Features • Two Identical Interface Channels • Pre-regulated Smoothed Voltage and a Supply Current up to 50 mA for the Sensors • Data from the Sensors by Current Modulation with a Transmission Rate of 60 kBaud • • • • • (Transmission Bandwidth 500 kHz) TTL-compatible Input Activates the Sensor Data Output Can be Directly Connected to a Microcontroller Input Operation Supply Voltage Range 5.7V ≤ VS ≤ 40V ESD Protection According to MIL-STD-883C Test Method 3015.7 High-level EMI Protection Side-airbag Sensor Dual Interface Benefits • Simple Wiring Thanks to One Common Line for Supply of the Sensor and Data Transmission from the Sensor to the U6268B • Current Modulation Provides High Noise Immunity for Data Transfer U6268B 1. Description The U6268B is an interface IC for remote automotive sensors. It links the crash sensors in the driver and passenger door with the main airbag unit in the dashboard. Two identical channels supply the external sensors and receive digital information from them via one active wire each. The interface supplies the external sensors with a preregulated smoothed voltage, the external units transmit the digital information back to the interface by current modulation. As the device is designed for safety-critical applications, the highest data transmission security is mandatory. With high immunity against cross coupling between the two channels, the U6268B is tailored for the harsh automotive environment. Figure 1-1. Block Diagram Data Microcontroller Channel 1 Voltage comparator Smoothed voltage regulator Enable Channel 1 Channel 2 Enable Channel 2 Data I/V converter Temperature monitor Data transmission Crash sensor Short circuit detection Smoothed voltage regulator Voltage comparator Channel 1 power supply I/V converter Channel 2 power supply Data transmission Crash sensor Rev. 4808B–AUTO–09/05 2. Pin Configuration Figure 2-1. Table 2-1. 2 Pinning SO16 GND 1 16 GND RETURN1 2 15 ENABLE1 OUT1 3 14 CLL1 VS 4 13 OCM1 OUT2 5 12 OCM2 SC 6 11 CLL2 RETURN2 7 10 ENABLE2 GND 8 9 GND Pin Description Pin Symbol 1 GND 2 RETURN1 3 OUT1 4 VS 5 OUT2 Function Ground and reference pin Return line of the external unit, internally connected to GND via a line-protection transistor Voltage-stabilized supply output and current-modulation input Supply voltage of the IC Voltage-stabilized supply output and current-modulation input 6 SC 7 RETURN2 8, 9 GND 10 ENABLE2 11 CLL2 Current logic level output (low at high OUT2 current, monitoring via OCM2) 12 OCM2 Analog current output, representing 1/10 current of OUT2 13 OCM1 Analog current output, representing 1/10 current of OUT1 14 CLL1 15 ENABLE1 16 GND Smooth time constant for slow voltage change at both OUT pins Return line of the external unit, internally connected to GND via a line-protection transistor Ground and reference pin Controls OUT1 voltage ENABLE1 High = OUT1 active, ENABLE1 Low or open = OUT1 switched off Current logic level output (low at high OUT1 current, monitoring via OCM1) Controls OUT2 voltage ENABLE2 High = OUT2 active, ENABLE1 Low or open = OUT2 switched off Ground and reference pin U6268B 4808B–AUTO–09/05 U6268B Figure 2-2. Functional Block Diagram VS Slew rate Vout 5 V/ms at VS rising Voltage Regulator Current mirror ratio IOCMx/IOUTx 10 V/ms at VS falling VSC VS VS ISC-ch SC + VSC IOUT Over current + - OUTx limitation VOUT ON OFF ISC-dis IOUT-sink Temperature protection high T > 165°C low T < 145°C ENABLEx Latch Temp Reset Set - + High = ENABLE OUTx Test mode If ENABLE x = 9 V then Temp = high CLLx VOCM-det Temp - + 4.2 V VOCM-lim OCMx + VCLL-x IOCM-sink Current limitation + - Vret_x + RETURNx 3Ω Iret-low GND 3 4808B–AUTO–09/05 3. Functional Description 3.1 VS The IC and the external units are powered via the VS pin 4. This pin is connected to the battery via a reverse battery protection diode. An electrolythic capacitor of 22 µF smoothes the voltage and absorbs positive and negative transients. 