MAXIM MAX5195

19-2557; Rev 0; 7/02
14-Bit, 260Msps High-Dynamic
Performance DAC
♦ 260Msps Output Update Rate
♦ Excellent SFDR Performance
To Nyquist (-12dBFS)
At 19.4MHz Output = 77dBc
At 51.6MHz Output = 76dBc
♦ Industry-Leading IMD Performance
For 4 Tones (-15dBFS)
At 18MHz Output = 86dBc
At 31MHz Output = 84dBc
♦ Low Noise Performance
SNR = 160dB/Hz at fOUT = 19.4MHz
♦ On-Chip 1.2V Bandgap Reference
♦ 20mA Full-Scale Current
♦ Single 5V Supply
♦ Differential LVPECL-Compatible Digital Inputs
♦ 48-Lead QFN-EP Package
Ordering Information
PART
MAX5195EGM
PIN-PACKAGE
48 QFN-EP*
*EP = Exposed paddle.
Base Stations:
Single-/Multi-Carrier UMTS, GSM
D13P
D13N
REFIN
37
38
39
40
41
42
43
D10P
D10N
D11P
D11N
D12P
D12N
44
45
46
D9N
DVCC
DGND
36
2
35
3
34
D7N
D7P
CLKP
4
33
5
32
AMPOUT
AVCC
AVCC
31
OUTP
CLKN
D6N
D6P
7
30
8
29
OUTN
AVCC
9
28
D5N
D5P
10
27
11
26
D4N
12
25
6
RSET
AVCC
AGND
AGND
REFOUT
AVCC
24
23
22
21
20
18
17
16
DVCC
DGND
D2N
D2P
15
MAX5195
14
Instrumentation
1
13
Automated Test Equipment
D9P
D8N
D8P
D4P
Broadband Cable Systems
47
Digital-Signal Synthesis
48
TOP VIEW
Direct IF Synthesis
D3N
D3P
LMDS, MMDS, Point-to-Point Microwave
Pin Configuration
D1N
D1P
D0N
D0P
T.P.
Applications
TEMP RANGE
-40°C to +85°C
19
The MAX5195 is available in a 48-lead QFN package
with exposed paddle and is specified for the extended
industrial temperature range (-40°C to +85°C).
Features
QFN
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1
MAX5195
General Description
The MAX5195 is an advanced, 14-bit, 260Msps digitalto-analog converter (DAC) designed to meet the
demanding performance requirements of signal synthesis applications found in wireless base stations and
other communication systems. Operating from a single
5V supply, this DAC offers exceptional dynamic performance such as 77dBc spurious-free dynamic range
(SFDR) at fOUT = 19.4MHz, while supporting update
rates beyond 260Msps.
The MAX5195 current-source array architecture supports a full-scale current range of 10mA to 20mA, which
allows a differential output voltage swing between
0.5VP-P and 1VP-P.
The MAX5195 features an integrated 1.2V bandgap reference and control amplifier to ensure high accuracy
and low-noise performance. Additionally, a separate
reference input pin allows the user to apply an external
reference source for optimum flexibility.
The digital and clock inputs of the MAX5195 are
designed for differential LVPECL-compatible voltage
levels.
MAX5195
14-Bit, 260Msps High-Dynamic
Performance DAC
ABSOLUTE MAXIMUM RATINGS
AVCC, DVCC to AGND..............................................-0.3V to +6V
AVCC, DVCC to DGND..............................................-0.3V to +6V
AGND to DGND.....................................................-0.3V to +0.3V
D0N–D013, D0P–D13P, T.P. to DGND .................-0.3V to +3.6V
OUTP, OUTN, AMPOUT, REFOUT, CLKP,
CLKN, RSET to AGND..........................................-0.3V to +6V
REFIN Voltage Range...............................................-0.3V to +6V
Continuous Power Dissipation (TA = +70°C)
48-Pin QFN-EP (thermal resistance θJA = +37°C/W)....2162W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(AVCC = DVCC = 5V, AGND = DGND = 0, external reference VREFIN = 1.196V, RT = 27.4Ω referenced to AVCC, VOUT = 1VP-P,
RSET = 3.83kΩ, fCLK = 156MHz, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
STATIC PERFORMANCE
Resolution
14
Integral Nonlinearity
INL
Best-straight-line fit
Differential Nonlinearity
DNL
TA = +25°C
Offset Error
VOS
Full-Scale Gain Error
(Note 2)
GE
LSB
±2
LSB
±1.5
+3.0
LSB
(Note 1)
0.05
0.1
%FS
Internal reference
2.5
6
External reference
1.6
4
-3.3
%FS
DYNAMIC PERFORMANCE
Maximum Throughput Rate
Signal-to-Noise Ratio
Spurious-Free Dynamic Range
to Nyquist, -12dBFS
fCLK
SNR
260
Full-scale output, within Nyquist window,
fCLK = 260MHz, fOUT = 19.4MHz
fCLK = 156MHz
SFDR
fCLK = 260MHz
Spurious-Free Dynamic Range
