MAXIM MAX8643

19-3970; Rev 2; 3/07
KIT
ATION
EVALU
E
L
B
A
AVAIL
3A, 2MHz Step-Down Regulator
with Integrated Switches
The MAX8643 high-efficiency switching regulator delivers up to 3A load current at output voltages from 0.6V
to (0.9 x VIN).The IC operates from 2.35V to 3.6V, making it ideal for on-board point-of-load and postregulation applications. Total output error is less than ±1%
over load, line, and temperature.
The MAX8643 features fixed-frequency PWM mode
operation with a switching frequency range of 500kHz
to 2MHz set by an external resistor. High-frequency
operation allows for an all-ceramic capacitor design.
The high operating frequency also allows for small-size
external components.
The low-resistance on-chip nMOS switches ensure high
efficiency at heavy loads while minimizing critical inductances, making the layout a much simpler task with
respect to discrete solutions. Following a simple layout
and footprint ensures first-pass success in new designs.
The MAX8643 comes with a high-bandwidth (> 14MHz)
voltage-error amplifier. The voltage-mode control architecture and the voltage-error amplifier permit a type III
compensation scheme to be utilized to achieve maximum loop bandwidth, up to 20% of the switching frequency. High loop bandwidth provides fast transient
response, resulting in less required output capacitance
and allowing for all-ceramic capacitor designs.
The MAX8643 provides two tri-state logic inputs to
select one of nine preset output voltages. The preset
output voltages allow customers to achieve ±1% output-voltage accuracy without using expensive 0.1%
resistors. In addition, the output voltage can be set to
any customer value by either using two external resistors at the feedback with 0.6V internal reference or
applying an external reference voltage to the REFIN
input. The MAX8643 offers programmable soft-start
time using one capacitor to reduce input inrush current.
The MAX8643 is available in a lead-free, 24-pin, 4mm x
4mm thin QFN package.
Applications
POLs
ASIC/CPU/DSP Core and I/O Voltages
DDR Power Supplies
Base-Station Power Supplies
Telecom and Networking Power Supplies
RAID Control Power Supplies
Pin Configuration appears at end of data sheet.
Features
o Internal 37mΩ RDS(ON) MOSFETs
o Continuous 3A Output Current
o ±1% Output Accuracy Over Load, Line,
and Temperature
o Operates from 2.35V to 3.6V Supply
o Adjustable Output from 0.6V to (0.9 x VIN)
o Soft-Start Reduces Inrush Supply Current
o 500kHz to 2MHz Adjustable Switching Frequency
o Compatible with Ceramic, Polymer, and
Electrolytic Output Capacitors
o VID-Selectable Output Voltages
0.6, 0.7, 0.8, 1.0, 1.2, 1.5, 1.8, 2.0, and 2.5V
o Fully Protected Against Overcurrent
and Overtemperature
o Lead-Free, 24-Pin, 4mm x 4mm
Thin QFN Package
Ordering Information
PART
TEMP
RANGE
PIN-PACKAGE
PKG
CODE
MAX8643ETG+
-40°C to
+85°C
24 Thin QFN-EP*
4mm x 4mm
T2444-4
+Denotes lead-free package.
*EP = Exposed pad.
Typical Operating Circuit
INPUT
2.4V, 3.6V
IN
EN
BST
OUTPUT
1.8V, 3A
MAX8643
LX
VDD
OUT
PGND
CTL1
FB
CTL2
FREQ
REFIN
COMP
SS
GND
VDD
PWRGD
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1
MAX8643
General Description
MAX8643
3A, 2MHz Step-Down Regulator
with Integrated Switches
ABSOLUTE MAXIMUM RATINGS
IN, VDD, PWRGD to GND ......................................-0.3V to +4.5V
COMP, FB, REFIN, OUT,
CTL_, EN, SS, FREQ to GND...................-0.3V to (VDD + 0.3V)
LX Current (Note 1) .....................................................-4A to +4A
BST to LX..................................................................-0.3V to +4V
PGND to GND .......................................................-0.3V to +0.3V
Continuous Power Dissipation (TA = +70°C)
24-Pin TQFN-EP
(derated 27.8mW/°C above +70°C)........................2222.2mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: LX has internal clamp diodes to GND and IN. Applications that forward bias these diodes should take care not to exceed
