MAXIM MAX2411

19-1324; Rev 1; 2/98
KIT
ATION
EVALU
LE
B
A
IL
A
AV
Low-Cost RF Up/Downconverter
with LNA and PA Driver
____________________________Features
♦ Low-Cost Silicon Bipolar Design
The LNA has a 2.4dB typical noise figure and a -10dBm
input third-order intercept point (IP3). The downconverter mixer has a low 9.2dB noise figure and 4dBm input
IP3. Image and local-oscillator filtering are implemented
off-chip for maximum flexibility. The PA driver amplifier
has 15dB of gain, which can be reduced over a 35dB
range. Power consumption is only 60mW in receive
mode and 90mW in transmit mode and drops to less
than 3µW in shutdown mode.
For applications requiring separate, single-ended IF
input and output ports, refer to the MAX2410 data
sheet. For applications requiring only a receive function, Maxim offers a low-cost downconverter with LNA
(see the MAX2406 data sheet).
♦ Low Power Consumption:
60mW Receive
90mW Full-Power Transmit
♦ Integrated Upconvert/Downconvert Function
♦ Operates from a Single +2.7V to +5.5V Supply
♦ 3.2dB Combined Receiver Noise Figure:
2.4dB (LNA)
9.2dB (mixer)
♦ Flexible Power-Amplifier Driver:
18dBm Output Third-Order Intercept (OIP3)
35dB Gain-Control Range
♦ LO Buffer for Low LO Drive Level
♦ 0.3µW Shutdown Mode
♦ Flexible Power-Down Modes Compatible with
MAX2510/MAX2511 IF Transceivers
_______________Ordering Information
PART
TEMP. RANGE
PIN-PACKAGE
MAX2411AEEI
-40°C to +85°C
28 QSOP
MAX2411AE/D
-40°C to +85°C
Dice*
*Dice are specified at TA = 25°C, DC parameters only.
________________________Applications
PWT1900
DCS1800/PCS1900
DECT
ISM-Band Transceivers
PHS/PACS
Iridium Handsets
Pin Configuration
TOP VIEW
28 GND
GND 1
27 LNAOUT
LNAIN 2
Typical Operating Circuit appears on last page.
26 GND
GND 3
Functional Diagram
GND 4
MAX2411A
VCC 5
LNAOUT
RXMXIN
LNAIN
RXEN
TXEN
PADROUT
LNA
POWER
MANAGEMENT
IF
IF
LO
LO
MAX2411A
PA DRIVER
TX MIXER
GC PADRIN
TXMXOUT
24 RXMXIN
RXEN 6
RX MIXER
25 GND
23 GND
LO 7
22 IF
LO 8
21 IF
TXEN 9
20 GND
19 TXMXOUT
VCC 10
GC 11
18 GND
GND 12
17 GND
16 PADRIN
PADROUT 13
15 GND
GND 14
QSOP
________________________________________________________________ Maxim Integrated Products
1
For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800.
For small orders, phone 408-737-7600 ext. 3468.
MAX2411A
________________General Description
The MAX2411A performs the RF front-end transmit/
receive function in time-division-duplex (TDD) communication systems. It operates over a wide frequency range
and is optimized for RF frequencies around 1.9GHz.
Applications include most popular cordless and PCS
standards. The MAX2411A includes a low-noise amplifier
(LNA), a downconverter mixer, a local-oscillator buffer, an
upconverter mixer, and a variable-gain power-amplifier
(PA) driver in a low-cost, plastic surface-mount package.
The MAX2411A’s unique bidirectional, differential IF port
reduces cost and component count by allowing the transmit and receive paths to share the same IF filter.
MAX2411A
Low-Cost RF Up/Downconverter
with LNA and PA Driver
ABSOLUTE MAXIMUM RATINGS
VCC to GND ................................................................-0.3V to 6V
LNAIN Input Power ...........................................................15dBm
LO, LO Input Power ..........................................................10dBm
PADRIN Input Power.........................................................10dBm
RXMXIN Input Power ........................................................10dBm
IF, IF Input Power (transmit mode) ...................................10dBm
Voltage at RXEN, TXEN, GC.......................-0.3V to (VCC + 0.3V)
Continuous Power Dissipation (TA = +70°C)
QSOP (derate 11mW/°C above +70°C) ........................909mW
Junction Temperature ......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature.........................................-65°C to +165°C
Lead Temperature (soldering, 10sec) .............................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(VCC = +2.7V to +5.5V, VGC = +3.0V, RXEN = TXEN = 0.6V, PADROUT pulled up to VCC with 50Ω resistor; IF, IF pulled up to VCC
with 50Ω resistor, TXMXOUT pulled up to VCC with 125Ω resistor, LNAOUT pulled up to VCC with 100Ω resistor, all RF inputs open,
TA = -40°C to +85°C. Typical values are at +25°C and VCC = +3.0V, unless otherwise noted.)