±10MHz Window, -12dBFS
2nd-Order Harmonic Distortion,
-12dBFS
fCLK = 156MHz
SFDR
fCLK = 260MHz
HD2
fCLK = 156MHz
fCLK = 260MHz
2
MHz
160
fOUT = 1MHz, -2dBFS
89
fOUT = 19.42MHz
77
fOUT = 51.67MHz
76
fOUT = 19.4MHz
74
fOUT = 51.61MHz
72
fOUT = 19.42MHz
82
fOUT = 51.67MHz
75
fOUT = 19.42MHz
82
fOUT = 51.61MHz
76
fOUT = 1.27MHz
-88
fOUT = 9.53MHz
-86
fOUT = 19.42MHz
-82
fOUT = 28.82MHz
-79
fOUT = 38.42MHz
-77
fOUT = 51.67MHz
-79
fOUT = 70.05MHz
-72
_______________________________________________________________________________________
dB/Hz
dBc
dBc
dBc
14-Bit, 260Msps High-Dynamic
Performance DAC
(AVCC = DVCC = 5V, AGND = DGND = 0, external reference VREFIN = 1.196V, RT = 27.4Ω referenced to AVCC, VOUT = 1VP-P,
RSET = 3.83kΩ, fCLK = 156MHz, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
3rd-Order Harmonic Distortion,
-12dBFS
SYMBOL
HD3
CONDITIONS
fCLK = 156MHz
fCLK = 260MHz
fCLK = 156MHz
2-Tone IMD,
-9dBFS, 200kHz
Frequency Spacing
IM3
fCLK = 260MHz
fCLK = 156MHz
2-Tone IMD,
-12dBFS, 200kHz
Frequency Spacing
IM3
fCLK = 260MHz
4-Tone Power Ratio,
-15dBFS, 200kHz
Frequency Spacing
4-Tone Power Ratio,
-18dBFS, 200kHz
Frequency Spacing
8-Tone Power Ratio,
-21dBFS, 200kHz
Frequency Spacing
8-Tone Power Ratio,
-24dBFS, 200kHz
Frequency Spacing
fCLK = 156MHz
MTPR
fCLK = 260MHz
fCLK = 156MHz
MTPR
fCLK = 260MHz
fCLK = 156MHz
MTPR
fCLK = 260MHz
fCLK = 156MHz
MTPR
fCLK = 260MHz
MIN
TYP
fOUT = 1.27MHz
-90
fOUT = 9.53MHz
-85
fOUT = 19.42MHz
-81
fOUT = 28.82MHz
-78
fOUT = 38.42MHz
-78
fOUT = 51.64MHz
-79
fOUT = 70.05MHz
-80
fOUT = 18MHz
92
fOUT = 31MHz
90
fOUT = 18MHz
91
fOUT = 31MHz
89
fOUT = 18MHz
89
fOUT = 31MHz
87
fOUT = 18MHz
88
fOUT = 31MHz
87
fOUT = 18MHz
86
fOUT = 31MHz
84
fOUT = 18MHz
86
fOUT = 31MHz
84
fOUT = 18MHz
81
fOUT = 31MHz
79
fOUT = 18MHz
81
fOUT = 31MHz
78
fOUT = 18MHz
80
fOUT = 31MHz
77
fOUT = 18MHz
79
fOUT = 31MHz
76
fOUT = 18MHz
75
fOUT = 31MHz
73
fOUT = 18MHz
76
fOUT = 31MHz
74
MAX
UNITS
dBc
dBc
dBc
dBc
dBc
dBc
dBc
REFERENCE AND CONTROL AMPLIFIER
Internal Reference Voltage Range
VREFOUT
1.136
1.196
1.255
V
1.196
±8%
V
µV/°C
Reference Input Voltage Range
VREFIN
Internal Reference Voltage Drift
TCOREF
30
ISINK
200
µA
ISOURCE
1.5
mA
RIN
1
MΩ
Internal Reference
Sink/Source Current
Amplifier Input Impedance
_______________________________________________________________________________________
3
MAX5195
ELECTRICAL CHARACTERISTICS (continued)
MAX5195
14-Bit, 260Msps High-Dynamic
Performance DAC
ELECTRICAL CHARACTERISTICS (continued)
(AVCC = DVCC = 5V, AGND = DGND = 0, external reference VREFIN = 1.196V, RT = 27.4Ω referenced to AVCC, VOUT = 1VP-P,
RSET = 3.83kΩ, fCLK = 156MHz, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
ANALOG OUTPUT TIMING
Output Fall Time
tFALL
90% to 10%
0.8
Output Rise Time
tRISE
10% to 90%
0.8
ns
0.5
pV-s
Glitch Energy
ns
TIMING CHARACTERISTICS
Data-to-Clock Setup Time
(D0N–D13N, D0P–D13P)
tSETUP
Referenced to the rising edge, Figure 4
0.5
1
ns
Data-to-Clock Hold Time
(D0N–D13N, D0P–D13P)
tHOLD
Referenced to the rising edge, Figure 4
0.5
1.1
ns
Propagation Delay Time
tPD
(Note 3)
Minimum Clock Pulse Width High
tCH
CLKP, CLKN
1.6
0.5
ns
ns
Minimum Clock Pulse Width Low
tCL
CLKP, CLKN
1.6
ns
2.4
V
LOGIC INPUTS (D0N–D13N, D0P–D13P, CLKP, CLKN)
Input Logic High
VIH
Input Logic Low
VIL
1.6
V
Input Logic Current, Logic High
IIH
VIH = 2.4V
-300
50
+300
µA
Input Logic Current, Logic Low
IIL
VIL = 1.6V
-300
10
+300
µA
Digital Input Capacitance
CIN
2
pF
POWER SUPPLIES
Analog Supply Voltage Range
AVCC
4.75
4.75
5
5.25
V
Digital Supply Voltage Range
DVCC
5
5.25
V
Analog Supply Current
IAVCC
AVCC = DVCC = 5V
48
58
mA
Digital Supply Current
IDVCC
AVCC = DVCC = 5V
190
230
mA
Power Dissipation
PDISS
AVCC = DVCC = 5V
1190
1440
Power-Supply Rejection Ratio
PSRR
AVCC = DVCC = 5V ±5% (Note 4)
0.2
mW
%FS/V
Note 1: Offset error is the deviation of the output voltage from its ideal value at midscale.