the IC’s package power dissipation limits.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VIN = VDD = 3.3V, VFB = 0.5V, TA = -40°C to +85°C. Typical values are at TA = +25°C, circuit of Figure 1, unless otherwise noted.) (Note 2)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
3.60
V
IN/VDD
IN and VDD Voltage Range
IN Supply Current
2.35
fS = 1MHz, no load,
L = 0.47µH
(includes gate-drive current)
VIN = 2.5V
4
VIN = 3.3V
5.5
VIN = 2.5V
1.4
VIN = 3.3V
2
4.6
mA
VDD Supply Current
fS = 1MHz
Total Shutdown Current from IN
and VDD
VIN = VDD = VBST - VLX = 3.6V, VEN = 0V
VDD Undervoltage Lockout
Threshold
LX starts/stops switching
13
VDD rising
VDD falling
2.3
2
1.8
Deglitching
2.1
1.9
2
mA
µA
V
µs
BST
BST Supply Current
VBST = VDD = VIN = 3.6V,
VLX = 3.6V or 0V, VEN = 0V
TA = +25°C
5
TA = +85°C
10
µA
PWM COMPARATOR
PWM Comparator Propagation
Delay
10mV overdrive
20
ns
COMP
COMP Clamp Voltage, High
VIN = 2.35V to 3.6V
COMP Slew Rate
PWM Ramp Amplitude
COMP Shutdown Resistance
From COMP to GND, VEN = VSS = 0V
2
V
1.4
V/µs
1
V
8
Ω
ERROR AMPLIFIER
Preset Output-Voltage Accuracy
REFIN = SS
FB Regulation Accuracy Using
External Resistors
CTL1 = CTL2 = GND
FB to OUT Resistor
All VID settings except CTL1 = CTL2 = GND
2
-1
Select
from
Table 1
+1
%
0.594
0.600
0.606
V
5
8
11
kΩ
_______________________________________________________________________________________
3A, 2MHz Step-Down Regulator
with Integrated Switches
(VIN = VDD = 3.3V, VFB = 0.5V, TA = -40°C to +85°C. Typical values are at TA = +25°C, circuit of Figure 1, unless otherwise noted.) (Note 2)
PARAMETER
CONDITIONS
MIN
TYP
MAX
Open-Loop Voltage Gain
1kΩ from COMP to GND
Error-Amplifier Unity-Gain
Bandwidth
Parallel 10kΩ, 40pF from COMP to GND (Note 3)
14
VDD = 2.35V to 2.6V
0
VDD - 1.65
VDD = 2.6V to 3.6V
0
VDD - 1.7
Error-Amplifier Common-Mode
Input Range
Error-Amplifier Minimum Output
Current
VCOMP = 1V
FB Input Bias Current
VFB = 0.7V, CTL1 = CTL2 =
Sourcing
1000
Sinking
-500
TA = +25°C
-200
UNITS
115
dB
26
MHz
V
µA
-40
nA
CTL_
CTL_ Input Bias Current
VCTL_ = 0V
-7
VCTL_ = VDD
+7
Rising
High-Impedance Threshold
Hysteresis
µA
0.75
V
VDD
- 1.2V
Falling
All VID transitions
50
mV
REFIN
REFIN Input Bias Current
REFIN Common-Mode Range
REFIN Offset Voltage
VREFIN = 0.6V
TA = +25°C
-500
-100
nA
VDD = 2.3V to 2.6V
0
VDD - 1.65
VDD = 2.6V to 3.6V
0
VDD - 1.7
CTL1 = CTL2 = GND, TA = +25°C
-3
+3
V
mV
LX (ALL PINS COMBINED)
LX On-Resistance, High Side
ILX = -2A
LX On-Resistance, Low Side
ILX = 2A
LX Current-Limit Threshold
VIN = 2.5V, high-side sourcing
VIN = VBST - VLX = 2.5V
39
VIN = VBST - VLX = 3.3V
37
VIN = 2.5V
36
VIN = 3.3V
34
4
TA = +25°C
LX Leakage Current
VIN = 3.6V, VEN = VSS = 0V
TA = +85°C
LX Switching Frequency
VIN = 2.5V to 3.3V
Frequency Range
VLX = 0V
VIN = 2.5V to 3.3V
LX Maximum Duty Cycle
RFREQ = 50kΩ, VIN = 2.5V to 3.3V
5.5
VLX = 3.6V
mΩ
A
+2
VLX = 0V
1
VLX = 3.6V
1
RFREQ = 50kΩ
0.9
1
1.1
RFREQ = 23.2kΩ
1.8
2.0
2.2
40
93
LX Minimum On-Time
RMS LX Output Current
55
mΩ
-2
500
LX Minimum Off-Time
58
3
µA
MHz
2000
kHz
75
ns
96
%
80
ns
A
_______________________________________________________________________________________
3
MAX8643
ELECTRICAL CHARACTERISTICS (continued)
ELECTRICAL CHARACTERISTICS (continued)
(VIN = VDD = 3.3V, VFB = 0.5V, TA = -40°C to +85°C. Typical values are at TA = +25°C, circuit of Figure 1, unless otherwise noted.) (Note 2)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
0.7
V
ENABLE
EN Input Logic-Low
EN Input Logic-High
1.7
VEN = 0V or 3.6V,
VDD = 3.6V
EN, Input Current
TA = +25°C
TA = +85°C
V
1
0.01
µA
SS
SS Charging Current
VSS = 0.45V
7
8
9
µA
500
Ω
Thermal-Shutdown Threshold
+165
°C
Thermal-Shutdown Hysteresis
20
°C
SS Discharge Resistance
THERMAL SHUTDOWN
POWER-GOOD (PWRGD)
Power-Good Threshold Voltage
VFB falling, 3mV hysteresis
87
Power-Good Falling-Edge Deglitch
90
93
%
Clock
cycles
48
PWRGD Output-Voltage Low
IPWRGD = 4mA
0.03
PWRGD Leakage Current
0.15
V
VDD = VPWRGD = 3.6V, VFB = 0.9V
0.01
µA
Current-Limit Startup Blanking
128
Clock
cycles
Restart Time
1024
Clock
cycles
OVERCURRENT LIMIT
Note 2: Specifications are 100% production tested at TA = +25°C. Limits over the operating temperature range are guaranteed by
design and characterization.
