MAXIM 32TSOP

10/29/2004
PACKAGE RELIABILITY REPORT
FOR
32 TSOP 8mm
Dallas Semiconductor
4401 South Beltwood Parkway
Dallas, TX 75244-3292
Prepared by:
Ken Wendel
Reliability Engineering Manager
Dallas Semiconductor
4401 South Beltwood Pkwy.
Dallas, TX 75244-3292
Email : ken.wendel@dalsemi.com
ph: 972-371-3726
fax: 972-371-6016
mbl: 214-435-6610
Conclusion:
The following qualification successfully meets the quality and reliability standards required of all Dallas
Semiconductor packages:
32 TSOP 8mm
In addition, Dallas Semiconductor's continuous reliability monitor program ensures that all outgoing
assemblies will continue to meet Maxim's quality and reliability standards. The current status of the
reliability monitor program can be viewed at http://www.maxim-ic.com/TechSupport /dsreliability.html.
Package Description:
A description of this assembly can be found in the product data sheet. You can find the product data
sheet at http://dbserv.maxim-ic.com/l_datasheet3.cfm.
Reliability Derating:
The Arrhenius model will be used to determine the acceleration factor for failure mechanisms that
are temperature accelerated.
AfT = exp((Ea/k)*(1/Tu - 1/Ts)) = tu/ts
AfT = Acceleration factor due to Temperature
tu = Time at use temperature (e.g. 55°C)
ts = Time at stress temperature (e.g. 125°C)
k = Boltzmann’s Constant (8.617 x 10-5 eV/°K)
Tu = Temperature at Use (°K)
Ts = Temperature at Stress (°K)
Ea = Activation Energy (e.g. 0.7 ev)
The activation energy of the failure mechanism is derived from either internal studies or industry
accepted standards, or activation energy of 0.7ev will be used whenever actual failure mechanisms
or their activation energies are unknown. All deratings will be done from the stress ambient
temperature to the use ambient temperature.
An exponential model will be used to determine the acceleration factor for failure mechanisms,
which are voltage accelerated.
AfV = exp(B*(Vs - Vu))
AfV = Acceleration factor due to Voltage
Vs = Stress Voltage (e.g. 7.0 volts)
Vu = Maximum Operating Voltage (e.g. 5.5 volts)
B = Constant related to failure mechanism type (e.g. 1.0, 2.4, 2.7, etc.)
The Constant, B, related to the failure mechanism is derived from either internal studies or industry
accepted standards, or a B of 1.0 will be used whenever actual failure mechanisms or their B are
unknown. All deratings will be done from the stress voltage to the maximum operating voltage.
Failure rate data from the operating life test is reported using a Chi-Squared statistical model at the
60% or 90% confidence level (Cf).
The failure rate, Fr, is related to the acceleration during life test by:
Fr = X/(ts * AfV * AfT * N * 2)
X = Chi-Sq statistical upper limit
N = Life test sample size
Failure Rates are reported in FITs (Failures in Time) or MTTF (Mean Time To Failure). The FIT rate
is related to MTTF by:
MTTF = 1/Fr
NOTE: MTTF is frequently used interchangeably with MTBF.
The calculated failure rate for this device/process is:
FAILURE RATE:
MTTF (YRS): 37651
FITS: 3.0
The parameters used to calculate this failure rate are as follows:
Cf: 60%
Ea: 0.7
B: 0
Tu: 25
°C
Vu: 5.5
Volts
The reliability data follows. Some of the data in this report may be generic. A the start of this data is
a description of the assembly vehicle used to generate this reliability data. The next section is the
detailed reliability data for each stress. If there are additional assemblies used as part of this report,
a description of each will follow which includes the respective reliability data for that assembly.
Where appropriate, preconditioning is performed before all stresses and the bond crater test unless
otherwise noted. The reliability data section includes the latest data available.