Note 2: Full-scale gain error is the deviation of the output voltage from the ideal full-scale value. The actual full-scale voltage is
determined by VOUTP - VOUTN, when D0P–D13P are set high and D0N–D13N are set low.
Note 3: Propagation delay is the time difference between the active edge of the clock and the active edge of the output.
Note 4: Power-supply rejection ratio is the full-scale output change as the supply voltage varies over its specified range.
4
_______________________________________________________________________________________
14-Bit, 260Msps High-Dynamic
Performance DAC
REFERENCE VOLTAGE
vs. TEMPERATURE
DIFFERENTIAL NONLINEARITY
1.5
1.20
MAX5195 toc02
3
MAX5195 toc01
2.0
2
1.19
0.5
0
-0.5
VREFOUT (V)
1
DNL (LSB)
0
-1
-1.0
1.17
-2
-1.5
-2.0
-3
2048 4096 6144 8192 10240 12288 14336 16384
1.16
0
2048 4096 6144 8192 10240122881433616384
DIGITAL INPUT CODE
-40
REFERENCE VOLTAGE
vs. ANALOG SUPPLY VOLTAGE
1.1888
1.70
GAIN ERROR (%FS)
1.1892
-0.04
-0.06
-0.08
5.125
5.250
1.65
1.60
1.55
-0.10
5.000
85
60
1.75
MAX5195 toc05
-0.02
OFFSET ERROR (%FS)
1.1896
35
GAIN ERROR vs. TEMPERATURE
0
MAX5195 toc04
1.1900
4.875
10
TEMPERATURE (°C)
OFFSET ERROR vs. TEMPERATURE
1.1904
1.1884
4.750
-15
DIGITAL INPUT CODE
MAX5195 toc06
0
1.50
-40
-15
10
35
60
85
-40
-15
10
35
85
60
ANALOG SUPPLY VOLTAGE (V)
TEMPERATURE (°C)
TEMPERATURE (°C)
SUPPLY CURRENT vs. TEMPERATURE
SUPPLY CURRENT vs. SUPPLY VOLTAGE
SPURIOUS-FREE DYNAMIC RANGE vs.
OUTPUT FREQUENCY (fCLK = 156.072MHz)
250
MAX5195 toc07
250
200
100
MAX5195 toc08
VREFOUT (V)
1.18
200
MAX5195 toc09
INL (LSB)
1.0
MAX5195 toc03
INTEGRAL NONLINEARITY
-6dBFS
90
100
ANALOG SUPPLY CURRENT
80
150
100
SFDR (dBc)
IAVCC, IDVCC (mA)
IAVCC, IDVCC (mA)
-12dBFS
DIGITAL SUPPLY CURRENT
150
DIGITAL SUPPLY CURRENT
ANALOG SUPPLY CURRENT
0
-40
-15
10
35
TEMPERATURE (°C)
60
85
0
4.750
-18dBFS
60
50
50
70
50
40
4.875
5.000
5.125
ANALOG SUPPLY VOLTAGE (V)
5.250
0
10
20
30
40
50
60
70
80
fOUT (MHz)
_______________________________________________________________________________________
5
MAX5195
Typical Operating Characteristics
(AVCC = DVCC = 5V, external reference VREFIN = 1.196V, fCLK = 156.072MHz, RT = 27.4Ω referenced to AVCC, CL = 15pF, VOUT =
1VP-P, RSET = 3.83kΩ, TA = +25°C, unless otherwise noted.)
Typical Operating Characteristics (continued)
(AVCC = DVCC = 5V, external reference VREFIN = 1.196V, fCLK = 156.072MHz, RT = 27.4Ω referenced to AVCC, CL = 15pF, VOUT =
1VP-P, RSET = 3.83kΩ, TA = +25°C, unless otherwise noted.)
SFDR (dBc)
-18dBFS
60
70
60
50
60
-18dBFS
40
60
80
100
120
40
0
20
40
60
80
100
120
140
20
0
40
60
80
100 120 140 160
fOUT (MHz)
fOUT (MHz)
fOUT (MHz)
SPURIOUS-FREE DYNAMIC RANGE vs.
