Advance Product Information April 4, 2006 9.9 - 12.5 Gb/s Optical Modulator Driver TGA4954-SL Key Features and Performance • • • Wide Drive Range (3V to 10V) Single-Ended Input/Output Low Power Dissipation (1.1W @ 6Vo) Low Rail Ripple 25psec Edge Rates (20/80%) Hot-pluggable Package Dimensions: 11.4 x 8.9 x 2.0 mm (0.450 x 0.350 x 0.080 inches) • • • • Product Description The TriQuint TGA4954-SL is part of a series of surface mount modulator drivers suitable for a variety of driver applications and is compatible with Metro MSA standards. The 4954 provides Metro and Long Haul designers with system critical features such as: low power dissipation (1.2W at Vo = 6V), low rail ripple, high voltage drive capability at 5V bias (6 V amplitude adjustable to 3 V), low output jitter, and low input drive sensitivity (250mV at Vo = 6V). The 4954 requires external DC blocks, a low frequency choke, and control circuitry. • Mach-Zehnder Modulator Driver Measured Data Vdd=5V; Id1=65mA; Id2=115mA; Vctrl1=-0.2V; Vctrl2=+0.2V 15 10 32 S21 S11 S22 28 24 5 0 20 -5 16 -10 12 -15 8 -20 4 -25 0 S11,S22 (dB) 36 S21 (dB) The 4954 consists of two high performance wideband amplifiers combined with off chip circuitry assembled in a surface mount package. A single 4954 placed between the MUX and Optical Modulator provides OEMs with a board level modulator driver surface mount solution. Primary Applications -30 0 5 10 Frequency (GHz) 15 20 Vout=6Vpp Evaluation boards available upon request. Lead Free & RoHS compliant. Note: This device is early in the characterization process prior to finalizing all electrical test specifications. Specifications are subject to change without notice. 1 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information April 4, 2006 TGA4954-SL TABLE I MAXIMUM RATINGS Symbol Parameter Value Notes 8V 1/ 2/ VD1 VD2 Drain Voltage VG1 VG2 Gate Voltage Range -3V to 0V 1/ Control Voltage Range -3V to VD 1/ Drain Supply Current (Quiescent) 200 mA 350 mA 1/ 2/ Gate Supply Current 15 mA 1/ VCTRL1 VCTRL2 ID1 ID2 | IG1 | | IG2 | | ICTRL1 | | ICTRL2 | Control Supply Current 15 mA 1/ 5/ PIN Input Continuous Wave Power 23 dBm 1/ 2/ VIN 12.5Gb/s PRBS Input Voltage 4 VPP 1/ 2/ PD Power Dissipation 4W 1/ 2/ 3/ TCH TM TSTG Operating Channel Temperature Mounting Temperature (10 Seconds) Storage Temperature 0 150 C 4/ 0 230 C 0 -65 to 150 C 1/ These ratings represent the maximum operable values for this device 2/ Combinations of supply voltage, supply current, input power, and output power shall not exceed PD at a package base temperature of 80°C 3/ When operated at this bias condition with a baseplate temperature of 80°C, the MTTF is reduced 4/ Junction operating temperature will directly affect the device median time to failure (MTTF). For maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels. 5/ Assure VCTRL1 never exceeds VD1, and VCTRL2 never exceeds VD2 during bias up and down sequences. 2 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information April 4, 2006 TGA4954-SL TABLE II THERMAL INFORMATION Parameter Test Conditions RΘJC Thermal Resistance (Channel to Backside of Package) VDD = 5V IDD = 215mA PDISS = 1.08W TBASE = 70°C TCH (°C) RΘJC (°C/W) MTTF (hrs) 92 20.4 >1E6 Note: Thermal transfer is conducted through the bottom of the TGA4954-SL package into the motherboard. The motherboard must be designed to assure adequate thermal transfer to the base plate. TABLE III RF CHARACTERIZATION TABLE (TA = 25°C, Nominal) Parameter Test Conditions Min Typ Max Units Small Signal Bandwidth 8 GHz Saturated Power Bandwidth 12 GHz Notes Small Signal Gain 0.1, 2, 4 GHz 6 GHz 10 GHz 14 GHz 16 GHz 28 26 24 17 12 34 33 30 25 21 dB 1/ Input Return Loss 0.1, 2, 4, 6, 10, 14, 16 GHz 10 15 dB 1/ Output Return Loss 0.1, 2, 4, 