Spec. No. : C336S2 Issued Date : 2003.06.01 Revised Date : Page No. : 1/1 CYStech Electronics Corp. CASD501S2 Surface Mount Small Signal Schottky Barrier Diodes Features • For surface mounted application • Extremely low VF • Extremely Thin Package • Low Stored Charge • Majority Carrier Conduction Mechanical Data • Case: Molded Plastic, JEDEC SOD-323. • Terminals: Solder plated, solderable per MIL-STD-750 Method 2026 • Polarity: Indicated by cathode band. • Mounting Position : Any. • Weight: 0.0045 gram, 0.000159 ounce Maximum Ratings (Ta=25℃, unless otherwise noted) Parameter Repetitive Peak Reverse Voltage Continuous Reverse Voltage Average Rectified Current Symbol VRM VR IO Peak Forward Surge Current IFSM Typical Junction Capacitance CD Operating Temperature Range Storage Temperature Range TJ TSTG Conditions min 8.3ms single half sine-wave superimposed on rated load (JEDEC method) f = 1MHz and applied 10VDC Reverse Voltage typ max 45 40 100 unit V V mA 1000 mA 20 pF -40 -40 +125 +125 °C °C max 0.55 30 unit V µA Electrical Characteristics (Ta=25℃, unless otherwise noted) Parameter Forward Voltage Reverse Leakage Current CASD501S2 Symbol VF IR Conditions IF = 100mA DC VR = 10V DC min typ CYStek Product Specification CYStech Electronics Corp. Spec. No. : C336S2 Issued Date : 2003.06.01 Revised Date : Page No. : 2/2 Characteristic Curves Forward Characteristics Reverse Characteristics 10000 100 125℃ Reverse Current---I R(μA) Forward Current---I F(mA) 125℃ 25℃ 75℃ -25℃ 10 1000 75℃ 100 10 25℃ 1 0.1 1 0 0.1 0.2 0.3 0.4 0.5 0 0.6 10 30 40 Reverse Voltage---VR(V) Forward Voltage---VF(V) Forward Current Derating Curve (Mounting on glass epoxy PCBs) Diode Capacitance vs Reverse Voltage 100 120 Percentage of Average Forward Current---(%) 20 Diode Capacitance---C D(pF) 100 80 60 40 20 10 1 0 0 25 50 75 100 125 Ambient Temperature---Ta(℃) CASD501S2 150 0 5 10 15 20 25 Reverse Voltage---VR(V) 30 35 CYStek Product Specification Spec. No. : C336S2 Issued Date : 2003.06.01 Revised Date : Page No. : 3/3 CYStech Electronics Corp. SOD-323 Dimension Marking: K A 1 5H 2 B D Style: Pin 1.Cathode 2.Anode J H E C 2-Lead SOD-323 Plastic Surface Mounted Package CYStek Package Code: S2 *: Typical Inches Min. Max. 0.0630 0.0709 0.0453 0.0531 0.0315 0.0394 0.0098 0.0157 DIM A B C D Millimeters Min. Max. 1.60 1.80 1.15 1.35 0.80 1.00 0.25 0.40 DIM E H J K Inches Min. Max. 0.0060 0.0000 0.0040 0.0035 0.0070 0.0906 0.1063 Millimeters Min. Max. 0.15 0.00 0.10 0.089 0.177 2.30 2.70 Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CASD501S2 CYStek Product Specification