OSRAM LATBT686

Hyper Multi TOPLED
Hyper-Bright LED
LATB T686
Vorläufige Daten / Preliminary Data
Besondere Merkmale
Features
• Gehäusetyp: weißes P-LCC-4 Gehäuse;
Kontrasterhöhung durch schwarze Oberfläche
(RGB-Displays)
• Besonderheit des Bauteils: additive
Farbmischung durch unabhängige
Ansteuerung aller Chips
• Wellenlänge: 615 nm (amber),
528 nm (true green), 467 nm (blau)
• Abstrahlwinkel: Lambertscher Strahler (120°)
• Technologie: InGaAlP (amber),
InGaN (true green), GaN (blau)
• optischer Wirkungsgrad: 11 lm/W (amber),
8 lm/W (true green),1 lm/W (blau)
• Gruppierungsparameter: Lichtstärke
• Verarbeitungsmethode: für alle
SMT-Bestücktechniken geeignet
• Lötmethode: IR Reflow Löten und
Wellenlöten (TTW)
• Vorbehandlung: nach JEDEC Level 2
• Gurtung: 8 mm Gurt mit 2000/Rolle, ø180 mm
oder 8000/Rolle, ø330 mm
• package: white P-LCC-4 package;
higher contrast by a black surface
(RGB-Displays)
• feature of the device: additive mixture of color
stimuli by independent driving of each chip
• wavelength: 615 nm (amber),
528 nm (true green), 467 nm (blue)
• viewing angle: Lambertian Emitter (120°)
• technology: InGaAlP (amber),
InGaN (true green), GaN (blue)
• optical efficiency: 11 lm/W (amber),
8 lm/W (true green),1 lm/W (blue)
• grouping parameter: luminous intensity
• assembly methods: suitable for all
SMT assembly methods
• soldering methods: IR reflow soldering and
TTW soldering
• preconditioning: acc. to JEDEC Level 2
• taping: 8 mm tape with 2000/reel, ø180 mm
or 8000/reel, ø330 mm
Anwendungen
Applications
• Anzeigen im Innen- und Außenbereich
(z.B. Grafikdisplays)
• Leuchtdiodenchips getrennt ansteuerbar
• Vollfarbdisplays bzw. RGB-Displays
• Hinterleuchtung (LCD, Schalter, Tasten,
Displays, Werbebeleuchtung,
Allgemeinbeleuchtung)
• Einkopplung in Lichtleiter
• indoor and outdoor displays (e.g. graphic
displays)
• LED chips can be controlled separately
• full color displays, RGB-Displays
• backlighting (LCD, switches, keys, displays,
illuminated advertising, general lighting)
• coupling into light guides
2001-06-22
1
LATB T686
Typ
Emissions
-farbe
Type
Color of
Emission
LATB T686
Q+R+K
Q+R+L
Q+S+K
Q+S+L
R+R+K
R+R+L
R+S+K
R+S+L
amber
true green
blue
Farbe der
Lichtaustrittsfläche
Color of the
Light Emitting
Area
colorless clear
and
black painted
package
surface
Lichtstärke
Bestellnummer
Luminous Intensity
IF = 20 mA
IV (mcd)
Ordering
Code
amber
true green
blue
71 ... 180
71 ... 112
71 ... 112
71 ... 112
71 ... 112
112 ... 180
112 ... 180
112 ... 180
112 ... 180
112 ... 280
112 ... 180
112 ... 180
180 ... 280
180 ... 280
112 ... 180
112 ... 180
180 ... 280
180 ... 280
7.1 ... 18.0 Q62703-Q5779
7.1 ... 11.2
11.2 ... 18.0
7.1 ... 11.2
11.2 ... 18.0
7.1 ... 11.2
11.2 ... 18.0
7.1 ... 11.2
11.2 ... 18.0
Helligkeitswerte werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von ±11 % ermittelt.
Luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of ±11 %.
Anm.: Die Standardlieferform von Serientypen beinhaltet eine Familiengruppe. Einzelne Gruppen sind
nicht erhältlich.
In einer Verpackungseinheit / Gurt ist immer nur eine Gruppe pro Farbe enthalten.
Note: The standard shipping format for serial types includes a family group. Individual groups are not
available.
No packing unit / tape ever contains more than one luminous intensity group per color.
2001-06-22
2
LATB T686
Grenzwerte
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Werte
Values
LA
LT
Einheit
Unit
LB
Betriebstemperatur
Operating temperature range
Top
– 40 … + 100
°C
Lagertemperatur
Storage temperature range
Tstg
– 40 … + 100
°C
Sperrschichttemperatur
Junction temperature
Tj
+ 125
+ 125
+ 100
°C
Durchlassstrom
Forward current
IF
30
20
20
mA
Stoßstrom
Surge current
tp = 10 µs, D = 0.005
IFM
1.00
0.25
0.20
A
Sperrspannung
Reverse voltage
VR
3
5
5
V
Leistungsaufnahme
Power consumption
Ptot
80
85
90
mW
Rth JA
Rth JA
Rth JS
Rth JS
580
825
340
490
480
770
260
420
580
825
340
490
K/W
K/W
K/W
K/W
Wärmewiderstand
Thermal resistance
Sperrschicht/Umgebung
1 chip on
Junction/ambient
3 chips on
Sperrschicht/Lötpad
1 chip on
Junction/solder point
3 chips on
Montage auf PC-Board FR 4 (Padgröße ≥ 16 mm 2)
mounted on PC board FR 4 (pad size ≥ 16 mm 2)
2001-06-22
3
LATB T686
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Werte
Values
Einheit
Unit
LA
LT
LB
Wellenlänge des emittierten Lichtes
Wavelength at peak emission
IF = 20 mA
(typ.)
λpeak
622
523
428
nm
Dominantwellenlänge 1)
Dominant wavelength 1)
IF = 20 mA
(typ.)
λdom
617
±5
528
±9
467
±5
nm
Spektrale Bandbreite bei 50 % Irel max
Spectral bandwidth at 50 % Irel max
IF = 20 mA
(typ.)
∆λ
16
33
60
nm
Abstrahlwinkel bei 50 % IV (Vollwinkel)
Viewing angle at 50 % IV
(typ.)
2ϕ
120
120
120
Grad
deg.
Durchlassspannung 2)
Forward voltage 2)
IF = 20 mA
(typ.)
(max.)
VF
VF
2.0
2.4
3.3
4.1
3.8
4.1
V
V
Sperrstrom
Reverse current
VR = 5 V
(typ.)
(max.)
IR
IR
0.01
10
0.01
10
0.01
10
µA
µA
Temperaturkoeffizient von λpeak
Temperature coefficient of λpeak
IF = 20 mA; –10°C ≤ T ≤ 100°C
(typ.)
TCλpeak
0.13
0.04
0.004
nm/K
Temperaturkoeffizient von λdom
Temperature coefficient of λdom
IF = 20 mA; –10°C ≤ T ≤ 100°C
(typ.)
TCλdom
0.06
0.03
0.03
nm/K
Temperaturkoeffizient von VF
Temperature coefficient of VF
IF = 20 mA; –10°C ≤ T ≤ 100°C
(typ.)
TCV
– 1.8
– 3.6
– 3.1
mV/K
Optischer Wirkungsgrad
Optical efficiency
IF = 20 mA
(typ.)
ηopt
11
8
1
lm/W
1)
Wellenlängen werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von ±1 nm ermittelt.
Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of ±1 nm.
2)
Durchlassspannungen werden mit einer Stromeinprägedauer von 1 ms und einer Genauigkeit von ±0,1 V ermittelt.
Forward voltages are tested at a current pulse duration of 1 ms and a tolerance of ±0.1 V.