3.2 OUT1, OUT2 OUTx provides a smoothed, very slowly changing supply voltage for the external units and monitors the output current. During normal operating conditions, the OUTx voltage is typically 3V below VS, and changes very slowly with a varying battery voltage in order to suppress disturbances in the data transmission. At low VS (5.7V to 8.5V), the OUTx voltage is typically 0.5V below VS. This voltage difference is reduced in to ensure sufficient supply voltage for the external unit between OUTx and RETURNx. The output current capability is 50 mA. The internal pulldown current at OUTx is typically 3 mA. Figure 3-1. Output Voltage with Tolerances versus Supply Voltage 35 Voutmax 30 Vout (V) 22.4 21.4 Voutmin 25 20 15 9.4 8.2 7.7 5.4 4.9 10 5 0 0 5 10 15 12.0 5.7 8.5 11.3 20 VS (V) 25 30 28.6 35 40 32.6 The data transmission from the external unit to the interface IC is carried out on the same line by varying the current level. The quiescent current consumption of the external unit is about 5 to 15 mA. This current level is interpreted as logic high level at the CLL pin. The external unit can switch on an additional current of 30 mA, interpreted by the interface as logic low. The slope time of the current pulse is approximately 1 µs which is suitable for a transmission rate up to 60 kBaud. The necessary transmission bandwidth of greater than 500 kHz between OUTx and OCMx is guaranteed (see “Application Circuit” on page 12). To achieve good current transmission behavior, the dynamic resistance of OUTx may not exceed 12Ω within the bandwidth range (total of 15Ω for OUTx and RETURN). The OUTx voltage can be switched off by ENABLEx = LOW to reset the external unit and to reduce power dissipation during fault conditions. The OUT pins are protected against overtemperature and short circuits. A reverse polarity diode at pin VS (pin 4) ensures that no current is fed back to the VBatt system in the case of a short between OUTx and VBatt. A minimum capacity of 33 nF is required at the pins OUTx. 4 U6268B 4808B–AUTO–09/05 U6268B 3.3 ENABLE1, ENABLE2 ENABLEx is a microcontroller-compatible input which switches the related output on or off. • A low or open circuit applied to ENABLEx switches off the related OUTx and RETURNx (high impedance). A sink current at pin OUTx discharges the capacitive load. • A high applied to ENABLEx switches on the related OUTx and RETURNx to supply the external unit. 3.4 OCM1, OCM2 The output current of OUTx is monitored with a transmission factor of 0.1 to the OCMx. With a resistor from OCM to GND, the current is converted to a voltage. The electrical characteristics are specified by ROCM = 750Ω. The CLL-current threshold, the OUT-current limitation and the OUT-current detection can be changed by varying ROCM in a range of 500Ω to 1 kΩ. Current monitoring enables the device to detect overcurrent conditions at OUTx (short-circuit to GND or RETURNx) and low current conditions at OUTx (short-circuit to VBatt or open load). The internal pull-down current at OUTx creates no OCMx-current. During