UDA1431T 16-bit, 48 kHz, low-cost stereo current DAC Rev. 04 — 30 May 2006 Product data sheet 1. General description The UDA1431T is a 16-bit, 48 kHz, single-chip stereo DAC employing bitstream conversion techniques. The UDA1431T supports the I2S-bus data format with word lengths of up to 24 bits, MSB justified and can be operated with a 256fs master clock mode. The audio outputs meet the IEC 61938 specification. 2. Features n n n n n n n n n n n n Low power consumption Analog power supply voltage from 10.8 V to 13.2 V Digital power supply voltage from 3.1 V to 3.5 V Master clock frequencies of 256fs Supports sampling frequencies up to 48 kHz Integrated digital filter No analog post filtering required for DAC Slave mode only applications I2S-bus input interface: 16-bit, 18-bit, 20-bit and 24-bit format compatible CMOS levels compatible digital inputs and outputs Very easy application Advanced audio configuration: u Stereo line output u High linearity, wide dynamic range and low distortion n Small package size (SO14) 3. Applications n n n n PC audio applications Car radio applications DVD players Digital set-top boxes UDA1431T Philips Semiconductors 16-bit, 48 kHz, low-cost stereo current DAC 4. Quick reference data Table 1. Quick reference data VDDA = 12.0 V; VDDD = 3.3 V; Tamb = 25 °C; fs = 48 kHz; fi = 1 kHz; all voltages referenced to ground (pins VSSA and VSSD); unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Supplies VDDA analog supply voltage (for DAC) 10.8 12.0 13.2 V VDDD digital supply voltage 3.1 3.3 3.5 V IDDA analog supply current (for DAC) - 6.6 - mA - 0.8 - mA - 7.0 - mA - 6.8 - mA - 102 - mW 5 - 65 °C 1.575 1.880 1.925 V VDDA = 12.0 V operating [1] power-down digital supply current IDDD VDDD = 3.3 V operating [1] power-down Ptot total power dissipation Tamb ambient temperature operating [1] Digital-to-analog converter Vo(rms) output voltage (RMS value) (THD + N)/S total harmonic distortion-plus-noise to signal ratio S/N signal-to-noise ratio αcs channel separation at 0 dB [2][3] −62 −66 - dB at −60 dB [2][4] - −32.5 - dB [3][5] 89 94 - dB 85 98 - dB at 0 dB; from 1 kHz to 20 kHz [1] A 1 kHz at 0 dB sine wave input is applied. [2] (THD + N)/S is the power ratio between the sum of noise and distortion and the output signal. [3] Measurement is performed with a 22 kHz low-pass filter and is unweighted. [4] Measurement is performed with a ITU-R-2K filter and is unweighted. [5] S/N is the power ratio between the output signal and the noise measured with no signal applied. 5. Ordering information Table 2. Ordering information Type number Package Name Description Version UDA1431T SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 UDA1431T_4 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 04 — 30 May 2006 2 of 17 UDA1431T Philips Semiconductors 16-bit, 48 kHz, low-cost stereo current DAC 6. Block diagram VDDD 14 UDA1431T MCLK BCLK WS SDI DVREF AVREF 13 4 11 VDDA 8 PD_N 9 12 UPSAMPLING FILTERING NOISE SHAPING CURRENT DAC AMPLIFIER UPSAMPLING FILTERING NOISE SHAPING CURRENT DAC AMPLIFIER 6 ROUT I2S-BUS INTERFACE 2 3 DIGITAL 10 LOUT ANALOG 1 7 VSSD VSSA 001aac962 Fig 1. Block diagram 7. Pinning information 7.1 Pinning VSSD 1 14 VDDD WS 2 13 MCLK SDI 3 12 PD_N BCLK 4 i.c. 5 ROUT 6 VSSA 7 UDA1431T 11 DVREF 10 LOUT 9 VDDA 8 AVREF 001aac963 Fig 2. Pin configuration 7.2 Pin description Table 3. Pin description Symbol Pin Description VSSD 1 digital ground WS 2 word select input SDI 3 serial audio data input BCLK 4 bit clock input i.c. 5 internally connected; do not connect or connect to VDDD UDA1431T_4 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 04 — 30 May 2006 3 of 17 UDA1431T Philips Semiconductors 16-bit, 48 kHz, low-cost stereo current DAC Table 3. Pin description …continued Symbol Pin Description ROUT 6 right channel output VSSA 7 analog ground (for DAC) AVREF 8 regulator decoupling VDDA 9 analog supply voltage (for DAC) LOUT 10 left channel output DVREF 11 internal reference voltage (digital part) PD_N 12 power-down input (active LOW) MCLK 13 master clock input (256fs) VDDD 14 digital supply voltage 8. Functional description 8.1 Master clock The UDA1431T operates in slave mode only. Therefore, in all applications the system devices must provide a master clock (pin MCLK) at 256fs for correct operation. The master clock must be locked in frequency to the digital interface input signals. The UDA1431T supports sampling frequencies up to 48 kHz. 8.2 Data formats The I2S-bus formats are shown in Figure 3. Left and right data channel words are time multiplexed. The UDA1431T supports I2S-bus formats with data word length up to 24 bits. The BCLK clock can be up to 48fs, or in other words the BCLK frequency is 48 times or less the word select frequency (pin WS): fBCLK ≤ 48 × fWS. Important: The WS edge MUST fall on the negative edge of the BCLK at all times for proper operation of the digital interface. 