TEMPERATURE (fOUT = 16MHz AT -12dBFS)
SPECTRAL PLOT, SINGLE-TONE SFDR
FOR A ±10MHz WINDOW
SPECTRAL PLOT, SINGLE-TONE SFDR
FOR A ±10MHz WINDOW
-20
81
80
79
-30
-40
fCENTER
-50
0
-60
-70
-20
-30
-40
77
-60
-70
-80
-90
-90
-100
-100
-110
-110
-40
-15
10
35
85
60
10 12 14 16 18 20 22 24 26 28
10 12 14 16 18 20 22 24 26 28
OUTPUT FREQUENCY (MHz)
OUTPUT FREQUENCY (MHz)
TEMPERATURE (°C)
SPURIOUS-FREE DYNAMIC RANGE vs.
CLOCK FREQUENCY (fOUT = 19MHz)
-6dBFS
-12dBFS
73
69
-70
32MHz/-18dBFS
-75
4-TONE MTPR (dBc)
81
SFDR (dBc)
MULTITONE (4 TONES) POWER RATIO vs.
CLOCK FREQUENCY
MAX5195 toc16
85
77
fCENTER
-50
-80
78
fCLK = 260.12MHz
fCENTER = 19.3975MHz
OUTPUT AMPLITUDE:
-12dBFS
-10
-80
18MHz/-18dBFS
32MHz/-15dBFS
-85
18MHz/-15dBFS
-90
-18dBFS
65
MAX5195 toc17
AMPLITUDE (dBm)
82
fCLK = 156.072MHz
fCENTER = 19.416 MHz
OUTPUT AMPLITUDE:
-12dBFS
-10
AMPLITUDE (dBm)
fCLK = 160MHz
MAX5195 toc14
0
MAX5195 toc13
83
-95
150
180
210
240
fCLK (MHz)
6
-18dBFS
50
40
20
0
-12dBFS
70
50
40
-6dBFS
90
80
-12dBFS
MAX5195 toc12
-6dBFS
80
70
100
SFDR (dBc)
-12dBFS
80
SFDR (dBc)
90
SPURIOUS-FREE DYNAMIC RANGE vs.
OUTPUT FREQUENCY (fCLK = 312.144MHz)
MAX5195 toc11
-6dBFS
90
100
MAX5195 toc10
100
SPURIOUS-FREE DYNAMIC RANGE vs.
OUTPUT FREQUENCY (fCLK = 260.12MHz)
270
300
330
150
180
210
240
270
300
330
fCLK (MHz)
_______________________________________________________________________________________
MAX5195 toc15
SPURIOUS-FREE DYNAMIC RANGE vs.
OUTPUT FREQUENCY (fCLK = 208.096MHz)
SFDR (dBc)
MAX5195
14-Bit, 260Msps High-Dynamic
Performance DAC
14-Bit, 260Msps High-Dynamic
Performance DAC
MULTITONE (8 TONES) POWER RATIO
vs. CLOCK FREQUENCY
-73.0
90%
MAX5195 toc19
32MHz/-24dBFS
8-TONE MTPR (dBc)
OUTPUT RISE/FALL TIMES
MAX5195 toc18
-70.0
18MHz/-24dBFS
-76.0
200mV/div
32MHz/-21dBFS
-79.0
10%
18MHz/-21dBFS
-82.0
-85.0
150
180
210
240
270
300
330
1ns/div
fCLK (MHz)
Pin Description
PIN
NAME
FUNCTION
1
D9P
2
D8N
Data Bit 9
Complementary Data Bit 8
3
D8P
Data Bit 8
4
D7N
Complementary Data Bit 7
5
D7P
Data Bit 7
6
CLKP
Converter Clock Input. Positive input terminal for LVPECL-compatible differential converter clock.
7
CLKN
Complementary Converter Clock Input. Negative input terminal for LVPECL-compatible differential
converter clock.
8
D6N
Complementary Data Bit 6
9
D6P
Data Bit 6
10
D5N
Complementary Data Bit 5
11
D5P
Data Bit 5
12
D4N
Complementary Data Bit 4
13
D4P
Data Bit 4
14
D3N
Complementary Data Bit 3
15
D3P
Data Bit 3
16, 47
DVCC
Digital Supply Voltage. Accepts a 4.75V to 5.25V supply voltage range. Bypass to DGND with a capacitor
combination of 10µF in parallel with 0.1µF and 47pF.
17, 46
18
19
20
21
22
DGND
D2N
D2P
D1N
D1P
D0N
Digital Ground
Complementary Data Bit 2
Data Bit 2
Complementary Data Bit 1
Data Bit 1
Complementary Data Bit 0 (LSB)
_______________________________________________________________________________________
7
MAX5195
Typical Operating Characteristics (continued)
(AVCC = DVCC = 5V, external reference VREFIN = 1.196V, fCLK = 156.072MHz, RT = 27.4Ω referenced to AVCC, CL = 15pF, VOUT =
1VP-P, RSET = 3.83kΩ, TA = +25°C, unless otherwise noted.)
MAX5195
14-Bit, 260Msps High-Dynamic
Performance DAC
Pin Description (continued)
PIN
NAME
23
D0P
Data Bit 0 (LSB)
FUNCTION
Test Point. Must be connected to LVPECL high level (2.4V) for optimum dynamic performance.
24
T.P.
