SGM8651/2/4 SGM8653/5 50MHz, Rail-to-Rail Output CMOS Operational Amplifier PRODUCT DESCRIPTION FEATURES The SGM8651/2/3/4/5 are high precision, low noise, low distortion, rail-to-rail output CMOS voltage feedback operational amplifiers offering ease of use and low cost. They have a wide input common-mode voltage range and output voltage swing, running at single-supply voltage from 2.5 V to 5.5 V. • Low Cost • Rail-to-Rail Output 2mV Typical VOS • Gain-Bandwidth Product: 50MHz • High Slew Rate: 66V/µs • Settling Time to 0.1% with 2V Step: 60 ns • Overload Recovery Time: 25ns • Low Noise : 8.7 nV/ Hz • Operates on 2.5 V to 5.5V Supplies • Input Voltage Range = – 0.2 V to + 3.8 V with VS = 5V • Low Power 2.3 mA/Amplifier Typical Supply Current 75µA/Amplifier when Disabled (SGM8653/5 only) • Small Packaging SGM8651 Available in SOT23-5 and SO-8 SGM8652 Available in MSOP-8 and SO-8 SGM8653 Available in SOT23-6 and SO-8 SGM8654 Available in TSSOP-16 and SO-16 SGM8655 Available in MSOP-10 Despite being low cost, the SGM8651/2/3/4/5 provide excellent overall performance. They offer wide gain-bandwidth product to 50MHz and a typical low power of 2.3 mA/amplifier. The SGM8651/2/3/4/5‘s low distortion and fast settling make them ideal for buffering high speed A/D or D/A converters. The SGM8653/5 has a power-down disable feature that reduces the supply current to 75µA/amplifier. These features make the SGM8653/5 ideal for portable and battery-powered applications where size and power are critical. All are specified over the extended –40°C to +125°C temperature range. PIN CONFIGURATIONS (Top View) APPLICATIONS SGM8651 DISABLE NC 1 8 (SGM8653 ONLY) OUT 1 -IN 2 7 +VS 2 +IN 3 6 OUT -VS 4 5 NC SOT23-5 SO-8 SGM8653 OUT A 1 2 8 +VS 7 OUT B 3 6 -IN B -VS 4 5 +IN B +IN A 5 +VS 4 -IN OUT 1 6 +VS -VS 2 5 DISABLE +IN 3 4 -IN SOT23-6 SO-8 / MSOP-8 OUT A 1 10 +VS -IN A 2 9 +IN A 8 3 OUT B 16 OUT D 1 -IN A 2 15 -IND +IN A 3 14 +IND +VS 4 13 -VS +INB 5 12 +INC -INB 6 11 -INC OUT B 7 10 OUT C NC 8 -IN B -VS 4 7 +IN B DISABLE 5 6 DISABLE MSOP-10 SGM8654 OUT A SGM8655 Shengbang Microelectronics Co, Ltd Tel: 86/451/84348461 www.sg-micro.com +IN 3 NC = NO CONNECT SGM8652 -IN A -VS 8653 Data Acquisition Process Control Audio Processing Video Processing Active Filters Test Equipment Cell Phone PA Control Broadband Communications A-to-D Driver D -to- A Driver SGM8651/8653 NC = NO CONNECT 9 NC TSSOP-16 / SO-16 REV. C ELECTRICAL CHARACTERISTICS :VS = +5V (At TA = +25℃, RL = 600Ω connected to Vs/2, unless otherwise noted) SGM8651/2/3/4/5 PARAMETER TYP CONDITION +25℃ MIN/MAX OVER TEMPERATURE +25℃ 0℃ to70℃ -40℃to 85℃ -40℃to 125℃ UNITS MIN/ MAX DYNAMIC PERFORMANCE Gain-Bandwidth Product(GBP) G = +10 50 MHz TYP Slew Rate G = +1, 2V Output Step 66 V/µs TYP Settling Time to 0.1% G = +1, 2 V Output Step 60 ns TYP Overload Recovery Time VIN﹒G = +VS 25 ns TYP % TYP NOISE/DISTORTION PERFORMANCE Total Harmonic Distortion + Noise G = +1, f = 1kHz, VO = 2Vp-p, RL = 600Ω Input Voltage Noise(en) f = 