MAX3070E–MAX3079E LE AVAILAB +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers General Description The MAX3070E–MAX3079E 3.3V, ±15kV ESD-protected, RS-485/RS-422 transceivers feature one driver and one receiver. These devices include fail-safe circuitry, guaranteeing a logic-high receiver output when receiver inputs are open or shorted. The receiver outputs a logic high if all transmitters on a terminated bus are disabled (high impedance). The MAX3070E–MAX3079E include a hot-swap capability to eliminate false transitions on the bus during power-up or hot insertion. The MAX3070E/MAX3071E/MAX3072E feature reduced slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing error-free data transmission up to 250kbps. The MAX3073E/MAX3074E/MAX3075E also feature slewrate-limited drivers but allow transmit speeds up to 500kbps. The MAX3076E/MAX3077E/MAX3078E driver slew rates are not limited, making transmit speeds up to 16Mbps possible. The MAX3079E slew rate is pin selectable for 250kbps, 500kbps, and 16Mbps. The MAX3072E/MAX3075E/MAX3078E are intended for half-duplex communications, and the MAX3070E/ MAX3071E/MAX3073E/MAX3074E/MAX3076E/MAX307 7E are intended for full-duplex communications. The MAX3079E is selectable for half-duplex or full-duplex operation. It also features independently programmable receiver and transmitter output phase through separate pins. The MAX3070E–MAX3079E transceivers draw 800µA of supply current when unloaded or when fully loaded Functional with the drivers disabled. All devices Diagrams have a 1/8-unit load receiver input impedance, allowing up to 256 transceivers on the bus. Applications Lighting Systems Industrial Control Features ♦ 3.3V Operation ♦ Electrostatic Discharge (ESD) Protection for RS-485 I/O Pins ±15kV Human Body Model ♦ True Fail-Safe Receiver While Maintaining EIA/TIA-485 Compatibility ♦ Hot-Swap Input Structure on DE and RE ♦ Enhanced Slew-Rate Limiting Facilitates ErrorFree Data Transmission (MAX3070E–MAX3075E/MAX3079E) ♦ Low-Current Shutdown Mode (Except MAX3071E/MAX3074E/MAX3077E) ♦ Pin-Selectable Full-/Half-Duplex Operation (MAX3079E) ♦ Phase Controls to Correct for Twisted-Pair Reversal (MAX3079E) ♦ Allow Up to 256 Transceivers on the Bus ♦ Available in Industry-Standard 8-Pin SO Package Ordering Ordering Information Information PART† TEMP RANGE PIN-PACKAGE MAX3070EEPD -40°C to +85°C 14 Plastic DIP MAX3070EESD -40°C to +85°C 14 SO MAX3070EAPD -40°C to +125°C MAX3070EASD -40°C to +125°C MAX3071EEPA -40°C to +85°C 14 Plastic DIP 14 SO 8 Plastic DIP MAX3071EESA -40°C to +85°C MAX3071EAPA -40°C to +125°C 8 Plastic DIP 8 SO MAX3071EASA -40°C to +125°C 8 SO Security Systems †Devices are available in both leaded (Pb) and lead(Pb)-free packaging. Specify lead-free by adding a “+” after the part number. Instrumentation Ordering Information continued at end of data sheet. Telecom Selector Guide, Pin Configurations, and Typical Operating Circuits appear at end of data sheet. Pin Configurations appear at end of data sheet. Functional Diagrams continued at end of data sheet. UCSP is a trademark of Maxim Integrated Products, Inc. For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com. 19-2668; Rev 2; 4/09 MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers ABSOLUTE MAXIMUM RATINGS Continuous Power Dissipation (TA = +70°C) 8-Pin SO (derate 5.88mW/°C above +70°C) .................471mW 8-Pin Plastic DIP (derate 9.09mW/°C above +70°C) .....727mW 14-Pin SO (derate 8.33mW/°C above +70°C) ...............667mW 14-Pin Plastic DIP (derate 10.0mW/°C above +70°C) ...800mW Operating Temperature Ranges MAX307_EE_ _ ................................................-40°C to +85°C MAX307_EA_ _ ..............................................-40°C to +125°C MAX3077EMSA .............................................-55°C to +125°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C (All voltages referenced to GND) Supply Voltage (VCC).............................................................+6V Control Input Voltage (RE, DE, SLR, H/F, TXP, RXP)......................................................-0.3V to +6V Driver Input Voltage (DI)...........................................-0.3V to +6V Driver Output Voltage (Z, Y, A, B) .............................-8V to +13V Receiver Input Voltage (A, B)....................................-8V to +13V Receiver Input Voltage Full Duplex (A, B) ..................................................-8V to +13V Receiver Output Voltage (RO)....................-0.3V to (VCC + 0.3V) Driver Output Current .....................................................