TSA1204 Dual channel 12-bit 20Msps 120mW A/D converter Features ■ 0.5 Msps to 20 Msps sampling frequency ■ Adaptive power consumption: 120 mW @ 20 Msps, 95 mW@10 Msps Multiplexed outputs ■ INIB 4 33 D5 AGND 5 32 D6 IPOL 6 31 D7 TSA1204 30 D8 29 D9 AGND 8 INQ 9 28 D10 27 D11(MSB) AGND 10 INBQ 11 26 VCCBE AGND 12 25 GNDBE 13 14 15 16 17 18 19 20 21 22 23 24 GNDBI DVCC DGND SELECT CLK DGND DVCC AVCC AGND INCMQ December 2006 34 D4 REFMQ The ADC outputs are multiplexed in a common bus with a small number of pins. A tri-state capability is available for the outputs, allowing chip selection. 35 D3 AGND 3 REFPQ For each channel, an integrated voltage reference simplifies the design and minimizes external components. It is nevertheless possible to use the circuit with external references. 36 D2 AVCCB 7 Description The TSA1204 is specifically designed for applications requiring very low noise floor, high SFDR and good insulation between channels. It is based on a pipeline structure and digital error correction to provide excellent static linearity and over 11.2 effective bits at FS=20 Msps, and Fin=10 MHz. 41 40 39 38 37 2 INI Built-in reference voltage with external bias capability. The TSA1204 is a new generation of high speed, dual-channel analog-to-digital converters implemented in a mainstream 0.25 µm CMOS technology yielding high performance and very low power consumption. D1 ■ D0(LSB) Dual simultaneous sample and hold inputs VCCBE ■ GNDBE Common clocking between channels 44 43 42 VCCBI ■ CLKD VCCBI 1GHz analog bandwidth track-and-hold 47 46 45 AGND 1 SFDR= -81.5 dBc @ Nyquist ■ 48 OEB ■ ENOB=11.2 @ Nyquist AVCC ■ index corner AVCC Independent supply for CMOS output stage with 2.5 V/3.3 V capability INCMI ■ REFMI Single supply voltage: 2.5 V REFPI ■ 7x7mm TQFP48 The inputs of the ADC must be differentially driven. The TSA1204 is available in extended (-40° C to +85° C) temperature range, in a small 48-pin TQFP package. Applications ■ Medical imaging and ultrasound ■ 3G base station ■ I/Q signal processing applications ■ High speed data acquisition system ■ Portable instrumentation Rev 4 1/31 www.st.com 31 Contents TSA1204 Contents 1 Schematic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 Dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 Timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 8.1 8.2 9 2/31 Additional functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 8.1.1 Output enable mode (OEB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 8.1.2 Select mode (SELECT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 References and common mode connection . . . . . . . . . . . . . . . . . . . . . . . 16 8.2.1 Internal reference and common mode . . . . . . . . . . . . . . . . . . . . . . . . . . 16 8.2.2 External reference and common mode . . . . . . . . . . . . . . . . . . . . . . . . . 16 8.3 Driving the differential analog inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 8.4 Clock input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 8.5 Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 8.6 Layout precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8.7 EVAL1204/BA evaluation board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8.7.1 Evaluation board operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 22 8.7.2 Consumption adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 8.7.3 Single and differential inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 8.7.4 Mode select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Practical application examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 9.1 Digital interface applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 9.2 Medical imaging application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 TSA1204 10 Contents Definitions of specified parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Static parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Dynamic parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 11 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 12 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 3/31 Schematic diagram 1 TSA1204 Schematic diagram Figure 1. TSA1204 block diagram +2.5V/3.3V SELECT OEB CLK VCCBE Timing VINI 12 AD 12 I channel VINBI VINCMI common mode VREFPI REF I VREFMI M U X Polar. IPOL VREFPQ VREFMQ D0 TO D11 Buffers REF Q common mode VINCMQ VINQ AD 12 Q channel VINBQ 12 GND Figure 2. 