PARAMETER
CONDITIONS
Supply-Voltage Range
MIN
TYP
2.7
Digital Input Voltage High
RXEN, TXEN pins
Digital Input Voltage Low
RXEN, TXEN pins
RXEN Input Bias Current (Note 1)
RXEN = 2.0V
TXEN Input Bias Current (Note 1)
TXEN = 2.0V
GC Input Bias Current
MAX
UNITS
5.5
V
2.0
V
0.6
V
0.1
1
µA
0.1
1
µA
GC = 3V, TXEN = 2V
35
51.1
µA
Supply Current, Receive Mode
RXEN = 2.0V
20
29.6
mA
Supply Current, Transmit Mode
TXEN = 2.0V
30
44.7
mA
Supply Current, Standby Mode
RXEN = 2.0V, TXEN = 2.0V
160
520
µA
Supply Current, Shutdown Mode
VCC = 3.0V
0.1
10
µA
AC ELECTRICAL CHARACTERISTICS
(MAX2411A EV kit, V CC = +3.0V, V GC = +2.15V, RXEN = TXEN = low, all measurements performed in 50Ω environment,
f LO = 1.5GHz, P LO = -10dBm, f LNAIN = f PADRIN = f RXMXIN = 1.9GHz, P LNAIN = -32dBm, P PADRIN = P RXMXIN = -22dBm,
fIF, IF = 400MHz, PIF = -32dBm (Note 1), TA = +25°C, unless otherwise noted.)
PARAMETER
CONDITIONS
MIN
TYP
MAX
TA = +25°C
14.2
16.2
17.4
TA = TMIN to TMAX
12.6
UNITS
LOW-NOISE AMPLIFIER (RXEN = high)
Gain (Note 2)
Noise Figure
Input IP3
(Note 3)
Output 1dB Compression
LO to LNAIN Leakage
RXEN = high or low
19.1
dB
2.4
dB
-10
dBm
-5
dBm
-49
dBm
RECEIVE MIXER (RXEN = high)
Conversion Gain (Note 2)
TA = +25°C
8.5
TA = -40°C to +85°C
7.5
9.4
10.0
10.9
dB
Noise Figure
Single sideband
9.2
dB
Input IP3
(Note 4)
4.0
dBm
-7.7
dBm
Input 1dB Compression
IF Frequency
(Notes 2, 5)
Minimum LO Drive Level
(Note 6)
2
450
-17
_______________________________________________________________________________________
MHz
dBm
Low-Cost RF Up/Downconverter
with LNA and PA Driver
(MAX2411A EV kit, V CC = +3.0V, V GC = +2.15V, RXEN = TXEN = low, all measurements performed in 50Ω environment,
f LO = 1.5GHz, P LO = -10dBm, f LNAIN = f PADRIN = f RXMXIN = 1.9GHz, P LNAIN = -32dBm, P PADRIN = P RXMXIN = -22dBm,
fIF, IF = 400MHz, PIF = -32dBm (Note 1), all impedance measurements made directly to pin (no matching network), TA = +25°C,
unless otherwise noted.)
PARAMETER
CONDITIONS
MIN
TYP
MAX
TA = +25°C
6.8
8.5
9.3
TA = TMIN to TMAX
5.7
UNITS
TRANSMIT MIXER (TXEN = high)
Conversion Gain (Note 1)
Output IP3
(Notes 1, 7)
Output 1dB Compression Point
LO Leakage
Noise Figure
Single sideband
IF Frequency
(Notes 2, 5)
Intermod Spurious Response
(Note 8)
10.4
dB
0.5
dBm
-11.1
dBm
-58
dBm
8.3
dB
450
FOUT = 2LO-2IF = 2.2GHz
-45.5
FOUT = 2LO-3IF = 1.8GHz
-70
FOUT = 3LO-6IF = 2.1GHz
-90
MHz
dBc
PA DRIVER (TXEN = high)
TA = +25°C
Gain (Note 2)
TA = TMIN to TMAX
Output IP3
(Note 4)
13
15
12.3
16.4
17
dB
18
dBm
Output 1dB Compression Point
6.3
dBm
Gain-Control Range
35
dB
12
dB/V
Gain-Control Sensitivity
(Note 9)
LOCAL-OSCILLATOR INPUTS (RXEN = TXEN = high)
Input Relative VSWR
Receive mode (TXEN = low)
1.10
Transmit mode (RXEN = low)
1.02
POWER MANAGEMENT (RXEN = TXEN = low)
Receiver Turn-On Time (Notes 2, 10)
RXEN = low to high
0.5
2.5
µs
Transmitter Turn-On Time (Notes 2, 11)
TXEN = low to high
0.3
2.5
µs
Note 1: Power delivered to IF SMA connector of MAX2411A EV kit. Power delivered to MAX2411A IC is approximately 1.0dB less
due to balun losses.
Note 2: Guaranteed by design and characterization.
Note 3: Two tones at 1.9GHz and 1.901GHz at -32dBm per tone.
