MURD330 SWITCHMODE Power Rectifier DPAK Surface Mount Package These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. Features • • • • http://onsemi.com ULTRAFAST RECTIFIER 3 A, 300 V Low Forward Voltage Drop Low Leakage Ultra−Fast Recovery Time Pb−Free Package is Available 1 Mechanical Characteristics • Case: Epoxy, Molded • Weight: 0.4 Gram (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal 4 3 Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds 1 2 MAXIMUM RATINGS Rating Rated Reverse Voltage Symbol Value Unit VR 300 V Average Rectified Forward Current IF 3 A Non−Repetitive Peak Surge Current IFSM 75 A TJ, Tstg −55 to +175 °C Operating Junction and Storage Temperature Range Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. MARKING DIAGRAM 4 1 3 AYWW U330 DPAK CASE 369C U330 A Y WW = Specific Device Code = Assembly Location = Year = Work Week ORDERING INFORMATION Device MURD330T4 MURD330T4G Package Shipping † DPAK 2500/Tape & Reel DPAK (Pb−Free) 2500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2004 December, 2004 − Rev. 1 1 Publication Order Number: MURD330/D MURD330 THERMAL CHARACTERISTICS Symbol Value Unit Thermal Resistance − Junction−to−Case Rating RqJC 2 °C/W Thermal Resistance − Junction−to−Ambient (Note 1) RqJA 49 °C/W Symbol Value Unit ELECTRICAL CHARACTERISTICS Rating Maximum Instantaneous Forward Voltage Drop (IF = 3 A, TJ = 25°C) (iF = 3 A, TJ = 150°C) VF Maximum Instantaneous Reverse Current (TJ = 25°C, 300 V) (TJ = 150°C, 300 V) IR Maximum Reverse Recovery Time (IF = 1 Amp, di/dt = 50 A/ms, VR = 30 V, TJ = 25°C) trr ESD Ratings: V 1.15 0.92 mA 5 500 ns 50 Machine Model = C Human Body Model = 3B > 400 > 8000 V 1. Rating applies when surface mounted on a 700 mm2, 1 oz Cu heat spreader. 100.0 10.0 1.0 175°C 0.1 0.4 0.5 0.6 150°C 0.7 0.8 0.9 25°C 1.0 1.1 1.2 1.3 VF, INSTANTANEOUS VOLTAGE (V) 1.4 IF, INSTANTANEOUS FORWARD CURRENT (A) IF, INSTANTANEOUS FORWARD CURRENT (A) TYPICAL CHARACTERISTICS 100.0 10.0 175°C 1.0 0.1 0.4 0.5 Figure 1. Typical Forward Voltage 0.6 0.7 150°C 0.8 0.9 1.0 25°C 1.1 1.2 1.3 VF, INSTANTANEOUS VOLTAGE (V) Figure 2. Maximum Forward Voltage http://onsemi.com 2 1.4 MURD330 1.0E−02 1.0E−02 1.0E−03 1.0E−03 1.0E−04 IR, REVERSE CURRENT (A) IR, REVERSE CURRENT (A) TYPICAL CHARACTERISTICS 175°C 1.0E−05 150°C 1.0E−06 1.0E−07 25°C 1.0E−08 1.0E−09 1.0E−10 0.0 50 100 150 200 250 300 175°C 150°C 1.0E−04 1.0E−05 1.0E−06 25°C 1.0E−07 1.0E−08 1.0E−09 1.0E−10 0.0 50 100 VR, REVERSE VOLTAGE (V) C, CAPACITANCE (pF) 100 10 0 20 40 60 80 100 120 140 160 180 200 3.0 SQUARE WAVE 2.5 1.5 1.0 0.5 0 0 0.5 IF, AVERAGE FORWARD CURRENT (A) IF, AVERAGE FORWARD CURRENT (A) 5.0 DC 2.0 1.0 0 100 110 120 130 140 150 160 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 6. Power Dissipation RqJC = 2°C/W 3.0 DC 2.0 Io, AVERAGE FORWARD CURRENT 6.0 SQUARE WAVE 300 3.5 Figure 5. Typical Capacitance TJ = 175°C/W 250 4.0 VR, REVERSE VOLTAGE (VOLTS) 4.0 200 Figure 4. Maximum Reverse Voltage Po, AVERAGE POWER DISSIPATION (W) Figure 3. Typical Reverse Voltage 1.0 150 VR, REVERSE VOLTAGE (V) 170 180 6.0 RqJC = 2°C/W 5.0 TJ = 175°C/W 4.0 DC 3.0 SQUARE WAVE 2.0 1.0 0 0 TC, CASE TEMPERATURE (°C) 20 40 60 80 100 120 140 160 180 200 TA, AMBIENT TEMPERATURE (°C) Figure 7. Current Derating, Case Figure 8. Current Derating, Ambient http://onsemi.com 3 MURD330 PACKAGE DIMENSIONS DPAK CASE 369C−01 ISSUE O −T− C B V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. SEATING PLANE E R 4 Z A S 1 2 DIM A B C D E F G H J K L R S U V Z 3 U K F J L H D G 2 PL 0.13 (0.005) M T INCHES MIN MAX 0.235 0.245 0.250 0.265 0.086 0.094 0.027 0.035 0.018 0.023 0.037 0.045 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.180 0.215 0.025 0.040 0.020 −−− 0.035 0.050 0.155 −−− MILLIMETERS MIN MAX 5.97 6.22 6.35 6.73 2.19 2.38 0.69 0.88 0.46 0.58 0.94 1.14 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.57 5.45 0.63 1.01 0.51 −−− 0.89 1.27 3.93 −−− SOLDERING FOOTPRINT* 6.20 0.244 3.0 0.118 2.58 0.101 5.80 0.228 1.6 0.063 6.172 0.243 SCALE 3:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SWITCHMODE is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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