Note 3: Guaranteed by design.
Typical Operating Characteristics
(Typical values are at VIN = VDD = 3.3V, VOUT = 1.8V, RFREQ = 50kΩ, IOUT = 3A, and TA = +25°C, unless otherwise noted.)
EFFICIENCY vs. OUTPUT CURRENT
EFFICIENCY vs. OUTPUT CURRENT
90
MAX8643 toc02
100
MAX8643 toc01
100
95
80
EFFICIENCY (%)
90
EFFICIENCY (%)
MAX8643
3A, 2MHz Step-Down Regulator
with Integrated Switches
VOUT = 2.5V
VOUT = 1.8V
70
VOUT = 1.2V
60
85
VOUT = 1.88V
80
VOUT = 1.5V
75
70
50
65
VIN = VDD = 3.3V
VIN = VDD = 2.5V
60
40
0.1
4
VOUT = 1.2V
1
OUTPUT CURRENT (A)
10
0.1
1
OUTPUT CURRENT (A)
_______________________________________________________________________________________
10
3A, 2MHz Step-Down Regulator
with Integrated Switches
1800
FREQUENCY (kHz)
EFFICIENCY (%)
90
85
VOUT = 1.8V
80
VOUT = 1.5V
75
VOUT = 1.2V
70
-40°C
1500
1350
-40°C
65
60
0.1
1
OUTPUT CURRENT (A)
+85°C
1650
1200
VIN = 2.5V
VDD = 3.3V
+25°C
+25°C
+85°C
-0.04
-0.10
-0.12
900
3.0
3.4
INPUT VOLTAGE (V)
VOUT = 1.8V
-0.08
-0.16
2.6
VOUT = 2.5V
-0.06
-0.14
2.2
VIN = VDD = 3.3V
-0.02
1050
10
MAX8643 toc05
1950
0
OUTPUT VOLTAGE CHARGE (%)
MAX8643 toc03
95
LOAD REGULATION
FREQUENCY vs. INPUT VOLTAGE
MAX8643 toc04
EFFICIENCY vs. OUTPUT CURRENT
100
VOUT = 1.2V
0
3.8
1
2
3
LOAD CURRENT (A)
4
5
SWITCHING WAVEFORMS
LOAD TRANSIENT
MAX8643 toc07
MAX8643 toc06
VIN = VDD = 3.3V
AC-COUPLED
50mV/div
VOUT
AC-COUPLED
20mV/div
VOUT
2A/div
ILX
0A
VLX
IOUT
2V/div
1A/div
0V
0A
100ns/div
40μs/div
SOFT-START WAVEFORMS
SHUTDOWN WAVEFORMS
MAX8643 toc08
VEN
MAX8643 toc09
2V/div
VEN
2V/div
0V
VOUT
1V/div
0V
VOUT
1V/div
RLOAD = 1Ω
400μs/div
0V
0V
RLOAD = 1Ω
10μs/div
_______________________________________________________________________________________
5
MAX8643
Typical Operating Characteristics (continued)
(Typical values are at VIN = VDD = 3.3V, VOUT = 1.8V, RFREQ = 50kΩ, IOUT = 3A, and TA = +25°C, unless otherwise noted.)
Typical Operating Characteristics (continued)
(Typical values are at VIN = VDD = 3.3V, VOUT = 1.8V, RFREQ = 50kΩ, IOUT = 3A, and TA = +25°C, unless otherwise noted.)