12 12 GNDBE Timing diagram Simultaneous sampling on I/Q channels N+4 N+3 I N N+13 N+12 N+6 N+11 N+7 N+2 N-1 N+5 N+1 N+8 N+9 Q N+10 CLK Tpd I + Tod Tod SELECT CLOCK AND SELECT CONNECTED TOGETHER OEB sample N-8 I channel sample N-6 Q channel sample N Q channel sample N+1 Q channel sample N+2 Q channel DATA OUTPUT sample N-9 I channel 4/31 sample N-7 Q channel sample N+1 sample N+2 I channel I channel sample N+3 I channel TSA1204 2 Pin descriptions Pin descriptions Table 1. Pin descriptions (TQFP48 package) Pin Name 1 AGND Description Analog ground Observation Pin Name 0V 25 GNDBE Digital buffer ground 0V 26 VCCBE Digital Buffer power supply 2.5 V/3.3 V 27 D11(MSB) Most Significant Bit output CMOS output (2.5 V/3.3 V) 28 D10 Digital output CMOS output (2.5 V/3.3 V) 29 D9 Digital output CMOS output (2.5 V/3.3 V) 30 D8 Digital output CMOS output (2.5 V/3.3 V) 2.5 V 31 D7 Digital output CMOS output (2.5 V/3.3 V) 0V 32 D6 Digital output CMOS output (2.5 V/3.3 V) 33 D5 Digital output CMOS output (2.5 V/3.3 V) 34 D4 Digital output CMOS output (2.5 V/3.3 V) 35 D3 Digital output CMOS output (2.5 V/3.3 V) 36 D2 Digital output CMOS output (2.5 V/3.3 V) 37 D1 Digital output CMOS output (2.5 V/3.3 V) 38 D0(LSB) Least Significant Bit output CMOS output (2.5 V/3.3 V) 39 VCCBE Digital Buffer power supply 2.5 V/3.3 V - See Application Note 0V 40 GNDBE Digital buffer ground 0V 2.5 V I channel analog input Description Observation 2 INI 3 AGND 4 INBI 5 AGND Analog ground 6 IPOL Analog bias current input 7 AVCC Analog power supply 8 AGND Analog ground 9 INQ 10 AGND Analog ground 11 INBQ Q channel inverted analog input 12 AGND Analog ground 13 REFPQ Q channel top reference voltage 14 REFMQ Q channel bottom reference voltage 15 INCMQ Q channel input common mode 16 AGND Analog ground 17 AVCC Analog power supply 2.5 V 41 VCCBI Digital Buffer power supply 18 DVCC Digital power supply 2.5 V 42 CLKD Data clock input 19 DGND Digital ground 0V 43 OEB Output Enable input 2.5 V/3.3 V CMOS input 20 CLK Clock input 2.5 V CMOS input 44 AVCC Analog power supply 2.5 V 21 SELECT Channel selection 2.5 V CMOS input 45 AVCC Analog power supply 2.5 V 22 DGND Digital ground 0V 46 INCMI I channel input common mode 23 DVCC Digital power supply 2.5 V 47 REFMI I channel bottom reference voltage 24 GNDBI Digital buffer ground 0V 48 REFPI I channel top reference voltage Analog ground 0V I channel inverted analog input 0V Q channel analog input 0V 0V 0V Idle at high level 2.5 V or 3.3 V 0V 5/31 Dynamic characteristics 3 TSA1204 Dynamic characteristics Dynamic characteristics are measured at AVCC = DVCC = VCCB = 2.5 V, FS= 20 Msps, Fin=10.5 MHz, Vin@ -1 dBFS, VREFP=1.0 V, VREFM=0 V and Tamb = 25° C (unless otherwise specified). Table 2. Symbol SFDR 4 Dynamic characteristics Parameter Test conditions Min Spurious free dynamic range SNR Signal to noise ratio THD Total harmonics distortion 66.9 Typ Max Unit -81.5 -71.0 dBc 68.5 -80 dB -70 dBc SINAD Signal to noise and distortion ratio 64.8 68 dB ENOB Effective number of bits 10.6 11.2 bits Timing characteristics Timing characteristics are measured at AVCC = DVCC = VCCB = 2.5 V, FS= 20 Msps, Fin=10.5 MHz, Vin@ -1 dBFS, VREFP=1.0 V, VREFM=0 V and Tamb = 25° C (unless otherwise specified). Table 3. Symbol 6/31 Timing characteristics Parameter Test conditions Min Typ Max Unit 20 MHz 55 % FS Sampling frequency 0.5 DC Clock duty cycle 45 50 TC1 Clock pulse width (high) 22.5 25 ns TC2 Clock pulse width (low) 22.5 25 ns Tod Data output delay (clock edge to data valid) 9 ns 10 pF load capacitance Tpd I Data pipeline delay for channel I 7 cycle s Tpd Q Data pipeline delay for channel Q 7.5 cycle s Ton Falling edge of OEB to digital output valid data 1 ns Toff Rising edge of OEB to digital output tri-state 1 ns TSA1204 5 Absolute maximum ratings Absolute maximum ratings Table 4. Absolute maximum ratings Symbol AVCC DVCC Parameter Analog supply voltage (1) Unit 0 to 3.3 V 0 to 3.3 V VCCBE Digital buffer supply voltage (1) 0 to 3.6 V VCCBI Digital buffer supply voltage (1) 0 to 3.3 V IDout Digital output current -100 to 100 mA Tstg Storage temperature +150 °C 2 1.5 kV ESD Latch-up Digital supply voltage (1) Values model(2) HBM: human body CDM: charged device model(3) Class(4) A 1. All voltage values, except differential voltage, are with respect to network ground terminal. The magnitude of input and output voltages must not exceed -0.3 V or VCC. 2. Electrostatic discharge pulse (ESD pulse) simulating a human body discharge of 100 pF through 1.5 kΩ. 3. Discharge to ground of a device that has been previously charged. 4. ST Microelectronics corporate procedure number 0018695. 