19-1458; Rev 0; 1/00 SIM/Smart Card Level Translators in µMAX Features ♦ SIM/Smart Card Level Shifting ♦ ±10kV ESD Card Socket Protection ♦ Allows Level Translation with DVCC ≥ VCC or DVCC ≤ VCC ♦ Automatically Shuts Down When Either Supply Is Removed ♦ Card Contacts Actively Pulled Low During Shutdown ♦ +1.425V to +5.5V Controller Voltage Range ♦ +2.25V to +5.5V Card Voltage Range ♦ 2.5µA (max) Total Quiescent Supply Current ♦ 0.01µA Total Shutdown Supply Current ♦ Ultra-Small 10-Pin µMAX Package ♦ Compliant with GSM Test Specifications 11.11 and 11.12 Applications SIM Interface in GSM Cellular Telephones Ordering Information PART TEMP. RANGE PIN-PACKAGE Smart Card Readers MAX1740EUB -40°C to +85°C 10 µMAX Logic Level Translation MAX1741EUB -40°C to +85°C 10 µMAX SPI™/QSPI™/MICROWIRE™ Level Translation Typical Operating Circuit DVCC DVCC SYSTEM CONTROLLER Pin Configuration VCC TOP VIEW DVCC VCC VCC RIN RST RST MAX1740 MAX1741 CIN CLK CLK SIM OR SMART CARD DATA 1 DVCC 2 CIN 3 RIN 4 SHDN (DDRV) 5 DATA OPTIONAL OPTIONAL 10 IO 9 MAX1740 MAX1741 VCC 8 CLK 7 RST 6 GND µMAX SHDN* IO DDRV* GND GND * SHDN FOR MAX1740 ONLY DDRV FOR MAX1741 ONLY IO ( ) ARE FOR MAX1741. GND SPI and QSPI are trademarks of Motorola, Inc. MICROWIRE is a trademark of National Semiconductor Corp. ________________________________________________________________ Maxim Integrated Products 1 For free samples and the latest literature, visit www.maxim-ic.com or phone 1-800-998-8800. For small orders, phone 1-800-835-8769. MAX1740/MAX1741 General Description The MAX1740/MAX1741 subscriber identity module (SIM)/smart card level translators provide level shifting and electrostatic discharge (ESD) protection for SIM and smart card ports. These devices integrate two unidirectional level shifters for the reset and clock signals, a bidirectional level shifter for the serial data stream, and ±10kV ESD protection on all card contacts. The MAX1740 includes a SHDN control input to aid insertion and removal of SIM and smart cards, while the MAX1741 includes a system-side data driver to support system controllers without open-drain outputs. The logic supply voltage range is +1.425V to +5.5V for the “controller side” and +2.25V to +5.5V for the “card side.” Total supply current is 2.5µA max. Both devices automatically shut down when either power supply is removed. For a complete SIM-card interface, combine the MAX1740/MAX1741 with the MAX1686H 0V/3V/5V regulated charge pump. The MAX1740/MAX1741 are available in ultra-small 10pin µMAX packages that are only 1.09mm high and half the area of an 8-pin SO. The MAX1740/MAX1741 are compliant with GSM test specifications 11.11 and 11.12. MAX1740/MAX1741 SIM/Smart Card Level Translators in µMAX ABSOLUTE MAXIMUM RATINGS DVCC, VCC to GND................................................-0.3V to +6.0V RIN, CIN, DATA, DDRV, SHDN to GND ......................................-0.3V to (DVCC + 0.3V) RST, CLK, IO to GND ................................-0.3V to (VCC + 0.3V) Continuous Power Dissipation (TA = +70°C) 10-Pin µMAX (derate 5.6mW/°C above +70°C) ..........444mW Operating Temperature Range ..........................-40°C to +85°C Storage Temperature Range ............................-65°C to +150°C Junction Temperature ......................................................