±250mA Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (VCC = 3.3V ±10%, TA =TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DRIVER Differential Driver Output Change in Magnitude of Differential Output Voltage Driver Common-Mode Output Voltage Change in Magnitude of Common-Mode Voltage Input High Voltage Input Low Voltage Input Hysteresis Input Current VOD VOD VOC VOC 2 VCC RL = 54 (RS485), Figure 1 1.5 VCC VCC RL = 100 or 54, Figure 1 (Note 2) 0.2 V 3 V 0.2 V RL = 100 or 54, Figure 1 VIL DE, DI, RE, TXP, RXP, H/F VHYS DE, DI, RE, TXP, RXP, H/F I IN2 VCC / 2 RL = 100 or 54, Figure 1 (Note 2) DE, DI, RE, TXP, RXP, H/F I IN1 2 0.8 DE, DI, RE μA 1 10 k 10 40 μA VCC x 0.4 SRL Input Low Voltage 2 ±1 TXP, RXP, H/F internal pulldown SRL Input Middle Voltage V VCC x 0.6 0.4 SRL = VCC SRL = GND IO V mV DE VCC - 0.4 Output Leakage (Y and Z) Full Duplex V 100 SRL Input High Voltage SRL Input Current V No load VIH Input Impedance First Transition Input Current RL = 100 (RS422), Figure 1 DE = GND, VCC = GND or 3.6V 75 -75 VIN = +12V VIN = -7V 125 -100 V V μA μA Maxim Integrated MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers DC ELECTRICAL CHARACTERISTICS (continued) (VCC = 3.3V ±10%, TA =TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.) (Note 1) PARAMETER SYMBOL Driver Short-Circuit Output Current I OSD Driver Short-Circuit Foldback Output Current I OSDF Thermal-Shutdown Threshold TTS Thermal-Shutdown Hysteresis TTSH Input Current (A and B) CONDITIONS MIN 0 V OUT 12V (Note 3) -7V VOUT VCC (Note 3) (VCC - 1V) VOUT 12V (Note 3) TYP MAX 40 250 -250 -40 20 -7V VOUT 1V (Note 3) -20 IA, B VTH -7V VCM 12V VIN = -7V mA °C 15 VIN = +12V mA °C 175 DE = GND, VCC = GND or 3.6V UNITS 125 -100 μA RECEIVER Receiver Differential Threshold Voltage -200 -125 -50 mV Receiver Input Hysteresis VTH VA + VB = 0V RO Output High Voltage VOH I O = -1mA RO Output Low Voltage VOL I O = 1mA 0.4 V Three-State Output Current at Receiver I OZR 0 V O VCC ±1 μA Receiver Input Resistance RIN -7V VCM 12V Receiver Output Short-Circuit Current I OSR 0V VRO VCC 15 mV VCC - 0.6 V 96 k ±80 mA SUPPLY CURRENT Supply Current Supply Current in Shutdown Mode ICC I SHDN No load, RE = 0, DE = VCC 0.8 1.5 No load, RE = VCC, DE = VCC 0.8 1.5 No load, RE = 0, DE = 0 0.8 1.5 RE = VCC, DE = GND 0.05 10 Human Body Model ±15 mA μA ESD PROTECTION ESD Protection for Y, Z, A, and B kV Note 1: All currents into the device are positive. All currents out of the device are negative. All voltages are referred to device ground, unless otherwise noted. Note 2: ΔVOD and ΔVOC are the changes in VOD and VOC, respectively, when the DI input changes state. Note 3: The short-circuit output current applies to peak current just prior to foldback current limiting. The short-circuit foldback output current applies during current limiting to allow a recovery from bus contention. Maxim Integrated 3 MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers DRIVER SWITCHING CHARACTERISTICS MAX3070E/MAX3071E/MAX3072E/MAX3079E with SRL = UNCONNECTED (250kbps) (VCC = 3.3V ±10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.) PARAMETER Driver Propagation Delay SYMBOL tDPLH tDPHL CONDITIONS CL= 50pF, RL= 54Ω, Figures 2 and 3 Driver Differential Output Rise or Fall Time tDR , tDF CL= 50pF, RL= 54Ω, Figures 2 and 3 Differential Driver Output Skew |tDPLH - tDPHL| tDSKEW CL= 50pF, RL= 54Ω, Figures 2 and 3 Maximum Data Rate MIN TYP MAX UNITS 250 1500 250 1500 350 1600 ns 200 ns ns 250 kbps Driver Enable to Output High tDZH Figure 4 2500 Driver Enable to Output Low tDZL Figure 5 2500 ns Driver Disable Time from Low tDLZ Figure 5 100 ns Driver Disable Time from High tDHZ Figure 4 100 ns Driver Enable from Shutdown to Output High tDZH(SHDN) Figure 4 5500 ns Driver Enable from Shutdown to Output Low tDZL(SHDN) Figure 5 5500 ns 600 ns Time to Shutdown tSHDN 50 200 ns RECEIVER SWITCHING CHARACTERISTICS MAX3070E/MAX3071E/MAX3072E/MAX3079E with SRL = UNCONNECTED (250kbps) (VCC = 3.3V ±10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.) PARAMETER Receiver Propagation Delay Receiver Output Skew |tRPLH - tRPHL| SYMBOL tRPLH tRPHL tRSKEW CONDITIONS TYP MAX 200 CL = 15pF, Figures 6 and 7 200 CL = 15pF, Figures 6 and 7 Maximum Data Rate 30 250 UNITS ns ns kbps Receiver Enable to Output Low tRZL Figure 8 50 ns Receiver Enable to Output High tRZH Figure 8 50 ns Receiver Disable Time from Low tRLZ Figure 8 50 ns Receiver Disable Time from High tRHZ Figure 8 50 ns Receiver Enable from Shutdown to Output High tRZH(SHDN) Figure 8 4000 ns Receiver Enable from Shutdown to Output Low tRZL(SHDN) Figure 8 4000 ns 600 ns Time to Shutdown 4 MIN tSHDN 50 200 Maxim Integrated MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers DRIVER SWITCHING CHARACTERISTICS MAX3073E/MAX3074E/MAX3075E/MAX3079E with SRL = VCC (500kbps) (VCC = 3.3V ±10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.) PARAMETER Driver Propagation Delay SYMBOL tDPLH tDPHL CONDITIONS CL = 50pF, RL = 54Ω, Figures 2 and 3 Driver Differential Output Rise or Fall Time tDR , tDF CL = 50pF, RL = 54Ω, Figures 2 and 3 Differential Driver Output Skew |tDPLH - tDPHL| tDSKEW CL = 50pF, RL = 54Ω, Figures 2 and 3 Maximum Data Rate MIN TYP MAX UNITS 180 800 180 800 200 800 ns 100 ns 500 ns kbps Driver Enable to Output High tDZH Figure 4 2500 ns Driver Enable to Output Low tDZL Figure 5 2500 ns Driver Disable Time from Low tDLZ Figure 5 100 ns Driver Disable Time from High tDHZ Figure 4 100 ns Driver Enable from Shutdown to Output High tDZH(SHDN) Figure 4 4500 ns Driver Enable from Shutdown to Output Low tDZL(SHDN) Figure 