100kHz 16 nV/ f = 1MHz 8.7 nV/ Hz f A/ Hz TYP mV MAX f = 10kHz Input Current Noise(In) Hz TYP TYP DC PERFORMANCE ±8 ±8.9 ±9.5 ±9.8 Input Offset Voltage (VOS) ±2 Input Offset Voltage Drift 4.5 µV/℃ TYP Input Bias Current（IB） 6 pA TYP pA TYP VO = 0.3 V to 4.7 V, RL = 150Ω 80 75 74 74 73 dB MIN VO = 0.2 V to 4.8 V, RL = 1KΩ 104 92 91 91 80 dB MIN V TYP 66 65 65 62 dB MIN 2 Input offset Current（IOS） Open-Loop Gain (AOL) INPUT CHARACTERISTICS Input Common-Mode Voltage Range (VCM) Common-Mode Rejection Ratio(CMRR) OUTPUT CHARACTERISTICS Output Voltage Swing from Rail -0.2 to +3.8 VCM = - 0.1 V to + 3.5 V 80 RL = 150Ω 0.12 V TYP RL = 1KΩ 0.03 V TYP mA MIN 0.08 Ω TYP Turn-On Time 220 ns TYP Turn-Off Time 150 ns TYP 127 Output Current Closed-Loop Output Impedance f＜100kHz, G = +1 100 96 89 82 POWER-DOWN DISABLE (SGM8653/5 only) DISABLE Voltage-Off 0.8 V MAX DISABLE Voltage-On 2 V MIN POWER SUPPLY 2.5 2.7 2.7 2.7 V MIN 5.5 5.5 5.5 5.5 V MAX 2.3 2.9 3.4 3.8 4 mA MAX 75 120 127 130 137 µA MAX 80 67 67 65 62 dB MIN Operating Voltage Range Quiescent Current (per amplifier) Supply Current when Disabled per amplifier (SGM8653/5 only) Power Supply Rejection Ratio (PSRR) ∆Vs = + 2.7V to + 5.5V, VCM = (-VS) + 0.5 Specifications subject to change without notice. ２ SGM8651/2/3/4/5 PACKAGE/ORDERING INFORMATION MODEL CHANNEL SGM8651 Single SGM8652 Dual SGM8653 Single with shutdown SGM8654 Quad SGM8655 Dual with shutdown ORDER NUMBER PACKAGE DESCRIPTION SGM8651XN5/TR SOT23-5 PACKAGE OPTION Tape and Reel, 3000 MARKING INFORMATION 8651 SGM8651XS/TR SO-8 Tape and Reel, 2500 SGM8651XS SGM8652XMS/TR MSOP-8 Tape and Reel, 3000 SGM8652XMS SGM8652XS/TR SO-8 Tape and Reel, 2500 SGM8652XS SGM8653XN6/TR SOT23-6 Tape and Reel, 3000 8653 SGM8653XS/TR SO-8 Tape and Reel, 2500 SGM8653XS SGM8654XS/TR SO-16 Tape and Reel, 2500 SGM8654XS SGM8654XTS TSSOP-16 Tape and Reel, 3000 SGM8654XTS SGM8655XMS/TR MSOP-10 Tape and Reel, 3000 SGM8655XMS ABSOLUTE MAXIMUM RATINGS CAUTION Supply Voltage, V+ to V- ......................................... 7.5 V Common-Mode Input Voltage ...................................... (–VS) – 0.5 V to (+VS) +0.5V Storage Temperature Range..................–65℃ to +150℃ Junction Temperature ..............................................160℃ Operating Temperature Range............ –55℃ to +150℃ Package Thermal Resistance @ TA = 25℃ SOT23-5, θJA......................................................... 190℃/W SOT23-6, θJA......................................................... 190℃/W SO-8, θJA..................................................................125℃/W MSOP-8, θJA.......................................................... 216℃/W MSOP-10, θJA........................................................ 216℃/W SO-16, θJA................................................................ 82℃/W TSSOP-16, θJA....................................................... 105℃/W Lead Temperature Range (Soldering 10 sec) ..................................................... 