Note 4: Two tones at 1.9GHz and 1.901GHz at -22dBm per tone.
Note 5: Mixer operation guaranteed to this frequency. For optimum gain, adjust output match. See the Typical Operating
Characteristics for graphs of IF port impedance versus IF frequency.
Note 6: At this LO drive level, the mixer conversion gain is typically 1dB lower than with -10dBm LO drive.
Note 7: Two tones at 400MHz and 401MHz at -32dBm per tone.
Note 8: Transmit mixer output at -17dBm.
Note 9: Calculated from measurements taken at VGC = 1.0V and VGC = 1.5V.
Note 10: Time from RXEN = low to RXEN = high transition until the combined receive gain is within 1dB of its final value. Measured
with 47pF blocking capacitors on LNAIN and LNAOUT.
Note 11: Time from TXEN = low to TXEN = high transition until the combined transmit gain is within 1dB of its final value. Measured
with 47pF blocking capacitors on PADRIN and PADROUT.
_______________________________________________________________________________________
3
MAX2411A
AC ELECTRICAL CHARACTERISTICS (continued)
__________________________________________Typical Operating Characteristics
(MAX2411A EV kit, VCC = +3.0V, VGC = +2.15V, RXEN = TXEN = low, all measurements performed in 50Ω environment,
fLO = 1.5GHz, PLO = -10dBm, fLNAIN = fPADRIN = fRXMXIN = 1.9GHz, PLNAIN = -32dBm, PPADRIN = PRXMXIN = -22dBm,
fIF, IF = 400MHz, PIF = -32dBm (Note 1), all impedance measurements made directly to pin (no matching network), TA = +25°C,
unless otherwise noted.)
RECEIVE-MODE SUPPLY CURRENT
vs. TEMPERATURE
34
VCC = 4.0V
32
30
VCC = 3.0V
28
VCC = 5.5V
22
VCC = 4.0V
21
20
19
VCC = 3.0V
18
VCC = 2.7V
VCC = 2.7V
10
35
60
-40
85
0.07
0.06
0.05
0.04
-15
0.02
10
35
60
0
85
-40
10
35
60
LNA INPUT IMPEDANCE
vs. FREQUENCY
LNA OUTPUT IMPEDANCE
vs. FREQUENCY
IMAGINARY
0
100
RXEN = VCC
80
-40
60
-80
40
-120
REAL
100
VCC = 3.0V
0
0
10
35
60
0.5
1.0
LNA GAIN vs. FREQUENCY
2.0
RXEN = VCC
19
0
0.5
1.0
0
13
2.5
3.0
2.0
2.5
-125
3.0
LNA INPUT IP3 vs. TEMPERATURE
16
14
1.5
FREQUENCY (GHz)
17
5
-100
0
3.0
-5
RXEN = VCC
-6
-7
VCC = 4.0V
15
FREQUENCY (GHz)
REAL
50
INPUT IP3 (dBm)
LNA GAIN (dB)
10
2.0
2.5
VCC = 5.5V
18
15
1.5
-75
LNA GAIN vs. TEMPERATURE
RXEN = VCC
1.0
1.5
20
MAX2411A-07
1pF SHUNT CAPACITOR AT LNA INPUT
USING EV KIT MATCHING CIRCUIT
(OPTIMIZED FOR 1.9GHz)
0.5
100
FREQUENCY (GHz)
TEMPERATURE (°C)
20
-50
-200
0
85
IMAGINARY
MAX2411A-08
-15
-25
150
-160
20
VCC = 2.7V
200
-8
-9
-10
VCC = 4.0V
-11
VCC = 5.5V
-13
VCC = 3.0V
VCC = 3.0V
VCC = 2.7V
-12
VCC = 2.7V
MAX2411A-09
200
0
RXEN = VCC
REAL IMPEDANCE (Ω)
VCC = 4.0V
85
MAX2411A-06
250
40
120
REAL IMPEDANCE (Ω)
300
0
-15
STANDBY SUPPLY CURRENT
vs. TEMPERATURE
VCC = 5.5V
25
VCC = 3.0V
VCC = 2.7V
TEMPERATURE (°C)
400
30
VCC = 4.0V
TEMPERATURE (°C)
RXEN = TXEN = 2.0V
-40
VCC = 5.5V
0.03
TEMPERATURE (°C)
MAX2411A-04
STANDBY SUPPLY CURRENT (µA)
-15
MAX2411A-05
500
4
0.08
0.01
IMAGINARY IMPEDANCE (Ω)
-40
RXEN = TXEN = GND
0.09
17
26
MAX2411A-03
23
0.10
-14
-15
-40
-15
10
35
TEMPERATURE (°C)
60
85
-40
-20
0
20
40
60
TEMPERATURE (°C)
_______________________________________________________________________________________
80
100
IMAGINARY IMPEDANCE (Ω)
VCC = 5.5V
RXEN = VCC
SHUTDOWN SUPPLY CURRENT (µA)
36
24
SHUTDOWN SUPPLY CURRENT
vs. TEMPERATURE
MAX2411A-02
TXEN = VCC
RECEIVE SUPPLY CURRENT (mA)
TRANSMITTER SUPPLY CURRENT (mA)
38
MAX2411A-01
TRANSMIT-MODE SUPPLY CURRENT
vs. TEMPERATURE
LNA GAIN (dB)
MAX2411A
Low-Cost RF Up/Downconverter
with LNA and PA Driver
Low-Cost RF Up/Downconverter
with LNA and PA Driver
(MAX2411A EV kit, VCC = +3.0V, VGC = +2.15V, RXEN = TXEN = low, all measurements performed in 50Ω environment, fLO = 1.5GHz,
PLO = -10dBm, fLNAIN = fPADRIN = fRXMXIN = 1.9GHz, PLNAIN = -32dBm, PPADRIN = PRXMXIN = -22dBm, fIF, IF = 400MHz,
PIF = -32dBm (Note 1), all impedance measurements made directly to pin (no matching network), T A = +25°C, unless otherwise noted.)