6, 10, 14, 16 GHz 10 15 dB 1/ Noise Figure 3 GHz 2.5 dB Small Signal AGC Range Midband 28 dB 26.5 dBm Saturated Output Power 2, 4, 6, 8 & 10 GHz 24 6/ 7/ 3 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information April 4, 2006 TGA4954-SL TABLE III (Continued) RF CHARACTERIZATION TABLE (TA = 25°C, Nominal) Parameter Test Conditions Min Eye Amplitude VD2 = 8.0V VD2 = 6.5V VD2 = 5.5V VD2 = 4.5V VD2 = 4.0V 9.0 7.0 6.0 5.5 5.0 Additive Jitter (RMS) VIN = 500mVPP VIN = 800mVPP Q-Factor VIN = 250mVPP VIN = 500mVPP VIN = 800mVPP Delta Crossing Percentage 250mVPP 800mVPP Delta Eye Amplitude 250mVPP 800mVPP Typ 1.2 1.4 25 25 25 -0.50 -0.50 Max 3.0 3.0 39 42 42 -0.1 0.0 Units Notes VPP 2/ psec 5/ V/V 10.0 8.0 % 0.50 0.50 VPP Table III Notes: 1/ Package RF Bias: VDD = 5V, adjust VG1 to achieve ID1 = 65mA then adjust VG2 to achieve ID2 = 115mA, VCTRL1 = -0.2V & VCTRL2 = +0.2 V 2/ VIN = 250mV, Data Rate = 10.7Gb/s, VD1 = VD2 or greater, VCTRL2 and VG2 are adjusted for maximum output 5/ Computed using RSS Method where JRMS_DUT = √(JRMS_TOTAL2 - JRMS_SOURCE2) 6/ Verified at die level on-wafer probe 7/ Power Bias Die Probe: VTEE = 8V, adjust VG to achieve ID = 175mA ±5%, VCTRL = +1.5V 8/ Value is the difference with the 500mV input measurement. Result is the absolute value. Note: At the die level, drain bias is applied through the RF output port using a bias tee, voltage is at the DC input to the bias tee 4 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information April 4, 2006 TGA4954-SL Measured Data Vdd=5V; Id1=65mA; Id2=115mA; Vctrl1=-0.2V; Vctrl2=+0.2V 36 32 28 S21 (dB) 24 20 16 12 8 4 0 0 2 4 6 8 10 12 14 16 18 20 14 16 18 20 Frequency (GHz) 0 S11 S22 -5 S11,S22 (dB) -10 -15 -20 -25 -30 -35 -40 0 2 4 6 8 10 12 Frequency (GHz) 5 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information April 4, 2006 Measured Data TGA4954-SL Vdd=5V; Id1=65mA; Vctrl1=-0.2V; Vin=500mVpp; Vo=6Vpp Vg2 & Vctrl2 are varied to achieve 6Vo & 50% crossing 9.953Gbps 10.7Gbps 11.3Gbps 12.5Gbps 6 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information April 4, 2006 Measured Data TGA4954-SL Vdd=5V; Id1=65mA; Vctrl1=-0.2V; Vo=6Vpp; 10.7Gbps Vg2 & Vctrl2 are varied to achieve 6Vo & 50% crossing Vin=250mVpp Vin=500mVpp Vin=800mVpp 7 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information April 4, 2006 TGA4954-SL Measured Data Vdd=5V; Id1=65mA; Vctrl1=-0.2V; Vin=500mVpp; 10.7Gbps Vg2 & Vctrl2 are varied to achieve 6Vo & 50% crossing 3Vo 4Vo 5Vo 6Vo Input 8 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information April 4, 2006 TGA4954-SL TGA4954 Typical Performance Data Measured in a Test Fixture Idd Vdd Id2 Test Fixture Id1 4954 SMT Driver RF(in) RF(out) Vctrl1 Vg1 Vctrl2 Vg2 Test Fixture Block Diagram 9 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information April 4, 2006 TGA4954-SL Production - Initial Alignment - Bias Procedure Vdd=5V, Vo=6Vamp, CPC=50% (Hot-Pluggable) Bias Network Initial Conditions Vg1=-1.5V Vg2=-1.5V Vctrl1=-0.2V Vctrl2=+.1V Vdd=5V Bias ON Bias OFF 1. Remove Vdd. 1. Disable the output of MUX 2. Remove Vg1, Vg2, Vctrl1 and Vctrl2 2. Apply Vg1, Vg2, Vctrl1 and Vctrl2 in any sequence. in any sequence. 3. Apply Vdd. 4. Make Vg1 more positive until Idd=65mA. - This is Id1 (current into the first stage) - Typical value for Vg1 is -0.65V 5. Make Vg2 more positive until Idd=180mA. - This sets Id2 to 115mA. - Typical value for Vg2 is -0.55V 6. Enable the output of the MUX. - Set Vin=500mV 7. Output Swing Adjust: Adjust Vctrl2 slightly positive to increase output swing or adjust Vctrl2 slightly negative to decrease the output swing. - Typical value for Vctrl2 is +0.22V for Vo=6V. 8. Crossover Adjust: Adjust Vg2 slightly positive to push the crossover down or adjust Vg2 slightly negative to push the crossover up. - Typical value for Vg2 is -0.57V to center crossover with Vo=6V. 10 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information April 4, 2006 TGA4954-SL Production - Post Alignment - Bias Procedure Vdd=5V, Vo=6Vamp, CPC=50% (Hot-Pluggable) Bias Network Initial Conditions Vg1= As found during initial alignment Vg2=-As found during initial alignment Vctrl1=-0.2V Vctrl2=As found during initial alignment Vdd=5V Bias ON 1. Mux output can be either Enabled or Disabled 2. Apply Vg1, Vg2, Vctrl1 and Vctrl2 in any sequence. 