260℃ ESD Susceptibility HBM...........................................................................1000V MM...............................................................................400V This integrated circuit can be damaged by ESD. Shengbang Micro-electronics recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. NOTES 1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ３ SGM8651/2/3/4/5 TYPICAL PERFORMANCE CHARACTERISTICS At TA= +25℃, VS = +5V, G = +2, RF = 887Ω, RG = 887Ω, CL = 47pF ,and RL= 600Ω, unless otherwise noted. Closed-Loop Gain vs.Frequency Capacitive Load vs.Frequency 6 G = +100 20 G = +10 0 G = +1 -20 -3 VIN -6 + 0.1 1 10 Frequency(MHz) 100 Rs SGM8653 - -9 CL VR F = 887Ω 0.1 1000 CL = 20pF V+ -15 1 Vo (RL is Optional) 10 100 Frequency(MHz) 1000 Small Signal Overshoot vs.Load Capacitance Output Impedance vs.Frequency 20 30 Small Signal Overshoot(%) Output Impedance(Ω) CL = 47pF CL = 30pF -12 -40 0.01 CL = 100pF 0 RG = 887 Ω 40 Vo = 0.1VP-P G = +1 3 RL =600 Ω VS = 5V RL = 600Ω CL = 47pF Normalized Gain(dB) Closed-Loop Gain(dB) 60 16 12 G = +100 8 G = +10 G = +1 4 Vo = 0.2VP-P G=+1 25 -overshoot 20 15 10 +overshoot 5 0 0 0.1 1 10 100 Frequency(KHz) 1000 0 10000 20 30 40 50 Capacitance(pF) 60 70 Small Signal Step Response Large Signal Step Response Vs = 5V CL = 47pF VIN = 200mV G = +1 Output Voltage(50mV/div) Vs = 5V CL = 47pF VIN = 2V G = +1 Output Voltage(500mV/div) 10 Time(400ns/div) Time(100µs/div) ４ SGM8651/2/3/4/5 TYPICAL PERFORMANCE CHARACTERISTICS At TA= +25℃, VS = +5V, G = +2, RF = 887Ω, RG = 887Ω, CL = 47pF ,and RL= 600Ω, unless otherwise noted. Input Voltage Noise Spectral Density vs.Frequency CMRR And PSRR vs.Frequency 100 Voltage Noise(nV/√Hz) 1000 CMRR 60 40 PSRR 20 0 0.01 0.1 1 Frequency(MHz) 10 100 10 1 0.01 100 Output Voltage(1V/div) 1.77V 0V 100 1000 VOUT = 2.4V Time(200ns/div) CMRR And PSRR vs.Temperature Maximum Output Voltage vs.Frequency 120 6 Vs = 5.5V Maximum Output Voltage Without Slew-Rate Induced Distortion RL = 150Ω 110 CMRR,PSRR(dB) 4 3 2 10 Vs = ±2.5V fIN = 5MHz G = +2 Time(25ns/div) 5 1 Large-Signal Disable/Enable Response Vs = ±2.5V VIN = 1.77V G = +2 2.5V 0.1 Frequency(kHz) Overload Recovery Time Output Voltage(Vp-p) CMRR,PSRR(dB) 80 Vs = 2.7V 1 100 PSRR 90 80 CMRR 70 0 60 0.1 1 10 Frequency(MHz) 100 -50 -30 -10 ５ 10 30 50 70 Temperature(℃) 90 110 130 SGM8651/2/3/4/5 TYPICAL PERFORMANCE CHARACTERISTICS At TA= +25℃, VS = +5V, G = +2, RF = 887Ω, RG = 887Ω, and RL = 150Ω connected to Vs/2,unless otherwise noted. Shutdown Current vs.Temperature Open-Loop Gain vs.Temperature 80 120 75 Shutdown Current(μA) Open–Loop Gain(dB) RL = 1KΩ 110 100 RL = 150Ω 90 80 VS = 5V 70 65 VS = 3V 60 VS = 2.7V 55 50 45 40 70 -50 -30 -10 10 30 50 70 Temperature(℃) 90 -50 -30 -10 110 130 Supply Current vs.Temperature 10 30 50 70 Temperature(℃) 3 Sourcing Current Output Voltage(V) VS = 3V VS = 5V 2.2 2 1.8 VS = 2.7V 1.6 1.4 135℃ 2 25℃ -50℃ VS = 3V 1 135℃ 25℃ -50℃ 1.2 Sinking Current 1 0 -50 -30 -10 10 30 50 70 Temperature(℃) 