+150°C Lead Temperature (soldering, 10s) ................................+300°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (Figure 1, DVCC = +1.8V, VCC = +3.0V or +5.0V, SHDN = DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC, CIO = CCLK = CRST = CDATA = 30pF, TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 1.425 5.5 V 2.25 5.5 V POWER SUPPLIES DVCC Operating Range VCC Operating Range DVCC VCC 1 CIN static DVCC Operating Current IDVCC CIN clocked at 1.625MHz from GND to DVCC with 50% duty cycle 8 CIN clocked at 3.25MHz from GND to DVCC with 50% duty cycle 16 µA 1.5 CIN static VCC Operating Current Total Shutdown Current IVCC ISHDN CIN clocked at 1.625MHz from GND to DVCC with 50% duty cycle 0.5 CIN clocked at 3.25MHz from GND to DVCC with 50% duty cycle 1 µA mA IOFF = IVCC + IDVCC, SHDN = GND (MAX1740 only), or DVCC = GND or VCC = GND 0.01 2 µA CIN, RIN, SHDN, DDRV LOGIC INPUTS Digital Input Low Threshold VIL Digital Input High Threshold VIH 0.2 · DVCC V 0.7 · DVCC V 1 µA 0.4 V 0.01 Input Leakage Current CLK, RST OUTPUTS Digital Output Low Level VOL Digital Output High Level VOH ISINK = 200µA ISOURCE = 20µA 0.9 · VCC ISOURCE = 200µA 0.8 · VCC V DATA INPUT/OUTPUT Between DATA and DVCC 13 Input Low Threshold VIL(DATA) (Note 1) 0.3 Input High Threshold VIH(DATA) (Note 2) DATA Pull-Up Resistance RDATA Input Low Current IIL Input High Current IIH 2 20 28 kΩ V DVCC - 0.6 V 1 mA 2 µA VCC = 5.0V _______________________________________________________________________________________ SIM/Smart Card Level Translators in µMAX (Figure 1, DVCC = +1.8V, VCC = +3.0V or +5.0V, SHDN = DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC, CIO = CCLK = CRST = CDATA = 30pF, TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) PARAMETER Output Low Level SYMBOL VOL(DATA) Output High Level VOH(DATA) CONDITIONS MIN TYP IO = GND, ISINK = 100µA DVCC = 3.0V, IO = GND, ISINK = 200µA MAX UNITS 0.4 V 0.4 V ISOURCE = 10µA 0.7 · DVCC V DVCC = 3.0V, ISOURCE = 20µA 0.7 · DVCC V IO INPUT/OUTPUT Between IO and VCC 6.5 Input Low Threshold VIL(IO) IIL(MAX) = 1mA (Note 1) 0.3 Input High Threshold VIH(IO) IIH(MAX) = ±20µA (Note 2) IO Pull-Up Resistance RIO 10 14 kΩ V 0.7 · VCC V Input Low Current IIL 1 mA Input High Current IIH 20 µA Output Low Level VOL(IO) DATA = GND or DDRV = GND, ISINK = 200µA 0.4 V Output High Level VOH(IO) ISOURCE = 20µA 0.8 · VCC V SHUTDOWN OUTPUT LEVELS Shutdown Output Levels (IO, CLK, RST) ISINK = 200µA, SHDN = GND, DATA = CIN = RIN = DVCC (MAX1740 only) 0.4 V ISINK = 200µA, DVCC = GND, SHDN (MAX1740) = DDRV (MAX1741) = DATA = CIN = RIN = DVCC 0.4 V ISINK = 200µA, VCC = GND, SHDN (MAX1740) = DDRV (MAX1741) = DATA = CIN = RIN = DVCC 0.4 V TIMING VCC = 2.7V to 5.5V Maximum CLK Frequency (Notes 3, 4) fCLK VCC = 2.25V to 3.6V DVCC = 2.7V 5 DVCC = 2.25V 5 DVCC = 1.7V 5 DVCC = 1.425V 3.5 DVCC = 2.25V 4 DVCC = 1.7V 4 DVCC = 1.425V MHz 3.5 _______________________________________________________________________________________ 3 MAX1740/MAX1741 ELECTRICAL CHARACTERISTICS (continued) MAX1740/MAX1741 SIM/Smart Card Level Translators in µMAX ELECTRICAL CHARACTERISTICS (Figure 1, DVCC = +1.8V, VCC = +3.0V or +5.0V, SHDN = DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC, CIO = CCLK = CRST = CDATA = 30pF, TA = -40°C to +85°C, unless otherwise noted.) (Note 5) PARAMETER SYMBOL CONDITIONS MIN MAX UNITS