2001-06-22
4
LATB T686
Relative spektrale Emission Irel = f (λ), TA = 25 °C, IF = 20 mA
Relative Spectral Emission
V(λ) = spektrale Augenempfindlichkeit
Standard eye response curve
OHL01061
100
Irel
%
blue
Vλ
true green
80
amber
60
40
20
0
350
400
450
500
550
600
650 nm
700
λ
Abstrahlcharakteristik Irel = f (ϕ)
Radiation Characteristic
40˚
30˚
20˚
10˚
0˚
ϕ
50˚
OHL01660
1.0
0.8
0.6
60˚
0.4
70˚
0.2
80˚
0
90˚
100˚
1.0
2001-06-22
0.8
0.6
0.4
0˚
20˚
5
40˚
60˚
80˚
100˚
120˚
LATB T686
Durchlassstrom IF = f (VF)
Forward Current
TA = 25 °C
Relative Lichtstärke IV/IV(20 mA) = f (IF)
Relative Luminous Intensity
TA = 25 °C
OHL00660
10 2
OHL00549
10 1
I F mA
IV
IV (20 mA)
amber
true green
blue
amber
10 1
10 0
5
5
10 0
10 -1
5
5
10 -1
1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8
10 -2
V 3.2
10 -1
5 10 0
5 10 1
VF
mA 10 2
I
Durchlassstrom IF = f (VF)
Forward Current
TA = 25 °C
Relative Lichtstärke IV/IV(25 °C) = f (TA)
Relative Luminous Intensity
IF = 20 mA
OHL00661
10 2
OHL00552
1.2
I F mA
IV
IV (25 ˚C)
true green
10 1
true green
blue
0.8
blue
amber
5
0.6
10 0
0.4
5
0.2
10 -1
2
2.5
3
3.5
4
4.5
0
5 V 5.5
VF
2001-06-22
0
20
40
60
80 ˚C 100
TA
6
LATB T686
Maximal zulässiger Durchlassstrom IF = f (T)
Max. Permissible Forward Current
1 chip on
IF
Maximal zulässiger Durchlassstrom IF = f (T)
Max. Permissible Forward Current
3 chips on
OHL00868
35
mA
amber
30
OHL00548
35
I F mA
30
amber
25
25
true
green
true
green
20
20
15
15
blue
blue
10
10
5
5
ΤS temp. solder point
ΤS temp. solder point
0
0
0 10 20 30 40 50 60 70 80 ˚C 100
T
Maximal zulässiger Durchlassstrom IF = f (T)
Max. Permissible Forward Current
3 chips on
T
Maximal zulässiger Durchlassstrom IF = f (T)
Max. Permissible Forward Current
1 chip on
IF
OHL01255
35
mA
IF
amber
30
0 10 20 30 40 50 60 70 80 ˚C 100
30
25
25
20
20
amber
15
15
blue
true
green
10
10
5
5
0
0 10 20 30 40 50 60 70 80 ˚C 100
true
green
0 10 20 30 40 50 60 70 80 ˚C 100
T
T
2001-06-22
blue
ΤA temp. ambient
ΤA temp. ambient
0
OHL01257
35
mA
7
LATB T686
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 25 °C
amber (1 Chip on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 85 °C
amber (1Chip on)
OHL00128
100
OHL00124
100
IF
IF
D=
A
0.005
0.01
0.02
0.05
0.1
0.2
0.5
t
A
tP
IF
D = TP
T
D=
10-1
0.005
0.01
0.02
0.05
0.1
0.2
0.5
10-1
tP
D= T
tP
IF
T
10-2 -5
10 10-4 10 -3 10 -2 10-1 10 0 10 1 s 102
10-2 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
tp
tp
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 25 °C
amber (3 Chips on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 85 °C
amber (3 Chips on)
OHL00130
100
IF
IF
A
0.005
0.01
0.02
0.05
0.1
0.2
0.5
tP