90 110 130 0 20 40 60 80 100 120 Output Current(mA) Output Voltage Swing vs.Output Current Channel Separation vs.Frequency -40 5 4 135℃ 25℃ Channel Separation(dB) -50 Output Voltage(V) Supply Current(mA) 2.8 2.4 110 130 Output Voltage Swing vs.Output Current 3 2.6 90 -50℃ 3 Sourcing Current VS = 5V 2 135℃ 1 25℃ -50℃ Sinking Current 0 0 25 50 75 100 125 -60 -70 -80 -90 -100 -110 -120 0.001 150 Output Current(mA) ６ 0.01 0.1 1 Frequency(MHz) 10 100 SGM8651/2/3/4/5 TYPICAL PERFORMANCE CHARACTERISTICS At TA= +25℃, VS = +5V, G = +2, RF = 887Ω, RG = 887Ω, and RL = 150Ω connected to Vs/2,unless otherwise noted. Offset Voltage Production Distribution Percent of Amplifiers(%) 24 21 Typical production distribution of packaged units. 18 15 12 9 6 3 0 -8 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 Offset Voltage(mV) ７ SGM8651/2/3/4/5 Power-Supply Bypassing and Layout APPLICATION NOTES The SGM865x family operates from either a single +2.7V to +5.5V supply or dual ±1.35V to ±2.75V supplies. For single-supply operation, bypass the power supply VDD with a 0.1µF ceramic capacitor which should be placed close to the VDD pin. For dual-supply operation, both the VDD and the VSS supplies should be bypassed to ground with separate 0.1µF ceramic capacitors. 2.2µF tantalum capacitor can be added for better performance. Driving Capacitive Loads The SGM865x can directly drive 47pF in unity-gain without oscillation. The unity-gain follower (buffer) is the most sensitive configuration to capacitive loading. Direct capacitive loading reduces the phase margin of amplifiers and this results in ringing or even oscillation. Applications that require greater capacitive drive capability should use an isolation resistor between the output and the capacitive load like the circuit in Figure 1. The isolation resistor RISO and the load capacitor CL form a zero to increase stability. The bigger the RISO resistor value, the more stable VOUT will be. Note that this method results in a loss of gain accuracy because RISO forms a voltage divider with the RLOAD. Good PC board layout techniques optimize performance by decreasing the amount of stray capacitance at the op amp’s inputs and output. To decrease stray capacitance, minimize trace lengths and widths by placing external components as close to the device as possible. Use surface-mount components whenever possible. For the high speed operational amplifier, soldering the part to the board directly is strongly recommended. Try to keep the high frequency big current loop area small to minimize the EMI (electromagnetic interfacing). RISO SGM8651 VOUT VIN CL VDD VDD Figure 1. Indirectly Driving Heavy Capacitive Load 10µF 10µF 0.1µF 0.1µF An improvement circuit is shown in Figure 2. It provides DC accuracy as well as AC stability. RF provides the DC accuracy by connecting the inverting signal with the output. CF and RIso serve to counteract the loss of phase margin by feeding the high frequency component of the output signal back to the