LNA OUTPUT 1dB COMPRESSION POINT
vs. SUPPLY VOLTAGE
3.0
2.5
2.0
1.5
1.0
0.5
-1
-2
-3
-4
480
860
1240
1620
80
-90
60
-130
-170
REAL
-210
3.2
3.7
4.2
4.7
5.2
-250
0
0.5
1.0
1.5
2.0
2.5
PA DRIVER GAIN vs. FREQUENCY
PA DRIVER GAIN AND OUTPUT IP3
vs. GC VOLTAGE
MAX2411A-13
50
30
USING EV KIT
MATCHING NETWORK
(OPTIMIZED FOR 1.9GHz)
0
-50
125
-100
100
-150
75
-200
50
-250
REAL
25
25
1.0
1.5
2.0
2.5
TXEN = VCC
10
IP3
5
0
GAIN
-5
-10
-15
-20
-25
-30
0
3.0
0
0.5
1.0
1.5
2.0
2.5
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
3.0
FREQUENCY (GHz)
FREQUENCY (GHz)
GC VOLTAGE (V)
PA DRIVER OUTPUT IP3
vs. TEMPERATURE
PA DRIVER GAIN vs. TEMPERATURE
PA DRIVER OUTPUT 1dB COMPRESSION
vs. SUPPLY VOLTAGE
20
19
18
VCC = 4.0V
17
VCC = 3.0V
16
17
PA DRIVER GAIN (dB)
VCC = 5.5V
TXEN = VCC
VCC = 5.5V
16
VCC = 4.0V
15
VCC = 2.7V
14
VCC = 2.7V
15
13
14
12
0
20
40
60
TEMPERATURE (°C)
80
100
VCC = 3.0V
8
6
MAX2411A-18
TXEN = VCC
OUTPUT 1dB COMPRESSION POINT (dBm)
18
MAX2411A-16
21
-20
15
5
-350
0.5
15
10
-300
0
TXEN = VCC
20
GAIN (dB)
IMAGINARY
150
20
3.0
MAX2411A-15
PA DRIVER OUTPUT IMPEDANCE
vs. FREQUENCY
MAX2411A-14
FREQUENCY (GHz)
IMAGINARY IMPEDANCE (Ω)
REAL IMPEDANCE (Ω)
-50
SUPPLY VOLTAGE (V)
175
OUTPUT IP3 (dBm)
100
0
2.7
2000
TXEN = VCC
-40
-10
FREQUENCY (MHz)
200
0
IMAGINARY
120
20
GAIN (dB) OR OUTPUT IP3 (dBm)
100
30
40
-6
0.0
70
TXEN = VCC
140
-5
MAX2411A-17
NOISE FIGURE (dB)
3.5
MAX2411A-11
4.0
RXEN = VCC
MAX2411A-12
160
REAL IMPEDANCE (Ω)
RXEN = VCC
OUTPUT 1dB COMPRESSION POINT (dBm)
4.5
0
MAX2411A-10
5.0
PA DRIVER INPUT IMPEDANCE
vs. FREQUENCY
VGC = 2.15V
4
TXEN = VCC
2
0
-2
VGC = 1.0V
-4
-40
-15
10
35
TEMPERATURE (°C)
60
85
2.7
3.2
3.7
4.2
4.7
5.2
5.7
SUPPLY VOLTAGE (V)
_______________________________________________________________________________________
5
IMAGINARY IMPEDANCE (Ω)
LNA NOISE FIGURE vs. FREQUENCY
MAX2411A
_____________________________Typical Operating Characteristics (continued)
_____________________________Typical Operating Characteristics (continued)
(MAX2411A EV kit, VCC = +3.0V, VGC = +2.15V, RXEN = TXEN = low, all measurements performed in 50Ω environment, fLO = 1.5GHz,
PLO = -10dBm, fLNAIN = fPADRIN = fRXMXIN = 1.9GHz, PLNAIN = -32dBm, PPADRIN = PRXMXIN = -22dBm, fIF, IF = 400MHz,
PIF = -32dBm (Note 1), all impedance measurements made directly to pin (no matching network), T A = +25°C, unless otherwise noted.)