6 Operating conditions Table 5. Operating conditions Symbol Parameter Min Typ Max Unit AVCC Analog supply voltage 2.25 2.5 2.7 V DVCC Digital supply voltage 2.25 2.5 2.7 V VCCBE External digital buffer supply voltage 1.8 2.5 3.5 V VCCBI Internal digital buffer supply voltage 2.25 2.5 2.7 V VREFP I VREFP Q Forced top voltage reference (1) 0.96 1.4 V VREFM I VREFM Q Forced bottom reference voltage (1) 0 0.4 V VINCM I VINCM Q Forced input common mode voltage 0.2 1 V 1. Condition VREFP-VREFM > 0.3 V 7/31 Electrical characteristics 7 TSA1204 Electrical characteristics Electrical characteristics are measured at AVCC = DVCC = VCCB = 2.5 V, FS= 20 Msps, Fin=2 MHz, Vin@ -1 dBFS, VREFP=1.0 V, VREFM=0 V, and Tamb = 25° C (unless otherwise specified). Table 6. Analog inputs Symbol VIN-VINB Parameter Full scale reference voltage Cin Input capacitance Req Equivalent input resistor BW Analog input bandwidth ERB Effective resolution bandwidth Table 7. Test conditions Differential inputs mandatory Min Typ Max Unit 1.1 2.0 2.8 Vpp Vin@full scale, FS=20 Msps 7.0 pF 3 KΩ 1000 MHz 70 MHz Digital inputs and outputs Symbol Parameter Test conditions Min Typ Max Unit 0 0.8 V Clock and select inputs VIL Logic "0" voltage VIH Logic "1" voltage 2.0 2.5 V OEB input VIL Logic "0" voltage VIH Logic "1" voltage 0.25 x VCCBE 0 0.75 x VCCBE VCCBE V V Digital outputs VOL Logic "0" voltage IOL=10 µA VOH Logic "1" voltage IOH=10 µA IOZ High impedance leakage current OEB set to VIH CL Output load capacitance Table 8. Symbol 8/31 0.1 x VCCBE 0 0.9 x VCCBE VCCBE V V -1.7 1.7 µA 15 pF Reference voltage Parameter Test conditions Min Typ Max Unit VREFPI VREFPQ Top internal reference voltage 0.807 0.89 0.963 V VINCMI VINCMQ Input common mode voltage 0.40 0.46 0.52 V TSA1204 Electrical characteristics Table 9. Power consumption Symbol Parameter Min Typ Max Unit ICCA Analog supply current 40 49.5 mA ICCD Digital supply current 2 3 mA ICCBE Digital buffer supply current (10 pF load) 6.2 9 mA ICCBI Digital buffer supply current 73 221 µA Power consumption in normal operation mode 120 155 mW Thermal resistance (TQFP48) 80 Pd Rthja Table 10. °C/W Accuracy Symbol Parameter Min Typ Max Unit OE Offset error -1.8 -0.5 1.8 LSB GE Gain error -0.1 0 0.1 % DNL Differential non linearity -0.93 ±0.4 +0.93 LSB INL Integral non linearity -1.8 ±0.8 +1.8 LSB Monotonicity and no missing codes Table 11. Guaranteed Matching between channels Symbol Parameter Min Typ Max Unit GM Gain match 0.033 0.1 % OM Offset match 0.4 2.5 LSB PHM Phase match 1 dg XTLK Crosstalk rejection 87 dB 9/31 Electrical characteristics TSA1204 Static parameter: integral non linearity(a) Figure 3. FS=20 MSPS; ICCA=40 mA; Fin=2 MH 0.8 INL (LSBs) 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 0 500 1000 1500 2000 2500 3000 3500 4000 3000 3500 4000 Output Code Static parameter: differential non linearity(a) Figure 4. FS=20 MSPS; ICCA=40 mA; Fin=2 MHz 0.4 DNL (LSBs) 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 0 500 1000 1500 2000 2500 Output Code a. For parameter definitions, see Section 10: Definitions of specified parameters on page 25. 10/31 TSA1204 Electrical characteristics Linearity vs. FS Fin=5MHz; Rpol adjustment 12 ENOB Q 11 90 ENOB I 10 80 SINAD Q SNR Q 9 70 8 60 7 SINAD_I SNR_I ENOB (bits) Dynamic parameters (dB) 100 Figure 6. 50 6 40 Dynamic parameters (dBc) Figure 5. 5 10 15 20 Distortion vs. FS Fin=5MHz; Rpol adjustment -20 -30 -40 -50 THD_I SFDR_I -60 -70 -80 -90 -100 THD_Q -110 SFDR_Q -120 25 10 15 20 Fs (MHz) Linearity vs. Fin FS=20Msps; ICCA=40mA ENOB_Q 12 ENOB_I 90 11 80 10 SINAD_Q SNR_Q 70 9 60 8 SNR_I 50 SINAD_I 7 40 6 30 5 0 10 20 30 40 ENOB (bits) Dynamic parameters (dB) 100 Figure 8. Dynamic parameters (dBc) Figure 7. Distortion vs. Fin FS=20Msps; ICCA=40mA -30 -40 -50 THD_Q -60 SFDR_I -70 -80 -90 THD_I SFDR_Q -100 -110 -120 50 0 10 20 Fin (MHz) Figure 9. 30 40 50 Fin (MHz) Linearity vs. Temperature Figure 10. Distortion vs. Temperature FS=20Msps; ICCA=40mA; Fin=2MHz FS=20Msps; ICCA=40mA; Fin=2MHz 12 ENOB_I 120 11.5 90 10.5 ENOB_Q 80 SNR_I SINAD_I 10 70 9.5 9 60 SNR_Q SINAD_Q 8.5 8 50 7.5 40 7 -40 10 Temperature (°C) 60 ENOB (bits) 11 Dynamic parameters (dBc) 100 Dynamic parameters (dB) 25 Fs (MHz) 110 100 SFDR_Q THD_Q 90 80 70 SFDR_I 60 THD_I 50 40 -40 10 60 Temperature (°C) 11/31 Electrical characteristics TSA1204 95 12 ENOB_Q 11 90 ENOB_I 85 10 80 75 SNR_Q 9 SINAD_Q 70 8 65 60 SINAD_I SNR_I ENOB (bits) Dynamic parameters (dB) 100 7 55 50 2.25 Dynamic Parameters (dBc) Figure 11. Linearity vs. AVCC Figure 12. Distortion vs. AVCC FS=20Msps; ICCA=40mA; Fin=5MHz FS=20Msps; ICCA=40mA; Fin=5MHz 2.45 2.55 -40 -50 -60 2.65 THD_I SFDR_I -70 -80 -90 THD_Q SFDR_Q -100 -110 -120 2.25 6 2.35 -30 2.35 2.45 2.55 2.65 AVCC (V) AVCC (V) 12 ENOB_Q 90 11 ENOB_I 80 10 SNR_Q SNR_I 70 9 60 SINAD_Q SINAD_I 8 50 40 2.25 ENOB (bits) Dynamic parameters (dB) 100 7 Dynamic Parameters (dBc) Figure 13. Linearity vs. DVCC Figure 14. Distortion vs. DVCC FS=20Msps; ICCA=40mA; Fin=5MHz FS=20Msps; ICCA=40mA; Fin=5MHz 2.45 2.55 -50 -60 THD_I 2.65 SFDR_I -70 -80 -90 THD_Q SFDR_Q -100 -110 -120 2.25 6 2.35 -40 2.35 2.45 2.55 2.65 DVCC (V) DVCC (V) 85 12 11.5 ENOB_I 80 11 ENOB_Q 75 70 SNR_Q SNR_I 10 65 60 9.5 SINAD_Q SINAD_I 9 55 50 2.25 8.5 8 2.35 2.45 2.55 VCCBI (V) 12/31 10.5 2.65 ENOB (bits) Dynamic parameters (dB) 90 Dynamic Parameters (dBc) Figure 15. Linearity vs. VCCBI Figure 16. Distortion vs. VCCBI FS=20Msps; ICCA=40mA; Fin=5MHz