amplifier’s inverting input, thereby preserving phase margin in the overall feedback loop. Vn Vn SGM8651 VOUT Vp 10µF Vp CF 0.1µF VSS(GND) RF VOUT SGM8651 RISO SGM8651 VIN VOUT CL VSS RL Figure 3. Amplifier with Bypass Capacitors Grounding Figure 2. Indirectly Driving Heavy Capacitive Load with DC Accuracy A ground plane layer is important for high speed circuit design. The length of the current path speed currents in an inductive ground return will create an unwanted voltage noise. Broad ground plane areas will reduce the parasitic inductance. For no-buffer configuration, there are two others ways to increase the phase margin: (a) by increasing the amplifier’s gain or (b) by placing a capacitor in parallel with the feedback resistor to counteract the parasitic capacitance associated with inverting node. Input-to-Output Coupling To minimize capacitive coupling, the input and output signal traces should not be parallel. This helps reduce unwanted positive feedback. ８ SGM8651/2/3/4/5 Typical Application Circuits C Differential Amplifier R2 The circuit shown in Figure 4 performs the difference function. If the resistors ratios are equal ( R4 / R3 = R2 / R1 ), then VOUT = ( Vp – Vn ) × R2 / R1 + Vref. R1 VIN Vn VOUT SGM8651 R2 R1 SGM8651 R3 = R1 // R2 VOUT Vp R3 Figure 6. Low Pass Active Filter R4 Vref Driving Video The SGM865x can be used in video applications like in Figure 7. Figure 4. Differential Amplifier Instrumentation Amplifier VIN 75Ω SGM8651 The circuit in Figure 5 performs the same function as that in Figure 4 but with the high input impedance. 75Ω CABLE R2 RG R1 RF VOUT 75Ω SGM8651 Vn VOUT SGM8651 Vp SGM8651 R3 G = 1 + RF / RG Figure 7. Typical Video Driving R4 Vref Figure 5. Instrumentation Amplifier Low Pass Active Filter The low pass filter shown in Figure 6 has a DC gain of (-R2/R1) and the –3dB corner frequency is 1/2πR2C. Make sure the filter is within the bandwidth of the amplifier. The Large values of feedback resistors can couple with parasitic capacitance and cause undesired effects such as ringing or oscillation in high-speed amplifiers. Keep resistors value as low as possible and consistent with output loading consideration. ９ SGM8651/2/3/4/5 PACKAGE OUTLINE DIMENSIONS SOT23-5 D θ b 0.20 Symbol L E E1 e C A1 e1 Min Max Min Max 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.400 0.012 0.016 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 e1 L A A2 Dimensions In Inches 1.050 e １０ Dimensions In Millimeters A L 0 0.950TYP 1.800 2.000 0.700REF 0.037TYP 0.071 0.079 0.028REF L1 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8° SGM8651/2/3/4/5 PACKAGE OUTLINE DIMENSIONS SOT23-6 D Symbol θ e1 e L E E1 b A1 C Min Max Min Max 1.050 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.400 0.012 0.016 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 e e1 A A2 L １１ Dimensions In Inches A 0.20 L 0 Dimensions In Millimeters 0.950TYP 1.800 2.000 0.700REF 0.037TYP 0.071 0.079 0.028REF L1 