ENABLE, the minimum voltage at OCMx is the saturation voltage of an internal NPN-transistor with typically 0.1V. The maximum voltage at OCM is limited by an internal clamping diode to 5.3V. 3.5 CLL1, CLL2 The current at pin OUTx is evaluated logically and ready to use for a microcontroller input. With this stage, the logic data transmission from the external unit to the interface is completed. CLLx is the output stage of a comparator with an internal threshold and with the OCMx input. A OCMx voltage higher than 2.4V creates a logic low at CLLx, and a OCMx voltage lower than 1.43V creates a logic high at CLLx. The comparator has an internal hysteresis of typically 0.4V. With the pull-down resistor ROCMx = 750Ω at OCMx, the correct OUTx-current threshold related to the logical output CLLx is ensured. The CLLx is low if the OUTx-current is higher than 27.3 mA, and the CLLx is “high”, if the OUTx-current is lower than 19.1 mA. The comparator has an internal hysteresis of typically 5 mA. The tolerance of the ROCM resistor is assumed to be 0%. The CLL pin is an open-collector output and needs a pull-up resistor of typically 2 kΩ to the 5-V supply. For ESD protection, a 7-V Zener diode is implemented. 3.6 RETURN 1, RETURN 2 The RETURNx pin provides a low-ohmic connection to GND via a switched open-collector NPNtransistor. If ENABLEx is high, RETURNx is switched on with a saturation voltage of less than 0.5V at IRETURNx ≤ 50 mA. If ENABLEx is low or open, RETURNx is a current sink with ≤ 2 mA. RETURNx is current-limited at typically 150 mA. 3.7 SC The smooth capacitor is designed to realize the long-time constant for the slow voltage change at OUTx for both interface channels. The capacity is typically 22 nF. At the rising edge of VBatt, the maximum slew rate is VOUTx = 5 V/ms, and at the falling edge of VBatt, the maximum slew rate is VOUTx = 10 V/ms. 5 4808B–AUTO–09/05 3.8 GND Pins A GND bond from the chip to pin 1 and pin 8 provides high ground breakage security and the lowest voltage drop and ground shift between the IC and circuit ground. The four GND pins and the die pad are directly connected to the copper leadframe, resulting in a very low thermal resistance, RthJC. To also achieve a low ambient thermal resistance (RthJA) it is recommended metal parts of the housing be connected in a proper way with the GND pins. 3.9 Power Dissipation Worst case calculation of the supply current IS: IS = 1.278 × (IOUT1 + IOUT2) + 18 mA Worst case calculation of the IC's power dissipation PV: PV = (VS × IS) – [(VS – Vdiff – Vret-sat) × (IOUT1 + IOUT2) + ROCM × ((IOUT12 + IOUT22)/81)] VS = Supply voltage (5.7 to 25V) Vdiff = VS to VOUTx voltage difference Vdiff = 3.6 V at 12 V ≤ VS ≤ 25V Vdiff = 0.8 V at 5.7 V ≤ VS ≤ 8.5V Vret-sat = 0.5 V saturation voltage return IOUTx = output current at pin OUTx = 0 to 60 mA ROCM = resistor at pin OCMx An integrated overtemperature protection generates a switch-off signal at a chip temperature of typically Tj = 160°C and a switch-on signal at typically Tj = 150°C. If overtemperature is detected, only the corresponding channel will be disabled. The other channel stays enabled. The RETURNx is switched off if the voltage at RETURNx exceeds 2V (short-circuit comparator threshold) and overtemperature is detected. The OUTx is switched off if the voltage at OCMx is higher than 4.6V (overcurrent detection level) and overtemperature is detected. The OCM voltage monitors the output current at OUTx via the current ratio of 0.1. The overcurrent-detection level of OUTx can be varied by changing the OCMx resistor. If OUTx is switched off by overtemperature and overcurrent detection, the CLLx output remains a logic low (overcurrent). As the IC is only overtemperature-protected against short-circuit conditions at RETURNx or OUTx, it has to be checked in each application that the chip temperature does not exceed Tjmax = 150°C in normal operation. 