6
CURRENT LIMIT (A)
7
6
5
4
3
MAX8643 toc11
8
MAX8643 toc12
7
MAX8643 toc10
VEN = 0V
9
HICCUP CURRENT LIMIT
CURRENT LIMIT vs. OUTPUT VOLTAGE
INPUT CURRENT vs. INPUT VOLTAGE
10
VOUT
0V
5
4
IOUT
5A/div
3
0A
2
2
IIN
1
1
1V/div
1A/div
0A
0
0
2.2
2.4
2.6 2.8 3.0 3.2
INPUT VOLTAGE (V)
3.4
3.6
0.5
1.0
1.5
2.0
OUTPUT VOLTAGE (V)
RMS INPUT CURRENT DURING SHORT CIRCUIT
vs. INPUT VOLTAGE (C4 = 0.022μF)
VOUT = 0V
RMS INPUT CURRENT (A)
0.40
0.35
0.30
0.25
0.20
0.15
0.10
EXPOSED PAD TEMPERATURE
vs. AMBIENT TEMPERATURE
110
90
80
70
60
50
40
30
20
0.05
MEASURED ON A MAX8643EVKIT
10
0
2.0
2.5
3.0
3.5
INPUT VOLTAGE (V)
0
4.0
20
40
60
TEMPERATURE (°C)
80
MAX8643 toc16
MAX8643 toc15
0.63
IIN
1A/div
0.62
0A
0.61
0.5V/div
0V
VREFIN
0.60
0.59
VOUT
1V/div
0V
VPWRGD
2V/div
0V
0.58
0.57
0.56
-40
6
100
SOFT-START WITH REFIN
FEEDBACK VOLTAGE vs. TEMPERATURE
0.64
FEEDBACK VOLTAGE (V)
VOUT = 1.8V
3A LOAD
100
EXPOSED PAD TEMPERATURE (°C)
0.45
MAX8643 toc13
0.50
400μs/div
2.5
MAX8643 toc14
INPUT CURRENT (μA)
MAX8643
3A, 2MHz Step-Down Regulator
with Integrated Switches
-15
10
35
TEMPERATURE (°C)
60
85
200μs/div
_______________________________________________________________________________________
3A, 2MHz Step-Down Regulator
with Integrated Switches
PIN
NAME
1, 7
GND
Analog Circuit Ground
FUNCTION
2
VDD
Supply Voltage and Bypass Input. Connect VDD to IN with a 10Ω resistor. Connect a 1µF ceramic
capacitor from VDD to GND.
3, 4
CTL1,
CTL2
Preset Output Voltage Selection Input. CTL1 and CTL2 set the output voltage to one of nine preset
voltages. See Table 1 for preset voltages.
5
REFIN
External Reference Input. Connect REFIN to SS to use the internal 0.6V reference. Connecting REFIN to an
external reference voltage forces FB to regulate the voltage applied to REFIN. REFIN is internally pulled to
GND when the IC is in shutdown mode.
6
SS
Soft-Start Input. Connect a capacitor from SS to GND to set the startup time. See the Soft-Start and REFIN
section for details on setting the soft-start time.
8
COMP
9
FB
Feedback Input. Connect FB to the center tap of an external resistor-divider from the output to GND to set
the output voltage from 0.6V to 90% of VIN. Connect FB through an RC network to the output when using
CTL1 and CTL2 to select any of nine preset voltages.
10
OUT
Output Voltage Sense. Connect to the output. Leave OUT unconnected when an external resistor-divider
is used.
11
FREQ
Oscillator Frequency Selection. Connect a resistor from FREQ to GND to select the switching frequency.
12
PWRGD
13
BST
Output of the Voltage-Error Amplifier. Connect the necessary compensation network from COMP to FB.
COMP is internally pulled to GND when the IC is in shutdown mode.
Power-Good Output. Open-drain output that is high impedance when VFB ≥ 90% of VREFIN or 0.6V. PWRGD is
internally pulled low when VFB falls below 90% of its regulation point. PWRGD is internally pulled low when the
IC is in shutdown mode, VDD or VIN is below the UVLO threshold, or the IC is in thermal shutdown.
High-Side MOSFET Driver Supply. Bypass BST to LX with a 0.1µF capacitor.
Inductor Connection. All LX pins are internally connected together. Connect all LX pins to the output
inductor. LX is high impedance when the IC is in shutdown mode.
14, 15, 16
LX
17–20
PGND
Power Ground. Connect all PGND pins externally to the power ground plane.
21, 22, 23
IN
Power-Supply Input. Input supply range is from 2.35V to 3.6V. Bypass with 22µF ceramic capacitance to
PGND externally. See the Typical Application Circuit.
24
EN
Enable Input. Logic input to enable/disable the MAX8643.
—
EP
Exposed Paddle. Connect to a large ground plane to optimize thermal performance.