V POWER SUPPLIES DVCC Operating Range VCC Operating Range DVCC Operating Current VCC Operating Current Total Shutdown Current DVCC 1.425 5.5 VCC 2.25 5.5 V IDVCC CIN static 1 µA IVCC CIN static 1.5 µA IOFF IOFF = IVCC + IDVCC, SHDN = GND (MAX1740 only), or DVCC = GND or VCC = GND 2 µA CIN, RIN, SHDN, DDRV LOGIC INPUTS Digital Input Low Threshold VIL Digital Input High Threshold VIH 0.2 · DVCC V 0.75 · DVCC Input Leakage Current V 1 µA 0.4 V CLK, RST OUTPUTS Digital Output Low Level Digital Output High Level VOL VOH ISINK = 200µA ISOURCE = 20µA 0.9 · VCC ISOURCE = 200µA 0.8 · VCC V DATA INPUT/OUTPUT Between DATA and DVCC 13 Input Low Threshold VIL(DATA) (Note 1) 0.3 Input High Threshold Input Low Current Input High Current VIH(DATA) IIL IIH (Note 2) VCC = 5.0V Output Low Level VOL(DATA) Output High Level VOH(DATA) DATA Pull-Up Resistance RDATA 28 kΩ V DVCC - 0.6 1 2 V mA µA IO = GND, ISINK = 100µA 0.4 V DVCC = 3.0V, IO = GND, ISINK = 200µA 0.4 V ISOURCE = 10µA 0.7 · DVCC V DVCC = 3.0V, ISOURCE = 20µA 0.7 · DVCC V IO INPUT/OUTPUT IO Pull-Up Resistance 4 RIO Between IO and VCC 6.5 0.3 Input Low Threshold VIL(IO) IIL(MAX) = 1mA (Note 1) Input High Threshold VIH(IO) IIH(MAX) = ±20µA (Note 2) Input Low Current IIL Input High Current IIH Output Low Level VOL(IO) DATA = GND or DDRV = GND, ISINK = 200µA Output High Level VOH(IO) ISOURCE = 20µA 14 V 0.7 · VCC 1 0.8 · VCC _______________________________________________________________________________________ kΩ V mA 20 µA 0.4 V V SIM/Smart Card Level Translators in µMAX (Figure 1, DVCC = +1.8V, VCC = +3.0V or +5.0V, SHDN = DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC, CIO = CCLK = CRST = CDATA = 30pF, TA = -40°C to +85°C, unless otherwise noted.) (Note 5) PARAMETER SYMBOL CONDITIONS MIN MAX UNITS ISINK = 200µA, SHDN = GND, DATA = CIN = RIN = DVCC (MAX1740 only) 0.4 V ISINK = 200µA, DVCC = GND, SHDN (MAX1740) = DDRV (MAX1741) = DATA = CIN = RIN = DVCC 0.4 V ISINK = 200µA, VCC = GND, SHDN (MAX1740) = DDRV (MAX1741) = DATA = CIN = RIN = DVCC 0.4 V SHUTDOWN OUTPUT LEVELS Shutdown Output Levels (IO, CLK, RST) TIMING VCC = 2.7V to 5.5V Maximum CLK Frequency (Notes 3, 4) DVCC = 2.7V 5 DVCC = 2.25V 5 5 DVCC = 1.7V fCLK VCC = 2.25V to 3.6V DVCC = 1.425V 3.5 DVCC = 2.25V 4 MHz 4 DVCC = 1.7V 3.5 DVCC = 1.425V VIL is defined as the voltage at which the output (DATA/IO) voltage equals 0.5V. VIH is defined as the voltage at which the output (DATA/IO) voltage exceeds the input (IO/DATA) voltage by 100mV. Timing specifications are guaranteed by design, not production tested. The maximum CLK frequency is defined as the output duty cycle remaining in the 40% to 60% range when the 50% CIN is applied. CIN has 5ns rise and fall times; levels are GND to DVCC. Input and output levels are measured at 50% of the waveform. Note 5: Specifications to -40°C are guaranteed by design, not production tested. Note 1: Note 2: Note 3: Note 4: Typical Operating Characteristics (Circuit of Figure 1, DVCC = 3.0V, VCC = 5.0V, DDRV or DATA = DVCC, RIN = CIN = GND, TA = +25°C, unless otherwise noted.) 