ONSEMI NUF9005MNT4G

NUF9005MN
Low Capacitance 8 Line EMI
Filter with ESD Protection
This device is an 8 line EMI filter array for wireless applications.
Greater than −25 dB attenuation is obtained at frequencies from
800 MHz to 2.2 GHz. It also offers ESD protection−clamping transients
from static discharges. ESD protection is provided across all capacitors.
Features
1
• EMI Filtering and ESD Protection
• Integration of 40 Discrete Components
• Compliance with IEC61000−4−2 (Level 4)
•
•
•
•
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16
Cd
2
15
Cd
> 14 kV (Contact)
DFN Package, 1.6 x 4.0 mm
Moisture Sensitivity Level 1
ESD Ratings: Machine Model = C
Human Body Model = 3B
This is a Pb−Free Device*
Cd
14
3
Cd
Cd
4
13
Cd
Cd
5
12
Benefits
Cd
• Reduces EMI/RFI Emmisions on a Data Line
• Integrated Solution Offers Cost and Space Savings
• Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
Cd
6
11
Cd
Cd
Cd
Cd
7
Filter Response
10
• Integrated Solution Improves System Reliability
8
Applications
•
•
•
•
•
Cd
9
Cd
EMI Filtering and ESD Protection for Data Lines
Wireless Phones
Handheld Products
Notebook Computers
LCD Displays
Cd
(Top View)
MARKING
DIAGRAM
1
1
2
3
4
5
6
7
8
16
DFN16
CASE 506AC
841
AYW
G
1
GND
16
15
14
13 12
11
(Bottom View)
10
841
A
Y
W
G
9
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Figure 1. Pin Connections
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device
Package
Shipping†
NUF9005MNT4G
DFN16
(Pb−Free)
4000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
November, 2006 − Rev. 0
1
Publication Order Number:
NUF9005MN/D
NUF9005MN
MAXIMUM RATINGS
Parameter
Symbol
ESD Discharge IEC61000−4−2
Value
VPP
Unit
kV
Contact Discharge
14
Steady−State Power per Resistor @ 25°C
PR
328
mW
Operating Temperature Range
TOP
−40 to 85
°C
Storage Temperature Range
TSTG
−55 to 150
°C
TL
260
°C
Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Parameter
Maximum Reverse Working Voltage
Breakdown Voltage
Symbol
Test Conditions
Min
Typ
VRWM
VBR
IR = 1.0 mA
Leakage Current
IR
VRWM = 3.3 V
Resistance
RA
IR = 20 mA
Capacitance (Notes 1 and 2)
Cd
Cut−Off Frequency (Note 3)
f3dB
Above this frequency,
appreciable attenuation occurs
1. Measured at 25°C, VR = 2.5 V, f = 1.0 MHz.
2. Total Line Capacitance is 2 times the Diode Capacitance (Cd).
3. 50 source and 50 load termination.
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2
6.0
7.0
Max
Unit
5.0
V
8.0
V
100
nA
85
100
115
10
12
15
pF
175
MHz
NUF9005MN
TYPICAL PERFORMANCE CURVES (TA= 25°C unless otherwise specified)
0
0
−5
−10
−10
Channel 1,4,5 & 8
−20
−20
S41 (dB)
S21 (dB)
−15
−25
−30
−40
−35
−40
−50
Channel 2,3,6 & 7
−45
−50
1.E+06
1.E+07
1.E+08
1.E+09
−60
1.E+06
1.E+10
1.E+07
1.E+08
1.E+09
1.E+10
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 2. Typical Insertion Loss Characteristic
(S21 Measurement)
Figure 3. Analog Crosstalk Curve
(S41 Measurement)
110
2.0
108
106
1.5
RESISTANCE ()
NORMALIZED CAPACITANCE
−30
1.0
0.5
104
102
100
98
96
94
92
0
0
1.0
2.0
3.0
4.0
90
−40
5.0
−20
0
20
40
60
80
REVERSE VOLTAGE (V)
TEMPERATURE (°C)
Figure 4. Typical Capacitance vs.
Reverse Biased Voltage
(Normalized Capacitance Cd at 2.5 V)
Figure 5. Typical Resistance over Temperature
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3
NUF9005MN
PACKAGE DIMENSIONS
DFN16
CASE 506AC−01
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION b APPLIES TO TERMINAL AND
IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
D
B
PIN ONE
REFERENCE
E
2X
0.15 C
(A3)
TOP VIEW
2X
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
0.15 C
(A3)
0.10 C
A
16X
0.08 C
SEATING
PLANE
SIDE VIEW
A1
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
4.00 BSC
3.10
3.30
1.60 BSC
0.30
0.50
0.50 BSC
0.20
−−−
0.20
0.40
C
D2
16X
L
1
e
2X
0.25 x 0.40 mm
TEST PAD SIZE
8
SOLDERING FOOTPRINT*
4.10
E2
14X
16X
K
16
0.50 PITCH
9
16X b
NOTE 3
0.10 C A B
0.05 C
BOTTOM VIEW
0.50
1.91
16X
0.28
16X 0.51
SCALE 16:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
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USA/Canada
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Phone: 421 33 790 2910
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Phone: 81−3−5773−3850
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4
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NUF9005MN/D