Assembly Information:
Assembly Site:
Pin Count:
Package Type:
Body Size:
Mold Compound:
Lead Frame:
Lead Finsh:
Die Attach:
Bond Wire / Size:
Flammability:
Theta JA:
Theta JC:
Moisture Sensitivity
(JEDEC J-STD20A)
Date Code Range:
ASE
28
TSOP
8x13.4x0.965
Sumitomo G700
Stamped Alloy 42
Sn Plate 100% Matte
Sumitomo 1076 DS
Au / 1.0 mil
UL 94-V0
Level 3
0429
to 0429
PACKAGE TESTS
DESCRIPTION
DATE CODE CONDITION
SOLDERABILITY
0429
READPOINT
JESD22-B102
QTY FAILS
15
Total:
0
0
FA#
Assembly Information:
Assembly Site:
Pin Count:
Package Type:
Body Size:
Mold Compound:
Lead Frame:
Lead Finsh:
Die Attach:
Bond Wire / Size:
Flammability:
Theta JA:
Theta JC:
Moisture Sensitivity
(JEDEC J-STD20A)
Date Code Range:
ATK (Amkor, K)
28
TSOP
8x13.4x0.965
Sumitomo 7351T
Stamped Copper C7025
SnPb Plate
8361J Epoxy Silverfilled Ablebond
Au / 1.0 mil
UL 94-V0
Level 3
0223
to 0303
OPERATING LIFE
DESCRIPTION
DATE CODE CONDITION
READPOINT
QTY FAILS
HIGH VOLTAGE LIFE
0223
125C, 7.0 VOLTS
1000 HRS
80
0
HIGH VOLTAGE LIFE
0223
125C, 7.0 VOLTS
1000 HRS
160
0
HIGH VOLTAGE LIFE
0303
125C, 6.0 VOLTS
1000 HRS
77
0
Total:
Assembly Information:
Assembly Site:
Pin Count:
Package Type:
Body Size:
Mold Compound:
Lead Frame:
Lead Finsh:
Die Attach:
Bond Wire / Size:
Flammability:
Theta JA:
Theta JC:
Moisture Sensitivity
(JEDEC J-STD20A)
Date Code Range:
FA#
0
ATK (Amkor, K)
32
TSOP
8x20x1.0
Sumitomo 7351T
Stamped Copper C7025
SnPb Plate
8361J Epoxy Silverfilled Ablebond
Au / 1.0 mil
UL 94-V0
Level 3
0038
to 0303
MOISTURE SENSITIVITY LEVEL 3
DESCRIPTION
DATE CODE CONDITION
ULTRASOUND
0038
READPOINT
J-STD-020
QTY FAILS
8
0
STORAGE LIFE
125C
24
HRS
8
MOISTURE SOAK
30C/60% R.H.
240
HRS
8
CONVECTION REFLOW
235C +5/-0C
3
PASS
8
0
EXTERNAL VISUAL
MIL-STD-883-2009
8
0
PRECONDITION U/S
J-STD-020
8
0
Total:
FA#
0
OPERATING LIFE
DESCRIPTION
DATE CODE CONDITION
READPOINT
QTY FAILS
FA#
HIGH VOLTAGE LIFE
0038
125C, 6.0 VOLTS
1000 HRS
116
0
HIGH VOLTAGE LIFE
0303
125C, 6.0 VOLTS
1000 HRS
77
0
Total:
0
PACKAGE TESTS
DESCRIPTION
DATE CODE CONDITION
READPOINT
QTY FAILS
SOLDERABILITY
0038
MIL-STD-883-2003
3
0
X-RAY
0038
MIL-STD-883-2012 : TOP & SIDE VIEW
6
0
PHYSICAL DIMENSIONS
MIL-STD-883-2016
6
0
MARK PERMANENCY
MIL-STD-883-2015
6
0
LEAD INTEGRITY
MIL-STD-883-2004 : COND B2
6
0
Total:
FA#
0
PRECONDITIONING LEVEL 3
DESCRIPTION
DATE CODE CONDITION
READPOINT
STORAGE LIFE
0038
QTY FAILS
125C
24
HRS
315
MOISTURE SOAK
30C/60% R.H.