FS=20Msps; ICCA=40mA; Fin=5MHz -40 -50 -60 THD_I SFDR_I -70 -80 -90 THD_Q SFDR_Q -100 -110 -120 2.25 2.35 2.45 VCCBI (V) 2.55 2.65 TSA1204 Electrical characteristics 12 ENOB_I 11.5 85 11 80 10.5 ENOB_Q 75 SNR_I 70 10 SINAD_I 9.5 9 65 SNR_Q 60 8.5 SINAD_Q ENOB (bits) Dynamic parameters (dB) 90 8 55 7.5 50 2.25 7 2.75 Dynamic Parameters (dBc) Figure 17. Linearity vs. VCCBE Figure 18. Distortion vs. VCCBE FS=20Msps; ICCA=40mA; Fin=5MHz FS=20Msps; ICCA=40mA; Fin=5MHz -40 -50 -60 SFDR_Q -80 -90 SFDR_I -100 THD_Q -110 -120 2.25 3.25 THD_I -70 2.75 3.25 VCCBE (V) VCCBE (V) Figure 19. Linearity vs. duty cycle Figure 20. Distortion vs. duty cycle FS=20Msps; ICCA=40mA; Fin=5MHz FS=20Msps; ICCA=40mA; Fin=5MHz 11.5 90 11 10.5 80 ENOB_Q SNR_I SINAD_I 70 10 9.5 9 60 SNR_Q 8.5 SINAD_Q 8 50 7.5 40 7 45 47 49 51 53 Positive Duty Cycle (%) 55 Dynamic parameters (dBc) ENOB_I ENOB (bits) Dynamic parameters (dB) -40 12 100 -50 -60 SFDR_Q THD_Q -70 -80 -90 SFDR_I THD_I -100 -110 -120 45 47 49 51 53 55 Positive Duty Cycle (%) 13/31 Electrical characteristics TSA1204 Figure 21. Single-tone 8K FFT at 20Msps - Channel I Fin=5MHz; ICCA=40mA, Vin@-1dBFS Power spectrum (dB) 0 -20 -40 -60 -80 -100 -120 -140 1 2 3 4 5 6 7 8 9 10 Frequency (MHz) Figure 22. Dual-tone 8K FFT at 20Msps - Channel I Fin1=9.7MHz; Fin2=10.7MHz; ICCA=40mA, Vin1@-7dBFS; Vin2@-7dBFS; IMD=-76dBc Power spectrum (dB) 0 -20 -40 -60 -80 -100 -120 -140 1 2 3 4 5 6 Frequency (MHz) 14/31 7 8 9 10 TSA1204 8 Application information Application information The TSA1204 is a dual-channel, 12-bit resolution analog-to-digital converter based on a pipeline structure and the latest deep submicron CMOS process to achieve the best performance in terms of linearity and power consumption. Each channel achieves 12-bit resolution through the pipeline structure which consists of 12 internal conversion stages in which the analog signal is fed and sequentially converted into digital data. A latency time of 7 clock periods is necessary to obtain the digitized data on the output bus. The input signals are simultaneously sampled, for both channels, on the rising edge of the clock. The output data is delivered on the rising edge of the clock for channel I and on the falling edge of the clock for channel Q, as shown in Figure 2: Timing diagram on page 4. The digital data produced at the different stages must be time delayed accordidng to the order of conversion. Fianlly, a digital data correction completes the processing and ensures the validity of the ending codes on the output bus. The structure is specifically designed to accept differential signals only. 8.1 Additional functions To simplify the application board as much as possible, the following operating modes are provided: 8.1.1 ● Output enable mode (OEB) ● Select mode (SELECT) Output enable mode (OEB) When set to low level (VIL), all digital outputs remain active and are in low impedance state. When set to high level (VIH), all digital output buffers are in high impedance state while the converter goes on sampling. When OEB is set to a low level again, the data arrives on the output with a very short Ton delay. This mechanism allows the chip select of the device. Figure 2: Timing diagram on page 4 summarizes this functionality. If you do not want to use OEB mode, the OEB pin should be grounded through a low value resistor. 8.1.2 Select mode (SELECT) The digital data output from each of the ADC cores is multiplexed to share the same output bus. This prevents an increase in the number of pins and allows to use the same package as for a single-channel ADC like the TSA1201. The information channel is selected with the "SELECT" pin. When set to high level (VIH), channel I data is present on the D0-D11 output bus. When set to low level (VIL), channel Q data is delivered on D0-D11. By connecting SELECT to CLK, channel I and channel Q are simultaneously present on D0D11, channel I on the rising edge of the clock and channel Q on the falling edge of the clock. (Refer to Figure 2: Timing diagram on page 4). 15/31 Application information 8.2 TSA1204 References and common mode connection VREFM must always be connected externally. 