TA31145FNG TA31145FNG The TA31145FNG package is Pb-Free. 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG 2004-09-01 TA31145FNG TA31145FNG Notice for Pb free product About solderability, following conditions were confirmed Solderability (1) Use of Sn-36Pb solder bath ・solder bath temperature = 230℃ ・dipping time = 5seconds ・the number of times = once ・use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder bath ・solder bath temperature = 245℃ ・dipping time = 5seconds ・the number of times = once ・use of R-type flux 2004-09-01