240
HRS
315
CONVECTION REFLOW
235C +5/-0C
3
PASS
315
Total:
FA#
0
0
TEMPERATURE CYCLE
DESCRIPTION
DATE CODE CONDITION
READPOINT
TEMP CYCLE
0038
1000 CYS
-55C TO 125C
QTY FAILS
77
Total:
FA#
0
0
TEMPERATURE HUMIDITY BIAS
DESCRIPTION
DATE CODE CONDITION
READPOINT
HAST
0038
100
130C, 85%R.H.,5.5V
HRS
QTY FAILS
77
Total:
FA#
0
0
UNBIASED MOISTURE RESISTANCE
DESCRIPTION
DATE CODE CONDITION
READPOINT
HAST, NO BIAS
0038
200
130C, 85% R.H.
HRS
Total:
Assembly Information:
Assembly Site:
Pin Count:
Package Type:
Body Size:
Mold Compound:
Lead Frame:
Lead Finsh:
Die Attach:
Bond Wire / Size:
Flammability:
Theta JA:
Theta JC:
Moisture Sensitivity
(JEDEC J-STD20A)
Date Code Range:
ATP (Amkor, PI)
28
TSOP
8x13.4x0.965
Sumitomo 7351T
Stamped Copper C7025
SnPb Plate
8361J Epoxy Silverfilled Ablebond
Au / 1.0 mil
UL 94-V0
Level 3
9921
to 9924
QTY FAILS
45
0
0
FA#
MOISTURE SENSITIVITY LEVEL 3
DESCRIPTION
DATE CODE CONDITION
PRECONDITION U/S
9921
READPOINT
QTY FAILS
J-STD-020
6
0
EXTERNAL VISUAL
MIL-STD-883-2009
8
0
ULTRASOUND
J-STD-020
8
0
STORAGE LIFE
125C
24
HRS
8
MOISTURE SOAK
30C/60% R.H.
240
HRS
8
CONVECTION REFLOW
235C +5/-0C
3
PASS
8
0
PRECONDITION U/S
J-STD-020
8
0
ULTRASOUND
9921
J-STD-020
8
0
STORAGE LIFE
125C
24
HRS
8
MOISTURE SOAK
30C/60% R.H.
240
HRS
8
CONVECTION REFLOW
235C +5/-0C
3
PASS
8
0
EXTERNAL VISUAL
MIL-STD-883-2009
8
0
Total:
FA#
0
OPERATING LIFE
DESCRIPTION
DATE CODE CONDITION
READPOINT
QTY FAILS
HIGH VOLTAGE LIFE
9921
125C, 7.0 VOLTS
1000 HRS
116
0
HIGH VOLTAGE LIFE
9924
125C, 7.0 VOLTS
1000 HRS
116
1
Total:
FA#
990165
1
PACKAGE TESTS
DESCRIPTION
DATE CODE CONDITION
READPOINT
QTY FAILS
CONSTRUCTION
ANALYSIS
9921
SENT TO OUTSIDE SOURCE
5
0
SOLDERABILITY
9921
MIL-STD-883-2003
3
0
X-RAY
9921
MIL-STD-883-2012 : TOP & SIDE VIEW
6
0
PHYSICAL DIMENSIONS
MIL-STD-883-2016
6
0
MARK PERMANENCY
MIL-STD-883-2015
6
0
LEAD INTEGRITY
MIL-STD-883-2004 : COND B2
6
0
SOLDERABILITY
9921
MIL-STD-883-2003
3
0
X-RAY
9921
MIL-STD-883-2012 : TOP & SIDE VIEW
6
0
PHYSICAL DIMENSIONS
MIL-STD-883-2016
6
0
MARK PERMANENCY
MIL-STD-883-2015
6
0
LEAD INTEGRITY
MIL-STD-883-2004 : COND B2
6
0
Total:
FA#
0
PRECONDITIONING LEVEL 3
DESCRIPTION
DATE CODE CONDITION
READPOINT
STORAGE LIFE
9921
QTY FAILS
125C
24
HRS
356
MOISTURE SOAK
30C/60% R.H.