25, 29, 32,
33, 35
AVCC
Analog Supply Voltage. Accepts a 4.75V to 5.25V supply voltage range. Bypass to AGND with a capacitor
combination of 10µF in parallel with 0.1µF and 47pF.
26
REFOUT
Reference Output. Output of the internal 1.2V precision bandgap reference. Bypass with a 1µF capacitor to
AGND, if an external reference source is used.
27, 28
AGND
30
OUTN
Complementary DAC Output. Negative terminal for differential voltage output.
31
OUTP
DAC Output. Positive terminal for differential voltage output.
34
AMPOUT
Control Amplifier Output. For stable operation, bypass to AGND with a combination of a 3kΩ resistor in
parallel with a 1.5µF tantalum capacitor.
36
RSET
Output Current Set Resistor. External resistor (3.83kΩ to 7.66kΩ) sets the full-scale current of the DAC.
37
REFIN
Reference Input. Accepts an input voltage range of 1.196V ±8%. Bypass to AGND with a 0.1µF capacitor,
when used with the internal bandgap reference.
38
D13N
Complementary Data Bit 13 (MSB)
39
D13P
Data Bit 13 (MSB)
40
D12N
Complementary Data Bit 12
41
D12P
Data Bit 12
42
D11N
Complementary Data Bit 11
43
D11P
Data Bit 11
44
D10N
Complementary Data Bit 10
45
D10P
Data Bit 10
48
D9N
Complementary Data Bit 9
8
Analog Ground
_______________________________________________________________________________________
14-Bit, 260Msps High-Dynamic
Performance DAC
The MAX5195 supports operation with the on-chip 1.2V
bandgap reference or an external reference voltage
source. REFIN serves as the input for an external reference source, and REFOUT provides a 1.2V output voltage, if the internal reference is used. For internal
reference operation, REFIN and REFOUT must be connected together and decoupled to AGND with a 1µF
capacitor in parallel with a 0.1µF capacitor for stable
operation.
Architecture
The MAX5195 is a high-performance, 14-bit, segmented
current-source array DAC (Figure 1) capable of operating with clock speeds up to 260MHz. The converter
consists of separate input and DAC registers, followed
by a current-source array. This current-source array is
capable of generating differential full-scale currents in
the range of 10mA to 20mA. An internal R2R resistor
network, in combination with external 27.4Ω termination
resistors, convert these differential output currents into a
differential output voltage with a peak-to-peak output
voltage range of 0.5V to 1V. An integrated 1.2V
bandgap reference, control amplifier, and user-selectable, external resistor determine the data converter’s
full-scale output range.
The MAX5195 reference circuit also employs a control
amplifier, designed to regulate the full-scale current IFS
for the differential current outputs of the MAX5195. For
stable operation, the output AMPOUT of this amplifier
must be bypassed with a 3kΩ resistor in parallel with a
1.5µF tantalum capacitor to AGND. Configured as a
voltage-to-current amplifier, the output current can be
calculated as follows:
IFS = 64 ✕ IREF - 1LSB
DVCC
1.2V
REFERENCE
DGND
AGND
AVCC
R2R
NETWORK
BIAS
REFOUT
REFIN
OUTP
CURRENT-SOURCE
ARRAY
RSET
OUTN
CLKN
INPUT REGISTER
CLKP
DECODER
INPUT LATCH
MAX5195
14
D0N/D0P–D13N/D13P
Figure 1. Simplified MAX5195 Block Diagram
_______________________________________________________________________________________
9
MAX5195
Internal Reference and Control Amplifier
Detailed Description
MAX5195
14-Bit, 260Msps High-Dynamic
Performance DAC
Table 1. IFS and RSET Selection Matrix Based on a Typical 1.2V Reference Voltage
RSET (kΩ)
FULL-SCALE CURRENT
IFS (mA)
REFERENCE CURRENT
IREF (µA)
CALCULATED
1% EIA STD
OUTPUT VOLTAGE
VOUTP/N* (mVP-P)
10
156.26
7.68
7.50
500
12
187.50
6.40
6.34
600
14
218.80
5.49
5.49
700
16
250.00
4.80
4.75
800
18
281.30
4.27
4.22
900
20
312.50
3.84
3.83
1000
*Terminated into a 27.4Ω load (see Analog Outputs section for details) referenced to AVCC.
1.5µF
AVCC
IFS = 64 ✕ IREF - (IFS / 214)
where I REF is the reference output current (I REF =
VREFOUT/RSET) and IFS is the full-scale current. RSET is
the reference resistor that determines the amplifier’s
output current (Figure 2) on the MAX5195. See Table 1
for a matrix of different IFS and RSET selections.
CURRENT-SOURCE
ARRAY
Figure 3 illustrates a low-impedance reference source
applied to the data converter for external reference
operation. REFIN allows an input voltage range of
1.196V ±8%. Use a fixed output voltage reference
source such as the 1.2V, 25ppm/°C (typ) MAX6520
bandgap reference for improved accuracy and drift
performance. Bypass the unused REFOUT pin of the
MAX5195 with a 1µF capacitor to AGND.
3kΩ
MAX5195
1.2V
REFERENCE
External Reference Operation
REFOUT
0.1µF
1µF
OUTP
REFIN
OUTN
RSET
IREF = VREFOUT/RSET
IREF
NOTE: CONNECT REFIN AND REFOUT TOGETHER FOR INTERNAL REFERENCE OPERATION.