5 4500 ns 600 ns MAX UNITS Time to Shutdown tSHDN 50 200 RECEIVER SWITCHING CHARACTERISTICS MAX3073E/MAX3074E/MAX3075E/MAX3079E with SRL = VCC (500kbps) (VCC = 3.3V ±10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.) PARAMETER Receiver Propagation Delay Receiver Output Skew |tRPLH - tRPHL| SYMBOL tRPLH tRPHL tRSKEW CONDITIONS MIN TYP 200 CL = 15pF, Figures 6 and 7 200 CL = 15pF, Figures 6 and 7 Maximum Data Rate 30 500 ns ns kbps Receiver Enable to Output Low tRZL Figure 8 50 ns Receiver Enable to Output High tRZH Figure 8 50 ns Receiver Disable Time from Low tRLZ Figure 8 50 ns Receiver Disable Time from High tRHZ Figure 8 50 ns Receiver Enable from Shutdown to Output High tRZH(SHDN) Figure 8 4000 ns Receiver Enable from Shutdown to Output Low tRZL(SHDN) Figure 8 4000 ns 600 ns Time to Shutdown Maxim Integrated tSHDN 50 200 5 MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers DRIVER SWITCHING CHARACTERISTICS MAX3076E/MAX3077E/MAX3078E/MAX3079E with SRL = GND (16Mbps) (VCC = 3.3V ±10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.) PARAMETER Driver Propagation Delay SYMBOL tDPLH tDPHL CONDITIONS MIN TYP MAX 50 CL = 50pF, RL= 54Ω, Figures 2 and 3 50 UNITS ns Driver Differential Output Rise or Fall Time tDR , tDF CL = 50pF, RL= 54Ω, Figures 2 and 3 15 ns Differential Driver Output Skew |tDPLH - tDPHL| tDSKEW CL = 50pF, RL= 54Ω, Figures 2 and 3 8 ns Maximum Data Rate 16 Mbps Driver Enable to Output High tDZH Figure 4 150 ns Driver Enable to Output Low tDZL Figure 5 150 ns Driver Disable Time from Low tDLZ Figure 5 100 ns Driver Disable Time from High tDHZ Figure 4 100 ns Driver Enable from Shutdown to Output High tDZH(SHDN) Figure 4 1250 1800 ns Driver Enable from Shutdown to Output Low tDZL(SHDN) Figure 5 1250 1800 ns 200 600 ns TYP MAX UNITS 40 75 40 75 Time to Shutdown tSHDN 50 RECEIVER SWITCHING CHARACTERISTICS MAX3076E/MAX3077E/MAX3078E/MAX3079E with SRL = GND (16Mbps) (VCC = 3.3V ±10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.) PARAMETER Receiver Propagation Delay Receiver Output Skew |tRPLH - tRPHL| SYMBOL tRPLH tRPHL tRSKEW CONDITIONS CL = 15pF, Figures 6 and 7 CL = 15pF, Figures 6 and 7 Maximum Data Rate 8 16 ns ns Mbps Receiver Enable to Output Low tRZL Figure 8 50 ns Receiver Enable to Output High tRZH Figure 8 50 ns Receiver Disable Time from Low tRLZ Figure 8 50 ns Receiver Disable Time from High tRHZ Figure 8 50 ns Receiver Enable from Shutdown to Output High tRZH(SHDN) Figure 8 1800 ns Receiver Enable from Shutdown to Output Low tRZL(SHDN) Figure 8 1800 ns 600 ns Time to Shutdown 6 MIN tSHDN 50 200 Maxim Integrated MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers Typical Operating Characteristics (VCC = 3.3V, TA = +25°C, unless otherwise noted. Note: The MAX3077EMSA/PR meets specification over temperature.) OUTPUT CURRENT vs. RECEIVER OUTPUT HIGH VOLTAGE DE = 0 0.7 0.6 MAX3070E toc02 20 15 10 -25 0 25 50 75 100 20 15 10 0 125 0 0.5 1.0 1.5 2.0 2.5 3.5 3.0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 OUTPUT HIGH VOLTAGE (V) OUTPUT HIGH VOLTAGE (V) RECEIVER OUTPUT HIGH VOLTAGE vs. TEMPERATURE RECEIVER OUTPUT LOW VOLTAGE vs. TEMPERATURE DRIVER OUTPUT CURRENT vs. DIFFERENTIAL OUTPUT VOLTAGE 3.15 3.10 0.7 3.05 0.6 0.5 0.4 0.3 90 80 0.2 0 25 50 75 100 50 40 30 0 -50 125 60 10 0 -25 70 20 0.1 3.00 MAX3070E toc06 IO = -1mA OUTPUT CURRENT (mA) 3.20 100 MAX3070E toc05 3.25 0.8 OUTPUT LOW VOLTAGE (V) IO = -1mA MAX3070E toc04 TEMPERATURE (°C) 3.30 -50 25 5 0 -50 -25 0 25 50 75 100 0 125 0.5 1.0 1.5 2.0 2.5 3.0 3.5 TEMPERATURE (°C) DIFFERENTIAL OUTPUT VOLTAGE (V) DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs. TEMPERATURE OUTPUT CURRENT vs. TRANSMITTER OUTPUT HIGH VOLTAGE OUTPUT CURRENT vs. TRANSMITTER OUTPUT LOW VOLTAGE 2.30 2.20 2.10 2.00 1.90 140 120 100 80 60 -50 -25 0 25 50 75 TEMPERATURE (°C) Maxim Integrated 100 125 140 120 100 80 60 40 20 20 0 0 1.60 160 40 1.80 1.70 180 MAX3070E toc09 2.40 160 OUTPUT CURRENT (mA) RL = 54Ω 2.50 OUTPUT CURRENT (mA) 2.60 XMAX3070E toc07 TEMPERATURE (°C) MAX3070E toc08 OUTPUT HIGH VOLTAGE (V) 30 5 0.5 DIFFERENTIAL OUTPUT VOLTAGE (V) 35 OUTPUT CURRENT (mA) DE = VCC 0.8 25 OUTPUT CURRENT (mA) 0.9 SUPPLY CURRENT (mA) 30 MAX3070E toc01 1.0 OUTPUT CURRENT vs. RECEIVER OUTPUT LOW VOLTAGE MAX3070E toc03 SUPPLY CURRENT vs. TEMPERATURE -7 -6 -5 -4 -3 -2 -1 0 1 OUTPUT HIGH VOLTAGE (V) 2 3 4 0 2 4 6 8 10 12 OUTPUT LOW VOLTAGE (V) 7 MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers Typical Operating Characteristics (continued) (VCC = 3.3V, TA = +25°C, unless otherwise noted. Note: The MAX3077EMSA/PR meets specification over temperature.) SHUTDOWN CURRENT vs. TEMPERATURE 1.4 1.2 1.0 0.8 0.6 0.4 tDPLH tDPHL 800 700 600 MAX3070E toc12 900 500 DRIVER PROPAGATION DELAY (ns) 1.6 1000 MAX3070E toc11 1.8 DRIVER PROPAGATION DELAY (ns) MAX3070E toc10 2.0 SHUTDOWN CURRENT (μA) DRIVER PROPAGATION DELAY vs. TEMPERATURE (500kbps) DRIVER PROPAGATION DELAY vs. TEMPERATURE (250kbps) 450 tDPLH 400 tDPHL 350 300 250 0.2 -25 0 25 50 75 100 -50 125 -25 0 25 50 75 100 0 25 50 75 100 DRIVER PROPAGATION DELAY vs. TEMPERATURE (16Mbps) RECEIVER