_______________________________________________________________________________________
7
MAX8643
Pin Description
3A, 2MHz Step-Down Regulator
with Integrated Switches
MAX8643
Block Diagram
VDD
MAX8643
UVLO
CIRCUITRY
SHUTDOWN
CONTROL
EN
CURRENT-LIMIT
COMPARATOR
BIAS
GENERATOR
LX
ILIM THRESHOLD
BST
IN
VOLTAGE
REFERENCE
SS
BST CAPACITOR
CHARGING SWITCH
SOFT-START
CONTROL
LOGIC
LX
IN
THERMAL
SHUTDOWN
REFIN
PGND
OUT
ERROR
AMPLIFIER
8kΩ
PWM
COMPARATOR
FB
CTL1
CTL2
VID
VOLTAGECONTROL
CIRCUITRY
FREQ
1VP-P
OSCILLATOR
COMP
SHDN
COMP LOW
DETECTOR
FB
0.9 x VREFIN
8
PWRGD
_______________________________________________________________________________________
GND
3A, 2MHz Step-Down Regulator
with Integrated Switches
INPUT
2.4V TO 3.6V
IN
C6
22μF
C7
0.01μF
VDD
R5
10Ω
BST
C10
0.1μF
L1
0.47μH
MAX8643
OUTPUT
1.8V, 3A
LX
VDD
C5
1μF
OUT
C8
22μF
C3
560pF
CTL2
C9
0.01μF
R3
158Ω
CTL1
PGND
EN
FB
FREQ
C2
1500pF
R2
2.67kΩ
REFIN
R4
50kΩ
C1
33pF
SS
C4
0.022μF
COMP
GND
VDD
R1
20kΩ
PWRGD
Figure 1. 1MHz, All-Ceramic Capacitor Design with VOUT = 1.8V
Detailed Description
The MAX8643 high-efficiency, voltage-mode switching
regulator is capable of delivering up to 3A of output
current. The MAX8643 provides output voltages from
0.6V to (0.9 x VIN) from 2.35V to 3.6V input supplies,
making it ideal for on-board point-of-load applications.
The output voltage accuracy is better than ±1% over
load, line, and temperature.
The MAX8643 features a wide switching frequency
range, allowing the user to achieve all-ceramic capacitor designs and fast transient responses. The high operating frequency minimizes the size of external
components. The MAX8643 is available in a small (4mm
x 4mm), lead-free, 24-pin thin QFN package. The REFIN
function makes the MAX8643 an ideal candidate for
DDR and tracking power supplies. Using internal lowRDS(ON) (37mΩ) n-channel MOSFETs for both high- and
low-side switches maintains high efficiency at both
heavy-load and high-switching frequencies.
The MAX8643 employs voltage-mode control architecture with a high-bandwidth (> 14MHz) error amplifier.
The voltage-mode control architecture allows up to
2MHz switching frequency, reducing board area. The
op-amp voltage-error amplifier works with type 3 com-
pensation to fully utilize the bandwidth of the high-frequency switching to obtain fast transient response.
Adjustable soft-start time provides flexibilities to minimize input startup inrush current. An open-drain,
power-good (PWRGD) output goes high when V FB
reaches 90% of VREFIN or 0.54V.
Controller Function
The controller logic block is the central processor that
determines the duty cycle of the high-side MOSFET
under different line, load, and temperature conditions.
Under normal operation, where the current-limit and
temperature protection are not triggered, the controller
logic block takes the output from the PWM comparator
and generates the driver signals for both high-side and
low-side MOSFETs. The break-before-make logic and
the timing for charging the bootstrap capacitors are
calculated by the controller logic block. The error signal
from the voltage-error amplifier is compared with the
ramp signal generated by the oscillator at the PWM
comparator and, thus, the required PWM signal is produced. The high-side switch is turned on at the beginning of the oscillator cycle and turns off when the ramp
voltage exceeds the VCOMP signal or the current-limit
threshold is exceeded. The low-side switch is then
turned on for the remainder of the oscillator cycle.
_______________________________________________________________________________________
9
MAX8643
Typical Application Circuit
MAX8643
3A, 2MHz Step-Down Regulator
with Integrated Switches
Current Limit
Undervoltage Lockout (UVLO)
The internal, high-side MOSFET has a typical 5.5A
peak current-limit threshold. When current flowing out
of LX exceeds this limit, the high-side MOSFET turns off
and the synchronous rectifier turns on. The synchronous rectifier remains on until the inductor current falls
below the low-side current limit. This lowers the duty
cycle and causes the output voltage to droop until the
current limit is no longer exceeded. The MAX8643 uses
a hiccup mode to prevent overheating during short-circuit output conditions.
During current limit if V FB drops below 420mV and
stays below this level for 12µs or more, the part enters
hiccup mode. The high-side MOSFET and the synchronous rectifier are turned off and both COMP and REFIN
are internally pulled low. If REFIN and SS are connected together, then both are pulled low. The part remains
in this state for 1024 clock cycles and then attempts to
restart for 128 clock cycles. If the fault-causing current
limit has cleared, the part resumes normal operation.
Otherwise, the part reenters hiccup mode again.
The UVLO circuitry inhibits switching when V DD is
below 2V (typ). Once VDD rises above 2V (typ), UVLO
clears and the soft-start function activates. A 100mV
hysteresis is built in for glitch immunity.