8.3 Noise shaper The 1st-order noise shaper operates at 32fs. It shifts in-band quantization noise to frequencies well above the audio band. This noise shaping technique enables high signal-to-noise ratios to be achieved. The noise shaper output is converted into an analog signal using a current DAC. 8.4 Reset After turning on the power supplies of the device, the device must be reset. This is done by applying a logic 0 pulse on PD_N (pin 12) during at least 8 full MCLK periods. If PD_N (pin 12) has a value of logic 0 at start-up, it must be set to logic 1 only after 8 full MCLK periods. The device is ready to receive audio data only after 128 MCLK periods from the end of the reset. UDA1431T_4 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 04 — 30 May 2006 4 of 17 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx Philips Semiconductors UDA1431T_4 Product data sheet WS RIGHT CHANNEL LEFT CHANNEL BCLK MSBL SDI B2L B3L B14L B15L MSBR LSBL B2R B3R B14R B15R LSBR MSBL Rev. 04 — 30 May 2006 I2S-BUS FORMAT WS RIGHT CHANNEL LEFT CHANNEL SDI LSBR MSBL B2L B3L B14L B15L LSBL MSBR B2R I2S-BUS FORMAT IN 16-BIT MODE B14R B15R LSBR MSBL 001aac967 UDA1431T 5 of 17 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Fig 3. I2S-bus data formats B3R 16-bit, 48 kHz, low-cost stereo current DAC BCLK UDA1431T Philips Semiconductors 16-bit, 48 kHz, low-cost stereo current DAC 9. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit - 15.2 V - 5.5 V VDDA analog supply voltage (for DAC) [1] VDDD digital supply voltage [1] Txtal crystal temperature - 125 °C Tstg storage temperature −65 +125 °C [1] All supply connections must be made to the same power supply. 10. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air 115 K/W UDA1431T_4 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 04 — 30 May 2006 6 of 17 UDA1431T Philips Semiconductors 16-bit, 48 kHz, low-cost stereo current DAC 11. Static characteristics Table 6. Static characteristics VDDA = 12.0 V; VDDD = 3.3 V; Tamb = 25 °C; all voltages referenced to ground (pins VSSA and VSSD); unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Supplies VDDA analog supply voltage (for DAC) 10.8 12.0 13.2 V VDDD digital supply voltage 3.1 3.3 3.5 V IDDA analog supply current (for DAC) - 6.6 - mA - 0.8 - mA - 7.0 - mA - 6.8 - mA - 102 - mW 5 - 65 °C - 0.3VDDD V VDDA = 12.0 V operating [1] power-down IDDD digital supply current VDDD = 3.3 V operating [1] power-down Ptot total power dissipation Tamb ambient temperature operating [1] Digital inputs: pins BCLK, WS, SDI, PD_N and MCLK VIL LOW-level input voltage 0 VIH HIGH-level input voltage 0.7VDDD - VDDD V |ILI| input leakage current (absolute value) - - 1 µA Ci input capacitance - - 2.5 pF - 4.9 - V Digital-to-analog converter VO(DC) [1] channel DC output voltage with respect to pin VSSA A 1 kHz at 0 dB sine wave input is applied. UDA1431T_4 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 04 — 30 May 2006 7 of 17 UDA1431T Philips Semiconductors 16-bit, 48 kHz, low-cost stereo current DAC 12. Dynamic characteristics Table 7. Dynamic characteristics VDDA = 12.0 V; VDDD = 3.3 V; Tamb = 25 °C; fs = 48 kHz; fi = 1 kHz; all voltages referenced to ground (pins VSSA and VSSD); unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 1.575 1.880 1.925 V - - 0.5 dB Digital-to-analog converter Vo(rms) output voltage (RMS value) ∆Vo unbalance between channels at −20 dB on both channels (THD + N)/S total harmonic distortion-plus-noise to signal ratio at 0 dB [1][2] −62 −66 - dB at −60 dB [1][3] - −32.5 - dB DNR dynamic range at −60 dB [3][4] 89 92.5 - dB S/N signal-to-noise ratio [2][5] 89 94 - dB Gpb pass-band gain at −20 