D= T
D= T
tP
IF
T
D=
10-1
0.005
0.01
0.02
0.05
0.1
0.2
0.5
tP
IF
T
10-2 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
10-2 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
tp
tp
2001-06-22
tP
A
D=
10-1
OHL00126
100
8
LATB T686
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 25 °C
true green (1 Chip on)
0.35
A
IF
0.30
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 85 °C
true green (1 Chip on)
OHL00127
tP
tP
IF
IF
D= T
0.12
A
0.10
T
OHL00123
tP
tP
IF
D= T
T
0.09
0.25
D=
0.08
D=
0.20
0.005
0.01
0.02
0.05
0.1
0.2
0.5
0.15
0.10
0.005
0.01
0.02
0.05
0.1
0.2
0.5
0.07
0.06
0.05
0.04
0.03
0.02
0.05
0.01
0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
tp
Zulässige Impulsbelastbarkeit IF = f (tp)
tp
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 25 °C
true green (3 Chips on)
OHL00129
0.22
IF
A
0.18
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 85 °C
true green (3 Chips on)
tP
D= T
0.08
IF A
0.07
tP
IF
T
0.12
0.10
0.08
tP
D= T
tP
IF
T
0.06
0.16
0.14
OHL00125
D=
0.005
0.01
0.02
0.05
0.1
0.2
0.5
0.05
0.04
0.03
0.06
D=
0.005
0.01
0.02
0.05
0.1
0.2
0.5
0.02
0.04
0.01
0.02
0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
0 -5
10 10-4 10-3 10-2 10-1 10 0 101 s 10 2
tp
tp
2001-06-22
9
LATB T686
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 25 °C
blue (1 Chip on)
OHL01433
0.25
IF
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 85 °C
blue (1 Chip on)
t
IF
IF
D = TP
A
OHL01434
0.25
tP
A
T
0.20
tP
t
IF
D = TP
T
0.20
D=
0.005
0.01
0.02
0.05
0.1
0.2
0.5
0.15
0.10
0.15
D=
0.005
0.01
0.02
0.05
0.1
0.2
0.5
0.10
0.05
0.05
0 -5
10 10 -4 10 -3 10 -2 10 -1 10 0 10 1 s 10 2
0 -5
10 10 -4 10 -3 10-2 10 -1 10 0 101 s 10 2
tp
tp
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 25 °C
blue (3 Chips on)
OHL00117
0.25
IF
A
0.20
0.15
0.10
0.05
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 85 °C
blue (3 Chips on)
t
D = TP
0.040
A
tP
IF
IF
t
D = TP
T
0.025
D=
0.005
0.01
0.02
0.05
0.1
0.2
0.5
OHL00118
0.020
0.015
tP
IF
T
D=
0.005
0.01
0.02
0.05
0.1
0.2
0.5
0.010
0.005
0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
tp
2001-06-22
tp
10
LATB T686
OHA02290
0.9
520
530
0.8
540
550
0.7
560
0.6
570
a)
0.5
580
590
600
610
620
630
0.4
+
0.3
0.2
0.1
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
Die Farbkoordinaten des Mischlichtes können innerhalb des mit a) gekennzeichneten Bereichs des Farbdreiecks
erwartet werden.
Der Unbuntpunkt (x = 0,33, y = 0,33) ist mit „+“ gekennzeichnet.
The color coordinates of the mixed light can be expected within the area of the color triangle marked a).
The achromatic point (x = 0.33, y = 0.33) is marked „+“.