3. Apply Vdd. 4. Enable the output of the MUX 5. Output Swing Adjust: Adjust Vctrl2 slightly positive to increase output swing or adjust Vctrl2 slightly negative to decrease the output swing. 6. Crossover Adjust: Adjust Vg2 slightly positive to push the crossover down or adjust Vg2 slightly negative to push the crossover up. Bias OFF 1. Remove Vdd. 2. Remove Vg1, Vg2, Vctrl1 and Vctrl2 in any sequence. 11 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information April 4, 2006 TGA4954-SL 0.350 0.327 0.207 0.407 0.438 0.327 15 16 17 9 18 19 6 5 4 3 2 0.175 1 0.367 0.412 0.450 7 0.236 8 0.167 0.080 REF. 0.024 0.000 10 11 12 13 14 0.000 0.017 0.087 0.177 0.175 0.127 0.047 Mechanical Drawing LID 0.020 SIDEWALL Bond Pad #1 Bond Pad #2 Bond Pad #3 Bond Pad #4 Bond Pad #5 Bond Pad #6 Bond Pad #7 Bond Pad #8 Bond Pad #9 N/C N/C Vg1 N/C N/C Vg2 N/C N/C RF Out 0.025 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.027 x 0.018 Bond Pad #10 Bond Pad #11 Bond Pad #12 Bond Pad #13 Bond Pad #14 Bond Pad #15 Bond Pad #16 Bond Pad #17 Bond Pad #18 Bond Pad #19 N/C N/C Vd2 N/C Vctrl2 Vd1 N/C Vctrl1 RF In GND 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.020 x 0.018 0.335 x 0.206 12 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information April 4, 2006 TGA4954-SL Application Circuit Recommended Components: DESIGNATOR DESCRIPTION MANUFACTURER PART NUMBER C1, C2 DC Block, Broadband Presidio BB0502X7R104M16VNT9820 C3, C4, C5 10uF Capacitor MLC Ceramic AVX 0802YC106KAT C6, C7 0.01 uFCapacitor MLC Ceramic AVX 0603YC103KAT C8 10 uF Capacitor Tantalum AVX TAJA106K016R L1 220 uH Inductor Belfuse S581-4000-14 L2 330 nH Inductor Panasonic ELJ-FAR33MF2 R1, R2 274 Ω Resistor Panasonic ERJ-2RKF2740X Notes: 1. C3 and C4 extend low frequency performance thru 30 KHz. For applications requiring low frequency performance thru 100 kHz, C3 and C4 may be omitted 2. C6 and C7 are power supply decoupling capacitors and may be omitted when driven directly with an opamp. Impedance looking into VCTRL1 and VCTRL2 is 10kΩ real 13 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information April 4, 2006 TGA4954-SL Recommended Surface Mount Package Assembly Proper ESD precautions must be followed while handling packages. Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry. TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed in the table below. Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on PCB and component layout and should be well controlled to ensure consistent mechanical and electrical performance. This package has little tendency to self-align during reflow. Clean the assembly with alcohol. Typical Solder Reflow Profiles Reflow Profile SnPb Pb Free Ramp-up Rate 3 °C/sec 3 °C/sec Activation Time and Temperature 60 – 120 sec @ 140 – 160 °C 60 – 180 sec @ 150 – 200 °C Time above Melting Point 60 – 150 sec 60 – 150 sec Max Peak Temperature 240 °C 260 °C Time within 5 °C of Peak Temperature 10 – 20 sec 10 – 20 sec Ramp-down Rate 4 – 6 °C/sec 4 – 6 °C/sec Ordering Information Part TGA4954-SL Package Style Land Grid Array Surface Mount GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. 14 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com