PROPAGATION DELAY vs. TEMPERATURE (250kbps AND 500kbps) RECEIVER PROPAGATION DELAY vs. TEMPERATURE (16Mbps) tDPLH 15 tDPHL 10 5 120 90 tDPLH tDPHL 60 30 0 25 50 75 100 125 60 50 tDPLH 40 tDPHL 30 20 10 0 0 -25 70 RECEIVER PROPAGATION DELAY (ns) 20 MAX3070E toc14 MAX3070E toc13 25 150 -50 -25 TEMPERATURE (°C) 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 TEMPERATURE (°C) TEMPERATURE (°C) RECEIVER PROPAGATION DELAY (250kbps AND 500kbps) DRIVER PROPAGATION DELAY (250kbps) MAX3070E toc17 MAX3070E toc16 VA - VB 1V/div DI 2V/div VY - VZ 2V/div 1μs/div 125 MAX3070E toc15 TEMPERATURE (°C) 0 8 -25 TEMPERATURE (°C) 30 -50 -50 125 TEMPERATURE (°C) DRIVER PROPAGATION DELAY (ns) -50 DRIVER PROPAGATION DELAY (ns) 200 500 0 RO 2V/div 200ns/div Maxim Integrated MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers Typical Operating Characteristics (continued) (VCC = 3.3V, TA = +25°C, unless otherwise noted. Note: The MAX3077EMSA/PR meets specification over temperature.) DRIVER PROPAGATION DELAY (500kbps) RECEIVER PROPAGATION DELAY (16Mbps) DRIVER PROPAGATION DELAY (16Mbps) MAX3070E toc18 MAX3070E toc20 MAX3070E toc19 VA 1V/div DI 2V/div DI 2V/div VB 1V/div VZ 1V/div VY - VZ 2V/div RO 2V/div VY 1V/div 400ns/div 20ns/div 10ns/div Test Circuits and Waveforms 3V Y DE RL/2 Y VOD DI VOC RL/2 VOD RL CL Z Z Figure 1. Driver DC Test Load Figure 2. Driver Timing Test Circuit VCC DI VCC/2 0 tDPLH tDPHL 1/2 VO Z VO Y 1/2 VO VO VDIFF 0 -VO VDIFF = V (Y) - V (Z) 10% 90% 90% 10% tDF tDR tSKEW = | tDPLH - tDPHL | Figure 3. Driver Propagation Delays Maxim Integrated 9 MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers Test Circuits and Waveforms (continued) S1 D 0 OR 3V OUT CL 50pF GENERATOR RL = 500Ω 50Ω VCC DE VCC / 2 tDZH, tDZH(SHDN) 0 0.25V OUT VOH VOM = (0 + VOH) / 2 0 tDHZ Figure 4. Driver Enable and Disable Times (tDHZ, tDZH, tDZH(SHDN)) VCC RL = 500Ω S1 0 OR 3V D OUT CL 50pF GENERATOR 50Ω VCC DE VCC / 2 tDZL, tDZL(SHDN) 0 tDLZ VCC VOM = (VOL + VCC) / 2 OUT VOL 0.25V Figure 5. Driver Enable and Disable Times (tDZL, tDLZ, tDLZ(SHDN)) 10 Maxim Integrated MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers Test Circuits and Waveforms (continued) B VID ATE R RECEIVER OUTPUT A +1V B -1V tRPLH VOH A RO tRPHL 1.5V VOL THE RISE TIME AND FALL TIME OF INPUTS A AND B < 4ns Figure 6. Receiver Propagation Delay Test Circuit Figure 7. Receiver Propagation Delays S1 +1.5V S3 VCC 1kΩ -1.5V VID R CL 15pF GENERATOR S2 50Ω S1 OPEN S2 CLOSED S3 = +1.5V S1 CLOSED S2 OPEN S3 = -1.5V 3V 3V 1.5V RE RE 0 0 tRZH, tRZH(SHDN) tRZL, tRZL(SHDN) VOH RO VCC VOH / 2 (VOL + VCC) / 2 RO 0 S1 OPEN S2 CLOSED S3 = +1.5V VOL S1 CLOSED S2 OPEN S3 = -1.5V 3V 1.5V 1.5V RE tRHZ 3V 0 RE 0 tRLZ VCC VOH 0.25V RO 0 RO 0.25V VOL Figure 8. Receiver Enable and Disable Times Maxim Integrated 11 MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers Pin Description PIN MAX3070E MAX3073E MAX3076E MAX3071E MAX3074E MAX3077E FULL-DUPLEX DEVICES MAX3079E HALFDUPLEX DEVICES FULLHALFDUPLE DUPLE X MODE X MODE NAME FUNCTION — — — 1 1 H/F Half-/Full-Duplex Select Pin. Connect H/F to VCC for halfduplex mode; connect to GND or leave unconnected for full-duplex mode. 2 2 1 2 2 RO Receiver Output. When RE is low and if (A - B) -50mV, RO is high; if (A - B) -200mV, RO is low. RE Receiver Output Enable. Drive RE low to enable RO; RO is high impedance when RE is high. Drive RE high and DE low to enter low-power shutdown mode. RE is a hotswap input (see the Hot-Swap Capability section for details). DE Driver Output Enable. Drive DE high to enable driver outputs. These outputs are high impedance when DE is low. Drive RE high and DE low to enter low-power shutdown mode. DE is a hot-swap input (see the HotSwap Capability section for details). DI Driver Input. With DE high, a low on DI forces noninverting output low and inverting output high. Similarly, a high on DI forces noninverting output high and inverting output low. 3 4 5 12 MAX3072E MAX3075E MAX3078E — — 3 2 3 4 3 4 5 3 4 5 — — — 6 6 SRL Slew-Rate Limit Selector Pin. Connect SRL to ground for 16Mbps communication rate; connect to VCC for 500kbps communication rate. Leave unconnected for 250kbps communication rate. 6, 7 4 5 7 7 GND Ground — — — 8 8 TXP Transmitter Phase. Connect TXP to ground or leave unconnected for normal transmitter phase/polarity. Connect to VCC to invert the transmitter phase/polarity. 9 5 — 9 — Y Noninverting Driver Output — — — — 9 Y Noninverting Driver Output and Noninverting Receiver Input* 10 6 — 10 — Z Inverting Driver Output — — — — 10 Z Inverting Driver Output and Inverting Receiver Input* 11 7 — 11 — B Inverting Receiver Input — — — — 11 B Receiver Input Resistors* — — 7 — — B Inverting Receiver Input and Inverting Driver Output Maxim Integrated MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers Pin Description (continued) PIN MAX3070E MAX3073E MAX3076E MAX3071E MAX3074E MAX3077E FULL-DUPLEX DEVICES MAX3072E MAX3075E MAX3078E MAX3079E HALFDUPLEX DEVICES FULLHALFDUPLE DUPLE X MODE X MODE NAME FUNCTION 12 8 — 12 — A Noninverting Receiver Input — — — — 12 A Receiver Input Resistors* Noninverting Receiver Input and Noninverting Driver Output — — 6 — — A — — — 13 13 RXP Receiver Phase. Connect RXP to GND or leave unconnected for normal transmitter phase/polarity. Connect to VCC to invert receiver phase/polarity. 