8.2.1 Internal reference and common mode In the default configuration, the ADC operates with its own reference and common mode voltages generated by its internal bandgap. It is recommended to decouple the VREFP and INCM pins in order to minimize low and high frequency noise (see Figure 23). Figure 23. Internal reference and common mode setting 1.03V VIN 330pF 10nF 4.7μF VREFP TSA1204 INCM 0.57V 330pF 10nF 4.7μF VINB VREFM 8.2.2 External reference and common mode Each of the voltages VREFM, VREFP and INCM can be fixed externally to better fit to the application needs (refer to Table 5: Operating conditions on page 7 for min/max values). It is possible to use an external reference voltage device for specific applications requiring even better linearity, accuracy or enhanced temperature behavior. The VREFP and VREFM voltages set the analog dynamic range at the input of the converter that has a full scale amplitude of 2*(VREFP-VREFM). The INCM voltage is half the value of VREFP-VREFM. The best linearity and distortion performance is achieved with a dynamic range above 2 Vpp and by increasing the VREFM voltage instead of lowering the VREFP one. To obtain the highest performance from the TSA1204 device, we recommend implementing the configuration shown in Figure 24 with the STMicroelectronics TS821or TS4041-1.2 Vref. Figure 24. External reference setting 1kΩ 330pF 10nF 4.7μF VCCA VREFP VIN TSA1204 VINB 16/31 VREFM TS821 TS4041 external reference TSA1204 8.3 Application information Driving the differential analog inputs The TSA1204 is designed to deliver optimum performance when driven on differential inputs. An RF transformer is an efficient way of achieving this high performance. Figure 25 describes the schematics. The input signal is fed to the primary of the transformer, while the secondary drives both ADC inputs. The common mode voltage of the ADC (INCM) is connected to the center-tap of the secondary of the transformer in order to bias the input signal around this common voltage, internally set to 0.46 V. It determines the DC component of the analog signal. Being a high impedance input, it acts as an I/O and can be externally driven to adjust this DC component. The INCM is decoupled to maintain a low noise level on this node. Our evaluation board is mounted with a 1:1 ADT1-1WT transformer from Minicircuits. You might also use a higher impedance ratio (1:2 or 1:4) to reduce the driving requirement on the analog signal source. Each analog input can drive a 1.4 Vpp amplitude input signal, so the resulting differential amplitude is 2.8 Vpp. Figure 25. Differential input configuration with transformer Analog source ADT1-1 1:1 50Ω VIN TSA1204 channels VINB I or Q 33pF INCM 330pF 10nF 470nF Figure 26. AC-coupled differential input 50Ω VIN 10nF 100kΩ 33pF common mode 50Ω INCM 100kΩ TSA1204 VINB 10nF Figure 26 represents the biasing of a differential input signal in AC-coupled differential input configuration. Both inputs VIN and VINB are centered around the common mode voltage, that can be let internal or fixed externally. 17/31 Application information TSA1204 Figure 27. DC-coupled 2 Vpp differential analog input analog AC+DC VREFP VIN DC TSA1204 VINB analog VREFM INCM DC 330pF 10nF 4.7μF VREFP-VREFM = 1 V Figure 27 shows a DC-coupled configuration with forced VREFP and INCM to the 1 V DC analog input while VREFM is connected to ground; the differential amplitude obtained is 2 Vpp. 8.4 Clock input The quality of your TSA1204 converter is very dependent on your clock input accuracy, in terms of aperture jitter; the use of a low jitter crystal controlled oscillator is recommended. Further points to consider in your implementation are: 8.5 ● The duty cycle must be between 45% and 55%. ● The clock power supplies must be independent from the ADC output supplies to avoid digital noise modulation on the output. ● When powered-on, the circuit needs several clock periods to reach its normal operating conditions. Therefore, it is recommended to keep the circuit clocked to avoid random states before applying the supply voltages. Power consumption optimization The internal architecture of the TSA1204 makes it possible to optimize power consumption according to the sampling frequency of the application. For this purpose, an external resistor is placed between IPOL and the analog ground pins. Therefore, the total dissipation can be optimized over the full sampling range (0.5 Msps up to 20 Msps). The TSA1204 combines the highest performance and the lowest consumption at 20 Msps when Rpol is equal to 54 kΩ. This value is nevertheless dependent on the application and the environment. In the lower sampling frequency range, this value of resistor may be adjusted in order to decrease the analog current without any degradation of the dynamic performance. Table 12 gives some values to illustrate this. 18/31 TSA1204 Application information Table 12. 8.6 Total power consumption optimization depending on Rpol value FS (Msps) 10 20 Rpol (kΩ) 120 54 Optimized power (mW) 95 120 Layout precautions To use the ADC circuits most efficiently at high frequencies, some precautions have to be taken for power supplies: ● First of all, the implementation of 4 proper separate supplies and ground planes (analog, digital, internal and external buffer ones) on the PCB is recommended for high speed circuit applications to provide low inductance and low resistance common return. The separation of the analog signal from the digital output part is mandatory to prevent noise from coupling onto the input signal. The best compromise is to connect AGND, DGND, GNDBI in a common point whereas GNDBE must be isolated. Similarly, the AVCC, DVCC and VCCBI power supplies must be separate from the VCCBE power supply. 