Figure 2. Internal Reference Configuration
1.5µF
3kΩ
AVCC
MAX5195
AMPOUT
1.2V
REFERENCE
REFOUT
1µF
REFIN
MAX6520
OUTP
RSET
CURRENT-SOURCE
ARRAY
OUTN
IREF = VREFOUT/RSET
IREF
Figure 3. External Reference Configuration Using the MAX6520
10
______________________________________________________________________________________
14-Bit, 260Msps High-Dynamic
Performance DAC
MINIMUM LVPECL SPECIFICATION
MAXIMUM LVPECL SPECIFICATION
Input Voltage High
PARAMETER
VCC** - 1.16V
VCC** - 0.88V
Input Voltage Low
VCC** - 1.81V
VCC** - 1.48V
Common-Mode Level
VCC** - 1.3V
**VCC is the supply voltage associated with the LVPECL source. A typical VCC level associated with LVPECL is 3.3V, which sets the
common-mode level to 2V, allowing a typical peak-to-peak signal swing of 0.8V.
LVPECL-Compatible Digital Inputs
(D0P–D13P, D0N–D13N)
The MAX5195 digital interface consists of 14 differential, LVPECL-compatible digital input pins. These inputs
follow standard positive binary coding where D0P and
D0N represent the differential inputs to the least significant bit (LSB), and D13P and D13N represent the differential pair associated with the most significant bit
(MSB). D0P/N through D13P/N accept LVPECL input
levels of 0.8VP-P (Table 2).
Each of the digital input terminals can be terminated
with a separate 50Ω resistor; however, to achieve the
lowest noise performance, it is recommended to terminate each differential pair with a 100Ω resistor located
between the positive and negative input terminals.
Clock Inputs (CLKP, CLKN) and Data
Timing Relationship
The MAX5195 features differential, LVPECL-compatible
clock inputs. Internal edge-triggered flip-flops latch the
input word on the rising edge of the clock-input pair
CLKP/CLKN. The DAC is updated with the data word
on the next rising edge of the clock input. This results in
a conversion latency of one clock cycle. The MAX5195
tCH
provides for minimum setup and hold times (<2ns), allowing for noncritical external interface timing (Figure 4).
For best AC performance, a differential, DC-coupled
clock signal with LVPECL-compatible voltage levels
(Table 2) should be used. The MAX5195 operates
properly with a clock duty cycle set within the limits listed in the Electrical Characteristics table. However, a
50% duty cycle should be utilized for optimum dynamic
performance. To maintain the DAC’s excellent dynamic
performance, clock and data signals should originate
from separate signal sources.
Analog Outputs (OUTP, OUTN)
The MAX5195’s current array is designed to drive fullscale currents of 10mA to 20mA into an internal R2R
resistor network (RR2R). To achieve the desired differential output voltage range of 0.5VP-P to 1VP-P, both
OUTP and OUTN should be externally terminated into
27.4Ω (RT), resulting in a combined load of RLOAD =
25Ω (Figure 5):
RLOAD = RR2R || RT
RLOAD = (285Ω ✕ 27.4Ω) / (285Ω + 27.4Ω)
RLOAD = 25Ω
tCL
CLKP
CLKN
tSETUP
tHOLD
D13–D0
OUTP
90% POINT
tPD
MAX5195
OUTN
10% POINT
tRISE, tFALL
Figure 4. Input/Output Timing Information
______________________________________________________________________________________
11
MAX5195
Table 2. LVPECL Voltage Levels
MAX5195
14-Bit, 260Msps High-Dynamic
Performance DAC
AVCC
AVCC
RR2R
285Ω
RT
27.4Ω
RR2R
285Ω
RLOAD = 25Ω
OUTN
OUTP
RT
27.4Ω
The proportional, differential output voltages can then
be used to drive a wideband RF transformer or a fast,
low-noise, low-distortion operational amplifier to convert
the differential voltage into a single-ended output.
The MAX5195 analog outputs can also be configured in
single-ended mode. For more details on different output
configurations, see the Applications Information section.
RLOAD = 25Ω
Applications Information
Differential Coupling Using a
Wideband RF Transformer
AVCC
AMPOUT
AGND
MAX5195
RLOAD IS THE COMBINED LOAD OF
THE INTERNAL R2R RESISTOR
NETWORK IN PARALLEL WITH THE
EXTERNAL TERMINATION RESISTOR.
Figure 5. Simplified Output Architecture
With a full-scale current of 10mA (20mA), both outputs
OUTP and OUTN achieve a 0.25V (0.5V) voltage swing
each, resulting in a 0.5VP-P (1VP-P) differential output
signal. For applications that require an even smaller
output voltage swing, the termination resistor value RT
can be as low as 0Ω.
A wideband RF transformer such as the TTWB1010 (1:1
turns ratio) from Coilcraft can be used to convert the
MAX5195 differential output signal to a single-ended
signal (Figure 6). As long as the generated output
spectrum is within the passband of the transformer, a
differentially coupled transformer provides the best distortion performance. Additionally, the transformer helps
to reject noise and even-order harmonics, provides
electrical isolation, and is capable of delivering more
power to the load.