BST
The gate-drive voltage for the high-side, n-channel
switch is generated by a flying-capacitor boost circuit.
The capacitor between BST and LX is charged from the
VIN supply while the low-side MOSFET is on. When the
low-side MOSFET is switched off, the voltage of the
capacitor is stacked above LX to provide the necessary
turn-on voltage for the high-side internal MOSFET.
Frequency Select (FREQ)
The switching frequency is resistor programmable from
500kHz to 2MHz. Set the switching frequency of the IC
with a resistor (RFREQ) connected from FREQ to GND.
RFREQ is calculated as:
RFREQ =
Soft-Start and REFIN
The MAX8643 utilizes an adjustable soft-start function
to limit inrush current during startup. An 8µA (typ) current source charges an external capacitor connected to
SS. The soft-start time is adjusted by the value of the
external capacitor from SS to GND. The required
capacitance value is determined as:
C=
8μA × t SS
REFIN
MAX8643
Figure 2. Typical Soft-Start Implementation with External
Reference
10
1
fS
− 0.05μs)
Power-Good Output (PWRGD)
PWRGD is an open-drain output that goes high impedance when VFB is above 0.9 x VREFIN. PWRGD pulls
low when VFB is below 90% of its regulation for at least
48 clock cycles. PWRGD is low during shutdown.
Programming the Output Voltage
(CTL1, CTL2)
R1
C
×(
where fS is the desired switching frequency in Hz.
0.6V
where tSS is the required soft-start time in seconds. The
MAX8643 also features an external reference input
(REFIN). The IC regulates FB to the voltage applied to
REFIN. The internal soft-start is not available when
using an external reference. A method of soft-start
when using an external reference is shown in Figure 2.
Connect REFIN to SS to use the internal 0.6V reference.
R2
50kΩ
0.95μs
As shown in Table 1, the output voltage is pin programmable by the logic states of CTL1 and CTL2. CTL1 and
CTL2 are tri-level inputs: VDD, unconnected, and GND.
Table 1. CTL1 and CTL2 Output Voltage
Selection
CTL1
CTL2
VOUT (V)
GND
GND
0.6
VDD
VDD
0.7
GND
Unconnected
0.8
1.0
GND
VDD
Unconnected
GND
1.2
Unconnected
Unconnected
1.5
Unconnected
VDD
1.8
VDD
GND
2.0
VDD
Unconnected
2.5
______________________________________________________________________________________
3A, 2MHz Step-Down Regulator
with Integrated Switches
Shutdown Mode
Drive EN to GND to shut down the IC and reduce quiescent current to less than 12µA. During shutdown, the LX
is high impedance. Drive EN high to enable the
MAX8643.
Thermal Protection
Thermal-overload protection limits total power dissipation
in the device. When the junction temperature exceeds TJ
= +165°C, a thermal sensor forces the device into shutdown, allowing the die to cool. The thermal sensor turns
the device on again after the junction temperature cools
by 20°C, causing a pulsed output during continuous
overload conditions. The soft-start sequence begins after
recovery from a thermal-shutdown condition.
Applications Information
IN and VDD Decoupling
To decrease the noise effects due to the high switching
frequency and maximize the output accuracy of
the MAX8643, decouple VIN with a 22µF capacitor from
VIN to PGND. Also decouple VDD with a 1µF from VDD
to GND. Place these capacitors as close to the IC
as possible.
Inductor Selection
Choose an inductor with the following equation:
L=
VOUT × (VIN − VOUT )
fS × VIN × LIR × IOUT(MAX)
where LIR is the ratio of the inductor ripple current to full
load current at the minimum duty cycle. Choose LIR
between 20% to 40% for best performance and stability.
Use an inductor with the lowest possible DC resistance
that fits in the allotted dimensions. Powdered iron ferrite
core types are often the best choice for performance.
With any core material, the core must be large enough
not to saturate at the current limit of the MAX8643.
Output-Capacitor Selection
The key selection parameters for the output capacitor are
capacitance, ESR, ESL, and voltage-rating requirements.
These affect the overall stability, output ripple voltage,
and transient response of the DC-DC converter. The out-
put ripple occurs due to variations in the charge stored
in the output capacitor, the voltage drop due to the
capacitor’s ESR, and the voltage drop due to the
capacitor’s ESL. Calculate the output voltage ripple
due to the output capacitance, ESR, and ESL:
VRIPPLE = VRIPPLE(C) +
VRIPPLE(ESR) + VRIPPLE(ESL)
where the output ripple due to output capacitance,
ESR, and ESL is:
IP−P
VRIPPLE(C) =
8 x COUT x fS
VRIPPLE(ESR) = IP−P x ESR
I
VRIPPLE(ESL) = P−P x ESL
t ON
I
VRIPPLE(ESL) = P−P x ESL
t OFF
or whichever is larger.
The peak inductor current (IP-P) is:
V − VOUT
V
IP−P = IN
x OUT
fS × L
VIN
Use these equations for initial capacitor selection.