90
80
5
4
3
2
20
15
10
-140
REAL
-160
1.0
1.5
2.0
2.5
0.0
3.0
0.5
1.0
1.5
2.0
2.5
FREQUENCY (GHz)
RECEIVE MIXER CONVERSION GAIN
vs. RF FREQUENCY
MAX2411Atoc22
6
5
9
VCC = 2.7V
8
7
6
18
VCC = 3.0V
VCC = 2.7V
2
5
4
12
10
8
4
2
0
RXEN = VCC
0
20
40
60
80
-40
-20
0
TEMPERATURE (°C)
20
40
60
80
RECEIVE MIXER GAIN AND NOISE FIGURE
vs. LO POWER
RXEN = VCC
12
10
9
GAIN
7
6
-300
IMAGINARY
600
-600
SINGLE-ENDED
400
-900
-1200
LO POWER (dBm)
0
0
200
0
-25
400
600
FREQUENCY (MHz)
200
IMAGINARY
800
-1500
1000
-50
150
-75
100
-100
-125
50
REAL
0
-150
-175
-50
0
-2
3.0
MAX2411A-27
250
800
REAL
-4
2.5
300
0
RXEN = VCC
5
-6
2.0
TXEN = VCC
200
4
1.5
TRANSMIT MIXER OUTPUT IMPEDANCE
vs. FREQUENCY
MAX2411Atoc26
1000
REAL IMPEDANCE (Ω)
NOISE FIGURE
-8
1.0
RF FREQUENCY (GHz)
IF OR IF OUTPUT IMPEDANCE
vs. FREQUENCY
MAX2411Atoc25
14
-18 -16 -14 -12 -10
0.5
TEMPERATURE (°C)
REAL IMPEDANCE (Ω)
0
RXEN = VCC
-2
IMAGINARY IMPEDANCE (Ω)
-20
EV KIT
MATCHING NETWORK
AT RXMXIN AND IFOUT
6
1
3
2
NARROW BAND MATCH
AT RXMXIN, EV KIT
MATCH AT IF, IF
14
4
3
IF = 400MHz
16
CONVERSION GAIN (dB)
VCC = 5.5V
VCC = 5.5V
VCC = 4.0V
-200
3.0
MAX2411A toc24
0.5
GAIN-CONTROL VOLTAGE (V)
RXEN = VCC
-40
-180
RECEIVE MIXER INPUT IP3
vs. TEMPERATURE
INPUT IP3 (dBm)
CONVERSION GAIN (dB)
-120
30
FREQUENCY (GHz)
10
6
-100
40
RECEIVE MIXER CONVERSION
GAIN vs. TEMPERATURE
12
11
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
MAX2411Atoc23
0
8
-80
50
0
0
0
11
-60
60
10
1
13
-40
70
20
5
-20
IMAGINARY
-100
0
0.5
1.0
1.5
2.0
FREQUENCY (GHz)
_______________________________________________________________________________________
2.5
-200
3.0
IMAGINARY IMPEDANCE (Ω)
NOISE FIGURE (dB)
6
REAL IMPEDANCE (Ω)
TXEN = VCC
7
0
RXEN = VCC
IMAGINARY IMPEDANCE (Ω)
25
MAX2410A-21
100
MAX2411A-20
TXEN = VCC
8
NOISE FIGURE (dB)
30
MAX2411A-19
10
9
RECEIVE MIXER INPUT IMPEDANCE
vs. FREQUENCY
PA DRIVER NOISE FIGURE
vs. GAIN-CONTROL VOLTAGE
PA DRIVER
NOISE FIGURE vs. FREQUENCY
GAIN AND NOISE FIGURE (dB)
MAX2411A
Low-Cost RF Up/Downconverter
with LNA and PA Driver
Low-Cost RF Up/Downconverter
with LNA and PA Driver
(MAX2411A EV kit, VCC = +3.0V, VGC = +2.15V, RXEN = TXEN = low, all measurements performed in 50Ω environment, fLO = 1.5GHz,
PLO = -10dBm, fLNAIN = fPADRIN = fRXMXIN = 1.9GHz, PLNAIN = -32dBm, PPADRIN = PRXMXIN = -22dBm, fIF, IF = 400MHz, PIF = -32dBm
(Note 1), all impedance measurements made directly to pin (no matching network), TA = +25°C, unless otherwise noted.)