Single-Ended Unbuffered Output
Configuration
Figure 7a shows an unbuffered single-ended output,
which is suitable for applications requiring a unipolar
voltage output. The nominal termination resistor load of
27.4Ω (referred to AVCC) results in a differential output
AVCC, DVCC
AVCC
RT
27.4Ω
VOUT, SINGLE ENDED
OUTP
AGND
1:1
D0–D13
14
OUTN
TTWB1010
RT
27.4Ω
MAX5195
AGND, DGND
AVCC
AGND
WIDEBAND RF TRANSFORMER
PERFORMS DIFFERENTIAL-TOSINGLE-ENDED CONVERSION.
Figure 6. Differential Coupling Using a Wideband RF Transformer
12
______________________________________________________________________________________
14-Bit, 260Msps High-Dynamic
Performance DAC
MAX5195
AVCC, DVCC
AVCC
RT
27.4Ω
OUTP
VOUTP
AGND
D0–D13
VOUT_ = IFS × RLOAD
14
VOUTN
OUTN
RT
27.4Ω
MAX5195
AVCC
AGND, DGND
AGND
RLOAD: RESISTOR COMBINATION OF
INTERNAL R2R NETWORK AND EXTERNAL
TERMINATION RESISTOR
Figure 7a. Single-Ended Unbuffered Output Configuration
AVCC, DVCC
RLOOP
OUTP
CLOOP
D0–D13
VOUT
14
AGND
OUTN
MAX5195
AGND, DGND
AVCC
Figure 7b. Single-Ended Buffered Output Configuration
swing of 1VP-P (0.5VP-P single ended) when applying a
full-scale current of 20mA.
Alternatively, an external unity-gain amplifier can be
used to buffer the outputs. This circuit works as an I-V
amplifier (Figure 7b), in which OUTP is held at AVCC by
the inverting terminal of the buffer amplifier. OUTN
should then be connected to AVCC to provide a DCcurrent path for the current switched to OUTP. The
amplifier’s maximum output swing and the MAX5195
full-scale current determine the value of RLOOP. An
optional roll-off capacitor (CLOOP) in the feedback loop
helps to ease dV/dt requirements at the input of the
operational amplifier. It is recommended that the amplifier’s power-supply rails be higher than the resistor’s
output reference voltage AVCC due to its positive and
negative output swing around AVCC.
______________________________________________________________________________________
13
MAX5195
14-Bit, 260Msps High-Dynamic
Performance DAC
Grounding, Bypassing, and Power-Supply
Considerations
point connecting the two planes. Digital signals should
run above the digital ground plane and analog signals
above the analog ground plane. Digital signals should
be kept as far away from sensitive analog inputs, reference input lines, and clock inputs. Digital signal paths
should be kept short and run lengths matched to avoid
propagation delay mismatch.
The MAX5195 has two separate power-supply inputs
for analog (AVCC) and digital (DVCC). Each AVCC input
should be decoupled with parallel ceramic chip capacitors of 10µF in parallel with 0.1µF and 47pF with these
capacitors as close to the supply pins as possible and
their opposite ends with the shortest possible connection to the ground plane (Figure 8). The DV CC pins
should also have separate 10µF in parallel with 0.1µF
and 47pF capacitors adjacent to their respective pins.
Try to minimize the analog and digital load capacitances for proper operation.
Grounding and power-supply decoupling can strongly
influence the performance of the MAX5195. Unwanted
digital crosstalk can couple through the input, reference, power supply, and ground connections, thus
affecting dynamic performance. Proper grounding and
power-supply decoupling guidelines for high-speed,
high-frequency applications should be closely followed.
This reduces EMI and internal crosstalk, which can also
affect the dynamic performance of the MAX5195.
Use of a multilayer printed circuit (PC) board with separate ground and power-supply planes is recommended. High-speed signals should be run on lines directly
above the ground plane. Since the MAX5195 has separate analog and digital ground buses (AGND and
DGND, respectively), the PC board should have separate analog and digital ground sections with only one
5V
10µF
1.5µF
0.1µF
47pF
3kΩ
DGND
AMPOUT
DVCC
5V
AVCC
1.2V
REFERENCE
R2R
NETWORK
BIAS
47pF
0.1µF
10µF
AGND
REFOUT
27.4Ω
AGND
REFIN
RSET
OUTP
CURRENT-SOURCE
ARRAY
1µF
VOUT
27.4Ω
AGND
OUTN
3.83kΩ
AGND
0.1µF
INPUT REGISTER
CLKP
2.4V
1.6V
DECODER
2V
260MHz,
LVPECL
MAX5195
CLKN
INPUT LATCH
14
D0N/D0P–D13N/D13P
Figure 8. Decoupling and Bypassing Techniques for MAX5195—Typical Operating Circuit
14
______________________________________________________________________________________
14-Bit, 260Msps High-Dynamic
Performance DAC
Enhanced Thermal Dissipation QFN-EP Package
The MAX5195 is packaged in a thermally enhanced 48pin QFN-EP package, providing greater design flexibility, increased thermal efficiency, and a low thermal
junction-case (θjc) resistance of ≈2°C/W. In this package, the data converter die is attached to an EP lead
frame. The back of the lead frame is exposed at the
package bottom surface (the PC board side of the
package, Figure 9. This allows the package to be
attached to the PC board with standard infrared (IR)
flow soldering techniques. A specially created land pattern on the PC board, matching the size of the EP
(5.5mm ✕ 5.5mm), guarantees proper attachment of the
chip, and can also be used for heat-sinking purposes.