8.7 ● Power supply bypass capacitors must be placed as close as possible to the IC pins in order to improve high frequency bypassing and reduce harmonic distortion. ● All inputs and outputs must be properly terminated with output termination resistors; then the amplifier load is resistive only and the stability of the amplifier is improved. All leads must be wide and as short as possible especially for the analog input in order to decrease parasitic capacitance and inductance. ● To keep the capacitive loading as low as possible at digital outputs, short lead lengths of routing are essential to minimize currents when the output changes. To minimize this output capacitance, use buffers or latches close to the output pins. ● Choose component sizes as small as possible (SMD). EVAL1204/BA evaluation board The EVAL1204/BA is a 4-layer board with high decoupling and grounding level. The schematic of the evaluation board is shown in Figure 30 and its top overlay view in Figure 29. The board has been characterized with a fully devoted ADC test bench as shown in Figure 28. Figure 28. Analog-to-digital converter characterization bench HP8644 Sine Wave Generator Data Vin ADC evaluation board Logic Analyzer PC Clk Clk HP8133 Pulse Generator HP8644 Sine Wave Generator 19/31 Application information Note: TSA1204 The analog signal must be filtered to be very pure. The dataready signal is the acquisition clock of the logic analyzer. The ADC digital outputs are latched by the octal buffers 74LCX573. All characterization measurements are made with SFSR=1 dB for static parameters. Figure 29. Evaluation board printed circuit Table 13. Name Part Type RSQ6 0 RSQ7 0 RSQ8 0 RSI6 0 RSI7 0 RSI8 0 47 R3 47 R5 RQ19 47 47 RI1 RQ1 47 RI19 47 RSI9 0NC RSQ5 0NC RSQ9 0NC RSI5 0NC 0NC R24 0NC R23 0NC R21 0NC R22 1K R2 47K R12 47K R11 Raj1 200K C23 C41 C29 20/31 Printed circuit board - list of components Footprint Name Part Type 805 CD2 10nF 805 C40 10nF 805 C39 10nF 805 CQ12 10nF 805 CQ9 10nF 805 C52 10nF 603 C18 10nF 603 C21 10nF 603 C4 10nF 603 C15 10nF 603 C27 10nF 603 C11 10nF 805 CI9 10nF 805 CI12 10nF 805 CI31 10nF 805 CQ31 10nF 805 CQ30 330pF 805 CI11 330pF 805 C51 330pF 805 C2 330pF 603 C17 330pF 603 CD3 330pF 603 C10 330pF CQ8 330pF VR5 trimmer CQ11 330pF 10µF 1210 CI8 330pF 10µF 1210 C14 330pF 10µF 1210 CI30 330pF Footprint 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 Name Part Type C26 330pF C20 330pF C33 330pF C25 330pF CI1 33pF CQ1 33pF C34 47µF C42 47µF C35 47µF C44 47µF C36 47µF C32 47µF C37 470nF CQ10 470nF C28 470nF CI10 470nF CQ32 470nF CQ13 470nF CI32 470nF C13 470nF C53 470nF C16 470nF C3 470nF C22 470nF CI13 470nF C38 470nF CD1 470nF C19 470nF Footprint Name Part Footprint Type 603 CQ6 NC 805 603 CI6 NC 805 603 U2 74LCX573 TSSOP20 603 U3 74LCX573 TSSOP20 603 U1 STG719 SOT23-6 603 JA ANALOGIC connector RB.1 J17 BUFPOW connector RB.1 J25 CKDATA SMA RB.1 J4 CLK SMA RB.1 J27 CON2 SIP2 RB.1 J26 CON2 SIP2 RB.1 JD DIGITAL connector 805 JI1 InI SMA 805 JI1B InIB SMA 805 JQ1 InQ SMA 805 JQ1B InQB SMA 805 SW1 SWITCH connector 805 S5 SW-SPST connector 805 S4 SW-SPST connector 805 TI2 T2-AT1-1WT ADT 805 TQ2 T2-AT1-1WT ADT 805 JI2 VREFI connector 805 JQ2 VREFQ connector 805 J6 32Pin IDC-32 805 connector 805 805 NC: non soldered 805 1 Q JQ1B InQB JI1B InIB 0 RQ19 50 RQ1 50 3 3 RSQ61 0 RI19 50 RI1 50 RSI6 1 0 0 NC RSQ9 4 RSQ8 T2-AT1-1WT 0 0 NC RSQ7 TQ2 6 0 2 RSQ5 ANALOGIC VCC GND JA AVCC 0 NC RSI9 4 RSI8 T2-AT1-1WT0 2 RSI7 + 0NM 0NM 0 NC TI2 6 RSI5 R22 R21 C42 47µF10µF C41 0NM R23 CI9 C4 470nF 10nF JQ2 VREFQ 330pF CQ8 NM 33pF CQ10 CQ9 CQ6 CQ1 330pF C2 NM 33pF 470nF 10nF C3 CI6 330pF CI8 CI1 470nF 10nF CI10 0NM R24 CI31 1K R2 330pF CI30 470nF 10nF 330pF CI12 AGND INI AGND INBI AGND IPOL AVCC AGND INQ AGND INBQ AGND ADC DUAL12B 8-14bits ADC C36 47µF C23 10µF C22 470nF C21 10nF C20 330pF AVCC DVCC C32 47µF C31 10µF C13 470nF C11 10nF C10 330pF J27 2 1 DIGITAL JD CON2 C5 CLK 100nF J4 50 R3 DVCC SW1 CD3 330pF CD2 10nF 330pF CD1 470nF DVcc J9 10µF R5 50 J25 CKDATA C35 VCCB2 47µF C19 470nF C18 10nF C17 330pF C29 36 35 34 33 32 31 30 29 28 27 26 25 330pF 10nF C25 470nF C27 C28 VCCB2 CON2 VCCB2 2 1 J26 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11(MSB) VCCBE GNDBE 470nF 10nF 1 2 3 4 5 6 7 8 9 10 11 12 330pF CI11 C52 10nF C14 330pF C51 330pF C53 470nF C43 10µF 47µF STG719 IN S2 Vcc D GNDS1 U1 VCCB1 C44 AVCC R12 47K S5 SW-SPST C15 10nF C16 470nF 47K R11 S4 SW-SPST VCCB1 VCCB2 CQ13 CQ12 CQ11 470nF 10nF CI13 REFP REFM INCM CQ32 CQ31 CQ30 Raj1 47K 470nF 10nF CI32 JI2 VREFI 48 47 46 45 44 43 42 41 40 39 38 37 REFPI REFMI INCMI AVCC AVCC