3.10 Test Hint The overtemperature signal can be activated by connecting ENABLE1 or ENABLE2 to 9V/10 mA. 6 U6268B 4808B–AUTO–09/05 U6268B 4. Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Parameters Supply voltage Symbol Min. Max. Unit VS –0.6 40 V –0.3 6 V Voltage at pins CLL1, CLL2, ENABLE1, ENABLE2 Voltage at SC Voltage at OCM1, OCM2 Voltage at RETURN1, RETURN2 Voltage at OUT1, OUT2 Current at supply (both channels OUTx and RETURNx shorted) Current at logical pins: CLL1, CLL2 ENABLE1, ENABLE2 Current at SC (SC related to GND or VBatt) VSC –0.3 30 V VOCMx –0.3 6.8 V VRETURNx –1 27 V VOUTx –1 40 V IS 240 mA ICCLx IENABLEx 3 0.1 mA mA 220 µA ISC Current at pins to external unit OUT1, OUT2, RETURN1, RETURN2 ESD classification Human body model (100 pF, 1.5 kΩ) Machine model (200 pF, 0.0Ω) –110 Internally limited All pins ±2000 ±200 V V Ambient temperature range Tamb –40 95 °C Junction temperature range Tj –40 150 °C Storage temperature range Tstg –55 125 °C 5. Thermal Resistance(1) Parameters Junction case Note: Symbol Value Unit RthJC 36 K/W 1. A good ambient thermal resistance junction (RthJA = 65 K/W) can be achieved by using a big pad size for ground connection near a metal component (see section “GND Pins” on page 6) 7 4808B–AUTO–09/05 6. Electrical Characteristics Tamb = –40°C to +95°C and Tj = –40°C to +150°C, Operation supply-voltage range VS = 5.7V to 18V continuously, VS ≤ 25V for maximum 25 min, VS ≤ 40V for up to 500 ms. The current values are based on R = 750Ω, 0%-resistor at OCM1/OCM2 pins. Parameters Supply Current Tj ≥ 125°C Test Conditions Max. Unit Outputs disabled, VS ≤ 18V Symbol IS Min. Typ. 8 mA Outputs disabled, VS ≤ 40V IS 14 mA One output enabled, VS ≤ 18V IS 13 mA Both outputs enabled, VS ≤ 18V IS 18 mA Output load 2 × 15 mA, VS ≤ 18V IS 56 mA Output load 2 × 28 mA, VS ≤ 18V IS 90 mA Output load 2 × 50 mA, VS ≤ 18V IS 146 mA Output load 2 × 60 mA, VS ≤ 18V (Tj > 125°C) IS 171 mA Both channels OUTx and RETURNx shorted, VS ≤ 18V IS 200 mA Function SC Voltage at SC VS = 5.7V VSC 5.1 5.3 V Voltage at SC VS = 12.5V VSC 9 9.4 V Maximal voltage at SC VS = 40V VSCmax 30 V SC-discharge current Voltage SC = VSC – 3V 5.7V ≤ VS ≤ 40V ISC_dis 33 82 µA SC-charge current Voltage SC = VSC – 3V 5.7V ≤ VS ≤ 40V ISC_ch –58 –20 µA 0.8 3.6 V V V Function OUT1 and OUT2 (See Figure 3-1 on page 4) Voltage difference, VS to VOUTx IOUTx = 5 to 50 mA 5.7V ≤ VS ≤ 8.5V 12V ≤ VS ≤ 25V Vdiff_low Vdiff_high 0.3 2.6 Output voltage OUTx 8.5V ≤ VS ≤ 11.3V VOUT_med 7.7 Maximal voltage at OUTx VS = 40V VOUT_max 25 30 Current mirror ratio, IOCMx/IOUTx VS ≤ 40V, IOUTx = 5 to 15 mA VS ≤ 25V, IOUTx = 15 to 50 mA VS ≤ 40V, IOUTx = 15 to 50 mA IOUT_ratio 0.09 0.10 0.097 0.12 0.11 0.11 Ratio_lin –5 5 % Linearity of mirror ratio IOCMx/IOUTx V Dynamic resistance OUTx VS ≤ 40V IOUT = 15 to 50 mA ROUT 2 12 Ω Dynamic resistance OUTx + RETURNx VS ≤ 40V IOUT = 15 to 50 mA RDyn 4 15 Ω OUTx current limitation (OUTx short to GND) VS ≤ 18V VS ≤ 40V IOUT_lim –80 –105 –60 –60 mA mA Tj < 125°C IOUT_det –70 –51 mA Tj ≥ 125°C Always valid: current limitation