WEDC WMF128K8

White Electronic Designs
WMF128K8-XXX5
128Kx8 MONOLITHIC FLASH, SMD 5962-96690
FEATURES
Access Times of 50*, 60, 70, 90, 120, 150ns
Organized as 128Kx8
Packaging
• 32 lead, Hermetic Ceramic, 0.400" SOJ (Package
101)
Commercial, Industrial and Military Temperature
Ranges
5 Volt Programming. 5V ± 10% Supply.
• 32 pin, Hermetic Ceramic, 0.600" DIP (Package
300)
Low Power CMOS
Embedded Erase and Program Algorithms
• 32 lead, Flatpack (Package 220)
TTL Compatible Inputs and CMOS Outputs
• 32 lead, Formed Flatpack (Package 221)
Page Program Operation and Internal Program
Control Time.
• 32 pin, Rectangular Ceramic Leadless Chip
Carrier (Package 601)
This product is subject to change without notice.
100,000 Erase/Program Cycles Minimum
Sector Erase Architecture
Note: For programming information refer to Flash Programming 1M5 Application Note.
• 8 equal size sectors of 16KBytes each
* The access time of 50ns is available in Industrial and Commercial temperature ranges
only.
• Any combination of sectors can be concurrently
erased. Also supports full chip erase
WE#
VCC
NC
4 3 2 1 32 31 30
A14
A13
A8
A9
A11
OE#
A10
CS#
I/O7
I/O6
I/O5
Pin Description
A0-16
I/O0-7
CS#
OE#
WE#
VCC
VSS
5
29
6
28
7
27
8
26
25
9
10
24
11
23
12
22
13
21
14 15 16 17 18 19 20
I/O4
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O3
VCC
WE#
NC
A14
A13
A8
A9
A11
OE#
A10
CS#
I/O7
I/O6
I/O5
I/O4
I/O3
VSS
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
I/O2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A16
Top View
A15
32 CLCC
Top View
A12
32 DIP
32 CSOJ
32 Flatpack
I/O1
NC
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
VSS
Pin Configuration For WMF128K8-XCLX5
NC
Pin Configuration For WMF128K8-XXX5
Address Inputs
Data Input/Output
Chip Select
Output Enable
Write Enable
+5.0V Power
Ground
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
1
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White Electronic Designs
ABSOLUTE MAXIMUM RATINGS (1)
Parameter
Operating Temperature
Supply Voltage (VCC)
Signal Voltage Range (any pin except A9) (2)
Storage Temperature Range
Lead Temperature (soldering, 10 seconds)
Data Retention Mil Temp
Endurance (write/erase cycles) (Mil Temp)
A9 Voltage for sector protect (VID) (3)
WMF128K8-XXX5
RECOMMENDED OPERATING CONDITIONS
Unit
°C
V
V
°C
°C
years
cycles
V
-55 to +125
-2.0 to +7.0
-2.0 to +7.0
-65 to +150
+300
10
10,000 min
-2.0 to +14.0
Parameter
Supply Voltage
Input High Voltage
Input Low Voltage
Operating Temp. (Mil.)
Operating Temp. (Ind.)
A9 Voltage for Sector Protect
Symbol
VCC
VIH
VIL
TA
TA
VID
Min
4.5
2.0
-0.5
-55
-40
11.5
Max
5.5
VCC + 0.5
+0.8
+125
+85
12.5
Unit
V
V
V
°C
°C
V
CAPACITANCE
NOTES:
1. Stresses above the absolute maximum rating may cause permanent damage to the
device. Extended operation at the maximum levels may degrade performance and
affect reliability.
2. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, inputs
may overshoot VSS to -2.0 V for periods of up to 20ns. Maximum DC voltage on
output and I/O pins is VCC + 0.5V. During voltage transitions, outputs may overshoot
to Vcc + 2.0 V for periods of up to 20ns.