14 1 8 14 14 VCC Positive Supply VCC = 3.3V ±10%. Bypass VCC to GND with a 0.1μF capacitor. 1, 8, 13 — — — — N.C. No Connect. Not internally connected. Can be connected to GND. *MAX3079E only. In half-duplex mode, the driver outputs serve as receiver inputs. The full-duplex receiver inputs (A and B) still have a 1/8-unit load, but are not connected to the receiver. Function Tables MAX3070E/MAX3073E/MAX3076E MAX3071E/MAX3074E/MAX3077E TRANSMITTING TRANSMITTING INPUTS INPUT OUTPUTS OUTPUTS RE DE DI Z Y DI Z Y X 1 1 0 1 1 0 1 0 0 1 0 X 1 0 1 0 0 X High-Z 1 0 X High-Z RECEIVING INPUTS RECEIVING Shutdown OUTPUT INPUTS OUTPUT A, B RO ≥ -50mV 1 RE DE A, B RO ≤ -200mV 0 0 X ≥ -50mV 1 Open/shorted 1 0 X ≤ -200mV 0 0 X Open/ shorted 1 1 1 X High-Z 1 0 X Shutdown Maxim Integrated 13 MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers Function Tables (continued) MAX3072E/MAX3075E/MAX3078E RECEIVING TRANSMITTING INPUTS INPUTS OUTPUTS OUTPUTS RE DE DI B/Z A/Y RE DE A-B X 1 1 0 1 0 X ≥ -50mV 1 0 X ≤ -200mV 0 0 X Open/ shorted 1 1 1 X High-Z 1 0 X Shutdown X 1 0 1 0 0 0 X High-Z High-Z 1 0 X Shutdown RO MAX3079E TRANSMITTING INPUTS OUTPUTS TXP RE DE DI Z Y 0 X 1 1 0 1 0 X 1 0 1 0 1 X 1 1 1 0 1 X 1 0 0 1 X 0 0 X High-Z X 1 0 X High-Z Shutdown RECEIVING INPUTS OUTPUTS H/F RXP RE DE 0 0 0 0 0 0 0 1 A, B Y, Z RO X > -50mV X 1 X < -200mV X 0 0 X > -50mV X 0 1 0 1 0 X < -200mV X 1 0 0 0 X > -50mV 1 1 0 0 0 X < -200mV 0 1 1 0 0 X > -50mV 0 1 1 0 0 X < -200mV 1 0 0 0 X Open/shorted X 1 1 0 0 0 X Open/shorted 1 0 1 0 X Open/shorted X 0 1 1 0 0 X Open/shorted 0 X X 1 1 X X High-Z X X 1 0 X X Shutdown X = Don’t care; shutdown mode, driver and receiver outputs are high impedance. 14 Maxim Integrated MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers Detailed Description The MAX3070E–MAX3079E high-speed transceivers for RS-485/RS-422 communication contain one driver and one receiver. These devices feature fail-safe circuitry, which guarantees a logic-high receiver output when the receiver inputs are open or shorted, or when they are connected to a terminated transmission line with all drivers disabled (see the Fail-Safe section). The MAX3070E/MAX3072E/MAX3073E/MAX3075E/ MAX3076E/MAX3078E/MAX3079E also feature a hotswap capability allowing line insertion without erroneous data transfer (see the Hot Swap Capability section). The MAX3070E/MAX3071E/MAX3072E feature reduced slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing error-free data transmission up to 250kbps. The MAX3073E/MAX3074E/MAX3075E also offer slew-rate limits allowing transmit speeds up to 500kbps. The MAX3076E/MAX3077E/MAX3078Es’ driver slew rates are not limited, making transmit speeds up to 16Mbps possible. The MAX3079E’s slew rate is selectable between 250kbps, 500kbps, and 16Mbps by driving a selector pin with a three-state driver. The MAX3072E/MAX3075E/MAX3078E are half-duplex transceivers, while the MAX3070E/MAX3071E/ MAX3073E/MAX3074E/MAX3076E/MAX3077E are fullduplex transceivers. The MAX3079E is selectable between half- and full-duplex communication by driving a selector pin (SRL) high or low, respectively. All devices operate from a single 3.3V supply. Drivers are output short-circuit current limited. Thermal-shutdown circuitry protects drivers against excessive power dissipation. When activated, the thermal-shutdown circuitry places the driver outputs into a high-impedance state. Receiver Input Filtering The receivers of the MAX3070E–MAX3075E, and the MAX3079E when operating in 250kbps or 500kbps mode, incorporate input filtering in addition to input hysteresis. This filtering enhances noise immunity with differential signals that have very slow rise and fall times. Receiver propagation delay increases by 25% due to this filtering. Fail-Safe The MAX3070E family guarantees a logic-high receiver output when the receiver inputs are shorted or open, or when they are connected to a terminated transmission line with all drivers disabled. This is done by setting the receiver input threshold between -50mV and -200mV. If the differential receiver input voltage (A - B) is greater than or equal to -50mV, RO is logic high. If A - B is less Maxim Integrated than or equal to -200mV, RO is logic low. In the case of a terminated bus with all transmitters disabled, the receiver’s differential input voltage is pulled to 0V by the termination. With the receiver thresholds of the MAX3070E family, this results in a logic high with a 50mV minimum noise margin. Unlike previous fail-safe devices, the -50mV to -200mV threshold complies with the ±200mV EIA/TIA-485 standard. Hot-Swap Capability (Except MAX3071E/MAX3074E/MAX3077E) Hot-Swap Inputs When circuit boards are inserted into a hot, or powered, backplane, differential disturbances to the data bus can lead to data errors. Upon initial circuit board insertion, the data communication