NTLJD2105L POWER MOSFET 8 V, 4.3 A, mCool] High Side Load Switch with Level Shift, 2x2 mm WDFN Package Features • WDFN 2x2 mm Package with Exposed Drain Pads Offers Excellent • • • • • • • Thermal Performance Low RDS(on) P−Channel Load Switch with N−channel MOSFET for Level Shift N Channel Operated at 1.5 V Gate Drive Voltage Level P Channel Operated at 1.5 V Supply Voltage Same Footprint as SC88 Low Profile (<0.8 mm) Allows it to Fit Easily into Extremely Thin Environments ESD Protection These are Pb−Free Devices http://onsemi.com VINMAX RDS(on) MAX IL MAX 50 mW @ 4.5 V 60 mW @ 2.5 V 20 V 4.3 A 80 mW @ 1.8 V 115 mW @ 1.5 V 4 2, 3 Q2 6 Applications • High Slide Load Switch with Level Shift • Optimized for Power Management in Ultra Portable Equipment 5 Q1 MOSFET(Q2) MAXIMUM RATINGS 1 (TJ = 25°C unless otherwise stated) Parameter Q2 Input Voltage (VDS, P−Channel) Q1 On/Off Voltage (VGS, N−Channel) Continuous Load Current (Note 1) Power Dissipation (Note 1) Value Unit VIN 8 V VON/OFF 6 V IL 4.3 A Steady State TA = 25°C Steady State TA = 25°C PD 1.56 W TA = 25°C IL 2.5 A Continuous Load Current (Note 2) Power Dissipation (Note 2) Symbol Steady State TA = 85°C 3.1 TA = 85°C 0.52 ILM 20 A TJ, TSTG −55 to 150 °C Source Current (Body Diode) (Note 2) IS −2.7 A Lead Temperature for Soldering Purposes (1/8” from case for 10 s) TL 260 °C tp = 10 ms Operating Junction and Storage Temperature 1 2 JN M G 3 Pin 1 WDFN6 CASE 506AZ JN M G 1.8 PD Pulsed Load Current TA = 25°C MARKING DIAGRAM 6 5 4 = Specific Device Code = Date Code = Pb−Free Package W PIN CONNECTIONS 1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces) 2. Surface−mounted on FR4 board using the minimum recommended pad size. S1 1 D2 2 D2 3 D1/G2 6 D1/G2 5 G1 D2 4 S2 (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2006 November, 2006 − Rev. 0 1 Publication Order Number: NTLJD2105L/D NTLJD2105L THERMAL RESISTANCE RATINGS Symbol Max Unit Junction−to−Ambient – Steady State (Note 3) Parameter RqJA 80 °C/W Junction−to−Ambient – t v 5 s (Note 3) RqJA 38 °C/W Junction−to−Ambient – Steady State Min Pad (Note 4) RqJA 180 °C/W 3. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces). 4. Surface−mounted on FR4 board using the minimum recommended pad size. ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Parameter Symbol Test Condition Min V(BR)DSS VGS = 0 V, ID = 250 mA −8.0 Typ Max Unit OFF CHARACTERISTICS Q2 Drain−to−Source Breakdown Voltage Q2 Forward Leakage Current IFL VON/OFF = 0 V, VIN = 8.0 V V TJ = 25°C 0.1 TJ = 85°C 1 Q1 Gate−to−Source Leakage Current IGSS VDS = 0 V, VGS1 = ±6 V Q1 Diode Forward On−Voltage VSD IS = −1.0 A, VGS1 = 0 V −0.8 mA ±100 nA −1.1 V ON CHARACTERISTICS Q1 ON/OFF Voltage VON/OFF Q1 Gate Threshold Voltage VGS1(TH) Q2 Input Voltage Q2 Drain−to−Source On Resistance Q2 Load Current VGS1 = VDS1, ID = 250 mA VIN RDS(on) IL 1.5 8.0 0.40 1.0 V 1.8 8.0 V mW VIN = 4.5 V, IL = 4.0 A 33 50 VIN = 2.5 V, IL = 3.0 A 40 60 VIN = 1.8 V, IL = 1.7 A 60 80 VIN = 1.5 V, IL = 1.2 A 75 115 VDROP v 0.2 V, VIN = 2.5 V, VON/OFF = 1.5 V 1.0 VDROP v 0.3 V, VIN = 1.8 V, VON/OFF = 1.5 V 1.0 http://onsemi.com 2 A