SGM2006/A Low Power, Low Dropout, 150mA, RF - Linear Regulators GENERAL DESCRIPTION FEATURES The SGM2006/A series low-power, low-noise, low-dropout, CMOS linear voltage regulators operate from a 2.5V to 5.5V input and deliver up to 150mA. They are the perfect choice for low voltage, low power applications. An ultra low ground current ( 150µA at 150mA output ) makes these part attractive for battery operated power systems. The SGM2006/A series also offer ultra low dropout voltage (150mV at 150mA output) to prolong battery life in portable electronics. Systems requiring a quiet voltage source, such as RF applications, will benefit from the SGM2006/A series’ ultra low output noise (30µVRMS) and high PSRR. An external noise bypass capacitor connected to the device’s BP pin can further reduce the noise level. - Low Output Noise: 30µVRMS typ(10Hz to 100KHz) - Ultra-Low Dropout Voltage: The output voltage is preset to voltages in the range of 1.5V to 5.0V. Other features include a 10nA logic-controlled shutdown mode, foldback current limit and thermal shutdown protection. 150mV at 150mA output - Low 77µA No-Load Supply Current - Low 150µA Operating Supply Current - at 150mA Output High PSRR: 73dB at 1KHz Thermal-Overload Protection Output Current Limit Preset Output Voltages (±2.7% Accuracy) 10nA Logic-Controlled Shutdown Available in Multiple Output Voltage Versions Fixed Outputs of 1.8V, 2.5V, 2.7V, 2.8V, 2.85V, 2.9V, 3.0V, 3.3Vand 3.6V Adjustable Output from 1.5V to 5.0V Devices come in 5-pin SOT23 package. PIN CONFIGURATIONS（TOP VIEW） SGM2006/A APPLICATIONS Cellular Telephones Cordless Telephones PHS Telephones PCMCIA Cards Modems MP3 Player Hand-Held Instruments Palmtop Computers Electronic Planners Portable/Battery-Powered Equipment Shengbang Microelectronics Co, Ltd Tel: 86/451/84348461 www.sg-micro.com IN 1 GND 2 EN 3 5 OUT 4 BP/FB SOT23-5 REV. C ORDERING INFORMATION MODEL VOUT(V) PINPACKAGE SPECIFIED TEMPERATURE RANGE ORDERING NUMBER PACKAGE MARKING PACKAGE OPTION SGM2006-1.8 1.8V SOT23-5 - 40°C to +125°C SGM2006-1.8XN5/TR X618 Tape and Reel, 3000 SGM2006-2.5 2.5V SOT23-5 - 40°C to +125°C SGM2006-2.5XN5/TR X625 Tape and Reel, 3000 SGM2006-2.7 2. 7V SOT23-5 - 40°C to +125°C SGM2006-2. 7XN5/TR X627 Tape and Reel, 3000 SGM2006-2.8 2.8V SOT23-5 - 40°C to +125°C SGM2006-2.8XN5/TR X628 Tape and Reel, 3000 SGM2006-2.85 2.85V SOT23-5 - 40°C to +125°C SGM2006-2.85XN5/TR X62J Tape and Reel, 3000 SGM2006-2.9 2.9V SOT23-5 - 40°C to +125°C SGM2006-2.9XN5/TR X629 Tape and Reel, 3000 SGM2006-3.0 3.0V SOT23-5 - 40°C to +125°C SGM2006-3.0XN5/TR X630 Tape and Reel, 3000 SGM2006-3.3 3.3V SOT23-5 - 40°C to +125°C SGM2006-3.3XN5/TR X633 Tape and Reel, 3000 SGM2006-3.6 3.6V SOT23-5 - 40°C to +125°C SGM2006-3.6XN5/TR X636 Tape and Reel, 3000 SGM2006A adjustable SOT23-5 - 40°C to +125°C SGM2006-XN5/TR X6AA Tape and Reel, 3000 ABSOLUTE MAXIMUM RATINGS IN to GND.....................................................................- 0.3V to +6V Output Short-Circuit Duration ...........................................Infinite EN to GND...................................................................- 0.3V to +6V OUT, BP/FB to GND......................................- 0.3V to (VIN + 0.3V) Power Dissipation, PD @ TA = 25℃ SOT23-5 .....................................................................................0.4W Package Thermal Resistance SOT23-5, θJA....................................................................... 250℃/W Operating Temperature Range...........................- 40°C to +125°C Junction Temperature...........................................................+150°C Storage Temperature.............................................