Max
Unit
4
12
A
A
2
V
Forward on voltage
ISD = 4A, VGS = 0
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 4A, di/dt = 100A/µs
VDD = 45V (see Figure 19)
510
3
12
ns
µC
A
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 4A, di/dt = 100A/µs
VDD = 45V, Tj = 150°C
(see Figure 19)
650
4
12.6
ns
µC
A
1.
Pulse width limited by safe operating area.
2.
Pulsed: Pulse duration = 300 µs, duty cycle 1.5%.
5/13
Electrical characteristics
STFV4N150
2.1
Electrical characteristics (curves)
Figure 1.
Safe operating area
Figure 2.
Thermal impedance
Figure 3.
Output characterisics
Figure 4.
Transfer characteristics
Figure 5.
Transconductance
Figure 6.
Static drain-source on resistance
6/13
STFV4N150
Electrical characteristics
Figure 7.
Gate charge vs gate-source voltage Figure 8.
Figure 9.
Normalized gate threshold voltage
vs temperature
Figure 11. Source-drain diode forward
characteristics
Capacitance variations
Figure 10. Normalized on resistance vs
temperature
Figure 12. Normalized BVDSS vs temperature
7/13
Electrical characteristics
Figure 13. Maximum avalanche energy vs
temperature
8/13
STFV4N150
STFV4N150
3
Test circuit
Test circuit
Figure 14. Switching times test circuit for
resistive load
Figure 15. Gate charge test circuit
Figure 16. Test circuit for inductive load
Figure 17. Unclamped inductive load test
switching and diode recovery times
circuit
Figure 18. Unclamped inductive waveform
Figure 19. Switching time waveform
9/13
Package mechanical data
4
STFV4N150
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
10/13
STFV4N150
Package mechanical data
TO-220FH (Fully plastic High voltage) MECHANICAL DATA
mm
DIM.
MIN.
TYP.
inch
MAX.
MIN.
TYP.
MAX.
A
4.4
4.6
0.173
0.181
B
2.5
2.7
0.098
0.106
D
2.5
2.75
0.098
0.108
E
0.45
0.7
0.017
0.027
F
0.75
1
0.030
0.039
F1
1.3
1.8
0.051
0.070
F2
1.3
1.8
0.051
0.070
G
4.95
5.2
0.195
0.204
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
L2
16
L3
28.6
30.6
1.126
L4
9.8
10.6
0.385
L5
0.409
0.630
3.4
1.204
0.417
0.134
L6
15.9
16.4
0.626
0.645
L7
9
9.3
0.354
0.366
L8
14.5
15
0.570
L9
2.4
0.590
0.094
P011W
11/13
Revision history
5
STFV4N150
Revision history
Table 8.
12/13
Revision history
Date
Revision
Changes
07-Jul-2005
1
First Release
06-Jun-2006
2
New template, inerted new value on Absolute maximum ratings
28-Jun-2006
3
The document has been reformatted
06-Mar-2007
4
Typo mistake on page 1
STFV4N150
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