3. Minimum DC input voltage on A9 pin is -0.5V. During voltage transitions, A9 may
overshoot Vss to -2V for periods of up to 20ns. Maximum DC input voltage on A9 is
+13.5V which may overshoot to 14.0 V for periods up to 20ns.
TA = +25°C
Parameter
Address Input capacitance
Output Enable capacitance
Write Enable capacitance
Chip Select capacitance
Data I/O capacitance
Symbol
CAD
COE
CWE
CCS
CI/O
Conditions
Max Unit
VI/O = 0 V, f = 1.0 MHz 15 pF
VIN = 0 V, f = 1.0 MHz 15 pF
VIN = 0 V, f = 1.0 MHz 15 pF
VIN = 0 V, f = 1.0 MHz 15 pF
VI/O = 0 V, f = 1.0 MHz 15 pF
This parameter is guaranteed by design but not tested.
DC CHARACTERISTICS — CMOS COMPATIBLE
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter
Input Leakage Current
Output Leakage Current
VCC Active Current for Read (1)
VCC Active Current for Program or Erase (2)
VCC Standby Current
Output Low Voltage
Output High Voltage
Output High Voltage
Low VCC Lock-Out Voltage
Symbol
ILI
ILO
ICC1
ICC2
ICC3
VOL
VOH1
VOH2
VLKO
Conditions
VCC = 5.5, VIN = GND to VCC
VCC = 5.5, VIN = GND to VCC
CS# = VIL, OE# = VIH
CS# = VIL, OE# = VIH
VCC = 5.5, CS# = VIH, f = 5MHz
IOL = 8.0 mA, VCC = 4.5
IOH = -2.5 mA, VCC = 4.5
IOH = -100 µA, VCC = 4.5
Min
Max
10
10
35
50
1.6
0.45
0.85 x VCC
VCC - 0.4
3.2
Unit
µA
µA
mA
mA
mA
V
V
V
V
NOTES:
1. The ICC current listed includes both the DC operating current and the frequency dependent component (at 5 MHz).
The frequency component typically is less than 2 mA/MHz, with OE# at VIH.
2. ICC active while Embedded Algorithm (program or erase) is in progress.
3. DC test conditions: VIL = 0.3V, VIH = VCC - 0.3V
AC TEST CONDITIONS
AC TEST CIRCUIT
Parameter
Input Pulse Levels
Input Rise and Fall
Input and Output Reference Level
Output Timing Reference Level
I OL
Current Source
VZ
D.U.T.
1.5V
(Bipolar Supply)
C eff = 50 pf
Typ
VIL = 0, VIH = 3.0
5
1.5
1.5
Unit
V
ns
V
V
Notes:
VZ is programmable from -2V to +7V.
IOL & IOH programmable from 0 to 16mA.
Tester Impedance Z0 = 75 Ω.
VZ is typically the midpoint of VOH and VOL.
IOL & IOH are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
I OH
Current Source
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
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White Electronic Designs
WMF128K8-XXX5
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, WE# CONTROLLED
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter
Symbol
Write Cycle Time
Chip Select Setup Time
Write Enable Pulse Width
Address Setup Time
Data Setup Time
Data Hold Time
Address Hold Time
Chip Select Hold Time
Write Enable Pulse Width High
Duration of Byte Programming Operation (min)
Sector Erase Time
Read Recovery Time before Write
VCC Set-up Time
Chip Programming Time
Output Enable Setup Time
Output Enable Hold Time (1)
-50
tAVAV tWC
tELWL tCS
tWLWH tWP
tAVWH tAS
tDVWH tDS
tWHDX tDH
tWHAX tAH
tWHEH tCH
tWHWL tWPH
tWHWH1
tWHWH2
tGHWL
tVCS
Min
50
0
25
0
25
0
40
0
20
14
2.2
0
50
tOES
tOEH
0
10
-60
Max
60
Min
60
0
30
0
30
0
45
0
20
14
2.2
0
50
12.5
-70
Max
60
Min
70
0
35
0
30
0
45
0
20
14
2.2
0
50
12.5
-90
Max
60
Min
90
0
45
0
45
0
45
0
20
14
2.2
0
50
12.5
0
10
0
10
-120
Max
60
Min
120
0
50
0
50
0
50
0
20
14
2.2
0
50
12.5
0
10
-150
Max
60
Min
150
0
50
0
50
0
50
0
20
14
2.2
0
50
12.5
0
10
0
10
Max
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs
60 sec
ms
µs
12.5 sec
ns
ns
NOTES:
1. For Toggle and Data# Polling.
AC CHARACTERISTICS – READ ONLY OPERATIONS
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter
Read Cycle Time
Address Access Time
Chip Select Access Time
OE# to Output Valid
Chip Select to Output High Z (1)
OE# High to Output High Z (1)
Output Hold from Address, CS# or OE#
Change, whichever is First
Symbol
tAVAV
tAVQV
tELQV
tGLQV
tEHQZ
tGHQZ
tAXQX
tRC
tACC
tCE
tOE
tDF
tDF
tOH
-50
Min
50
-60
Max
Min
60
50
50
25
20
20
-70
Max
Min
70
60
60
30
20
20
0
-90
Max
Min
90
70
70
35
20
20
0
0
-120
Max
Min
120
90
90
40
25
25
0
-150
Max
Min
150
120
120
50
30
30
0
Unit
Max
150
150
55
35
35
0
ns
ns
ns
ns
ns
ns
ns
NOTES:
1. Guaranteed by design, but not tested
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
3
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
WMF128K8-XXX5
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS,CS# CONTROLLED
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter
Write Cycle Time
WE# Setup Time
CS# Pulse Width
Address Setup Time
Data Setup Time
Data Hold Time
Address Hold Time
WE# Hold from WE# High
CS# Pulse Width High
Duration of Programming Operation
Duration of Erase Operation
Read Recovery before Write
Chip Programming Time
Symbol
tAVAV
tWLEL
tELEH
tAVEL
tDVEH
tEHDX
tELAX
tEHWH
tEHEL
tWHWH1
tWHWH2
tGHEL
tWC
tWS
tCP
tAS
tDS
tDH
tAH
tWH
tCPH
-50
Min
-60
Max
Min
-70
Max
Min
-90
Max
Min
-120
Max
Min
-150
Max
Min
Max
Unit
50
60
70
90
120
150
ns
0
0
0
0
0
0
ns
25
30
35
45
50
50
ns
0
0
0
0
0
0
ns
25
30
30
45
50
50
ns
0
0
0
0
0
0
ns
40
45
45
45
50
50
ns
0
0
0
0
0
0
ns
20
20
20
20
20
20
ns
14
14
14
14
14
14
µs
2.2
60
0
2.2
60
0
12.5
2.2
60
0
12.5
2.2
60
0
12.5
2.2
60
0
12.5
2.2
60
sec
12.5
sec
0
12.5
ns
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
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WMF128K8-XXX5
Outputs
WE#
OE#
CS#
Addresses
High Z
tACC
tCE
tOE
Addresses Stable
tRC
Output Valid
tOH
tDF
High Z
AC WAVEFORMS FOR READ OPERATIONS
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
5
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WMF128K8-XXX5
A0A0H
tDH
tWPH
Data
tDS
tCS
WE#
OE#
5.0 V
tWP
tGHWL
tWC
CS#
NOTES:
1. PA is the address of the memory location to be programmed.
2. PD is the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to each chip.
4. DOUT is the output of the data written to the device.
5. Figure indicates last two bus cycles of four bus cycle sequence.
Addresses
5555H
tAS
PA
PD
tAH
tWHWH1
Data# Polling
PA
D7 #
DOUT
tOE
tCE
tRC
tDF
tOH
WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
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WMF128K8-XXX5
5555H
AAAAH
tDS
tDH
tWPH
tVCS
VCC
Data
WE#
OE#
Addresses
NOTE:
1. SA is the sector address for Sector Erase.
CS#
tGHWL
tCS
tWP
tAS
2AAAH
5555H
tAH
5555H
8080H
5555H
AAAAH
2AAAH
5555H
SA
1010H/3030H
AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS
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April 2001
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WMF128K8-XXX5
I/O0-15
Valid Data
I/O0-6 and I/O8-14
Invalid
t OE
I/O7 and I/O15
Valid Data
I/O0-6 and
I/O8-14
I/O7 and
I/O15
Data
WE#
OE#
CS#
t CH
tOEH
tCE
t OE
tWHWH 1 or 2
I/O7 # and I/O15 #
t OH
t DF
High Z
AC WAVEFORMS FOR DATA# POLLING DURING EMBEDDED ALGORITHM OPERATIONS
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
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WMF128K8-XXX5
A0H
tDH
tCPH
5.0 V
tDS
Data
CS#
OE#
tWS
tWC
WE#
Addresses
5555H
tGHEL
tCP
tAS
PA
PD
t AH
tWHWH1
Data# Polling
PA
D7 #
DOUT
ALTERNATE CS# CONTROLLED PROGRAMMING OPERATION TIMINGS
NOTES:
1. PA represents the address of the memory location to be programmed.
2. PD represents the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to each chip.
4. DOUT is the output of the data written to the device.
5. Figure indicates the last two bus cycles of a four bus cycle sequence.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
9
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White Electronic Designs
WMF128K8-XXX5
PACKAGE 101: 32 LEAD, CERAMIC SOJ
3.96 (0.156) MAX
21.1 (0.830) ± 0.25 (0.010)
0.89 (0.035)
Radius TYP
0.2 (0.008)
± 0.05 (0.002)
11.3 (0.442)
± 0.30 (0.012)
9.55 (0.376) ± 0.25 (0.010)
1.27 (0.050) ± 0.25 (0.010)
PIN 1 IDENTIFIER
1.27 (0.050) TYP
19.1 (0.750) TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 220: 32 LEAD, CERAMIC FLATPACK
20.83 (0.820)
± 0.25 (0.010)
PIN 1
IDENTIFIER
2.60 (0.102) MAX
10.41 (0.410)
± 0.13 (0.005)
10.16 (0.400)
± 0.51 (0.020)
0.43 (0.017)
± 0.05 (0.002)
0.127 (0.005)
+ 0.05 (0.002)
– 0.025 (0.001)
1.27 (0.050) TYP
19.05 (0.750) TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
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White Electronic Designs
WMF128K8-XXX5
PACKAGE 221: 32 LEAD, FORMED CERAMIC FLATPACK
3.35 (0.132)
MAX
20.83 (0.820)
±0.25 (0.010)
0.15 (0.006)
TYP
1.27 (0.050) TYP
10.41 (0.410)
±0.13 (0.005)
13.47 (0.530)
±0.13 (0.005)
+
+
0.43 (0.017)
±0.05 (0.002)
1.27 (0.050) TYP
0.63 (0.025) TYP
0°/ -4°
19.05 (0.750) TYP
1.52 (0.060) TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 300: 32 PIN, CERAMIC DIP, SINGLE CAVITY SIDE BRAZED
42.4 (1.670) ± 0.4 (0.016)
15.04 (0.592)
± 0.3 (0.012)
4.34 (0.171) ± 0.79 (0.031)
PIN 1 IDENTIFIER
3.2 (0.125) MIN
0.84 (0.033)
± 0.4 (0.014)
2.5 (0.100)
TYP
1.27 (0.050)
± 0.1 (0.005)
0.46 (0.018)
± 0.05 (0.002)
0.25 (0.010)
± 0.05 (0.002)
15.25 (0.600)
± 0.25 (0.010)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
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White Electronic Designs