processor undergoes its own power-up sequence. During this period, the processor’s logic-output drivers are high impedance and are unable to drive the DE and RE inputs of these devices to a defined logic level. Leakage currents up to ±10µA from the high-impedance state of the processor’s logic drivers could cause standard CMOS enable inputs of a transceiver to drift to an incorrect logic level. Additionally, parasitic circuit board capacitance could cause coupling of V CC or GND to the enable inputs. Without the hot-swap capability, these factors could improperly enable the transceiver’s driver or receiver. When VCC rises, an internal pulldown circuit holds DE low and RE high. After the initial power-up sequence, the pulldown circuit becomes transparent, resetting the hot-swap tolerable input. Hot-Swap Input Circuitry The enable inputs feature hot-swap capability. At the input there are two NMOS devices, M1 and M2 (Figure 9). When VCC ramps from zero, an internal 10µs timer turns on M2 and sets the SR latch, which also turns on M1. Transistors M2, a 500µA current sink, and M1, a 100µA current sink, pull DE to GND through a 5kΩ resistor. M2 is designed to pull DE to the disabled state against an external parasitic capacitance up to 100pF that can drive DE high. After 10µs, the timer deactivates M2 while M1 remains on, holding DE low against three-state leakages that can drive DE high. M1 remains on until an external source overcomes the required input current. At this time, the SR latch resets and M1 turns off. When M1 turns off, DE reverts to a standard, high-impedance CMOS input. Whenever VCC drops below 1V, the hot-swap input is reset. For RE there is a complementary circuit employing two PMOS devices pulling RE to VCC. 15 MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers operation. Drive H/F high for half-duplex operation. In full-duplex mode, the pin configuration of the driver and receiver is the same as that of a MAX3070E. In halfduplex mode, the receiver inputs are switched to the driver outputs, connecting outputs Y and Z to inputs A and B, respectively. In half-duplex mode, the internal full-duplex receiver input resistors are still connected to pins 11 and 12. VCC 10μs TIMER SR LATCH TIMER ±15kV ESD Protection 5kΩ DE (HOT SWAP) DE 100μA 500μA M1 M2 Figure 9. Simplified Structure of the Driver Enable Pin (DE) MAX3079E Programming The MAX3079E has several programmable operating modes. Transmitter rise and fall times are programmable, resulting in maximum data rates of 250kbps, 500kbps, and 16Mbps. To select the desired data rate, drive SRL to one of three possible states by using a three-state driver: V CC , GND, or unconnected. For 250kbps operation, set the three-state device in highimpedance mode or leave SRL unconnected. For 500kbps operation, drive SRL high or connect it to VCC. For 16Mbps operation, drive SRL low or connect it to GND. SRL can be changed during operation without interrupting data communications. Occasionally, twisted-pair lines are connected backward from normal orientation. The MAX3079E has two pins that invert the phase of the driver and the receiver to correct this problem. For normal operation, drive TXP and RXP low, connect them to ground, or leave them unconnected (internal pulldown). To invert the driver phase, drive TXP high or connect it to VCC. To invert the receiver phase, drive RXP high or connect it to VCC. Note that the receiver threshold is positive when RXP is high. The MAX3079E can operate in full- or half-duplex mode. Drive the H/F pin low, leave it unconnected (internal pulldown), or connect it to GND for full-duplex 16 As with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electrostatic discharges encountered during handling and assembly. The driver outputs and receiver inputs of the MAX3070E family of devices have extra protection against static electricity. Maxim’s engineers have developed state-of-the-art structures to protect these pins against ESD of ±15kV without damage. The ESD structures withstand high ESD in all states: normal operation, shutdown, and powered down. After an ESD event, the MAX3070E–MAX3079E keep working without latchup or damage. ESD protection can be tested in various ways. The transmitter outputs and receiver inputs of the MAX3070E–MAX3079E are characterized for protection to the following limits: • ±15kV using the Human Body Model • ±6kV using the Contact Discharge method specified in IEC 1000-4-2 ESD Test Conditions ESD performance depends on a variety of conditions. Contact Maxim for a reliability report that documents test setup, test methodology, and test results. Human Body Model Figure 10a shows the Human Body Model, and Figure 10b shows the current waveform it generates when discharged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest, which is then discharged into the test device through a 1.5kΩ resistor. IEC 1000-4-2 The IEC 1000-4-2 standard covers ESD testing and performance of finished equipment. However, it does not specifically refer to integrated circuits. The MAX3070E family of devices