240
HRS
356
CONVECTION REFLOW
235C +5/-0C
3
PASS
356
Total:
FA#
0
0
TEMPERATURE CYCLE
DESCRIPTION
DATE CODE CONDITION
READPOINT
QTY FAILS
TEMP CYCLE
9921
-55C TO 125C
1000 CYS
77
0
TEMP CYCLE
9921
-55C TO 125C
1000 CYS
91
0
FA#
Total:
0
TEMPERATURE HUMIDITY BIAS
DESCRIPTION
DATE CODE CONDITION
READPOINT
HAST
9921
130C, 85%R.H.,5.5V
100
HAST
9921
130C, 85%R.H.,5.5V
100
QTY FAILS
HRS
45
1
HRS
90
0
Total:
FA#
No FA
1
UNBIASED MOISTURE RESISTANCE
DESCRIPTION
DATE CODE CONDITION
READPOINT
HAST, NO BIAS
9921
130C, 85% R.H.
200
HAST, NO BIAS
9921
130C, 85% R.H.
200
QTY FAILS
HRS
45
0
HRS
55
0
Total:
Assembly Information:
Assembly Site:
Pin Count:
Package Type:
Body Size:
Mold Compound:
Lead Frame:
Lead Finsh:
Die Attach:
Bond Wire / Size:
Flammability:
Theta JA:
Theta JC:
Moisture Sensitivity
(JEDEC J-STD20A)
Date Code Range:
FA#
0
ATP (Amkor, PI)
32
TSOP
8x20x1.0
Sumitomo 7351T
Stamped Copper C7025
SnPb Plate
8361J Epoxy Silverfilled Ablebond
Au / 1.0 mil
UL 94-V0
Level 3
9913
to 0106
MOISTURE SENSITIVITY LEVEL 3
DESCRIPTION
DATE CODE CONDITION
PRECONDITION U/S
9913
READPOINT
QTY FAILS
J-STD-020
8
0
ULTRASOUND
J-STD-020
8
0
STORAGE LIFE
125C
HRS
8
MOISTURE SOAK
30C/60% R.H.
240
HRS
8
CONVECTION REFLOW
235C +5/-0C
3
PASS
8
0
EXTERNAL VISUAL
MIL-STD-883-2009
8
0
Total:
FA#
0
OPERATING LIFE
DESCRIPTION
DATE CODE CONDITION
READPOINT
QTY FAILS
HIGH VOLTAGE LIFE
9913
125C, 6.0 VOLTS
1000 HRS
85
0
HIGH VOLTAGE LIFE
0106
125C, 6.0 VOLTS
1000 HRS
256
2
Total:
FA#
iBATT
LEAK
2
PACKAGE TESTS
DESCRIPTION
DATE CODE CONDITION
READPOINT
QTY FAILS
SOLDERABILITY
9913
MIL-STD-883-2003
3
0
X-RAY
9913
MIL-STD-883-2012 : TOP & SIDE VIEW
6
0
FA#
PHYSICAL DIMENSIONS 9913
MIL-STD-883-2016
6
0
MARK PERMANENCY
MIL-STD-883-2015
6
0
LEAD INTEGRITY
MIL-STD-883-2004 : COND B2
6
0
Total:
0
PRECONDITIONING LEVEL 3
DESCRIPTION
DATE CODE CONDITION
READPOINT
QTY FAILS
STORAGE LIFE
9913
125C
24
HRS
315
MOISTURE SOAK
30C/60% R.H.