1.2 1.0 DATA OR DDRV = DVCC fCIN = 3.25MHz 0.8 0.6 0.4 0.2 fDATA = fCIN/372 fCIN = 1.625MHz DATA OR DDRV = DVCC fCIN = 1.625MHz 0 2.0 2.5 3.0 3.5 DATA OR DDRV = DVCC VVCC = 5.0V 1.5 fDATA OR fCIN/372 VVCC = 5.0V 1.0 0.5 0 4.0 VCC (V) 4.5 5.0 5.5 DATA OR DDRV = DVCC VVCC = 5.0V 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 fCIN (MHz) 1.7 MAX1740toc03 2.0 fDATA OR fCIN/372 VVCC = 5.0V SUPPLY CURRENT, IVCC + IDVCC (mA) 1.4 VDVCC = 3.0V CIN CLOCKED WITH A 0 TO 3V SQUARE WAVE MAX1740toc02 1.6 2.5 SUPPLY CURRENT, IVCC + IDVCC (mA) fDATA = fCIN/372 VDVCC = 3.0V CIN CLOCKED WITH A fCIN = 3.25MHz 0 TO 3V SQUARE WAVE MAX1740/1toc01 SUPPLY CURRENT, IVCC + IDVCC (mA) 1.8 TOTAL OPERATING SUPPLY CURRENT vs. TEMPERATURE TOTAL OPERATING SUPPLY CURRENT vs. CLOCK FREQUENCY TOTAL OPERATING SUPPLY CURRENT vs. SUPPLY VOLTAGE (VCC) VDVCC = 3.0V, fIN = 3.25MHz, CIN CLOCKED WITH A 0 TO 3V SQUARE WAVE 1.5 fDATA = fCIN/372 VVCC = 5.0V 1.3 1.1 DATA OR DDRV = DVCC VVCC = 5.0V 0.9 0.7 0.5 fDATA = fCIN/372 VVCC = 3.0V DATA OR DDRV = DVCC VVCC = 3.0V -40 -15 10 35 60 85 TEMPERATURE (°C) _______________________________________________________________________________________ 5 MAX1740/MAX1741 ELECTRICAL CHARACTERISTICS (continued) Typical Operating Characteristics (continued) (Circuit of Figure 1, DVCC = 3.0V, VCC = 5.0V, DDRV or DATA = DVCC, RIN = CIN = GND, TA = +25°C, unless otherwise noted.) CIN TO CLK WAVEFORM 3V MAX1740/1toc05 MAX1740/1toc04 RIN TO RST WAVEFORM 3V CIN 1V/div 0 5V RST 2V/div CLK 2V/div 0 0 fCIN = 3.25MHz fRIN = 3.25MHz 40ns/div UNDERVOLTAGE SHUTDOWN WAVEFORM DDRV TO IO AND DATA WAVEFORM (MAX1741 ONLY) VCC 0.5V/div MAX1740/1toc09 40ns/div 1.5V 3V 0 3V 0 DDRV 2V/div DATA 2V/div 0 5V 1V CLK, RST, OR IO 0.5V/div 0 IO 2V/div 0 1ms/div 6 RIN 1V/div 0 5V MAX1740/1toc08 MAX1740/MAX1741 SIM/Smart Card Level Translators in µMAX 1µs/div _______________________________________________________________________________________ SIM/Smart Card Level Translators in µMAX PIN NAME FUNCTION 1 DATA System Controller Data Input/Output. An open-drain input/output with a 20kΩ pull-up resistor to DVCC. For bidirectional data transfer, connect to an open-drain controller output capable of sinking 1mA while pulling DATA low. If the controller is not open drain, use DDRV to send data and DATA to receive data. 2 2 DVCC Supply Voltage for System Controller Digital Pins. Set at +1.425V to +5.5V. 3 3 CIN System Controller Clock Input 4 4 RIN System Controller Reset Input — 5 DDRV Optional System Controller Data Input. Connect to controllers without an open-drain output. When not used, connect DDRV to DVCC. 5 — SHDN Shutdown Mode Input. Driving SHDN low reduces the total supply current to less than 2µA. In shutdown mode, RST, CLK, and IO are actively pulled low and the transfer gate between DATA and IO is disabled. When not used, connect SHDN to DVCC. 6 6 GND System Controller and Card Ground 7 7 RST Reset Output to Card. Actively pulled low during shutdown. 8 8 CLK Clock Output to Card. Actively pulled low during shutdown. 9 9 VCC Supply Voltage for Card-Side Digital Pins. Set at +2.25V to +5.5V. Proper supply bypassing is required to meet ±10kV ESD specifications. 