helps you design equipment to meet IEC 1000-4-2, without the need for additional ESD-protection components. The major difference between tests done using the Human Body Model and IEC 1000-4-2 is higher peak Maxim Integrated MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers RC 1MΩ CHARGE-CURRENTLIMIT RESISTOR HIGHVOLTAGE DC SOURCE Cs 100pF RD 1500Ω IP 100% 90% DISCHARGE RESISTANCE STORAGE CAPACITOR Ir AMPS DEVICE UNDER TEST 36.8% 10% 0 0 Figure 10a. Human Body ESD Test Model CHARGE-CURRENTLIMIT RESISTOR HIGHVOLTAGE DC SOURCE Cs 150pF tDL CURRENT WAVEFORM Figure 10b. Human Body Current Waveform I 100% 90% RD 330Ω DISCHARGE RESISTANCE STORAGE CAPACITOR TIME tRL IPEAK RC 50MΩ TO 100MΩ PEAK-TO-PEAK RINGING (NOT DRAWN TO SCALE) DEVICE UNDER TEST 10% tr = 0.7ns TO 1ns t 30ns 60ns Figure 10c. IEC 1000-4-2 ESD Test Model current in IEC 1000-4-2, because series resistance is lower in the IEC 1000-4-2 model. Hence, the ESD withstand voltage measured to IEC 1000-4-2 is generally lower than that measured using the Human Body Model. Figure 10c shows the IEC 1000-4-2 model, and Figure 10d shows the current waveform for IEC 1000-4-2 ESD Contact Discharge test. The air-gap test involves approaching the device with a charged probe. The contact-discharge method connects the probe to the device before the probe is energized. Machine Model The machine model for ESD tests all pins using a 200pF storage capacitor and zero discharge resistance. The objective is to emulate the stress caused when I/O pins are contacted by handling equipment during test and assembly. Of course, all pins require this protection, not just RS-485 inputs and outputs. Maxim Integrated Figure 10d. IEC 1000-4-2 ESD Generator Current Waveform Applications Information 256 Transceivers on the Bus The standard RS-485 receiver input impedance is 12kΩ (1-unit load), and the standard driver can drive up to 32unit loads. The MAX3070E family of transceivers has a 1/8-unit load receiver input impedance (96kΩ), allowing up to 256 transceivers to be connected in parallel on one communication line. Any combination of these devices as well as other RS-485 transceivers with a total of 32unit loads or fewer can be connected to the line. Reduced EMI and Reflections The MAX3070E/MAX3071E/MAX3072E feature reduced slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing error-free data transmission up to 250kbps. The MAX3073E/MAX3074E/MAX3075E offer higher driver output slew-rate limits, allowing transmit speeds up to 500kbps. The MAX3079E with SRL = VCC or unconnected, are slew-rate limited. With SRL unconnected, the MAX3079E error-free data transmission is up to 250kbps; with SRL connected to VCC the data transmit speeds up to 500kbps. 17 MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers Low-Power Shutdown Mode (Except MAX3071E/MAX3074E/MAX3077E) Low-power shutdown mode is initiated by bringing both RE high and DE low. In shutdown, the devices typically draw only 50nA of supply current. RE and DE can be driven simultaneously; the parts are guaranteed not to enter shutdown if RE is high and DE is low for less than 50ns. If the inputs are in this state for at least 600ns, the parts are guaranteed to enter shutdown. Enable times t ZH and t ZL (see the Switching Characteristics section) assume the part was not in a low-power shutdown state. Enable times tZH(SHDN) and tZL(SHDN) assume the parts were shut down. It takes drivers and receivers longer to become enabled from low-power shutdown mode (tZH(SHDN), tZL(SHDN)) than from driver/receiver-disable mode (tZH, tZL). A R Line Length The RS-485/RS-422 standard covers line lengths up to 4000ft. For line lengths greater than 4000ft, use the repeater application shown in Figure 11. Typical Applications The MAX3072E/MAX3075E/MAX3078E/MAX3079E transceivers are designed for bidirectional data communications on multipoint bus transmission lines. Figures 12 and 13 show typical network applications circuits. To minimize reflections, terminate the line at both ends in its characteristic impedance, and keep stub lengths off the main line as short as possible. The slew-rate-limited MAX3072E/MAX3075E and the two modes of the MAX3079E are more tolerant of imperfect termination. MAX3070E/MAX3071E/MAX3073E/ MAX3074E/MAX3076E/MAX3077E/ MAX3079E (FULL-DUPLEX) RO RE Driver Output Protection Two mechanisms prevent excessive output current and power dissipation caused by faults or by bus contention. The first, a foldback current limit on the output stage, provides immediate protection against short circuits over the whole common-mode voltage range (see the Typical Operating Characteristics). The second, a thermal-shutdown circuit, forces the driver outputs into a high-impedance state if the die temperature becomes excessive. DATA IN B 120Ω DE Chip Information Z DI D TRANSISTOR COUNT: 1228 PROCESS: BiCMOS DATA OUT Y 120Ω Figure 11. Line Repeater for MAX3070E/MAX3071E/MAX3073E/ MAX3074E/MAX3076E/MAX3077E/MAX3079E in Full-Duplex Mode 120Ω 120Ω DI DE B B D D DI DE RO A B A B A A R R RO RE RE R MAX3072E MAX3075E MAX3078E MAX3079E (HALF-DUPLEX) R D D DI DE RO RE DI DE RO RE Figure 12. Typical Half-Duplex RS-485 Network 18 Maxim Integrated MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers A RO RE DE Y 120Ω 120Ω R D B DI Z Z 120Ω 120Ω D DI DE RE RO B R Y A Y Z B A Y Z B R D DI A R MAX3070E MAX3073E MAX3076E MAX3079E (FULL-DUPLEX) D DE RE RO DI DE RE RO Figure 13. Typical Full-Duplex RS-485 Network Selector Guide PART HALF/FULLDUPLEX DATA RATE (Mbps) SLEW-RATE LIMITED LOW-POWER SHUTDOWN RECEIVER/ DRIVER ENABLE TRANSCEIVERS ON BUS PINS MAX3070E Full 0.250 Yes Yes Yes 256 14 MAX3071E Full 0.250 Yes No No 256 8 MAX3072E Half 0.250 Yes Yes Yes 256 8 MAX3073E Full 0.5 Yes Yes Yes 256 14 MAX3074E Full 0.5 Yes No No 256 8 MAX3075E Half 0.5 Yes Yes Yes 256 8 MAX3076E Full 16 No Yes Yes 256 14 MAX3077E Full 16 No No No 256 8 MAX3078E Half 16 No Yes Yes 256 8 MAX3079E Selectable Selectable Selectable Yes Yes 256 14 Maxim Integrated 19 MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers Pin Configurations and Typical Operating Circuits VCC DE N.C. 1 RO RE 0.1μF 14 4 14 VCC 2 13 N.C. R 3 12 A DE 4 11 B DI 5 10 Z D GND 6 9 Y GND 7 8 N.C. VCC RE Y 9 5 DI MAX3070E MAX3073E MAX3076E Rt D RO R 10 Z 12 2 RO N.C. A Rt R DI D 11 B 1, 8, 13 GND 6, 7 3 GND DE RE TYPICAL FULL-DUPLEX OPERATING CIRCUIT DIP/SO 0.1μF MAX3071E MAX3074E MAX3077E VCC 1 VCC 1 R RO 2 DI 3 D GND 4 8 A 7 B 6 Z 5 Y Y 5 3 DI VCC Rt D 6 RO R Z 8 2 RO A Rt R DI D 7 B DIP/SO GND 4 GND TYPICAL FULL-DUPLEX OPERATING CIRCUIT 0.1μF RO 1 8 R VCC RO RE 2 7 B RE DE 3 6 A DE 5 GND DI DI 4 D 1 R 8 2 7 3 6 4 VCC MAX3072E MAX3075E MAX3078E B 5 DI D A A Rt D DE Rt B GND RO R RE DIP/SO TYPICAL HALF-DUPLEX OPERATING CIRCUIT NOTE: PIN LABELS Y AND Z ON TIMING, TEST, AND WAVEFORMS DIAGRAMS. REFER TO PINS A AND B WHEN DE IS HIGH. 20 Maxim Integrated MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers Pin Configurations and Typical Operating Circuits (continued) VCC RE MAX3079E A RO TOP VIEW H/F 1 14 VCC RO 2 13 RXP RE 3 12 A DE 4 MAX3079E 11 B DI 5 10 Z SRL 6 9 Y GND 7 8 TXP B RXP H/F Z TXP Y DIP/SO DI NOTE: SWITCH POSITIONS INDICATED FOR H/F = GND. GND Maxim Integrated DE SRL 21 MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers Ordering Information (continued) PART† PART† TEMP RANGE PIN-PACKAGE TEMP RANGE PIN-PACKAGE MAX3072EEPA -40°C to +85°C 8 Plastic DIP MAX3076EEPD -40°C to +85°C 14 Plastic DIP MAX3072EESA -40°C to +85°C 8 SO MAX3076EESD -40°C to +85°C 14 SO MAX3072EAPA -40°C to +125°C 8 Plastic DIP MAX3076EAPD -40°C to +125°C MAX3072EASA -40°C to +125°C 8 SO MAX3076EASD -40°C to +125°C MAX3073EEPD -40°C to +85°C 14 Plastic DIP MAX3077EEPA -40°C to +85°C 14 Plastic DIP 14 SO 8 Plastic DIP MAX3073EESD -40°C to +85°C 14 SO MAX3077EESA -40°C to +85°C MAX3073EAPD -40°C to +125°C 14 Plastic DIP MAX3077EAPA -40°C to +125°C 8 Plastic DIP 8 SO MAX3073EASD -40°C to +125°C 14 SO MAX3077EASA -40°C to +125°C 8 SO MAX3074EEPA -40°C to +85°C 8 Plastic DIP MAX3077EMSA/PR -55°C to +125°C 8 SO MAX3074EESA -40°C to +85°C 8 SO MAX3078EEPA -40°C to +85°C 8 Plastic DIP MAX3074EAPA -40°C to +125°C 8 Plastic DIP MAX3078EESA -40°C to +85°C 8 SO MAX3074EASA -40°C to +125°C 8 SO MAX3078EAPA -40°C to +125°C 8 Plastic DIP MAX3075EEPA -40°C to +85°C 8 Plastic DIP MAX3078EASA -40°C to +125°C 8 SO MAX3075EESA -40°C to +85°C 8 SO MAX3079EEPD -40°C to +85°C 14 Plastic DIP MAX3075EAPA -40°C to +125°C 8 Plastic DIP MAX3079EESD -40°C to +85°C 14 SO MAX3075EASA -40°C to +125°C 8 SO MAX3079EAPD -40°C to +125°C 14 Plastic DIP MAX3079EASD -40°C to +125°C 14 SO †Devices are available in both leaded (Pb) and lead(Pb)-free packaging. Specify lead-free by adding a “+” after the part number. Package Information For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE 22 PACKAGE CODE 8 Plastic DIP P8-2 14 Plastic DIP P14-3 8 SO S8-4 14 SO S14-1 DOCUMENT NO. 21-0043 21-0041 Maxim Integrated MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers Package Information (continued) DIM A A1 B C e E H L N E H INCHES MILLIMETERS MAX MIN 0.053 0.069 0.010 0.004 0.014 0.019 0.007 0.010 0.050 BSC 0.150 0.157 0.228 0.244 0.016 0.050 MAX MIN 1.75 1.35 0.10 0.25 0.49 0.35 0.19 0.25 1.27 BSC 3.80 4.00 5.80 6.20 0.40 SOICN .EPS For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. 1.27 VARIATIONS: 1 INCHES TOP VIEW DIM D D D MIN 0.189 0.337 0.386 MAX 0.197 0.344 0.394 MILLIMETERS MIN 4.80 8.55 9.80 MAX 5.00 8.75 10.00 N MS012 8 AA 14 AB 16 AC D A B e FRONT VIEW A1 C 0\-8\ L SIDE VIEW PROPRIETARY INFORMATION TITLE: PACKAGE OUTLINE, .150" SOIC APPROVAL Maxim Integrated DOCUMENT CONTROL NO. 21-0041 REV. B 1 1 23 MAX3070E–MAX3079E +3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers Revision History REVISION NUMBER REVISION DATE 0 10/02 2 4/09 DESCRIPTION Initial release. PAGES CHANGED — Added /PR information to reflect new characterization information for military temperature version. 2, 3, 7, 8, 12, 13, 19, 22–25 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. 24 © Maxim Integrated Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000 The Maxim logo and Maxim Integrated are trademarks of Maxim Integrated Products, Inc.