- 65°C to +150°C Lead Temperature (soldering, 10s).......................................260°C ESD Susceptibility HBM..........................................................................................4000V MM..............................................................................................400V Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PIN DESCRIPTION PIN NAME FUNCTION 1 IN 2 GND 3 EN Shutdown Input. A logic low reduces the supply current to 10nA. Connect to IN for normal operation. 4 BP Reference-Noise Bypass(fixed voltage version only). Bypass with a low-leakage 0.01µF ceramic capacitor for reduced noise at the output. 4 FB Adjustable voltage version only—this is used to set the output voltage of the device. 5 OUT Regulator Input. Supply voltage can range from 2.5V to 5.5V. Bypass with a 1µF capacitor to GND. Ground. Regulator Output. 2 SGM2006/A ELECTRICAL CHARACTERISTICS (VIN = VOUT (NOMINAL) + 0.5V (1), TA = - 40°C to +125°C, unless otherwise noted. Typical values are at TA = + 25°C.) PARAMETER Input Voltage SYMBOL CONDITIONS MIN VIN IOUT =1mA to150mA, TA = +25°C VOUT + 0.5V≤VIN≤ 5.5V Output Voltage Accuracy(1) Maximum Output Current Current Limit Ground Pin Current ILIM IQ UNITS 2.5 5.5 V -2.7 +2.7 % 160 Load Regulation ΔVLDR en PSRR 600 77 IOUT = 150mA, EN = 2V 150 mA 145 1 IOUT = 150mA ΔVLNR mA No load, EN = 2V IOUT = 1mA Line Regulation(1) Power Supply Rejection Rate MAX 150 Dropout Voltage (2) Output Voltage Noise TYP VIN = 2.5V or (VOUT + 0.5V) to 5.5V, IOUT = 1mA IOUT = 0.1mA to 150mA, COUT = 1µF f = 10Hz to 100KHz, CBP = 0.01µF, COUT = 10µF µA mV 150 190 0.03 0.15 %/V 0.0008 0.002 %/mA 30 µVRMS CBP = 0.1µF, ILOAD = 50mA, f = 100Hz, 78 dB COUT = 1µF f = 1KHz, 73 dB SHUTDOWN EN Input Threshold VIH VIL 2.0 VIN = 2.5V to 5.5V 0.4 TA = +25°C 0.01 TA = +125°C 0.01 TA = +25°C 0.01 TA = +125°C 0.01 TA = +25°C 30 µs TSHDN 160 ℃ ΔTSHDN 15 ℃ EN Input Bias Current IB(SHDN) EN = 0V and EN = 5.5V Shutdown Supply Current IQ(SHDN) EN = 0.4V CBP = 0.01µF Shutdown Exit Delay(3) COUT = 1µF, No load 1 V 1 µA µA THERMAL PROTECTION Thermal Shutdown Temperature Thermal Shutdown Hysteresis Specifications subject to change without notice. Note 1: VIN = VOUT(NOMINAL) + 0.5V or 2.5V, whichever is greater. Note 2: The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT + 0.5V. (Only applicable for VOUT = +2.5V to +5.0V.) Note 3: Time needed for VOUT to reach 95% of final value. ３ SGM2006/A TYPICAL OPERATION CIRCUIT INPUT 2.5V TO 5.5V OUT IN CIN 1μF ON OFF INPUT 2.5V TO 5.5V OUTPUT OUT IN SGM 2006A R1 COUT 1μF CIN 1μF ON FB EN OUTPUT OFF GND R2 COUT 1μF SGM 2006 BP EN GND Adjustable Voltage Version CBP 0.01μF Fixed Voltage Version Standard 1% Resistor Values for Common Output Voltages of Adjustable Voltage Version VOUT(V) 1.5 1.8 2.5 2.7 2.8 2.85 2.9 3.0 3.3 3.6 R1(kΩ) 13 28 63.4 56 78.7 80.6 75 88.7 95.3 130 R2(kΩ) 61.9 61.9 61.9 47 61.9 61.9 56 61.9 57.6 68 Note: VOUT = (R1 + R2)/ R2 ×1.233 ４ SGM2006/A TYPICAL OPERATING CHARACTERISTICS VIN = VOUT(NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, CBP = 0.01µF, TA = +25℃, unless otherwise noted. Output Voltage vs.Load Current 3.4 2.85 3.35 Output Voltage(V) Output Voltage(V) Output Voltage vs.Load Current 2.9 2.8 2.75 3.3 3.25 VOUT = 2.8V VOUT = 3.3V 2.7 3.2 0 50 100 Load Current(mA) 150 0 50 100 Load Current(mA) Ground Pin Current vs.Load Current Ground Pin Current vs.Input Voltage 200 160 VOUT = 2.8V 150 140 130 Ground Pin Current(µA) Ground Pin Current(µA) 150 VOUT = 3.3V 120 110 100 VOUT = 2.8V 90 80 160 Iload = 50mA 120 80 No Load 40 70 60 0 0 50 100 Load Current(mA) 150 0 Ground Pin Current vs.Input Voltage 2 3 4 Input Voltage(V) 5 6 Output Voltage vs.Input Voltage 200 6 VOUT = 3.3V No Load 5 Iload = 50mA 160 Output Voltage(V) Ground Pin Current(µA) 1 120 80 No Load 40 VOUT = 3.3V 4 3 VOUT = 2.8V 2 1 0 0 0 1 2 3 4 Input Voltage(V) 5 0 6 ５ 1 2 3 4 Input Voltage(V) 5 6 SGM2006/A TYPICAL OPERATING CHARACTERISTICS VIN = VOUT(NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, CBP = 0.01µF, TA = +25℃, unless otherwise noted. Output Voltage vs.Temperature Output Voltage vs.Temperature 2.9 3.4 ILOAD = 150mA Output Voltage(V) 2.85 2.8 