240
HRS
315
CONVECTION REFLOW
235C +5/-0C
3
PASS
315
Total:
FA#
0
0
TEMPERATURE CYCLE
DESCRIPTION
DATE CODE CONDITION
READPOINT
TEMP CYCLE
9913
1000 CYS
-55C TO 125C
QTY FAILS
70
Total:
FA#
0
0
TEMPERATURE HUMIDITY BIAS
DESCRIPTION
DATE CODE CONDITION
READPOINT
HAST
9913
100
130C, 85%R.H.,5.5V
HRS
QTY FAILS
70
Total:
FA#
0
0
UNBIASED MOISTURE RESISTANCE
DESCRIPTION
DATE CODE CONDITION
READPOINT
HAST, NO BIAS
9913
200
130C, 85% R.H.
HRS
QTY FAILS
40
Total:
Assembly Information:
Assembly Site:
Pin Count:
Package Type:
Body Size:
Mold Compound:
Lead Frame:
Lead Finsh:
Die Attach:
Bond Wire / Size:
Flammability:
Theta JA:
Theta JC:
Moisture Sensitivity
(JEDEC J-STD20A)
Date Code Range:
FA#
0
0
NSEB
28
TSOP
8x13.4x0.965
Ciba-Geigy Aratonic 2184-4 (KMC 184)
Stamped Copper C7025
SnPb Plate
84-1 LMISR4 Epoxy Silverfilled Ablebond
Au / 1.0 mil
UL 94-V0
Level 3
0432
to 0432
PACKAGE TESTS
DESCRIPTION
DATE CODE CONDITION
SOLDERABILITY
0432
READPOINT
JESD22-B102
QTY FAILS
8
Total:
0
0
FA#
Assembly Information:
Assembly Site:
Pin Count:
Package Type:
Body Size:
Mold Compound:
Lead Frame:
Lead Finsh:
Die Attach:
Bond Wire / Size:
Flammability:
Theta JA:
Theta JC:
Moisture Sensitivity
(JEDEC J-STD20A)
Date Code Range:
NSEB
32
TSOP
8x20x1.0
Ciba-Geigy Aratonic 2184-4 (KMC 184)
Stamped Copper C7025
SnPb Plate
84-1 LMISR4 Epoxy Silverfilled Ablebond
Au / 1.0 mil
UL 94-V0
Level 3
0145
to 0324
CONSTRUCTION ANALYSIS
DESCRIPTION
DATE CODE CONDITION
CONSTRUCTION
ANALYSIS
0146
READPOINT
TO BE SUBMITTED BY ASSEMBLY SITE
QTY FAILS
3
Total:
FA#
0
0
MOISTURE SENSITIVITY LEVEL 3
DESCRIPTION
DATE CODE CONDITION
ULTRASOUND
0145
READPOINT
J-STD-020
QTY FAILS
8
0
STORAGE LIFE
125C
24
HRS
8
MOISTURE SOAK
30C/60% R.H.
192
HRS
8
CONVECTION REFLOW
235C +5/-0C
3
PASS
8
0
EXTERNAL VISUAL
J-STD-020, 6.1a
8
0
PRECONDITION U/S
J-STD-020
8
0
8
0
ULTRASOUND
0146
J-STD-020
STORAGE LIFE
125C
24
HRS
8
MOISTURE SOAK
30C/60% R.H.
192
HRS
8
CONVECTION REFLOW
235C +5/-0C
3
PASS
8
0
EXTERNAL VISUAL
J-STD-020, 6.1a
8
0
PRECONDITION U/S
J-STD-020
8
0
8
0
ULTRASOUND
0147
J-STD-020
STORAGE LIFE
125C
24
HRS
8
MOISTURE SOAK
30C/60% R.H.