OEB CLKD VCCBI VCCBI GNDBE VCCBE D0(LSB) D1 REFPQ REFMQ INCMQ AGND AVCC DVCC DGND CLK SELECT DGND DVCC GNDBI NM: non soudé + + REFP REFM INCM + 13 14 15 16 17 18 19 20 21 22 23 24 1 2 3 4 5 6 7 8 9 10 1 2 3 4 5 6 7 8 9 10 10nF 330pF C26 OEB VCC D0 Q0 D1 Q1 U3 D2 Q2 D3 Q3 D4 Q4 D5 Q5 D6 Q6 D7 Q7 GND LE 74LCX573 OEB VCC D0 Q0 D1 Q1 D2 Q2 D3 Q3 D4 Q4 U2 D5 Q5 D6 Q6 D7 Q7 GND LE 470nF C39 47µF C37 C34 VCCB3 C33 C40 C38 330pF 10nF 470nF 74LCX573 VCCB2 GndB1 VccB1 GndB2 VccB2 GndB3 VccB3 VCCB1 J17 BUFPOW + VCC GND 20 19 18 17 16 15 14 13 12 11 20 19 18 17 16 15 14 13 12 11 Normal mode Test mode Switch S5 Open Short VCCB3 OEB Mode Normal mode High Impedance output mode Switch S4 Open Short analog input with transformer (default) single input differential input CLK D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 DO 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 RS5 RS6 RS7 RS8 RS9 C C C C C C C J6 CLK GND D11 GND D10 GND D9 GND D8 GND D7 GND D6 GND D5 GND D4 GND D3 GND D2 GND D1 GND D0 GND TSA1204 Application information Figure 30. TSA1204 evaluation board schematic + + 21/31 Application information 8.7.1 TSA1204 Evaluation board operating conditions Table 14 below shows the connections to the board for the power supplies and other pins. Table 14. Board connections for power supplies and other pins Board marking Connection Internal voltage (V) AV AVCC 2.5 AG AGND 0 RPI REFPI RMI REFMI CMI INCMI 0.46 <1 RPQ REFPQ 0.89 <1.4 RMQ REFMQ CMQ INCMQ DV DVCC 2.5 DG DGND 0 GB1 GNDBI 0 VB1 VCCBI 2.5 GB2 GNDBE 0 VB2 VCCBE 1.8/2.5/3.3 GB3 GNDB3 0 VB3 VCCB3 2.5 0.89 External voltage (V) <1.4 <0.4 <0.4 0.46 <1 Caution: Do not use the VB3 power supply (5 V) dedicated to the 74LCX573 external buffers to supply the VB2 of the TSA1203 which cannot exceed 3.3 V. 8.7.2 Consumption adjustment Before beginnning characterization tests, make sure to adjust the Rpol (Raj1), and therefore Ipol, value according to your sampling frequency. 8.7.3 Single and differential inputs The test board can be driven on a single analog input, or on differential inputs. With a single analog input, you must use the ADT1-1WT transformer to generate a differential signal. In this configuration, the resistors RSI6, RSI7, RSI8 for channel I (respectively RSQ6, RSQ7, RSQ8 for channel Q) are connected as short-circuits whereas RSI5, RSI9 (respectively RSQ5, RSQ9 for channel Q) are open circuits. Alternatively, you can use the JI1 and JI1B differential inputs. In this case, the resistances RSI5, RSI9 for channel I (respectively RSQ5, RSQ9 for channel Q) are connected as shortcircuits whereas RSI6, RSI7, RSI8 (respectively RSQ6, RSQ7, RSQ8 for channel Q) are open circuits. 22/31 TSA1204 8.7.4 Application information Mode select In order to select the channel you want to evaluate, you must set a jumper on the board in the relevant position for the SELECT pin (see Figure 31). The channels selected depend on the position of the jumper: ● With the jumper connected to the upper connectors, channel I at the output is selected. ● With the jumper connected horizontally, channel Q at the output is selected. ● With the jumper connected to the lower connectors, both channels are selected, relative to the clock edge. Figure 31. Mode selection SELECT I channel SELECT Q channel I/Q channels CLK DGND DVCC 23/31 Practical application examples TSA1204 9 Practical application examples 9.1 Digital interface applications The wide external buffer power supply range of the TSA1204 makes it a perfect choice for plugging into 2.5 V or 3.3 V low voltage DSPs or digital interfaces. 9.2 Medical imaging application Driven by the demand of the applications requiring nowadays either portability or ahigh degree of parallelism (or both), this product satisfies the requirements of medical imaging and telecom infrastructures. The typical system diagram in Figure 32 shows how a narrow input beam of acoustic energy is sent into a living body via the transducer and how the energy reflected back is analyzed. Figure 32. Medical imaging application HV TX amps TX beam former Mux and T/R switches ADC RX beam former TGC amplifier Processing and display The transducer is a piezoelectric ceramic such as zirconium titanate. The whole array can reach up to 512 channels. The TX beam former, amplified by the HV TX amps, delivers up to 100 V amplitude excitation pulses with phase and amplitude shifts. The mux and T/R switch is a two-way input signal transmitter/output receiver. To compensate for skin and tissues attenuation effects, the time gain compensation (TGC) amplifier is an exponential amplifier that enables the amplification of low voltage signals to the ADC input range. Differential output structure with low noise and very high linearity are mandatory factors. These applications need high speed, low power and high performance ADCs. 10-12 