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8° SGM8651/2/3/4/5 PACKAGE OUTLINE DIMENSIONS SO-8 D C E E1 L Symbol θ e Min Max Min Max 1.350 1.750 0.053 0.069 A1 0.100 0.250 0.004 0.010 A2 1.350 1.550 0.053 0.061 B 0.330 0.510 0.013 0.020 C 0.190 0.250 0.007 0.010 D 4.780 5.000 0.188 0.197 E 3.800 4.000 0.150 0.157 E1 5.800 6.300 0.228 0.248 A1 1.270TYP 0.050TYP L 0.400 1.270 0.016 0.050 θ 0° 8° 0° 8° A A2 Dimensions In Inches A e B Dimensions In Millimeters １２ SGM8651/2/3/4/5 PACKAGE OUTLINE DIMENSIONS MSOP-8 C E θ e A2 A A1 E1 L b Symbol Dimensions In Millimeters Min Max Dimensions In Inches Min Max A A1 A2 b c D e E E1 L θ 0.800 1.200 0.000 0.200 0.760 0.970 0.30 TYP 0.15 TYP 2.900 3.100 0.65 TYP 2.900 3.100 4.700 5.100 0.410 0.650 0° 6° 0.031 0.047 0.000 0.008 0.030 0.038 0.012 TYP 0.006 TYP 0.114 0.122 0.026 TYP 0.114 0.122 0.185 0.201 0.016 0.026 0° 6° D １３ SGM8651/2/3/4/5 PACKAGE OUTLINE DIMENSIONS MSOP-10 b L C E A A1 A2 b c D e E E1 L θ θ A2 e A A1 E1 Symbol Dimensions In Millimeters Min Max Dimensions In Inches Min Max 0.800 1.200 0.000 0.200 0.760 0.970 0.30 TYP 0.152 TYP 2.900 3.100 0.50 TYP 2.900 3.100 4.700 5.100 0.410 0.650 0° 6° 0.031 0.047 0.000 0.008 0.030 0.038 0.012 TYP 0.006 TYP 0.114 0.122 0.020 TYP 0.114 0.122 0.185 0.201 0.016 0.026 0° 6° D １４ SGM8651/2/3/4/5 PACKAGE OUTLINE DIMENSIONS SO-16 D L C E θ A1 A e A2 E1 Symbol A A1 A2 b c D E E1 e L θ Dimensions In Millimeters Min Max Dimensions In Inches Min Max 1.350 1.750 0.100 0.250 1.350 1.550 0.330 0.510 0.170 0.250 9.800 10.20 3.800 4.000 5.800 6.200 1.270 (BSC) 0.400 1.270 0° 8° 0.053 0.069 0.004 0.010 0.053 0.061 0.013 0.020 0.007 0.010 0.386 0.402 0.150 0.157 0.228 0.244 0.050 (BSC) 0.016 0.050 0° 8° b １５ SGM8651/2/3/4/5 PACKAGE OUTLINE DIMENSIONS TSSOP-16 A b E E1 Symbol PIN #1 IDENT. A2 A e C L θ D A D E b c E1 A A2 A1 e L H θ Dimensions In Millimeters Min Max 4.900 4.300 0.190 0.090 6.250 5.100 4.500 0.300 0.200 6.550 1.100 0.800 1.000 0.020 0.150 0.65 (BSC) 0.500 0.700 0.25(TYP) 1° 7° Dimensions In Inches Min Max 0.193 0.169 0.007 0.004 0.246 0.201 0.177 0.012 0.008 0.258 0.043 0.031 0.039 0.001 0.006 0.026 (BSC) 0.020 0.028 0.01(TYP) 1° 7° H A1 １６ SGM8651/2/3/4/5 REVISION HISTORY Location Page 9/05— Data Sheet changed from REV.A to REV.B Added SGM8655 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Universal Changes to PRODUCT DESCRIPTION, FEATURES, and PIN CONFIGURATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Changes to ELECTRICAL CHARACTERISTICS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Updated PACKAGE/ORDERING INFORMATION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 11/06— Data Sheet changed from REV. B to REV. C Changes to ABSOLUTE MAXIMUM ATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Shengbang Microelectronics Co, Ltd Unit 3, ChuangYe Plaza No.5, TaiHu Northern Street, YingBin Road Centralized Industrial Park Harbin Development Zone Harbin, HeiLongJiang 150078 P.R. China Tel.: 86-451-84348461 Fax: 86-451-84308461 www.sg-micro.com １７ SGM8651/2/3/4/5