### AVAGO HDJD-J822

```HDJD-J822
Color Management System Feedback Controller
Data Sheet
Description
Failure Rate Prediction
The following cumulative test results have been obtained from testing performed at Avago Technologies
in accordance with the latest revision of JEDEC. Avago
Technologies tests parts at the absolute maximum rated
conditions recommended for the device. The actual performance you obtain from Avago Technologies parts depends on the electrical and environmental characteristics
of your application but will probably be better than the
performance outlined in Table 1.
The junction temperature of the device determines the
failure rate of semiconductor devices. The relationship
between ambient temperature and actual junction temperature is given by the following:
TJ(°C) = TA(°C) + θJAPAVG
where:
TA = ambient temperature in °C
θJA = thermal resistance of junction-to-ambient in °C/
Watt
PAVG = average power dissipated in Watt
The estimated MTBF and failure rate at temperatures lower than the actual stress temperature can be determined
by using an Arrhenius model for temperature acceleration. Results of such calculations are shown in the table
below using activation energy of 0.7eV.
Table 1. Life Tests
Demonstrated Performance
Test Name
High Temperature
Operating Life
Performance in Time
(60% confidence)
Stress Test
Conditions
Total
Device Hrs
Units
Tested
Units
Failed
MTBF [1]
Failure Rate [2] (FIT)
TA = 85°C,
AVdd = 5.5V,
DVdd = 5.5V
231,000
231
0
2.52 x 105
3968
Table 2.
Performance in Time
(60% Confidence)
Performance in Time
(90% Confidence)
Ambient
Temperature
(°C)
Junction
Temperature [3]
(°C)
MTBF [1] (hrs)
Failure Rate [2] (FIT)
MTBF (hrs)
Failure Rate (FIT)
85
87
2.52 x 105
3968
1.00 x 105
9970
75
82
4.81 x 105
2080
1.91 x 105
5225
65
77
9.52 x 105
1050
3.79 x 105
2638
55
57
1.97 x 106
508
7.83 x 105
1277
45
47
4.25 x 106
235
1.69 x 106
591
35
37
9.65 x 106
104
3.84 x 106
260
27
2.32 x 107
43
9.22 x 106
108
25
Notes:
1. The 60% or 90% confidence MTBF represents the minimum level of reliability performance which is expected from 60% or 90% of all samples.
The confidence level is established based on the chi-square distribution.
2. Failure rate (FIT) is 1/MTBF x 109, assuming the failures are exponentially distributed.
3. Calculated from data generated at 85°C biased at DVdd 5.5V, AVdd 5.5V and θJA = 45°C/watt
Table 3. Environmental Tests
Test Name
Test Conditions
Units Tested
Units Failed
Temperature Cycle
-65°C/+150°C, 500 cycles
231
0
HAST
130°C/85%RH, 96 hrs
231
0
Autoclave
121°C, 15psig, 96 hrs
231
0
High Temperature Storage
150°C, 1000hrs
45
0
Table 4. Electrostatic Discharge (ESD) Classification Test Results:
Test Name
Reference
Results
ESD Human Body Model
MILSTD 883, Method 3015
2000V
ESD Machine Model
MILSTD 883, Method 3015
200V
Latch up at 125°C
AEC-Q100-004
Pass (+/-100mA)
Moisture Sensitivity Classification: Class 3
Pre-conditioning per JESD22-A113-A class 3 was performed on all devices prior to reliability testing except
for High Temperature Operating Life and electrical verification test.
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