NTLJD2105L TYPICAL PERFORMANCE CURVES (TJ = 25°C unless otherwise noted) 0.15 0.20 VIN = 2.5 V 0.10 TJ = 25°C TJ = 85°C 0.05 0.00 VDROP, VOLTAGE DROP (V) VDROP, VOLTAGE DROP (V) VIN = 4.5 V 0 1 2 3 0.15 0.10 TJ = 85°C 0.05 0.00 4 TJ = 25°C 0 1 IL, LOAD CURRENT (AMPS) Figure 1. Voltage Drop versus Load Current @ VIN = 4.5 V Figure 2. Voltage Drop versus Load Current @ VIN = 2.5 V 4 0.35 VIN = 1.5 V VDROP, VOLTAGE DROP (V) VIN = 1.8 V VDROP, VOLTAGE DROP (V) 3 IL, LOAD CURRENT (AMPS) 0.25 0.20 TJ = 25°C 0.15 0.10 TJ = 85°C 0.05 0.00 2 0 1 2 3 0.30 0.25 0.15 TJ = 85°C 0.10 0.05 0.00 4 TJ = 25°C 0.20 0 1 IL, LOAD CURRENT (AMPS) 2 3 IL, LOAD CURRENT (AMPS) Figure 3. Voltage Drop versus Load Current @ VIN = 1.8 V Figure 4. Voltage Drop versus Load Current @ VIN = 1.5 V http://onsemi.com 3 4 NTLJD2105L TYPICAL PERFORMANCE CURVES (TJ = 25°C unless otherwise noted) Figure 5. Turn−on (Vin = 1.5 V, RL = 3 W, R1 = 1 kW, R2 = 0, C1 = 47 nF) Figure 6. Turn−off (Vin = 1.5 V, RL = 3 W, R1 = 1 kW, R2 = 0, C1 = 47 nF) Figure 7. Turn−on (Vin = 1.5 V, RL = 3 W, R1 = 10 kW, R2 = 1 kW, C1 = 47 nF) Figure 8. Turn−off (Vin = 1.5 V, RL = 3 W, R1 = 10 kW, R2 = 1 kW, C1 = 47 nF) Figure 9. Turn−on (Vin = 3 V, RL = 3 W, R1 = 10 kW, R2 = 1 kW, C1 = 47 nF) Figure 10. Turn−off (Vin = 3 V, RL = 3 W, R1 = 10 kW, R2 = 1 kW, C1 = 47 nF) http://onsemi.com 4 NTLJD2105L EFFECTIVE TRANSIENT THERMAL RESISTANCE TYPICAL PERFORMANCE CURVES (TJ = 25°C unless otherwise noted) 1000 100 D = 0.5 0.2 0.1 10 0.05 P(pk) 0.02 0.01 1 D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) − TA = P(pk) RqJA(t) t1 t2 DUTY CYCLE, D = t1/t2 SINGLE PULSE 0.1 0.000001 0.00001 0.0001 0.001 0.01 0.1 t, TIME (sec) 1 10 100 1000 Figure 11. Thermal Response 4 VIN 2, 3 R1 6 6 5 ON/OFF CO Q1 CI VOUT C1 Q2 LOAD 1 R2 GND GND Figure 12. Load Switch Application ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Components Description R1 Pull−up Resistor Typical 10 kW to 1.0 W* Typical 0 kW to 100 kW* R2 Optional Slew−Rate Control CO, CI Output Capacitance C1 Optional In−Rush Current Control Value Usually < 1.0 mF Typical v 1000 pF *Minimum R1 value should be at least 10 x R2 to ensure Q1 turn−on. ORDERING INFORMATION Device NTLJD2105LTBG Package Shipping † WDFN6 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 NTLJD2105L PACKAGE DIMENSIONS WDFN6, 2x2 CASE 506AZ−01 ISSUE A D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. PINS 2 & 3 CONNECTED TO LARGE FLAG. 6. PIN 6 CONNECTED TO SMALL FLAG. A B PIN ONE REFERENCE ÍÍÍ ÍÍÍ ÍÍÍ E DIM A A1 A3 b D D2 D3 E E2 e G G2 K L 0.10 C 2X 0.10 C 2X A3 0.10 C A 0.08 C 6X A1 C G2 SOLDERING FOOTPRINT* SEATING PLANE D3 6X 2.30 e L 1 4X 1.05 3 0.45 1 6X 0.35 0.38 NOTE 6 2X E2 0.65 PITCH NOTE 5 6X MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.25 0.35 2.00 BSC 0.30 0.50 0.80 1.00 2.00 BSC 0.90 1.10 0.65 BSC 0.41 REF 0.085 REF 0.25 REF 0.20 0.30 6 K 0.11 4 6X D2 b 0.10 C A G 0.05 C B 0.95 NOTE 3 6X 0.43 DIMENSIONS: MILLIMETERS BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. mCool is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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