VCC = 4.8V
4
7
6
5
EV KIT MATCH NETWORK
AT TXMXOUT AND IF, IF
4
TXEN = VCC
0
20
40
60
-1.5
0.5
80
1.0
1.5
2.0
2.5
TEMPERATURE (°C)
RF FREQUENCY (GHz)
TRANSMIT MIXER GAIN AND NOISE FIGURE
vs. LO POWER
IF OR IF OUTPUT IMPEDANCE
vs. FREQUENCY
TXEN = VCC
9
REAL IMPEDANCE (Ω)
GAIN
7
6
-40
600
-600
SINGLE-ENDED
-900
-12
-9
-6
LO POWER (dBm)
-3
0
60
80
RXEN = TXEN = VCC
10
15
20
25
30
35
0
-15
40
-1200
REAL
-18
20
LO PORT RETURN LOSS vs. FREQUENCY
-300
IMAGINARY
200
5
0
0
0
5
400
-20
TEMPERATURE (°C)
RXEN = VCC
800
NF
8
3.0
MAX2411Atoc32
1000
MAX2411toc31
10
GAIN AND NOISE FIGURE (dB)
VCC = 2.7V
IMAGINARY IMPEDANCE (Ω)
-20
VCC = 3.0V
IF = 400MHz
0
-40
0.5
-0.5
1
0
VCC = 4.0V
1.5
3
2
2
VCC = 5.5V
MAX2411A-33
VCC = 2.7V
TXEN = VCC
2.5
OUTPUT IP3 (dBm)
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
8
6
8
3.5
RETURN LOSS (dB)
VCC = 5.5V
NARROW BAND AT TXMXOUT,
EV KIT MATCH AT IF, IF
9
MAX2411Atoc29
TXEN = VCC
10
10
MAX2411Atoc28
12
TRANSMIT MIXER OUTPUT IP3
vs. TEMPERATURE
TRANSMIT MIXER CONVERSION GAIN
vs. RF FREQUENCY
MAX2411A toc30
TRANSMIT MIXER CONVERSION GAIN
vs. TEMPERATURE
0
200
400
600
FREQUENCY (MHz)
800
-1500
1000
40
0
0.5
1.0
1.5
2.0
2.5
3.0
FREQUENCY (GHz)
_______________________________________________________________________________________
7
MAX2411A
_____________________________Typical Operating Characteristics (continued)
MAX2411A
Low-Cost RF Up/Downconverter
with LNA and PA Driver
______________________________________________________________Pin Description
PIN
NAME
1, 3, 4, 12, 14,
18, 20, 23, 28
GND
2
LNAIN
RF Input to LNA. AC couple to this pin. At 1.9GHz, LNAIN can be easily matched to 50Ω with one
external shunt 1pF capacitor.
5, 10
VCC
Supply Voltage (2.7V to 5.5V). Bypass VCC to GND at each pin with a 47pF capacitor as close to
each pin as possible.
6
RXEN
Logic-Level Enable for Receiver Circuitry. A logic high turns on the receiver. When TXEN and
RXEN are both at a logic high, the part is placed in standby mode, with a 160µA (typical) supply
current. If TXEN and RXEN are both at a logic low, the part is set to shutdown mode, with a
0.1µA (typical) supply current.
7
LO
50Ω Local-Oscillator (LO) Input Port. AC couple to this pin.
8
LO
50Ω Inverting Local-Oscillator Input Port. For single-ended operation, connect LO directly to
GND. If a differential LO signal is available, AC couple the inverted LO signal to this pin.
Ground. Connect GND to the PC board ground plane with minimal inductance.
9
TXEN
Logic-Level Enable for Transmitter Circuitry. A logic high turns on the transmitter. When TXEN
and RXEN are both at a logic high, the part is placed in standby mode, with a 160µA (typical)
supply current. If TXEN and RXEN are both at a logic low, the part is set to shutdown mode, with
a 0.1µA (typical) supply current.
11
GC
Gain-Control Input for PA Driver. By applying an analog control voltage between 0V and 2.15V, the
gain of the PA driver can be adjusted over a 35dB range. Connect to VCC for maximum gain.
13
PADROUT
Power Amplifier Driver Output. AC couple to this pin. Use external shunt inductor to VCC to match
PADROUT to 50Ω. This also provides DC bias. See the Typical Operating Characteristics for a
plot of PADROUT Impedance vs. Frequency.
15, 17
GND
16
PADRIN
RF Input to Variable-Gain Power Amplifier Driver. Internally matched to 50Ω. AC couple to this
pin. This input typically provides a 2:1 VSWR at 1.9GHz. AC couple to this pin. See the Typical
Operating Characteristics for a plot of PADRIN Impedance vs. Frequency.
19
TXMXOUT
RF Output of Transmit Mixer (upconverter). Use an external shunt inductor to VCC as part of a
matching network to 50Ω. This also provides DC bias. AC couple to this pin. See the Typical
Operating Characteristics for a plot of TXMXOUT Impedance vs. Frequency.
21
22
8
FUNCTION
PA Driver Input Grounds. Connect GND to the PC board ground plane with minimal inductance.