Determine final values by testing a prototype or an
evaluation circuit. A smaller ripple current results in less
output voltage ripple. Since the inductor ripple current
is a factor of the inductor value, the output voltage ripple decreases with larger inductance. Use ceramic
capacitors for low ESR and low ESL at the switching
frequency of the converter. The ripple voltage due to
ESL is negligible when using ceramic capacitors.
Load-transient response depends on the selected output capacitance. During a load transient, the output
instantly changes by ESR x ΔILOAD. Before the controller can respond, the output deviates further,
depending on the inductor and output capacitor values. After a short time, the controller responds by regulating the output voltage back to its predetermined
value. The controller response time depends on the
closed-loop bandwidth. A higher bandwidth yields a
faster response time, preventing the output from deviating further from its regulating value. See the Compensation Design section for more details.
______________________________________________________________________________________
11
MAX8643
The logic states of CTL1 and CTL2 should be programmed only before power-up. Once the part is
enabled, CTL1 and CTL2 should not be changed. If the
output voltage needs to be reprogrammed, cycle
power or EN and reprogram before enabling.
MAX8643
3A, 2MHz Step-Down Regulator
with Integrated Switches
Input-Capacitor Selection
The input capacitor reduces the current peaks drawn
from the input power supply and reduces switching
noise in the IC. The total input capacitance must be
equal to or greater than the value given by the following
equation to keep the input ripple voltage within specs
and minimize the high-frequency ripple current being
fed back to the input source:
CIN _ MIN =
D x t S x IOUT
VIN − RIPPLE
where VIN-RIPPLE is the maximum allowed input ripple
voltage across the input capacitors and is recommended to be less than 2% of the minimum input voltage. D
is the duty cycle (VOUT / VIN), and tS is the switching
period (1/fS).
The impedance of the input capacitor at the switching
frequency should be less than that of the input source so
high-frequency switching currents do not pass through
the input source but are instead shunted through the
input capacitor. High source impedance requires high
input capacitance. The input capacitor must meet the
ripple current requirement imposed by the switching currents. The RMS input ripple current is given by:
IRIPPLE = ILOAD ×
parallel, the value of the ESR in the above equation is
equal to that of the ESR of a single output capacitor
divided by the total number of output capacitors.
The high switching frequency range of the MAX8643
allows the use of ceramic output capacitors. Since the
ESR of ceramic capacitors is typically very low, the frequency of the associated transfer function zero is higher
than the unity-gain crossover frequency, fC, and the zero
cannot be used to compensate for the double pole created by the output filtering inductor and capacitor. The double pole produces a gain drop of 40dB/decade and a
phase shift of 180°/decade. The error amplifier must compensate for this gain drop and phase shift to achieve a
stable high-bandwidth closed-loop system. Therefore,
use type III compensation as shown in Figure 3 and
Figure 4. Type III compensation possesses three poles
and two zeros with the first pole, fP1_EA, located at zero
frequency (DC). Locations of other poles and zeros of the
type III compensation are given by:
fZ1_ EA =
L
COUT
VOUT × (VIN − VOUT )
VIN
MAX8643
FB
CTL1
C1
R1
CTL2
COMP
R4
C2
a) EXTERNAL RESISTOR-DIVIDER
L
VOUT
LX
COUT
MAX8643
R2
OUT
R3
8kΩ
1
2π x ESR x CO
___________________________________________________
R2
C3
The power transfer function consists of one double pole
and one zero. The double pole is introduced by the output filtering inductor, L, and the output filtering capacitor,
CO. The ESR of the output filtering capacitor determines
the zero. The double pole and zero frequencies are
given as follows:
1
fP1_ LC = fP2 _ LC =
⎛ R + ESR ⎞
2π x L x C O x ⎜ O
⎟
⎝ RO + RL ⎠
12
R3
OUT
Compensation Design
where RL is equal to the sum of the output inductor’s
DCR and the internal switch resistance, RDSON. A typical
value for RDSON is 37mΩ. RO is the output load resistance, which is equal to the rated output voltage divided
by the rated output current. ESR is the total equivalent
series resistance of the output filtering capacitor. If there
is more than one output capacitor of the same type in
VOUT
LX
where IRIPPLE is the input RMS ripple current.
fZ _ ESR =
1
2π x R1 x C1
C3
FB
VOLTAGE
SELECT
CTL1
CTL2
R1
C1
COMP
C2
b) INTERNAL PRESET VOLTAGE
Figure 3. Type III Compensation Network
3A, 2MHz Step-Down Regulator
with Integrated Switches
OPEN-LOOP
GAIN
THIRD
POLE
DOUBLE POLE
C1 =
GAIN (dB)
SECOND
POLE
POWER-STAGE
TRANSFER
FUNCTION
FIRST AND SECOND ZEROS
Figure 4. Type III Compensation Illustration
1
2π x R1 x C1
R1 =
fP3 _ EA =
1
2π x R1 x C2
C3 =
The above equations are based on the assumptions
that C1>>C2, and R3>>R2, which are true in most
applications. Placements of these poles and zeros are
determined by the frequencies of the double pole and
ESR zero of the power transfer function. It is also a
function of the desired closed-loop bandwidth. The following section outlines the step-by-step design procedure to calculate the required compensation
components for the MAX8643. When the output voltage
of the MAX8643 is programmed to a preset voltage, R3
is internal to the IC and R4 does not exist (Figure 3b).