192
HRS
8
CONVECTION REFLOW
235C +5/-0C
3
PASS
8
0
EXTERNAL VISUAL
J-STD-020, 6.1a
8
0
PRECONDITION U/S
J-STD-020
8
0
Total:
FA#
0
OPERATING LIFE
DESCRIPTION
DATE CODE CONDITION
READPOINT
QTY FAILS
HIGH VOLTAGE LIFE
0145
125C, 6.0 VOLTS
1000 HRS
70
0
HIGH VOLTAGE LIFE
0146
125C, 6.0 VOLTS
1000 HRS
77
0
HIGH VOLTAGE LIFE
0147
125C, 6.0 VOLTS
1000 HRS
77
0
HIGH TEMP OP LIFE
0324
125C, 5.5 VOLTS
1000 HRS
77
0
FA#
HIGH TEMP OP LIFE
0324
125C, 5.5 VOLTS
988
HRS
77
Total:
0
0
PACKAGE TESTS
DESCRIPTION
DATE CODE CONDITION
SOLDERABILITY
0145
X-RAY
0145
READPOINT
QTY FAILS
JESD22-B102
3
0
MIL-STD-883-2012 : TOP & SIDE VIEW
6
0
PHYSICAL DIMENSIONS
JESD22-B100
6
0
MARK PERMANENCY
JESD22-B107
6
0
LEAD INTEGRITY
JESD22-B105 TEST CONDITION B
6
0
SOLDERABILITY
0146
JESD22-B102
3
0
X-RAY
0146
MIL-STD-883-2012 : TOP & SIDE VIEW
6
0
PHYSICAL DIMENSIONS
JESD22-B100
6
0
MARK PERMANENCY
JESD22-B107
6
0
LEAD INTEGRITY
JESD22-B105 TEST CONDITION B
6
0
SOLDERABILITY
0147
JESD22-B102
3
0
X-RAY
0147
MIL-STD-883-2012 : TOP & SIDE VIEW
6
0
PHYSICAL DIMENSIONS
JESD22-B100
6
0
MARK PERMANENCY
JESD22-B107
6
0
LEAD INTEGRITY
JESD22-B105 TEST CONDITION B
6
0
Total:
FA#
0
PRECONDITIONING LEVEL 3
DESCRIPTION
DATE CODE CONDITION
READPOINT
STORAGE LIFE
0145
QTY FAILS
125C
24
HRS
308
MOISTURE SOAK
30C/60% R.H.
192
HRS
308
CONVECTION REFLOW
235C +5/-0C
3
PASS
308
STORAGE LIFE
125C
24
HRS
308
MOISTURE SOAK
30C/60% R.H.
192
HRS
308
CONVECTION REFLOW
235C +5/-0C
3
PASS
308
STORAGE LIFE
0146
125C
24
HRS
308
MOISTURE SOAK
0147
30C/60% R.H.
192
HRS
308
CONVECTION REFLOW
235C +5/-0C
3
PASS
308
Total:
FA#
0
0
0
0
TEMPERATURE CYCLE
DESCRIPTION
DATE CODE CONDITION
READPOINT
QTY FAILS
TEMP CYCLE
0145
-55C TO 125C
1000 CYS
70
0
TEMP CYCLE
0146
-55C TO 125C
1000 CYS
77
0
TEMP CYCLE
0147
-55C TO 125C
1000 CYS
77
0
Total:
FA#
0
TEMPERATURE HUMIDITY BIAS
DESCRIPTION
DATE CODE CONDITION
READPOINT
QTY FAILS
HAST
0145
130C, 85%R.H.,5.5V
100
HRS
44
0
HAST
0146
130C, 85%R.H.,5.5V
100
HRS
77
0
HAST
0147
130C, 85%R.H.,5.5V
100
HRS
77
0
FA#
Total:
0
UNBIASED MOISTURE RESISTANCE
DESCRIPTION
DATE CODE CONDITION
READPOINT
HAST, NO BIAS
0145
130C, 85% R.H.
200
HRS
44
0
HAST, NO BIAS
0146
130C, 85% R.H.
200
HRS
74
0
HAST, NO BIAS
0147
130C, 85% R.H.
200
HRS
73
0
Total:
FAILURE RATE:
MTTF (YRS): 37651
FITS: 3.0
QTY FAILS
0
FA#