IF
Differential IF Port of Transmit (Tx) and Receive (Rx) Mixers, Inverting Side. In Rx mode, this output
is an open collector and should be pulled up to VCC with an inductor. This inductor can be part of
the matching network to the desired IF impedance in both Tx and Rx modes. Additionally, a resistor
may be placed across IF and IF to set a terminating impedance. In Tx mode, this input is internally
AC-coupled; however, AC couple to this pin externally. For single-ended operation, connect this
port to VCC and bypass with 1000pF capacitor to GND.
IF
Differential IF Port of Tx and Rx Mixers, Noninverting Side. In Rx mode, this output is an open collector and should be pulled up to VCC with an inductor. This inductor can be part of the matching network to the desired IF impedance in both Tx and Rx modes. Additionally, a resistor may be placed
across IF and IF to set a terminating impedance. In Tx mode, this input is internally AC coupled;
however, AC couple to this pin externally.
_______________________________________________________________________________________
Low-Cost RF Up/Downconverter
with LNA and PA Driver
PIN
NAME
FUNCTION
24
RXMXIN
RF Input to Receive Mixer (downconverter). This input typically requires a matching network for
connecting to an external filter. AC couple to this pin. See the Typical Operating Characteristics
for a plot of RXMXIN Impedance vs. Frequency.
25
GND
Receive Mixer Input Ground. Connect GND to the PC board ground plane with minimal inductance.
26
GND
LNA Output Ground. Connect GND to the PC board ground plane with minimal inductance.
27
LNAOUT
LNA Output. AC couple to this pin. This output typically provides a VSWR of better than 2:1 at frequencies from 1.7GHz to 3GHz with no external matching components. At other frequencies, a
matching network may be required to match LNAOUT to an external filter. Consult the Typical
Operating Characteristics for a plot of LNA Output Impedance vs. Frequency.
_______________Detailed Description
The MAX2411A consists of five major components: a
transmit mixer followed by a variable-gain poweramplifier (PA) driver as well as a low-noise amplifier
(LNA), receive mixer, and power-management section.
The following sections describe each of the blocks in
the MAX2411A Functional Diagram.
Low-Noise Amplifier (LNA)
The LNA is a wideband, single-ended cascode amplifier that can be used over a wide range of frequencies.
Refer to the LNA Gain vs. Frequency graph in the
Typical Operating Characteristics. Its port impedances
are optimized for operation around 1.9GHz, requiring
only a 1pF shunt capacitor at the LNA input for a VSWR
of better than 2:1 and a noise figure of 2.4dB. As with
every LNA, the input match can be traded off for better
noise figure.
PA Driver
The PA driver has typically 15dB of gain, which is
adjustable over a 35dB range via the GC pin. At full gain,
the PA driver has a noise figure of 3.5dB at 1.9GHz.
For input and output matching information, refer to the
Typical Operating Characteristics for plots of PA Driver
Input and Output Impedance vs. Frequency.
Bidirectional IF Port
The MAX2411A has a unique bidirectional differential IF
port, which can eliminate the need for separate transmit
and receive IF filters, reducing cost and component count.
Consult the Typical Operating Circuit for more information.
For single-ended operation, connect the unused IF port to
VCC and bypass with a 1000pF capacitor to GND.
In receive mode, the IF and IF pins are open-collector
outputs that need external inductive pull-ups to VCC for
proper operation. These inductors are typically used as
part of an IF matching network.
In transmit mode, IF and IF are high-impedance inputs
that are internally AC coupled to the transmit mixer.
This internal AC coupling prevents the DC bias voltage
required for the receive mixer outputs from reaching
the transmit mixer inputs.
Receive Mixer
The receive mixer is a wideband, double-balanced
design with excellent noise figure and linearity. Inputs to
the mixer are the RF signal at the RXMXIN pin and the
LO inputs at LO and LO. The downconverted output signal appears at the IF port. For more information, see the
Bidirectional IF Port section. The conversion gain of the
receive mixer is typically 9.4dB with a 9.2dB noise figure.
RF Input
The RXMXIN input is typically connected to the LNA output through an off-chip filter. This input is externally
matched to 50Ω. See the Typical Operating Circuit for an
example matching network and the Receive Mixer Input
Impedance vs. Frequency graph in the Typical Operating
Characteristics.
Local-Oscillator Inputs
The LO and LO pins are internally terminated with 50Ω
on-chip resistors. AC couple the local-oscillator signal
to these pins. If a single-ended LO source is used, connect LO directly to ground.
Transmit Mixer
The transmit mixer takes an IF signal at the IF port and
upconverts it to an RF frequency at the TXMXOUT pin.
For more information on the IF port, see the Bidirectional
IF Port section. The conversion gain is typically 8.5dB,
and the output 1dB compression point is typically
11.1dBm at 1.9GHz.
_______________________________________________________________________________________
9
MAX2411A
_________________________________________________Pin Description (continued)
MAX2411A
Low-Cost RF Up/Downconverter
with LNA and PA Driver
RF Output
The transmit mixer output appears on the TXMXOUT
pin, an open-collector output that requires an external
pull-up inductor for DC biasing, which can be part of an
impedance matching network. Consult the Typical
Operating Characteristics for a plot of TXMXOUT
Impedance vs. Frequency.