2001-06-22
11
LATB T686
Maßzeichnung
Package Outlines
3.0 (0.118)
2.6 (0.102)
2.3 (0.091)
2.1 (0.083)
1.7 (0.067)
2.1 (0.083)
0.8 (0.031)
0.9 (0.035)
0.6 (0.024)
0.7 (0.028)
1.1 (0.043)
1
4
Package marking
0.1 (0.004) typ
0.5 (0.020)
3.7 (0.146)
3.3 (0.130)
3.4 (0.134)
3.0 (0.118)
4˚±1
3
(2.4 (0.094))
2
0.18 (0.007)
0.6 (0.024)
0.4 (0.016)
GPLY6900
1
Cathode
Amber (A)
2
Anode
A, T, B
3
Cathode
Blue (B)
4
Cathode
True Green (T)
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Gewicht / Approx. weight: 34 mg
2001-06-22
12
LATB T686
Lötbedingungen
Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
IR-Reflow Lötprofil
(nach IPC 9501)
IR Reflow Soldering Profile (acc. to IPC 9501)
OHLY0597
300
˚C
T
250
240-245 ˚C
10-40 s
200
183 ˚C
120 to 180 s
Ramp-down rate up to 6 K/s
150
Defined for Preconditioning: up to 6 K/s
100
Ramp-up rate up to 6 K/s
50
Defined for Preconditioning: 2-3 K/s
0
0
50
100
150
200
t
2001-06-22
13
s
250
LATB T686
Wellenlöten (TTW)
TTW Soldering
(nach CECC 00802)
(acc. to CECC 00802)
OHLY0598
300
C
T
10 s
250
Normalkurve
standard curve
235 C ... 260 C
Grenzkurven
limit curves
2. Welle
2. wave
200
1. Welle
1. wave
150
ca 200 K/s
2 K/s
5 K/s
100 C ... 130 C
100
2 K/s
50
Zwangskühlung
forced cooling
0
0
50
100
150
200
t
2001-06-22
14
s
250
LATB T686
Empfohlenes Lötpaddesign
Recommended Solder Pad
IR Reflow Löten
IR Reflow Soldering
3.3 (0.130)
3.3 (0.130)
0.4 (0.016)
2.6 (0.102)
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
Kathoden Markierung /
Cathode marking
7.5 (0.295)
0.5 (0.020)
1.5 (0.059)
4.5 (0.177)
1.1 (0.043)
Cu Fläche / <_ 12 mm 2 per pad
Cu-area
Lötstoplack
Solder resist
OHLPY439
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
2001-06-22
15
LATB T686
Wellenlöten (TTW)
TTW Soldering
3.5 (0.138)
Bewegungsrichtung
der Platine
PCB-direction
3.5 (0.138)
1 (0.039)
8 (0.315)
2 (0.079)
2 (0.079)
3 (0.118)
6 (0.236)
2.8 (0.110)
2 (0.079)
6.1 (0.240)
1.5 (0.059)
Empfohlenes Lötpaddesign
Recommended Solder Pad
2.8 (0.110)
0.5 (0.020)
7.5 (0.295)
Padgeometrie für
verbesserte Wärmeableitung
Cu Fläche / > 12 mm 2 per pad
Cu-area
Paddesign for
improved heat dissipation
Lötstoplack
Solder resist
OHAY0583
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Gurtung / Polarität und Lage
Verpackungseinheit 2000/Rolle, ø180 mm
oder 8000/Rolle, ø330 mm
Method of Taping / Polarity and Orientation Packing unit 2000/reel, ø180 mm
or 8000/reel, ø330 mm
4 (0.157)
C
C
C
A
8 (0.315)
1.75 (0.069)
2 (0.079)
3.5 (0.138)
2.9 (0.114)
4 (0.157)
3.6 (0.142)
1.5 (0.059)
OHAY0095
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
2001-06-22
16
LATB T686
Revision History: 2001-06-22
Previous Version:
Page
2001-05-21
Subjects (major changes since last revision)
Published by OSRAM Opto Semiconductors GmbH & Co. OHG
Wernerwerkstrasse 2, D-93049 Regensburg
© All Rights Reserved.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1
A critical component is a component used in a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or
system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2001-06-22
17