2.75 3.35 3.3 3.25 VOUT = 3.3V VOUT = 2.8V 2.7 3.2 -40 -20 0 20 40 60 80 Temperature(℃) 100 120 140 -40 -20 220 240 200 220 180 200 VOUT = 3.3V 180 160 140 120 VOUT = 2.8V 100 20 40 60 80 Temperature(℃) 100 120 140 TA = +125℃ 160 TA = +85℃ 140 TA = +25℃ 120 100 TA = -40℃ 80 60 40 ILOAD = 150mA 80 0 Dropout Voltage vs.Load Current 260 Dropout Voltage(mV) Ground Pin Current(μA) Ground Pin Current vs.Temperature VOUT = 2.8V 20 0 60 -40 -20 0 20 40 60 80 Temperature(℃) 0 100 120 140 15 Dropout Voltage vs.Load Current 30 45 60 75 90 105 120 135 150 Load Current(mA) Current limit vs.Temperature 180 1000 160 900 TA = +125℃ 140 Current limit(mA) Dropout Voltage(mV) Output Voltage(V) ILOAD = 150mA TA = +85℃ 120 TA = +25℃ 100 80 TA = -40℃ 60 40 VOUT = 3.3V 20 800 700 VOUT = 3.3V 600 500 400 VOUT = 2.8V 300 200 0 100 0 15 30 45 60 75 90 105 120 135 150 Load Current(mA) -40 -20 ６ 0 20 40 60 80 Temperature(℃) 100 120 140 SGM2006/A TYPICAL OPERATING CHARACTERISTICS VIN = VOUT(NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, CBP = 0.01µF, TA = +25℃, unless otherwise noted. ７ SGM2006/A TYPICAL OPERATING CHARACTERISTICS VIN = VOUT(NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, CBP = 0.01µF, TA = +25℃, unless otherwise noted. Power-Supply Rejection Ratio vs.Frequency Output Noise Spectral Density vs.Frequency 100 80 Output Noise Spectral Density (μV/√Hz) 90 PSRR(dB) 10 CBP = 0.1μF ILOAD = 50mA VIN = VOUT+1V 70 COUT = 10μF 60 50 1 COUT = 1μF 0.1 40 COUT = 1μF 30 20 0.01 CBP = 0.01μF ILOAD = 50mA 0.1 1 10 Frequency(kHz) 100 0.01 0.01 1000 COUT = 10μF 0.1 1 10 100 1000 Frequency(kHz) Output Noise vs.Load Current 50 Output Noise(µVRMS) 45 VOUT = 3.3V 40 35 30 25 VOUT = 2.8V 20 f = 10Hz to 100kHz CBP = 0.01μF COUT = 10μF 15 10 5 0 1 10 100 Load Current(mA) 1000 ８ SGM2006/A Application Notes When LDO is used in handheld products, Attention must be paid to voltage spike which would damage SGM2006. In such applications, voltage spike will be generated at changer interface and VBUS pin of USB interface when changer adapters and USB equipments are hot-inserted. Besides this, handheld products will be tested on the production line on the condition of no battery. Test Engineer will apply power from the connector pin which connects with positive pole of the battery. When external power supply is turned on suddenly, the voltage spike will be generated at the battery connector. The voltage spike will be very high, it always exceeds the absolute maximum input voltage (6.0V) of LDO. In order to get robust design. Design Engineer needs to clear up this voltage spike. Zener diode is a cheap and effective solution to eliminate such voltage spike. For example, BZM55B5V6 is a 5.6V small package Zener diode which can be used to remove voltage spike in cell phone design. The schematic is shown in below: 1 Vcc Input BZM55B5V6 1uF IN VOUT SGM2006 C1 GND 2 EN 3 5 VOUT C2 BP/FP 4 4.7uF 0.01uF Control ９ SGM2006/A PACKAGE OUTLINE DIMENSIONS SOT23-5 D θ b 0.20 Symbol L E E1 e C A1 e1 Min Max Min Max 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.400 0.012 0.016 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 e1 L A A2 Dimensions In Inches 1.050 e １０ Dimensions In Millimeters A L 0 0.950TYP 1.800 0.037TYP 2.000 0.700REF 0.071 0.079 0.028REF L1 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8° SGM2006/A REVISION HISTORY Location Page 12/06— Data Sheet changed from REV. A to REV. B Changed to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Added Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 03/07— Data Sheet changed from REV. B to REV. C Changed to TYPICAL OPERATING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Shengbang Microelectronics Co, Ltd Unit 3, ChuangYe Plaza No.5, TaiHu Northern Street, YingBin Road Centralized Industrial Park Harbin Development Zone Harbin, HeiLongJiang 150078 P.R. China Tel.: 86-451-84348461 Fax: 86-451-84308461 www.sg-micro.com １１ SGM2006/A