When externally programming the MAX8643 (Figure
3a), the output voltage is determined by:
R4 =
0.6 × R3
(VOUT − 0.6)
R
2 x π x R3 x (1+ L ) × fC
RO
Due to the underdamped nature of the output LC double pole, set the two zero frequencies of the type III
compensation less than the LC double-pole frequency
to provide adequate phase boost. Set the two zero frequencies to 80% of the LC double-pole frequency.
Hence:
fZ1_ EA =
1
fP2 _ EA =
2π x R2 x C 3
2.5 VIN
1
x
L x CO x (RO + ESR)
x
L x CO x (RO + ESR)
0.8 x C1
1
RL + RO
RL + RO
Setting the second compensation pole, f P2_EA , at
fZ_ESR yields:
0.8 x R 3
R2 =
CO x ESR
C3
Set the third compensation pole at 1/2 of the switching
frequency to gain some phase margin. Calculate C2 as
follows:
1
C2 =
π x R1 x fS × 2
The above equations provide accurate compensation
when the zero-cross frequency is significantly higher
than the double-pole frequency. When the zero-cross
frequency is near the double-pole frequency, the actual
zero-cross frequency is higher than the calculated frequency. In this case, lowering the value of R1 reduces
the zero-cross frequency. Also, set the third pole of the
type III compensation close to the switching frequency
if the zero-cross frequency is above 200kHz to boost
the phase margin. The recommended range for R3 is
2kΩ to 10kΩ. Note that the loop compensation remains
unchanged if only R4’s resistance is altered to set different outputs.
______________________________________________________________________________________
13
MAX8643
COMPENSATION
TRANSFER
FUNCTION
The zero-cross frequency of the closed-loop, fC, should
be between 10% and 20% of the switching frequency,
fS. A higher zero-cross frequency results in faster transient response. Once fC is chosen, C1 is calculated
from the following equation:
Pin Configuration
PCB Layout Considerations and
Thermal Performance
14
PGND
LX
LX
LX
BST
18
17
16
15
14
13
PGND 19
12 PWRGD
PGND 20
11 FREQ
IN 21
10 OUT
MAX8643
IN 22
IN 23
3
4
5
6
SS
2
REFIN
1
CTL2
+
CTL1
EN 24
VDD
3) Keep the high-current paths as short and wide as
possible. Keep the path of switching current short
and minimize the loop area formed by LX, the output capacitors, and the input capacitors.
4) Connect IN, LX, and PGND separately to a large
copper area to help cool the IC to further improve
efficiency and long-term reliability.
5) Ensure all feedback connections are short and
direct. Place the feedback resistors and compensation components as close to the IC as possible.
6) Route high-speed switching nodes, such as LX,
away from sensitive analog areas (FB, COMP).
TOP VIEW
PGND
Careful PCB layout is critical to achieve clean and stable
operation. It is highly recommended to duplicate the
MAX8643 EV kit layout for optimum performance. If deviation is necessary, follow these guidelines for good PCB
layout:
1) Connect input and output capacitors to the power
ground plane; connect all other capacitors to the signal ground plane.
2) Place capacitors on VDD, VIN, and SS as close as
possible to the IC and its corresponding pin using
direct traces. Keep power ground plane (connected
to PGND) and signal ground plane (connected to
GND) separate.
GND
MAX8643
3A, 2MHz Step-Down Regulator
with Integrated Switches
9
FB
8
COMP
7
GND
THIN QFN
Chip Information
PROCESS: BiCMOS
______________________________________________________________________________________
3A, 2MHz Step-Down Regulator
with Integrated Switches
24L QFN THIN.EPS
PACKAGE OUTLINE,
12, 16, 20, 24, 28L THIN QFN, 4x4x0.8mm
21-0139
E
1
2
______________________________________________________________________________________
15
MAX8643
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
MAX8643
3A, 2MHz Step-Down Regulator
with Integrated Switches
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
PACKAGE OUTLINE,
12, 16, 20, 24, 28L THIN QFN, 4x4x0.8mm
21-0139
E
2
2
Revision History
Pages changed at Rev 2: 1, 4, 5, 6, 13–16
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
16 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2007 Maxim Integrated Products
is a registered trademark of Maxim Integrated Products. Inc.