dB; over the band 20 Hz to 20 kHz −1.0 - +0.5 dB B bandwidth at −3 dB cut-off frequency - 22 - kHz ϕmis phase mismatch at −20 dB; over the band 20 Hz to 20 kHz - 0.2 1.5 deg αcs channel separation at 0 dB; from 1 kHz to 20 kHz 85 98 - dB [1] (THD + N)/S is the power ratio between the sum of noise and distortion, and the output signal. [2] Measurement is performed with a 22 kHz low-pass filter and is unweighted. [3] Measurement is performed with a ITU-R-2K filter and is unweighted. [4] DNR is the result of (THD + N)/S corrected with the full-scale ratio (60 dB in this case). [5] S/N is the power ratio between the output signal and the noise measured with no signal applied. Table 8. Timing characteristics VDDA = 12.0 V; VDDD = 3.3 V; Tamb = 5 °C to 65 °C; fs = 48 kHz; all voltages referenced to ground (pins VSSA and VSSD); unless otherwise specified. Symbol td(po-so) Parameter Conditions delay time from power on to stable output MCLK active [1] Min Typ Max Unit - - 500 ms Master clock (see Figure 4) Master clock input: pin MCLK Tcy(MCLK) master clock cycle time - 81.4 - ns tWL pulse width LOW 28 - 53 ns tWH pulse width HIGH 28 - 53 ns Digital interface (see Figure 5) Bit clock input: pin BCLK Tcy(BCLK) bit clock cycle time 20.83 - - µs tWL pulse width LOW 7.29 - - µs UDA1431T_4 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 04 — 30 May 2006 8 of 17 UDA1431T Philips Semiconductors 16-bit, 48 kHz, low-cost stereo current DAC Table 8. Timing characteristics …continued VDDA = 12.0 V; VDDD = 3.3 V; Tamb = 5 °C to 65 °C; fs = 48 kHz; all voltages referenced to ground (pins VSSA and VSSD); unless otherwise specified. Symbol Parameter tWH Conditions Min Typ Max Unit pulse width HIGH 7.29 - - µs tr rise time - - 3.12 µs tf fall time - - 3.12 µs Data input: pin SDI tsu(SDI) data input set-up time 4.16 - - µs th(SDI) data input hold time 0 - - µs Word select input: pin WS tsu(WS) word select set-up time 4.16 - - µs th(WS) word select hold time 0 - - µs [1] The device is ready to receive audio data only after 128 MCLK periods from the end of the reset; see Section 8.4. tWH MCLK tWL Tcy(MCLK) 001aac965 Fig 4. System clock timing WS th(WS) tWH tr tf tsu(WS) BCLK tWL Tcy(BCLK) tsu(SDI) th(SDI) SDI 001aac966 Fig 5. Serial interface timing UDA1431T_4 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 04 — 30 May 2006 9 of 17 UDA1431T Philips Semiconductors 16-bit, 48 kHz, low-cost stereo current DAC 13. Application information 3.3 V 12 V 100 nF 100 nF DGND AGND VDDA VDDD BCLK audio data I2S-bus (3-wire) WS SDI 14 9 4 6 ROUT LOW-PASS FILTER (AC COUPLED)(1) right channel LOUT LOW-PASS FILTER (AC COUPLED)(1) left channel 2 3 10 UDA1431T MCLK master clock fMCLK = 256fs (2) 13 8 AVREF 100 nF connect to VDDD for normal use (2) PD_N 12 11 7 DVREF 1 VSSA 4.7 µF AGND 100 nF 4.7 µF VSSD AGND AGND DGND 001aac964 (1) At low frequencies, optimum performances will be reached using a Tantalum or a Niobium capacitor rather than with a ceramic capacitor. (2) After turning on the power supplies of the device, the device must be reset. This is done by applying a logic 0 pulse on PD_N (pin 12) during at least 8 full MCLK periods; see Section 8.4. Fig 6. Application diagram 14. Test information 14.1 Quality information The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable. UDA1431T_4 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 04 — 30 May 2006 10 of 17 UDA1431T Philips Semiconductors 16-bit, 48 kHz, low-cost stereo current DAC 15. Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.010 0.057 inches 0.069 0.004 0.049 0.05 0.244 0.039 0.041 0.228 0.016 0.028 0.024 0.01 0.01 0.028 0.004 0.012 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 7. Package outline SOT108-1 (SO14) UDA1431T_4 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 04 — 30 May 2006 11 of 17 UDA1431T Philips Semiconductors 16-bit, 48 kHz, low-cost stereo current DAC 16. Handling information Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe you must take normal precautions appropriate to handling integrated circuits. 17. Soldering 17.1 Introduction to soldering surface mount packages There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 17.