WMF128K8-XXX5
PACKAGE 601: 32 PIN, RECTANGULAR CERAMIC LEADLESS CHIP CARRIER
7.62 (0.300) TYP
3.81
(0.150) TYP
5.08
(0.200)
TYP
0.56 (0.022)
0.71 (0.028)
10.16
(0.400)
TYP
PIN 1
0.38 (0.015) x 45°
PIN 1 IDENTIFIER
11.25 (0.443)
11.60 (0.457)
1.63 (0.064)
2.54 (0.100)
13.79 (0.543)
14.15 (0.557)
1.02 (0.040) x 45°
3 PLACES
32PinCLCCpkgdim.eps
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
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White Electronic Designs
WMF128K8-XXX5
ORDERING INFORMATION
W M F 128K8 - XXX X X 5 X
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
VPP PROGRAMMING VOLTAGE
5 = 5V
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
DE = 32 Lead Ceramic SOJ (Package 101)
C = 32 Pin Ceramic DIP (Package 300)
FE = 32 Lead Ceramic Flatpack (Package 220)
FF = 32 Lead Formed Ceramic Flatpack (Package 221)
CL = 32 Pin rectangular Ceramic Leadless Chip Carrier (Package 601)
ACCESS TIME (ns)
ORGANIZATION, 128K x 8
Flash
MONOLITHIC
WHITE ELECTRONIC DESIGNS CORP.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
13
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White Electronic Designs
WMF128K8-XXX5
DEVICE TYPE
SECTOR SIZE
SPEED
PACKAGE
SMD NO.
128K x 8 Flash Monolithic
16KByte
150ns
32 pin DIP (C)
5962-96690 01HYX
128K x 8 Flash Monolithic
16KByte
120ns
32 pin DIP (C)
5962-96690 02HYX
128K x 8 Flash Monolithic
16KByte
90ns
32 pin DIP (C)
5962-96690 03HYX
128K x 8 Flash Monolithic
16KByte
70ns
32 pin DIP (C)
5962-96690 04HYX
128K x 8 Flash Monolithic
16KByte
60ns
32 pin DIP (C)
5962-96690 05HYX
128K x 8 Flash Monolithic
16KByte
150ns
32 lead SOJ (DE)
5962-96690 01HXX
128K x 8 Flash Monolithic
16KByte
120ns
32 lead SOJ (DE)
5962-96690 02HXX
128K x 8 Flash Monolithic
16KByte
90ns
32 lead SOJ (DE)
5962-96690 03HXX
128K x 8 Flash Monolithic
16KByte
70ns
32 lead SOJ (DE)
5962-96690 04HXX
128K x 8 Flash Monolithic
16KByte
60ns
32 lead SOJ (DE)
5962-96690 05HXX
128K x 8 Flash Monolithic
16KByte
150ns
32 lead Flatpack (FE)
5962-96690 01HTX
128K x 8 Flash Monolithic
16KByte
120ns
32 lead Flatpack (FE)
5962-96690 02HTX
128K x 8 Flash Monolithic
16KByte
90ns
32 lead Flatpack (FE)
5962-96690 03HTX
128K x 8 Flash Monolithic
16KByte
70ns
32 lead Flatpack (FE)
5962-96690 04HTX
128K x 8 Flash Monolithic
16KByte
60ns
32 lead Flatpack (FE)
5962-96690 05HTX
128K x 8 Flash Monolithic
16KByte
150ns
32 lead Formed Flatpack (FF)
5962-96690 01HUX
128K x 8 Flash Monolithic
16KByte
120ns
32 lead Formed Flatpack (FF)
5962-96690 02HUX
128K x 8 Flash Monolithic
16KByte
90ns
32 lead Formed Flatpack (FF)
5962-96690 03HUX
128K x 8 Flash Monolithic
16KByte
70ns
32 lead Formed Flatpack (FF)
5962-96690 04HUX
128K x 8 Flash Monolithic
16KByte
60ns
32 lead Formed Flatpack (FF)
5962-96690 05HUX
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
14
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com