Table 1. Advanced System PowerManagement Function
RXEN
TXEN
0
0
Shutdown
0
1
Transmit
Advanced System Power Management
1
0
Receive
RXEN and TXEN are the two separate power-control
inputs for the receiver and transmitter. If both inputs
are at logic 0, the part enters shutdown mode, and
the supply current drops below 1µA. When one input
is brought to logic 1, the corresponding function is
enabled. If RXEN and TXEN are both set to logic 1, the
part enters standby mode, as described in the Standby
Mode section. Table 1 summarizes these operating
modes.
1
1
Standby mode
Power-down is guaranteed with a control voltage at or
below 0.6V. The power-down function is designed to
reduce the total power consumption to less than 1µA in
less than 2.5µs. Complete power-up happens in the
same amount of time.
Standby Mode
When the TXEN and RXEN pins are both set to logic 1,
all functions are disabled, and the supply current drops
to 160µA (typ); this mode is called Standby. This mode
corresponds to a standby mode on the compatible IF
transceiver chips MAX2510 and MAX2511.
__________Applications Information
Extended Frequency Range
The MAX2411A has been characterized at 1.9GHz for
use in PCS-band applications. However, it operates
over a much wider frequency range. The LNA gain and
noise figure, PA driver gain, and mixer conversion gain
are plotted over a wide frequency range in the Typical
Operating Characteristics. When operating the device
10
FUNCTION
at RF frequencies other than those specified in the AC
Electrical Characteristics table, it may be necessary to
design or alter the matching networks on the RF ports. If
the IF frequency is different from that specified in the AC
Electrical Characteristics table, the IF, IF matching network must also be altered. The Typical Operating
Characteristics provide port impedance data versus frequency on all RF and IF ports for use in designing
matching networks. The LO port (LO and LO) is internally terminated with 50Ω resistors and provides a VSWR of
approximately 1.2:1 to 2GHz and 2:1 up to 3GHz.
Layout Issues
A properly designed PC board is essential to any
RF/microwave circuit. Be sure to use controlled impedance lines on all high-frequency inputs and outputs.
Use low-inductance connections to ground on all GND
pins, and place decoupling capacitors close to all VCC
connections.
For the power supplies, a star topology works well.
Each VCC node in the circuit has its own path to the
central VCC and a decoupling capacitor that provides a
low impedance at the RF frequency of interest. The
central V CC node has a large decoupling capacitor
as well. This provides good isolation between the
different sections of the MAX2411A. The MAX2411A
EV kit layout can be used as a guide to integrating the
MAX2411A into your design.
______________________________________________________________________________________
Low-Cost RF Up/Downconverter
with LNA and PA Driver
RF BPF
MATCH
IF
LNAIN
IF
MATCH
ANTENNA
IF
RF BPF
IF BPF
T/R
TXEN
RXEN
POWER
MANAGEMENT
LO
MAX2411
LOCAL
OSCILLATOR
LO
PA DRIVER
PA
MATCH
PADROUT
RF BPF
GC
RF BPF
MATCH
______________________________________________________________________________________
11
MAX2411A
_________________________________________Typical Application Block Diagram
MAX2411A
Low-Cost RF Up/Downconverter
with LNA and PA Driver
___________________________________________________Typical Operating Circuit
1
LNA INPUT
(1.9GHz)
GND
GND
28
220pF
220pF
2
1pF
3
4
LNAIN
LNAOUT
GND
GND
GND
GND
VCC
RXMXIN
27
LNA
OUTPUT
26
25
VCC
5
47pF
MAX2411A
GND
24
3.9nH
220pF
Rx MIXER
INPUT (1.9GHz)
VCC
23
27nH
7
LO INPUT
LO
IF
220pF
22
27nH
1000pF
1000pF
8
LO
IF
21
VCC
VCC
10
1000pF
27nH
VCC
47pF
GND
VCC
GND
1000pF
GND
400MHz
27nH
20
IF SAW
FILTER
(200Ω)
1000pF
17
18
VCC
18nH
220pF
PA OUTPUT
(1.9GHz)
13
12
14
TXEN
RXEN
GC
9
PADROUT
1000pF
GND
5.6nH
GND
TXEN
6 RXEN
11 GC
TXMXOUT
PADRIN
GND
12
3.9nH
19
16
220pF
220pF
Tx MIXER
OUTPUT
(1.9GHz)
PA DRIVER
INPUT
15
______________________________________________________________________________________
Low-Cost RF Up/Downconverter
with LNA and PA Driver
QSOP.EPS
______________________________________________________________________________________
13
MAX2411A
Package Information
MAX2411A
Low-Cost RF Up/Downconverter
with LNA and PA Driver
NOTES
14
______________________________________________________________________________________