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow temperatures range from 215 °C to 260 °C depending on solder paste material. The peak top-surface temperature of the packages should be kept below: Table 9. SnPb eutectic process - package peak reflow temperatures (from J-STD-020C July 2004) Package thickness Volume mm3 < 350 Volume mm3 ≥ 350 < 2.5 mm 240 °C + 0/−5 °C 225 °C + 0/−5 °C ≥ 2.5 mm 225 °C + 0/−5 °C 225 °C + 0/−5 °C Table 10. Pb-free process - package peak reflow temperatures (from J-STD-020C July 2004) Package thickness Volume mm3 < 350 Volume mm3 350 to 2000 Volume mm3 > 2000 < 1.6 mm 260 °C + 0 °C 260 °C + 0 °C 260 °C + 0 °C 1.6 mm to 2.5 mm 260 °C + 0 °C 250 °C + 0 °C 245 °C + 0 °C ≥ 2.5 mm 250 °C + 0 °C 245 °C + 0 °C 245 °C + 0 °C Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 17.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. UDA1431T_4 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 04 — 30 May 2006 12 of 17 UDA1431T Philips Semiconductors 16-bit, 48 kHz, low-cost stereo current DAC To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 17.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 °C and 320 °C. 17.5 Package related soldering information Table 11. Suitability of surface mount IC packages for wave and reflow soldering methods Package[1] Soldering method Wave Reflow[2] BGA, HTSSON..T[3], LBGA, LFBGA, SQFP, SSOP..T[3], TFBGA, VFBGA, XSON not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable[4] suitable PLCC[5], SO, SOJ suitable suitable LQFP, QFP, TQFP not recommended[5][6] suitable SSOP, TSSOP, VSO, VSSOP not CWQCCN..L[8], not suitable PMFP[9], WQCCN..L[8] UDA1431T_4 Product data sheet recommended[7] suitable not suitable © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 04 — 30 May 2006 13 of 17 UDA1431T Philips Semiconductors 16-bit, 48 kHz, low-cost stereo current DAC [1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. [2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. [3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. [6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. [9] Hot bar soldering or manual soldering is suitable for PMFP packages. UDA1431T_4 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 04 — 30 May 2006 14 of 17 UDA1431T Philips Semiconductors 16-bit, 48 kHz, low-cost stereo current DAC 18. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes UDA1431T_4 20060530 Product data sheet - UDA1431T_3 Modifications: • • Added: Section 8.4 “Reset” Changed: table note 2 of Table 8 and figure note 2 of Figure 6 UDA1431T_3 20060329 Product data sheet - UDA1431T_2 UDA1431T_2 20060220 Product data sheet - UDA1431T_1 (9397 750 14957) UDA1431T_1 (9397 750 14957) 20060206 Product data sheet - - UDA1431T_4 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 04 — 30 May 2006 15 of 17 UDA1431T Philips Semiconductors 16-bit, 48 kHz, low-cost stereo current DAC 19. Legal information 19.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com. 19.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 19.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 19.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 20. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] UDA1431T_4 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 04 — 30 May 2006 16 of 17 Philips Semiconductors UDA1431T 16-bit, 48 kHz, low-cost stereo current DAC 21. Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.4 9 10 11 12 13 14 14.1 15 16 17 17.1 17.2 17.3 17.4 17.5 18 19 19.1 19.2 19.3 19.4 20 21 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Master clock . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Data formats . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Noise shaper. . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 Application information. . . . . . . . . . . . . . . . . . 10 Test information . . . . . . . . . . . . . . . . . . . . . . . . 10 Quality information . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Handling information. . . . . . . . . . . . . . . . . . . . 12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13 Package related soldering information . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © Koninklijke Philips Electronics N.V. 2006. All rights reserved. For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: [email protected]. Date of release: 30 May 2006 Document identifier: UDA1431T_4