is higher than overcurrent detection IOUT_det –60 –51 mA VS = 14V, OCMx shorted to GND IOUT_max –140 –85 mA Overcurrent detection level Maximum OUTx current (OUTx short to GND) 8 U6268B 4808B–AUTO–09/05 U6268B 6. Electrical Characteristics (Continued) Tamb = –40°C to +95°C and Tj = –40°C to +150°C, Operation supply-voltage range VS = 5.7V to 18V continuously, VS ≤ 25V for maximum 25 min, VS ≤ 40V for up to 500 ms. The current values are based on R = 750Ω, 0%-resistor at OCM1/OCM2 pins. Parameters Test Conditions Symbol Min. Leakage current at disabled OUTx OUTx short to GND, VS ≤ 25V OUTx short to GND, VS ≤ 38.5V IOUT_leak –0.02 –12 Leakage voltage at disabled OUTx OUTx open, VS ≤ 38.5V VOUT_leak Internal pull-down current VS ≤ 18V VS ≤ 40V IOUT_sink Supply rejection ratio VSC = 7.6V Vrej_mV Supply rejection ratio Variation of VS = 8.4V to 40V in 10 ms Vrej_dB 51.9 dB COUT_min 33 nF Switching on ENABLE = 1 to 90% VOUT reached Switching off ENABLE = 0 to 10% VOUT reached Enable_on 3 30 µs Enable_off 30 100 µs Voltage threshold CLL-comparator CLLx low-level voltage threshold CLLx high-level voltage threshold Voltage hysteresis VCLL_L VCLL_H VCLL_hys 1.75 1.43 0.26 2.4 1.9 0.6 V V V Minimum voltage at OCMx IOUT = 0 to 5 mA VOCM_min 0.5 V Current-limitation level VS ≤ 40V, OUTx short to GND VOCM_lim 4.3 5.3 V Overcurrent-detection level VS ≤ 40V VOCM_det 4.2 4.9 V Current limitation minus overcurrent detection VOCM_lim – VOCM_over ∆_lim_OCM 0.15 0.5 V IOCM_sink 0.1 0.45 mA 0.5 V Minimum capacity at OUTx for phase margin Delay time with Cout = 47 nF 1.8 2.5 Typ. Max. Unit mA mA 4.3 V 4 4.5 mA mA 80 mV Function OCM1, OCM2 Internal pull-down current Function RETURN1, RETURN2 Enable high saturation voltage IRETURN = 50 mA Dynamic resistance dI ≥ 10 mA Current limitation RETURNx is always higher than current limitation OUTx Overcurrent-detection level Delay time CRETURN = 47 nF Vret_sat Rret 2 8 Ω Enable high, VRETURNx = 2V Enable high, VRETURNx ≤ 18V Enable low, VRETURNx ≤ 18V Iret_lim Iret_lim Iret_low 60 70 0.8 150 200 2 mA mA mA Threshold comparator, switch-off return Threshold comparator, switch-on return Hysteresis Vret_low 1.4 2 V Vret_high 1.1 1.5 V Vret_hys 0.2 0.7 V Switching on IRETURN at 50 mA Switching off IRETURN at 1 mA tdRet_on tdRet_off 3 30 30 90 µs µs ICLL_L ICLL_H 23.3 19.1 3.5 27.3 22.3 8.2 mA mA mA Function CLL1, CLL2 (CLLx with 2 kΩ to 5V) ROCM = 750Ω CLL low-level threshold CLL high-level threshold Hysteresis ICLL_hys CLL saturation voltage ICLL ≤ 2.5 mA VCLL_sat 0.4 V CLL leakage current VCLL ≤ 6.5V ICLL_leak 1 µA IOUT threshold CLL comparator 9 4808B–AUTO–09/05 6. Electrical Characteristics (Continued) Tamb = –40°C to +95°C and Tj = –40°C to +150°C, Operation supply-voltage range VS = 5.7V to 18V continuously, VS ≤ 25V for maximum 25 min, VS ≤ 40V for up to 500 ms. The current values are based on R = 750Ω, 0%-resistor at OCM1/OCM2 pins. Parameters Test Conditions Response time to current change IOUT to CLL rise IOUT to CLL fall Maximum difference between rise and fall time CLL output switching speed Rise Fall Symbol Min. tCll_rise tCll_fall 0.1 0.1 Typ. Max. Unit t∆-rise-fall 2 2 1 µs µs µs tCLL_rise tCLL-fall 1 1 µs µs Current transmission rate 60 kHz Current transmission 3 dB bandwidth 500 kHz Function ENABLE1, ENABLE2 Enable high-level threshold VEnable_on 2 6.5 V Enable low-level threshold VEnable_off –0.3 +0.8 V IEnable 10 100 µA Pdis1 1 W Pdis2 0.75 W 165 155 20 °C °C °C Enable input pull-down current (to ensure output