10 10 IO Card-Side Bidirectional Input/Output. An open-drain output with a 10kΩ pull-up resistor to VCC. For bidirectional data transfer, connect to an open-drain card output capable of sinking 1mA while pulling IO low. Actively pulled low during shutdown. MAX1740 MAX1741 1 Detailed Description The MAX1740/MAX1741 provide the necessary level translation for interfacing with subscriber identity modules (SIMs) and smart cards in multivoltage systems. These devices operate with logic supply voltages between +1.425V and +5.5V on the controller side (DVCC) and between +2.25V and +5.5V on the card side (VCC). The total supply current (IDVCC + IVCC) is 2.5µA (max) while operating in an idle state (see Electrical Characteristics). Figure 2 shows a typical application circuit and functional diagram. Level Translation The MAX1740/MAX1741 provide level translators for a clock input, a reset input, and a bidirectional data input/output. The clock and reset inputs (CIN and RIN) are level shifted from the controller-side supply rails (DVCC to GND) to the card-side supply rails (VCC to GND). When connected to an open-drain controller output, DATA and IO provide bidirectional level translation. MAX1740 MAX1741 +1.8V DVCC VCC SHDN* RST RIN CIN DDRV* DATA CLK +3.0V OR +5.0V IO 30pF 30pF 30pF 30pF GND * SHDN FOR MAX1740 ONLY DDRV FOR MAX1741 ONLY NOTE: ALL CAPACITANCES INCLUDE CAPACITIVE LOADS OF TEST PROBES AND BOARD LAYOUT. Figure 1. MAX1740/MAX1741 Test Circuit _______________________________________________________________________________________ 7 MAX1740/MAX1741 Pin Description MAX1740/MAX1741 SIM/Smart Card Level Translators in µMAX All level translation is valid for DVCC ≥ VCC or DVCC ≤ VCC. The MAX1740/MAX1741 contain internal pull-up resistors from DATA to the controller-side supply (DVCC) and from IO to the card-side supply (VCC). For push-pull controller outputs, see the Data Driver section for bidirectional data translation. est way to achieve this is by shutting down the MAX1686H or by driving SHDN (MAX1740 only) low. If specific sequencing is desired, pull IO low by driving either DATA or DDRV (MAX1741 only) low, and pull CLK and RST low by driving CIN and RIN low, respectively. Data Driver (MAX1741 only) ESD Protection When using a microcontroller (µC) without an open-drain output, use the data driver (DDRV) input to send data to the SIM/smart card, while DATA provides the controllerside output for bidirectional data transfer. When not used, connect DDRV to DVCC to reduce total supply current. As with all Maxim devices, ESD-protection structures on all pins protect against electrostatic discharges (ESDs) encountered during handling and assembly. For further protection during card insertion and removal, the pins that connect to the card socket (CLK, RST, IO, VCC, and GND) provide protection against ±10kV of ESD, according to the Human Body Model. The ESD structures withstand high ESD in all states: normal operation, shutdown, and power-down. After an ESD event, the MAX1740/MAX1741 continue working without latchup. Shutdown Mode For the MAX1740, drive SHDN low to activate shutdown. Connect SHDN to DVCC or drive high for normal operation. To allow for card insertion and removal, shutdown mode actively pulls CLK, RST, and IO low; it also disconnects the internal 10kΩ pull-up resistor from VCC to prevent excessive current draw. Shutdown mode reduces the total supply current (I DVCC + I VCC ) to 0.01µA. ESD Test Conditions ESD performance depends on a variety of conditions. Contact Maxim for a reliability report documenting test setup, test methodology, and test results. SIM/Smart Card Insertion/Removal Human Body Model The SIM/smart card specifications require that the card-side pins (V CC , CLK, RST, IO) be at ground