Designing thermal vias* into the land area and implementing large ground planes in the PC board design
further enhance the thermal conductivity between
board and package. To remove heat from a 48-pin
QFN-EP package effectively, an array of 3 ✕ 3 (or
greater) vias (≤0.3mm diameter per via hole and 1.2mm
pitch between via holes) is recommended. A smaller via
array can be used as well, but results in an increased θja.
Note that efficient thermal management for the MAX5195
is strongly dependent on PC board and circuit design,
component placement, and installation; therefore, exact
performance figures cannot be provided. For more information on proper design techniques and recommendations to enhance the thermal performance of parts such
as the MAX5195, refer to Amkor Technology’s website at
www.amkor.com.
Static Performance Parameter Definitions
Integral Nonlinearity (INL)
Integral nonlinearity is the deviation of the values on an
actual transfer function from either a best-straight-line
fit (closest approximation to the actual transfer curve)
or a line drawn between the endpoints of the transfer
function, once offset and gain errors have been nullified. For a DAC, the deviations are measured every
individual step.
Differential Nonlinearity (DNL)
Differential nonlinearity is the difference between an
actual step height and the ideal value of 1LSB. A DNL
error specification of less than 1LSB guarantees no
missing codes and a monotonic transfer function.
*Connect the land pattern to internal or external copper
planes.
DIE
48-LEAD QFN PACKAGE
WITH EXPOSED PAD
BONDING WIRE
EPOXY
EXPOSED PAD
COPPER
TRACE, 1oz
COPPER TRACE, 1oz
PC BOARD
TOP LAYER
GROUND PLANE
AGND, DGND
POWER PLANE
GROUND PLANE (AGND)
3 x 3 ARRAY OF THERMAL VIAS
THERMAL LAND
COPPER PLANE, 1oz
MAX5195
Figure 9. MAX5195 Exposed Paddle/PC Board Cross Section
______________________________________________________________________________________
15
MAX5195
The power-supply voltages should also be decoupled
at the point where they enter the PC board with tantalum or electrolytic capacitors. Ferrite beads with additional decoupling capacitors forming a π network can
also improve performance.
The analog and digital power-supply inputs AVCC and
DVCC of the MAX5195 allow a 4.75V to 5.25V supply
voltage range.
MAX5195
14-Bit, 260Msps High-Dynamic
Performance DAC
Offset Error
The offset error is the difference between the ideal and
the actual offset point. For a DAC, the offset point is the
step value when the digital input is at midscale. This
error affects all codes by the same amount.
Gain Error
A gain error is the difference between the ideal and the
actual full-scale output voltage on the transfer curve,
after nullifying the offset error. This error alters the slope
of the transfer function and corresponds to the same
percentage error in each step.
Glitch Energy
Glitch impulses are caused by asymmetrical switching
times in the DAC architecture, which generates undesired output transients. The amount of energy that
appears at DAC’s output is measured over time and is
usually specified in the pV-s range.
Dynamic Performance Parameter
Definitions
Signal-to-Noise Ratio (SNR)
For a waveform perfectly reconstructed from digital
samples, the theoretical maximum SNR is the ratio of the
full-scale analog output (RMS value) to the RMS quantization error (residual error). The ideal, theoretical minimum can be derived from the DAC’s resolution (N bits):
SNRdB = 6.02dB ✕ N + 1.76dB
However, noise sources such as thermal noise, reference noise, clock jitter, etc., affect the ideal reading.
SNR is therefore computed by taking the ratio of the
RMS signal to the RMS noise, which includes all spectral components minus the fundamental, the first four
harmonics, and the DC offset.
16
Spurious-Free Dynamic Range
SFDR is the ratio of RMS amplitude of the carrier frequency (maximum signal components) to the RMS
value of the next largest distortion component. SFDR is
measured in dBc, with respect to the carrier frequency
amplitude.
Multitone Power Ratio (MTPR)
A series of equally spaced ones is applied to the DAC
with one tone removed from the center of the range.
MTPR is defined as the worst-case distortion (usually a
3rd-order harmonic product of the fundamental frequencies), which appears as the largest spur at the frequency
of the missing tone in the sequence. This test can be
performed with any number of input tones; however, four
and eight tones are among the most common test conditions for CDMA- and GSM/EDGE-type applications.
Intermodulation Distortion (IMD)
The two-tone IMD is the ratio expressed in dBc of either
input tone to the worst 3rd-order (or higher) IMD products. Note that 2nd-order IMD products usually fall at
frequencies, which can be easily removed by digital filtering. Therefore, they are not as critical as 3rd-order
IMDs. The two-tone IMD performance of the MAX5195
was tested with the two individual input tone levels set
to -9dBFS and -12dBFS.
Chip Information
TRANSISTOR COUNT: 15,000
PROCESS: SiGe
______________________________________________________________________________________
14-Bit, 260Msps High-Dynamic
Performance DAC
QFN 28, 32,44, 48L.EPS
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 17
© 2002 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
MAX5195
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)