disabled during power-off and reset of microcontroller) Power Dissipation Power dissipation 1 Tj ≥ 125°C Power dissipation 2 Tj ≥ 125°C VS = 18V, IOUT1 = 28 mA, IOUT2 at overcurrent detection level or IOUT2 = 28 mA, IOUT1 at overcurrent detection level VS = 18V, IOUT1 = IOUT2 = 28 mA Selective Overtemperature Protection Logic AND connected with overcurrent Switch off detection Switch on (RETURNx, OUTx) Hysteresis Time delay until overtemperature shut-down 10 VS = 25V, Tamb = 125°C OUT1 = OUT2 = GND Temp_off Temp_on Temp_hys 155 145 5 tdel 100 ms U6268B 4808B–AUTO–09/05 U6268B 7. Timing Diagrams Figure 7-1. Variation of Power Supply VS 14.0 V 12.0 V VSC 10.7 V 8.7 V VOUTx 10.7 V 0.4 ms 0.2 ms 8.7 V t Figure 7-2. Overcurrent Protection VENABLEx 5.0 V IOUTx 75 mA overcurrent overcurrent overcurrent overtemperature shut down 15 mA 100 ms VCLLx 5.0 V Pause/pulse for example 150 ms 75 ms t (Pulse/pause time depends on power disipation and RthJA) 11 4808B–AUTO–09/05 Figure 7-3. Data Transmission VENABLEx 30 µs VOUTx discharge of COUT = 47 nF with internal current 13 V 200 mV overcurrent 60 mA IOUTx 40 mA 10 mA VOCMx 4.7 V 150 µs charge time COUT = 47 nF current modulation from sensor 50 µs overcurrent 3.0 V 0.75 V VCLLx 5.0 V 0V Figure 7-4. t Application Circuit +VBatt 100 nF 22 mF VCC = 5 V 14 Microcontroller I/O VS 3 CLL1 47 nF Enable1 13 OCM1 Return1 750 47 nF Out2 11 I/O 10 12 750 2 U6268B VCC = 5 V 5V Out1 Interface1 15 I/O I/O 12 Sensor 1 4 5V 5 CLL2 Sensor 2 47 nF Interface2 Enable2 OCM2 GND 1, 8, 9, 16 Return2 SC 6 7 47 nF 22 nF U6268B 4808B–AUTO–09/05 U6268B 8. Ordering Information Extended Type Number Package U6268B-MFPG3Y Remarks SO16 Taped and reeled, Pb-free 9. Package Information Package SO16 Dimensions in mm 5.2 4.8 10.0 9.85 3.7 1.4 0.25 0.10 0.4 1.27 6.15 5.85 8.89 16 0.2 3.8 9 technical drawings according to DIN specifications 1 8 10. Revision History Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this document. Revision No. History 4808B-AUTO-09/05 • Put datasheet in a new template • Pb-free logo on page 1 added • Table “Ordering Information” on page 13 changed 13 4808B–AUTO–09/05 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Regional Headquarters Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland Tel: (41) 26-426-5555 Fax: (41) 26-426-5500 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Atmel Operations Memory 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany Tel: (49) 71-31-67-0 Fax: (49) 71-31-67-2340 Microcontrollers 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France Tel: (33) 2-40-18-18-18 Fax: (33) 2-40-18-19-60 ASIC/ASSP/Smart Cards 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel: 1(719) 576-3300 Fax: 1(719) 540-1759 Biometrics/Imaging/Hi-Rel MPU/ High Speed Converters/RF Datacom Avenue de Rochepleine BP 123 38521 Saint-Egreve Cedex, France Tel: (33) 4-76-58-30-00 Fax: (33) 4-76-58-34-80 Zone Industrielle 13106 Rousset Cedex, France Tel: (33) 4-42-53-60-00 Fax: (33) 4-42-53-60-01 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel: 1(719) 576-3300 Fax: 1(719) 540-1759 Scottish Enterprise Technology Park Maxwell Building East Kilbride G75 0QR, Scotland Tel: (44) 1355-803-000 Fax: (44) 1355-242-743 Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. © Atmel Corporation 2005. All rights reserved. Atmel ®, logo and combinations thereof, Everywhere You Are ® and others, are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. Printed on recycled paper. 4808B–AUTO–09/05