bit resolution is necessary to lower the quantification noise. As multiple channels are used, a dual converter is a must for room saving issues. The input signal is in the range of 2 to 20 MHz (mainly 2 to 7 MHz) and the application uses mostly a 4 over-sampling ratio for spurious free dynamic range (SFDR) optimization. The next RX beam former and processing blocks enable the analysis of the output channels versus the input beam. 24/31 TSA1204 10 Definitions of specified parameters Definitions of specified parameters Static parameters Static measurements are performed using the histograms method on a 2 MHz input signal, sampled at 50 Msps, which is high enough to fully characterize the test frequency response. The input level is +1 dBFS to saturate the signal. Differential non linearity (DNL) The average deviation of any output code width from the ideal code width of 1 LSB. Integral non linearity (INL) An ideal converter exhibits a transfer function which is a straight line from the starting code to the ending code. The INL is the deviation from this ideal line for each transition. Dynamic parameters Dynamic measurements are performed by spectral analysis, applied to an input sine wave of various frequencies sampled at 40 Msps. The input level is -1dBFS to measure the linear behavior of the converter. All the parameters are given without correction for the full scale amplitude performance except the calculated ENOB parameter. Spurious free dynamic range (SFDR) The ratio between the power of the worst spurious signal (not always an harmonic) and the amplitude of fundamental tone (signal power) over the full Nyquist band. It is expressed in dBc. Total harmonic distortion (THD) The ratio of the rms sum of the first five harmonic distortion components to the rms value of the fundamental line. It is expressed in dB. Signal to noise ratio (SNR) The ratio of the rms value of the fundamental component to the rms sum of all other spectral components in the Nyquist band (fs/ 2) excluding DC, fundamental and the first five harmonics. SNR is reported in dB. Signal to noise and distortion ratio (SINAD) Similar ratio as for SNR but including the harmonic distortion components in the noise figure (not DC signal). It is expressed in dB. The effective number of bits (ENOB) is easily deduced from the SINAD, using the formula: SINAD= 6.02 × ENOB + 1.76 dB. When the applied signal is not full scale (FS), but has an A0 amplitude, the SINAD expression becomes: SINAD2Ao=SINADFull Scale+ 20 log (2A0/FS) 25/31 Definitions of specified parameters TSA1204 SINAD2Ao=6.02 × ENOB + 1.76 dB + 20 log (2A0/FS) The ENOB is expressed in bits. Analog input bandwidth The maximum analog input frequency at which the spectral response of a full power signal is reduced by 3 dB. Higher values can be achieved with smaller input levels. Effective resolution bandwidth (ERB) The band of input signal frequencies that the ADC is intended to convert without loosing linearity i.e. the maximum analog input frequency at which the SINAD is decreased by 3 dB or the ENOB by 1/2 bit. Pipeline delay Delay between the initial sample of the analog input and the availability of the corresponding digital data output, on the output bus. Also called data latency. It is expressed as a number of clock cycles. 26/31 TSA1204 11 Package mechanical data Package mechanical data In order to meet environmental requirements, STMicroelectronics offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics trademark. ECOPACK specifications are available at: www.st.com. 27/31 Package mechanical data TSA1204 Figure 33. Package mechanical data (48-pin plastic package) A A2 e 48 A1 37 36 12 25 E3 E1 E B 1 0,10 mm .004 inch SEATING PLANE c 24 L D3 D1 D L1 13 K 0,25 mm .010 inch GAGE PLANE Millimeters Inches Ref. Min. Typ. A Min. Typ. 1.60 A1 0.05 A2 1.35 B 0.17 C 0.09 0.15 0.002 0.006 1.40 1.45 0.053 0.055 0.057 0.22 0.27 0.007 0.009 0.011 0.20 0.004 0.008 9.00 0.354 D1 7.00 0.276 D3 5.50 0.216 e 0.50 0.0197 E 9.00 0.354 E1 7.00 0.276 E3 5.50 0.216 L1 K 0.45 Max. 0.063 D L 28/31 Max. 0.60 0.75 0.018 1.00 0.024 0.039 0° (min.), 7° (max.) 0.030 TSA1204 12 Ordering information Ordering information Table 15. Order codes Part number TSA1204IFT-E EVAL1204/BA Temperature range Package Packing Marking -40° C to +85° C TQFP48 Tape & reel SA1204I Evaluation board 29/31 Revision history 13 TSA1204 Revision history Table 16. 30/31 Document revision history Date Revision Changes 1-Apr-2004 1 Initial release. 2-May-2005 2 Datasheet modified from Not for new Design to full production further to new business demand. 26-Sep-2006 3 Editorial updates. Reorganized document structure. No technical changes. 12-Dec-2006 4 Renamed pin 42 to CLKD. TSA1204 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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