potential prior to inserting the SIM/smart card. For applications using the MAX1686H (Figure 4), the easi- Figure 3a shows the Human Body Model, and Figure 3b shows the current waveform it generates when discharged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of inter- VCC DVCC DVCC DVCC VCC RIN RST 1µF VCC RST 1µF CLK CIN SYSTEM CONTROLLER 20k OPTIONAL SHDN* OPTIONAL DDRV* SIM OR SMART CARD 10k IO DATA CLK IO SHUTDOWN CONTROL GND GND MAX1740 MAX1741 GND * SHDN FOR MAX1740 ONLY DDRV FOR MAX1741 ONLY Figure 2. Typical Application Circuit and Functional Diagram 8 _______________________________________________________________________________________ SIM/Smart Card Level Translators in µMAX MAX1740/MAX1741 RC 1M RD 1500Ω IP 100% 90% DISCHARGE RESISTANCE CHARGE-CURRENT LIMIT RESISTOR PEAK-TO-PEAK RINGING (NOT DRAWN TO SCALE) Ir AMPERES HIGHVOLTAGE DC SOURCE Cs 100pF DEVICE UNDER TEST STORAGE CAPACITOR 36.8% 10% 0 0 Figure 3a. Human Body ESD Test Model tDL CURRENT WAVEFORM Figure 3b. Human Body Model Current Waveform +3.0V +5.0V CXN CXP 3.0V OR 5.0V DVCC IN MAX1686 OUT MAX1686H 3/5 SHDN SYSTEM CONTROLLER OPTIONAL SHDN SIM OR SMART CARD VCC RIN RST RST CIN CLK CLK IO SYSTEM CONTROLLER IO OPTIONAL GND * SHDN FOR MAX1740 ONLY DDRV FOR MAX1741 ONLY Figure 4. Using MAX1740/MAX1741 and MAX1686/MAX1686H Charge Pump for SIM Card Applications est, which is then discharged into the test device through a 1.5kΩ resistor. Applications Information SIM/Smart Card Interface To provide 5V when interfacing with a 5V SIM/smart card, 3V systems require a DC-DC converter. The MAX1686H +5V regulating charge pump for SIM cards provides 0V/3V/5V for full compatibility with SIM/smart card specifications. Figure 4 shows the charge pump for SIM card applications. Alternatively, the MAX619 generates a regulated 5V from input voltages as low as 2V. PGND SPI/QSPI/ MICROWIRE SYSTEM VCC VCC RIN RST CS CIN CLK SCLK IO DOUT DATA OPTIONAL GND SET MAX1740 MAX1741 DVCC SHDN* GND OUT MAX8867 MAX8860 PGND VCC DDRV* IN GND DVCC DATA +3.3V DVCC MAX1740 MAX1741 OPTIONAL GND TIME tRL SHDN* DDRV* DIN GND GND * SHDN FOR MAX1740 ONLY DDRV FOR MAX1741 ONLY Figure 5. MAX1740/MAX1741 with SPI/QSPI/MICROWIRE Interfaces SPI/QSPI/MICROWIRE Interface The MAX1740/MAX1741 are also useful as 3V/5V level shifters in SPI, QSPI, and MICROWIRE applications (Figure 5). On the slave side, connect CLK to SCLK, RST to CS, and IO to DOUT and DIN. The unidirectional level shifters transfer chip select and clock signals to the slave device(s), while the bidirectional level shifter transfers data. ___________________Chip Information TRANSISTOR COUNT: 114 _______________________________________________________________________________________ 9 ________________________________________________________Package Information 10LUMAX.EPS MAX1740/MAX1741 SIM/Smart Card Level Translators in µMAX Note: The MAX1740/MAX1741 do not have an exposed pad. 10 ______________________________________________________________________________________ SIM/Smart Card Level Translators in µMAX MAX1740/MAX1741 NOTES ______________________________________________________________________________________ 11 MAX1740/MAX1741 SIM/Smart Card Level Translators in µMAX NOTES Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2000 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.